CN102815119A - Manufacturing method for albums and photo frames - Google Patents

Manufacturing method for albums and photo frames Download PDF

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Publication number
CN102815119A
CN102815119A CN2011101530232A CN201110153023A CN102815119A CN 102815119 A CN102815119 A CN 102815119A CN 2011101530232 A CN2011101530232 A CN 2011101530232A CN 201110153023 A CN201110153023 A CN 201110153023A CN 102815119 A CN102815119 A CN 102815119A
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China
Prior art keywords
picture
photograph album
base board
manufacturing approach
bonded
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Pending
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CN2011101530232A
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Chinese (zh)
Inventor
蔡炳仁
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Individual
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Individual
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Priority to CN2011101530232A priority Critical patent/CN102815119A/en
Publication of CN102815119A publication Critical patent/CN102815119A/en
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Abstract

The invention relates to a manufacturing method for albums and photo frames. The manufacturing method comprises, in particular, subjecting base materials to cutting molding to form a base board of a base board of an album upper board; compositing a high-ray material layer on photos to form a photo layer; jointing the photo layer on the upper board based board to form the upper board; and jointing the upper board and a lower board into an album by using a spine. The manufacturing method for the photo frames comprises subjecting base materials to cutting molding to form a base board of a photo frame bottom board; compositing high-ray materials on photos to form photo layers; and jointing the base materials on the base board of the bottom board to form a photo frame. According to the manufacturing method for albums and photo frames, the high-ray material layer is jointed with photos, and then jointed with the upper board base board or the bottom board base board, so that the probability of bubbles is reduced effectively, and further the rate of finished products is improved greatly, and the average manufacturing cost of albums and photo frames is reduced effectively.

Description

The manufacturing approach of photograph album and photo frame
Technical field
The present invention relates to the manufacturing approach of a kind of photograph album and photo frame, relate in particular to a kind of photograph album that prevents to bubble and the manufacturing approach of photo frame.
Background technology
Along with development of times, the raising of living standards of the people, photography becomes requisite activity in people's daily life.
And for reasonable and permanent the depositing of photography photo, this just be unable to do without photograph album with photo frame, and photograph album and photo frame not only have the function of protection photo, and necessary attractive in appearance and durable, otherwise just lost the meaning of use photograph album and photo frame.
The manufacturing approach of existing photograph album and photo frame has a lot, but existing manufacturing approach yield rate is not very high, and manufacturing cost is also than higher, and having is exactly to foam easily in the surface of photograph album and photo frame again, causes decrease in yield.
Summary of the invention
The objective of the invention is defective, the manufacturing approach of a kind of photograph album and photo frame is provided, reduce manufacturing cost, improve yield rate to prior art.
For realizing above-mentioned purpose, the invention provides a kind of manufacturing approach of photograph album, the manufacturing approach of said photograph album specifically comprises:
Step 1 with the base material excision forming, forms base board on the photograph album;
Step 2 is compounded in high optical material layer on the picture, forms picture layer;
Step 3 is bonded on said going up on the base board with said picture layer, forms upper plate;
Step 4 utilizes the book back to be bonded into photograph album said upper plate and lower plate.
Also comprise in the said step 1, the said edges of boards of going up base board are repaiied hypotenuse, with the said plate angle cavetto arc of going up base board.In the said step 2 high optical material layer is compounded on the picture and is specially: utilize no shadow glue that said high optical material layer is bonded on the said picture.In the said step 3 said picture layer being bonded on said going up on the base board is specially: through heating said picture layer is bonded in said going up on the base board.Also comprise after being bonded on said picture layer on the said upward base board in the said step 3, prune the said picture layer of going up on the base board.Also comprise before the said step 4:, form lower plate the moulding of lower plate substrate cut.
For realizing above-mentioned purpose, the invention provides a kind of manufacturing approach of photo frame, the manufacturing approach of said photo frame specifically comprises:
Step 1 with the base material excision forming, forms the photo frame baseplate substrate;
Step 2 is compounded in high optical material layer on the picture, forms picture layer;
Step 3 is bonded on said picture layer on the said baseplate substrate, forms photo frame.
Also comprise in the said step 1, the edges of boards of said baseplate substrate are repaiied hypotenuse, with the plate angle cavetto arc of said baseplate substrate.In the said step 2 high optical material layer is compounded on the picture layer and is specially: utilize no shadow glue that high optical material layer is bonded on the picture.In the said step 3 said picture layer is bonded on the said baseplate substrate and is specially: said picture layer is bonded in said going up on the base board through heating.
The manufacturing approach of photograph album of the present invention and photo frame; Because at first, engage with last base board or baseplate substrate again, therefore effectively reduce the possibility of bubble with high optical material layer and figure chip bonding; Make that thus yield rate increases greatly, thereby effectively reduced the average manufacturing cost of photograph album and photo frame.
Description of drawings
Fig. 1 is the flow chart of the manufacturing approach of photograph album of the present invention;
Fig. 2 is the flow chart of the manufacturing approach of photo frame of the present invention.
The specific embodiment
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
The manufacturing approach of photograph album of the present invention and photo frame is made amendment existing manufacturing approach, earlier high optical material layer is compounded on the picture, rejoins on substrate, thereby improves the generation that yield rate reduces bubble.
Fig. 1 is the flow chart of the manufacturing approach of photograph album of the present invention, and as shown in the figure, the manufacturing approach of photograph album of the present invention specifically comprises the steps:
Step 101 with the base material excision forming, forms base board on the photograph album;
The normal conditions photograph album has upper plate and lower plate, and this step is the basis of making upper plate, and the material of last base board can be plank or the like.In base material when cutting, can be cut into regular shape, also can be cut into abnormal shape, and therefore not limitting of the shape of cutting is as long as cut just passable as required.After cutting, can also further process and modify last base board, for example will go up the edges of boards of base board and repair hypotenuse, to the plate angle cavetto arc of last base board, can be so that the upper plate substrate be more beautiful and practicality more.Through this step, last base board is just made and has been accomplished.
Step 102 is compounded in high optical material layer on the picture, forms picture layer;
Picture can be normal photograph, also can be other print media, so long as picture is just passable, and not restriction.The effect one of high optical material layer is to make picture more beautiful, the 2nd, picture is played a protective role.Concrete high luminescent material can be the minute surface emitting layer, also can be the dulling material of diffuse reflector, and the thickness of material is 0.25 to 0.45 millimeter.
The complex method of high luminescent material and picture has a lot, for example utilizes no shadow glue that high optical material layer is bonded on the picture or the like, also can utilize water-base cement.
Step 103 is bonded on picture layer on the base board and forms upper plate;
This step engages picture layer exactly with last base board, joint method has a lot, can picture layer be bonded on the base board through heating; Can utilize heating, malleation and negative pressure mode, gluing on last base board is bonded in picture layer on the base board then.So just make and accomplished upper plate.
If the shape of picture layer and last base board is not in full accord, also need prune the picture layer on the base board.Utilize method of the present invention, make upper plate substrate front side and side can be coated with picture layer.
Existing method is first with picture and upper plate substrate bonded, and then high luminescent material is bonded on the picture, and such mode yield rate is lower, because it is very big to produce the probability of bubble, causes substandard products; And the present invention is first with high luminescent material and figure chip bonding, and then is combined on the base board, greatly reduces the generation probability of bubble thus.
Step 104 is made lower plate;
The manufacturing approach of lower plate has a lot, if desired with the identical effect of upper plate, and then can be just the same with the manufacturing approach of upper plate; Also can make more fairly simplely,, form lower plate the moulding of lower plate substrate cut.After cutting, can also further process and modify following base board, for example will descend the edges of boards of base board to repair hypotenuse, to the plate angle cavetto arc of following base board.
Step 105 utilizes the book back to be bonded into photograph album upper plate and lower plate;
This step is to make last step of photograph album, utilizes the book back to engage upper plate and lower plate, for example can be bonding mode, has so just formed photograph album.
Utilize the manufacturing approach of photograph album of the present invention; Because,, therefore effectively reduce the possibility of bubble again with the upper plate substrates at first with high optical material layer and figure chip bonding; Make that thus yield rate increases greatly, thereby effectively reduced the average manufacturing cost of photograph album.
Fig. 2 is the flow chart of the manufacturing approach of photo frame of the present invention, and as shown in the figure, the manufacturing approach of photo frame of the present invention specifically comprises the steps:
Step 201 with the base material excision forming, forms the photo frame baseplate substrate;
The normal conditions photo frame has base plate, and this step is the basis of making base plate, and the material of baseplate substrate can be plank or the like.In base material when cutting, can be cut into regular shape, also can be cut into abnormal shape, and therefore not limitting of the shape of cutting is as long as cut just passable as required.After cutting, can also further process and modify baseplate substrate, for example the edges of boards of baseplate substrate are repaiied hypotenuse, to the plate angle cavetto arc of baseplate substrate, can be so that baseplate substrate be more beautiful and practicality more.Through this step, baseplate substrate is just made and has been accomplished.
Step 202 is compounded in high optical material layer on the picture, forms picture layer;
Picture can be normal photograph, also can be other print media, so long as picture is just passable, and not restriction.The effect one of high optical material layer is to make picture more beautiful, the 2nd, picture is played a protective role.Concrete high luminescent material can be the minute surface emitting layer, also can be the dulling material of diffuse reflector, and the thickness of material is 0.25 to 0.45 millimeter.
The complex method of high luminescent material and picture has a lot, for example utilizes no shadow glue that high optical material layer is bonded on the picture or the like, also can utilize water-base cement.
Step 203 is bonded on picture layer and forms photo frame on the baseplate substrate;
This step engages picture layer exactly with baseplate substrate, joint method has a lot, can picture layer be bonded on the baseplate substrate through heating; Can utilize heating, malleation and negative pressure mode, gluing on baseplate substrate is bonded in picture layer on the baseplate substrate then.So just make and accomplished photo frame.
If the shape of picture layer and baseplate substrate is not in full accord, also need prune the picture layer on the baseplate substrate.Utilize method of the present invention, make baseplate substrate front and side can be coated with picture layer.
Existing method is earlier picture to be combined with baseplate substrate, and then high luminescent material is bonded on the picture, and such mode yield rate is lower, because it is very big to produce the probability of bubble, causes substandard products; And the present invention is first with high luminescent material and figure chip bonding, and then is combined on the baseplate substrate, greatly reduces the generation probability of bubble thus, thereby has improved yield rate, so effectively reduce average manufacturing cost.
The above-described specific embodiment; The object of the invention, technical scheme and beneficial effect have been carried out further explain, and institute it should be understood that the above is merely the specific embodiment of the present invention; And be not used in qualification protection scope of the present invention; All within spirit of the present invention and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. the manufacturing approach of a photograph album is characterized in that, the manufacturing approach of said photograph album specifically comprises:
Step 1 with the base material excision forming, forms base board on the photograph album;
Step 2 is compounded in high optical material layer on the picture, forms picture layer;
Step 3 is bonded on said going up on the base board with said picture layer, forms upper plate;
Step 4 utilizes the book back to be bonded into photograph album said upper plate and lower plate.
2. the manufacturing approach of photograph album according to claim 1 is characterized in that, also comprises in the said step 1, and the said edges of boards of going up base board are repaiied hypotenuse, with the said plate angle cavetto arc of going up base board.
3. the manufacturing approach of photograph album according to claim 1 is characterized in that, in the said step 2 high optical material layer is compounded on the picture to be specially: utilize no shadow glue that said high optical material layer is bonded on the said picture.
4. the manufacturing approach of photograph album according to claim 1 is characterized in that, in the said step 3 said picture layer is bonded on said going up on the base board and is specially: through heating said picture layer is bonded in said going up on the base board.
5. the manufacturing approach of photograph album according to claim 1 is characterized in that, in the said step 3 said picture layer is bonded on saidly also to comprise after going up on the base board, prunes said on picture layer on the base board.
6. the manufacturing approach of photograph album according to claim 1 is characterized in that, also comprises before the said step 4: with the moulding of lower plate substrate cut, form lower plate.
7. the manufacturing approach of a photo frame is characterized in that, the manufacturing approach of said photo frame specifically comprises:
Step 1 with the base material excision forming, forms the photo frame baseplate substrate;
Step 2 is compounded in high optical material layer on the picture, forms picture layer;
Step 3 is bonded on said picture layer on the said baseplate substrate, forms photo frame.
8. the manufacturing approach of photograph album according to claim 7 is characterized in that, also comprises in the said step 1, and the edges of boards of said baseplate substrate are repaiied hypotenuse, with the plate angle cavetto arc of said baseplate substrate.
9. the manufacturing approach of photograph album according to claim 7 is characterized in that, in the said step 2 high optical material layer is compounded on the picture layer to be specially: utilize no shadow glue that high optical material layer is bonded on the picture.
10. the manufacturing approach of photograph album according to claim 1 is characterized in that, in the said step 3 said picture layer is bonded on the said baseplate substrate to be specially: through heating said picture layer is bonded in said going up on the base board.
CN2011101530232A 2011-06-09 2011-06-09 Manufacturing method for albums and photo frames Pending CN102815119A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011101530232A CN102815119A (en) 2011-06-09 2011-06-09 Manufacturing method for albums and photo frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101530232A CN102815119A (en) 2011-06-09 2011-06-09 Manufacturing method for albums and photo frames

Publications (1)

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CN102815119A true CN102815119A (en) 2012-12-12

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Family Applications (1)

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CN2011101530232A Pending CN102815119A (en) 2011-06-09 2011-06-09 Manufacturing method for albums and photo frames

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2264660Y (en) * 1996-12-27 1997-10-15 吕基丰 Inner page structure of photo album
CN2501689Y (en) * 2001-09-07 2002-07-24 富洋田广告有限公司 Integral photo album structure
US20060022450A1 (en) * 2004-08-02 2006-02-02 Kleissler Charles R Album page for displaying planar articles
CN2784209Y (en) * 2005-05-19 2006-05-31 徐永基 Transparent waterproof image structure
CN2836643Y (en) * 2005-08-29 2006-11-15 张子东 Integral crystal picture frame
CN200981402Y (en) * 2006-11-20 2007-11-28 上海集思堂工艺品有限公司 Page structure of photograph album with false proof sign, water-proof and scrape-proof function
US20100007128A1 (en) * 2006-11-06 2010-01-14 Guido Peleman Leaf for the composition of a photo album and photo album provided with such a leaf
CN101954832A (en) * 2010-08-31 2011-01-26 于长馨 Method for mounting pictures or photographs

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2264660Y (en) * 1996-12-27 1997-10-15 吕基丰 Inner page structure of photo album
CN2501689Y (en) * 2001-09-07 2002-07-24 富洋田广告有限公司 Integral photo album structure
US20060022450A1 (en) * 2004-08-02 2006-02-02 Kleissler Charles R Album page for displaying planar articles
CN2784209Y (en) * 2005-05-19 2006-05-31 徐永基 Transparent waterproof image structure
CN2836643Y (en) * 2005-08-29 2006-11-15 张子东 Integral crystal picture frame
US20100007128A1 (en) * 2006-11-06 2010-01-14 Guido Peleman Leaf for the composition of a photo album and photo album provided with such a leaf
CN200981402Y (en) * 2006-11-20 2007-11-28 上海集思堂工艺品有限公司 Page structure of photograph album with false proof sign, water-proof and scrape-proof function
CN101954832A (en) * 2010-08-31 2011-01-26 于长馨 Method for mounting pictures or photographs

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Application publication date: 20121212