CN102815780A - Method of removing arsenic from basic etching waste liquid of printed circuit board - Google Patents
Method of removing arsenic from basic etching waste liquid of printed circuit board Download PDFInfo
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- CN102815780A CN102815780A CN2012102789817A CN201210278981A CN102815780A CN 102815780 A CN102815780 A CN 102815780A CN 2012102789817 A CN2012102789817 A CN 2012102789817A CN 201210278981 A CN201210278981 A CN 201210278981A CN 102815780 A CN102815780 A CN 102815780A
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- arsenic
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- ferric hydroxide
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Abstract
The invention provides a method of removing arsenic from basic etching waste liquid of a printed circuit board used for recycling and safety disposal of the basic etching waste liquid, belonging to the technical field of chemical industry. The method comprises the following steps of: firstly, preparing ferric hydroxide, which is easy to settle and filter, and is free of divalent iron; secondly, adding the prepared ferric hydroxide into the basic etching waste liquid requiring to remove the arsenic, and fully stirring; and thirdly, separating solid and liquid to obtain arsenic-containing solid phase ferric hydroxide for recycling. A liquid phase is basic etching liquid, wherein the arsenic content reaches requirements. The method has the characteristics of low treatment cost, simple treatment process, good treatment effect, high treatment efficiency, material recycling, greenness, environmental friendliness, zero emission, small device investment and the like, and is suitable for arsenic removal treatment of the basic etching waste liquid.
Description
[technical field]
The present invention relates to a kind of method of arsenic removal from alkaline etching waste liquid for producing printed circuit board, can be used for resource utilization, the innocent treatment procedure of alkaline etching waste liquid for producing, belong to environmental technology field.
[background technology]
Alkaline etching waste liquid for producing printed circuit board is a kind of waste of making the etch process generation of printed circuit board; Wherein mainly contain a large amount of cupric ions and ammonium chloride, ammoniacal liquor; If it is not carried out resource utilization, harmless treatment, then cause than serious environmental and pollute and the wasting of resources.Present resource utilization, method for innocent treatment mainly are as the raw material of producing Chemicals such as copper sulfate, basic copper chloride, cupric oxide with it.The arsenic impurities that often contains 10-50ppm in the general alkaline etching waste liquid for producing.And as copper sulfate, basic copper chloride that fodder additives is used its arsenic content is often required very sternly, require arsenic content to be lower than 4ppm like feed-grade bluestone standard HG2932.If be raw material production feed grade mantoquita as raw material therefore, just must make its product reach requirement by deeply removing arsenic with etching waste liquor.
Existing from alkaline etching waste liquid for producing arsenic removal technology comprise neutralization precipitation method, sulphide precipitation, the ferrite precipitator method, flocculent precipitation etc.; These methods are owing to have complex process, cost height; Efficient is low, produces defectives such as arsenic-containing waste, does not all reach the ideal effect of removing arsenic.Therefore be necessary to set up one processing cost be low, treatment capacity big, the removal method of arsenic in the alkaline etching waste liquid for producing of treatment process, green, environmental protection, being used for the etching waste liquor is the production process of the mantoquita used of the fodder additives of raw material.
[summary of the invention]
The objective of the invention is to effectively solve the removal problem of arsenic impurities in the above-mentioned alkaline etching waste liquid for producing.Generally the arsenic compound with alkaline etching waste liquid for producing often is the deposition state.But because this moment, the pH in the solution was higher, be generally about 9～10, therefore be easy to generate the colloid of arsenic compound; The colloidal solid volume is little, and specific surface is big, thereby surface energy is higher; Solubleness is bigger than normal; Arsenic can not be precipitated fully, but also make solution solid-liquid separation difficulty, thereby be difficult to reach the ideal effect.
If but add at this moment the specific surface prepared less, be puffy, be easy to filtering ferric hydroxide precipitate, then formed the colloidal arsenic compound and be adsorbed and flocculation sediment very soon.And this arsenic compound that is adsorbed will be converted into more stable deposit seeds after after a while, and this deposit seeds also can induce the colloid of other arsenic compound to change same stable arsenic compound deposit seeds into.If the ferric hydroxide precipitate of the arsenic compound that therefore obtains through solid-liquid separation is used further to the arsenic removal process, can reach very ideal effect of removing arsenic.Thereby this method owing to recycle and contain the arsenic waste, thereby do not contain the arsenic waste discharge.After repeatedly circulating,, can carry out the recycling of arsenic when arsenic content runs up to a certain degree.
Therefore present method can be divided into following steps:
1, preparation ferric hydroxide precipitate.
2, the alkaline etching waste liquid for producing that will treat arsenic removal adds the ferric hydroxide precipitate prepare, and fully stirs.
3, solid-liquid separation, the solid phase that obtains contain the arsenic ferric hydroxide precipitate and recycle.The liquid phase that obtains is arsenic content and meets the requirements of alkaline etching waste liquid for producing.
Characteristics such as present method has that processing cost is low, treating processes is simple, treatment effect is good, processing efficiency is high, and material recycles, green, environmental protection, zero release, facility investment are little are well suited for and alkaline etching waste liquid for producing is carried out arsenic removal handle.
[embodiment]
Further specify embodiment of the present invention and effect with following indefiniteness embodiment:
Embodiment 1
The alkaline etching waste liquid for producing arsenic content of certain circuit board plant is 30ppm, and its arsenic removal treating processes is following:
1, under abundant stirring state, in the liquor ferri trichloridi of the iron hydroxide solution adding 5% with 5%, the control endpoint pH is 7; Add simultaneously ydrogen peroxide 50 will be wherein ferrous iron all be oxidized to ferric iron, churning time is 2 hours, generates to be puffy, to be easy to sedimentation and filtering ferric hydroxide precipitate; And water rinsing repeatedly, flush away sodium-chlor wherein is after waiting to precipitate sedimentation; Discard the upper strata stillness of night, obtain water ratio and be 95% ironic hydroxide slurries.
2, under abundant stirring state, the above-mentioned slurries that prepare ferric hydroxide precipitate are added the alkaline etching waste liquid for producing of treating arsenic removal, add-on is 4.5L/m
3, stirred 1 hour.
3, carry out solid-liquid separation, the solid phase that obtains recycles as ferric hydroxide precipitate after adding water slurrying.The liquid phase that obtains is arsenic content and meets the requirements of alkaline etching waste liquid for producing.
Handling the alkaline etching waste liquid for producing arsenic content that obtains through above-mentioned steps is 0.8ppm, has reached the requirement of production feed grade mantoquita.
Embodiment 2
The alkaline etching waste liquid for producing arsenic content of certain circuit board plant is 15ppm, and its arsenic removal treating processes is following:
1, under abundant stirring state, be that 90% the slurry that contains the arsenic ferric hydroxide precipitate adds the alkaline etching waste liquid for producing of treating arsenic removal with arsenic removal last time solid-liquid separation and the water cut that adds water slurrying, add-on is 3.6L/m
3, stirred 1 hour.
2, carry out solid-liquid separation, the solid phase that obtains recycles as ferric hydroxide precipitate after adding water slurrying.The liquid phase that obtains is arsenic content and meets the requirements of alkaline etching waste liquid for producing.
Handling the alkaline etching waste liquid for producing arsenic content that obtains through above-mentioned steps is 0.6ppm, has reached the requirement of production feed grade mantoquita.
Embodiment 3
The alkaline etching waste liquid for producing arsenic content of certain circuit board plant is 10ppm, and its arsenic removal treating processes is following:
1, under abundant stirring state, be that 90% slurries that contain the arsenic ferric hydroxide precipitate add alkaline etching waste liquid for producing with arsenic removal last time solid-liquid separation and the water cut that adds water slurrying, add-on is 2.5L/m
3, stirred 1 hour.
2,, carry out solid-liquid separation, the solid phase that obtains recycles as ferric hydroxide precipitate after adding water slurrying.The liquid phase that obtains is arsenic content and meets the requirements of alkaline etching waste liquid for producing.
Handling the alkaline etching waste liquid for producing arsenic content that obtains through above-mentioned steps is 0.5ppm, has reached the requirement of production feed grade mantoquita.
Above-described embodiment has only expressed preferred implementation of the present invention, can not be interpreted as the restriction to claim of the present invention, so the present invention is not limited to this concrete technical process.Those skilled in the art can also make some distortion and improvement according to technical scheme of the present invention and design, and these all belong to protection scope of the present invention.So all other embodiments that the claim scope draws according to the present invention all should belong to the scope that the present invention is contained.
Claims (2)
1. the method for an arsenic removal from alkaline etching waste liquid for producing printed circuit board is characterized in that comprising following steps:
(1), preparation be easy to sedimentation and filtering, do not contain ferrous ferric hydroxide precipitate.
(2), the ferric hydroxide precipitate for preparing is added the alkaline etching waste liquid for producing of treating arsenic removal.
(3), solid-liquid separation, the solid phase that obtains contains the arsenic ferric hydroxide precipitate and recycles, the liquid phase that obtains is arsenic content and meets the requirements of alkaline etching waste liquid for producing.
2. treatment process according to claim 1 is characterized in that: said (4) step solid-liquid separation is separated with the method for press filtration, or separates with other solid-liquid separating methods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102789817A CN102815780A (en) | 2012-08-07 | 2012-08-07 | Method of removing arsenic from basic etching waste liquid of printed circuit board |
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| CN2012102789817A CN102815780A (en) | 2012-08-07 | 2012-08-07 | Method of removing arsenic from basic etching waste liquid of printed circuit board |
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| CN102815780A true CN102815780A (en) | 2012-12-12 |
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| CN2012102789817A Pending CN102815780A (en) | 2012-08-07 | 2012-08-07 | Method of removing arsenic from basic etching waste liquid of printed circuit board |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101333025A (en) * | 2008-07-11 | 2008-12-31 | 深圳市危险废物处理站 | Process for removing arsenic in alkaline etching waste liquid for producing printed circuit board |
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- 2012-08-07 CN CN2012102789817A patent/CN102815780A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101333025A (en) * | 2008-07-11 | 2008-12-31 | 深圳市危险废物处理站 | Process for removing arsenic in alkaline etching waste liquid for producing printed circuit board |
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Application publication date: 20121212 |