CN102817232A - Preparation method for electricity conductive cloth, and electricity conductive cloth - Google Patents
Preparation method for electricity conductive cloth, and electricity conductive cloth Download PDFInfo
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- CN102817232A CN102817232A CN2012102878986A CN201210287898A CN102817232A CN 102817232 A CN102817232 A CN 102817232A CN 2012102878986 A CN2012102878986 A CN 2012102878986A CN 201210287898 A CN201210287898 A CN 201210287898A CN 102817232 A CN102817232 A CN 102817232A
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Abstract
The present invention discloses a preparation method for an electricity conductive cloth and the electricity conductive cloth. The preparation method comprises the following steps: carrying out a catalytic treatment, wherein an ionic palladium solution is adopted to carry out a pretreatment on the surface of an original cloth; carrying out chemical copper plating, wherein chemical copper plating is performed on the surface of the original cloth; carrying out copper electroplating, wherein copper electroplating is performed on the original cloth, and a thickening treatment is performed on the copper layer of the original cloth; and carrying out nickel electroplating, wherein a nickel layer is electroplated on the surface to provide protection for the copper layer. With application of the method of the present invention to produce the electricity conductive cloth, equipment investment is less, and a copper electroplating layer is adopted to carry out thickening on the copper layer of the product, such that a cost of the copper electroplating process is less than a cost of a complete chemical copper plating process, and the resulting product has characteristics of low electric resistance, low internal stress of the plating layer, and good ductility so as to provide advantages of low cost, high yield, low electric resistance of the product, excellent adhesion and the like.
Description
Technical field
The present invention relates to the conductive fabric field, relate in particular to a kind of preparation method and conductive fabric of conductive fabric.
Background technology
In the preparation technology of existing conductive fabric; Generally comprise vacuum plating, electro-coppering and three steps of electronickelling; Detailed process makes cloth surface deposition layer of metal for utilizing vacuum plating, and deposition back cloth cover conductionization is utilized the electro-coppering thickening then; Reach required electric conductivity, electroplate one deck nickel after accomplishing at last the copper layer is protected.But, adopt this preparation technology's equipment to have high input, production capacity is low, and high to the raw material surface requirements, occurs plating leakage easily, and causes yield rate low.
Therefore, prior art awaits to improve and development.
Summary of the invention
In view of the deficiency of above-mentioned prior art, the object of the present invention is to provide a kind of preparation method and conductive fabric of conductive fabric, be intended to solve problems such as the preparation technology's yield rate that has conductive fabric now is low, input height.
Technical scheme of the present invention is following:
The preparation method of conductive fabric, wherein, the preparation method of said conductive fabric may further comprise the steps:
Catalytic treatment: adopt ionic palladium solution that preliminary treatment is carried out on former cloth surface;
Electroless copper: carry out electroless copper on former cloth surface;
Electro-coppering: former cloth is carried out electro-coppering, the copper layer of former cloth is thickeied;
Electronickelling: the copper layer is protected at electroplating surface one nickel dam.
The preparation method of described conductive fabric, wherein, said catalytic treatment specifically may further comprise the steps:
The dip-coating of former cloth normal temperature in the catalytic liquid that is mixed by palladium salt and PU resin solution, is got into baking oven and carries out dry solidification at 150-200 degree centigrade after extruding.
The preparation method of described conductive fabric, wherein, said electroless copper specifically may further comprise the steps:
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes former cloth coating surface one deck chemical plating copper layer;
The chemical bronze plating liquid that is adopted in the said electroless copper processing contains the copper chloride that concentration is 4.5-7.5g/L, the EDTA of 25-30g/L, the NaOH of 7-10g/L, HCHO and a small amount of chemical copper stabilizing agent of 2-4g/L, and plating temperature is controlled at 40-50 degree centigrade.
The preparation method of described conductive fabric, wherein, said electro-coppering and electronickelling specifically may further comprise the steps:
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.
The preparation method of described conductive fabric, wherein, containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 60-70g/L and the potassium pyrophosphate of 280-320g/L, said electro-coppering plating in pH is 8.2-8.8, temperature 30-50 degree centigrade scope; Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, said electronickelling plating in pH3.5-4.5, temperature 30-50 degree centigrade scope.
Beneficial effect: use method provided by the present invention to produce conductive fabric; Less input for equipment; Also use copper electroplating layer that product copper layer is thickeied; Chemical copper technology cost is low fully because of the copper plating process cost, and resulting product resistance is low, the coating internal stress is low, ductility good, so have advantages such as cost is low, yield rate is high, product resistance is low, adhesive force is good.
The specific embodiment
The present invention provides a kind of preparation method and conductive fabric of conductive fabric, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The preparation method of conductive fabric provided by the present invention comprises catalytic treatment, electroless copper, electro-coppering and four steps of electronickelling.In preparation method of the present invention; Adopt a kind of ionic palladium solution that preliminary treatment is carried out on former cloth surface before this, and made its surface possess the electroless plating reaction ability, carried out the chemical copper plating on former cloth surface then; Obtain preliminary electric conductivity; Utilize copper plating process that the copper layer is thickeied again, make product obtain required surperficial low-resistance value, last electroplating surface one deck nickel is protected the copper layer.Make resulting conductive fabric have that cost is low, yield rate is high, product resistance is low and advantage such as adhesive force is good.
Wherein, said catalytic treatment specifically may further comprise the steps:
The dip-coating of former cloth normal temperature in the catalytic liquid that is mixed by palladium salt and PU resin solution, is got into baking oven and carries out dry solidification at 150-200 degree centigrade after extruding.
Former cloth surface after the process catalytic treatment is intact possesses chemical copper self-catalysis ability, can directly be used to carry out follow-up electroless copper processing.Wherein, the PU resin solid content is controlled at 0.4-1.0% and is advisable in the catalytic liquid, and palladium content is advisable more than 300ppm content, because palladium content is low excessively, it is not enough that catalysis triggers performance, can cause subsequent chemistry copper facing progress slow.
Said electroless copper specifically may further comprise the steps:
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes the chemical plating copper layer of former measuring fiber coating surface one deck conduction.
Through after the chemical copper plating is carried out on former cloth surface, make former cloth obtain preliminary metallic conduction performance.Wherein, The chemical bronze plating liquid that is adopted in the said electroless copper processing mainly contains the copper chloride that concentration is 4.5-7.5g/L, the EDTA of 25-30g/L, the NaOH of 7-10g/L, HCHO and a small amount of chemical copper stabilizing agent of 2-4g/L, and plating temperature is controlled at 40-50 degree centigrade.Said chemical copper stabilizing agent is a common chemical copper stabilizing agent, like 2 ' 2 bipyridyls, potassium ferrocyanide etc.Through behind the electroless copper, deposit 5-15g/m on the former cloth
2Copper plate be advisable.
Said electro-coppering and electronickelling specifically may further comprise the steps:
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.
Utilize copper plating process that the chemical copper layer is thickeied earlier, make product obtain required surperficial low-resistance value, the fragility that chemical plating copper layer is existed is big, the higher relatively defective of resistance is improved, and at electroplating surface one deck nickel the copper layer is protected at last.Wherein, containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 60-70g/L and the potassium pyrophosphate of 280-320g/L, about 10-20 g/m in the plating in pH is 8.2-8.8, temperature 30-50 degree centigrade scope
2The copper layer.Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, plating in pH3.5-4.5, temperature 30-50 degree centigrade scope.Plating 5-10 g/m on former cloth
2Nickel metal layer, can anticorrosive protection be provided to the copper layer.
Through after above-mentioned four steps, can also electroplate post processing to said conductive fabric, with anti-wear performance and the anti-fingerprint metachrosis that increases said conductive fabric.Said plating last handling process can be for applying 2-5g/m on said conductive fabric
2Polyurethane coating.Said polyurethane is preferably anti-yellowing polyurethane, applies said anti-yellowing polyurethane, can make that conductive fabric has that metal strong adhesion, anti-wear performance are good, advantage such as the anti-xanthochromia of product and anti-fingerprint metachrosis are good.
A kind of conductive fabric also is provided among the present invention, and said conductive fabric adopts above-mentioned preparation method to prepare, said conductive fabric comprise a former cloth with, be coated on palladium salt deposit, chemical plating copper layer, copper electroplating layer and electroless nickel layer on the said former cloth from the inside to the outside successively.The outer surface of said conductive fabric can also comprise an anti-yellowing polyurethane layer.Fiber surface after the conductive fabric metallization applies an anti-yellowing polyurethane coating, and behind dry solidification, the content of anti-yellowing polyurethane is 2-5g/m on the said conductive fabric
2, this coating plays a protective role to the coat of metal, can improve anti-peeling force of the coat of metal and anti-wear performance greatly, and the metal adhesive force of the conductive fabric of process the inventive method post processing is good, and wear-corrosion resistance is good.
Use method provided by the present invention to produce conductive fabric; Less input for equipment; Also use copper electroplating layer that product copper layer is thickeied; Chemical copper technology cost is low fully because of the copper plating process cost, and resulting product resistance is low, the coating internal stress is low, ductility good, so have advantages such as cost is low, yield rate is high, product resistance is low, adhesive force is good.
Embodiment 1 280T polyurethane fiber plaids
With 280T polyurethane fiber plaids is former cloth; With the dip-coating of former cloth normal temperature in the catalytic liquid that mixes by palladium salt and PU resin solution; The PU resin solid content is 0.4% in the catalytic liquid, and palladium content is 320ppm, after extruding, gets into baking oven and carries out dry solidification at 200 degrees centigrade.
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes the chemical copper layer of former measuring fiber coating surface one deck conduction.Wherein, the chemical bronze plating liquid that is adopted in the said electroless copper processing mainly contains the copper chloride that concentration is 7.5g/L, the EDTA of 30g/L, the NaOH of 10g/L, HCHO and a small amount of chemical copper stabilizing agent of 4g/L, and plating temperature is controlled at 40 degrees centigrade.Said chemical copper stabilizing agent is 2 ' 2 bipyridyls.Through behind the electroless copper, deposit 10g/m on the former cloth
2Copper plate.
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.Wherein, containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 60g/L and the potassium pyrophosphate of 280g/L, is 8.2 at pH, plating in 30 degrees centigrade of scopes of temperature, and said electro-coppering process is the about 10/m of plating on former cloth
2Copper plate.Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, plating in pH3.5-4.5,30 degrees centigrade of scopes of temperature, plating 8g/m on former cloth
2Nickel metal layer.
Adopt the 280T polyurethane fiber plaids of this prepared, according to ASTM F390-98 standard four-point probe method test surfaces resistance, resistance value can reach 0.015-0.025 Ω/sq; According to AATCC TM8 standard testing metallic cohesion, the result generally can reach 5 grades; Properties of product are superior.
Embodiment 2 270T polyurethane fiber plaids
With 270T polyurethane fiber plaids is former cloth; With the dip-coating of former cloth normal temperature in the catalytic liquid that mixes by palladium salt and PU resin solution; The PU resin solid content is 0.6% in the catalytic liquid, and palladium content is 330ppm, after extruding, gets into baking oven and carries out dry solidification at 150 degrees centigrade.
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes the chemical copper layer of former measuring fiber coating surface one deck conduction.Wherein, the chemical bronze plating liquid that is adopted in the said electroless copper processing mainly contains the copper chloride that concentration is 4.5/L, the EDTA of 25g/L, the NaOH of 7g/L, HCHO and a small amount of chemical copper stabilizing agent of 2g/L, and plating temperature is controlled at 40-50 degree centigrade.Said chemical copper stabilizing agent is 2 ' 2 bipyridyls.Through behind the electroless copper, deposit 5g/m on the former cloth
2Copper plate.
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.Wherein, containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 70g/L and the potassium pyrophosphate of 320g/L, plating in pH is 8.2-8.8,50 degrees centigrade of scopes of temperature, and said electro-coppering process is the about 20/m of plating on former cloth
2Copper plate.Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, plating in pH3.5-4.5,50 degrees centigrade of scopes of temperature, plating 10g/m on former cloth
2Nickel metal layer
Adopt the 270T polyurethane fiber plaids of this prepared, according to ASTM F390-98 standard four-point probe method test surfaces resistance, resistance value can reach 0.015-0.025 Ω/sq; According to AATCC TM8 standard testing metallic cohesion, the result generally can reach 5 grades; Properties of product are superior.
Embodiment 3 230T polyurethane fiber plaids
With 230T polyurethane fiber plaids is former cloth; With the dip-coating of former cloth normal temperature in the catalytic liquid that mixes by palladium salt and PU resin solution; The PU resin solid content is 1.0% in the catalytic liquid, and palladium content is 340ppm, after extruding, gets into baking oven and carries out dry solidification at 180 degrees centigrade.
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes the chemical copper layer of former measuring fiber coating surface one deck conduction.Wherein, the chemical bronze plating liquid that is adopted in the said electroless copper processing mainly contains the copper chloride that concentration is 6g/L, the EDTA of 28g/L, the NaOH of 8g/L, HCHO and a small amount of chemical copper stabilizing agent of 3g/L, and plating temperature is controlled at 40-50 degree centigrade.Said chemical copper stabilizing agent is 2 ' 2 bipyridyls.Through behind the electroless copper, deposit 15g/m on the former cloth
2Copper plate.
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.Wherein, containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 50g/L and the potassium pyrophosphate of 300g/L, plating in pH is 8.2-8.8,40 degrees centigrade of scopes of temperature, and said electro-coppering process is the about 12/m of plating on former cloth
2Copper plate.Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, plating in pH3.5-4.5,40 degrees centigrade of scopes of temperature, plating 5g/m on former cloth
2Nickel metal layer.
Adopt the 230T polyurethane fiber plaids of this prepared, according to ASTM F390-98 standard four-point probe method test surfaces resistance, resistance value can reach 0.015-0.025 Ω/sq; According to AATCC TM8 standard testing metallic cohesion, the result generally can reach 5 grades; Properties of product are superior.
Embodiment 4 280T polyurethane fiber plaids
With 280T polyurethane fiber plaids is former cloth; With the dip-coating of former cloth normal temperature in the catalytic liquid that mixes by palladium salt and PU resin solution; The PU resin solid content is 0.5% in the catalytic liquid, and palladium content is 320ppm, after extruding, gets into baking oven and carries out dry solidification at 200 degrees centigrade.
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes the chemical copper layer of former measuring fiber coating surface one deck conduction.Wherein, the chemical bronze plating liquid that is adopted in the said electroless copper processing mainly contains the copper chloride that concentration is 7.5g/L, the EDTA of 30g/L, the NaOH of 10g/L, HCHO and a small amount of chemical copper stabilizing agent of 4g/L, and plating temperature is controlled at 40 degrees centigrade.Said chemical copper stabilizing agent is 2 ' 2 bipyridyls.Through behind the electroless copper, deposit 12g/m on the former cloth
2Copper plate.
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.Wherein, containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 60g/L and the potassium pyrophosphate of 280g/L, is 8.2 at pH, plating in 30 degrees centigrade of scopes of temperature, and said electro-coppering process is the about 15/m of plating on former cloth
2Copper plate.Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, plating in pH3.5-4.5,30 degrees centigrade of scopes of temperature, plating 7g/m on former cloth
2Nickel metal layer.
Said conductive fabric is electroplated post processing, on said conductive fabric, apply anti-yellowing polyurethane, through behind the dry solidification, the content of anti-yellowing polyurethane is 3g/m on the said conductive fabric
2
Adopt the 280T polyurethane fiber plaids of this prepared, according to ASTM F390-98 standard four-point probe method test surfaces resistance, resistance value can reach 0.015-0.025 Ω/sq; According to AATCC TM8 standard testing metallic cohesion, the result generally can reach 5 grades; Properties of product are superior.The gained conductive fabric has also that anti-wear performance is good, the anti-xanthochromia of product and the good advantage of anti-fingerprint metachrosis.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection domain of accompanying claims of the present invention according to above-mentioned explanation.
Claims (6)
1. the preparation method of a conductive fabric is characterized in that, the preparation method of said conductive fabric may further comprise the steps:
Catalytic treatment: adopt ionic palladium solution that preliminary treatment is carried out on former cloth surface;
Electroless copper: carry out electroless copper on former cloth surface;
Electro-coppering: former cloth is carried out electro-coppering, the copper layer of former cloth is thickeied;
Electronickelling: the copper layer is protected at electroplating surface one nickel dam.
2. the preparation method of conductive fabric according to claim 1 is characterized in that, said catalytic treatment specifically may further comprise the steps:
The dip-coating of former cloth normal temperature in the catalytic liquid that is mixed by palladium salt and PU resin solution, is got into baking oven and carries out dry solidification at 150-200 degree centigrade after extruding.
3. the preparation method of conductive fabric according to claim 1 is characterized in that, said electroless copper specifically may further comprise the steps:
The former cloth that will pass through catalytic treatment carries out electroless copper processing, makes former cloth coating surface one deck chemical plating copper layer;
The chemical bronze plating liquid that is adopted in the said electroless copper processing contains the copper chloride that concentration is 4.5-7.5g/L, the EDTA of 25-30g/L, the NaOH of 7-10g/L, HCHO and a small amount of chemical copper stabilizing agent of 2-4g/L, and plating temperature is controlled at 40-50 degree centigrade.
4. the preparation method of conductive fabric according to claim 1 is characterized in that, said electro-coppering and electronickelling specifically may further comprise the steps:
The former cloth that will pass through electroless copper carries out electro-coppering processing at the cupric pyrophosphate copper plating solution, in the nickel sulfamic acid nickel plating solution, carries out electronickelling processing again.
5. the preparation method of conductive fabric according to claim 4; It is characterized in that; Containing concentration in the said cupric pyrophosphate copper plating solution is the cupric pyrophosphate of 60-70g/L and the potassium pyrophosphate of 280-320g/L, said electro-coppering plating in pH is 8.2-8.8, temperature 30-50 degree centigrade scope; Said nickel sulfamic acid nickel plating solution contains the nickel sulfamic acid that concentration is 360g/L, the nickel chloride of 20g/L and the boric acid of 25g/L, said electronickelling plating in pH3.5-4.5, temperature 30-50 degree centigrade scope.
6. a conductive fabric is characterized in that, said conductive fabric adopts and prepares like the arbitrary described preparation method of claim 1 ~ 5.
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