CN102807374A - Solder resist for high-temperature co-fired multilayer ceramic and preparation method of solder resist - Google Patents
Solder resist for high-temperature co-fired multilayer ceramic and preparation method of solder resist Download PDFInfo
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- CN102807374A CN102807374A CN2012102423270A CN201210242327A CN102807374A CN 102807374 A CN102807374 A CN 102807374A CN 2012102423270 A CN2012102423270 A CN 2012102423270A CN 201210242327 A CN201210242327 A CN 201210242327A CN 102807374 A CN102807374 A CN 102807374A
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Abstract
The invention relates to a solder resist for high-temperature co-fired multilayer ceramic. The solder resist for the high-temperature co-fired multilayer ceramic consists of organic powder and organic carriers. The organic powder consists of main body solder resisting materials and firing aids. The main body solder resisting materials consist of one or more of aluminum oxide, magnesium oxide and zirconium oxide. The firing aids consist of a plurality of compounds which at least contain one element of calcium, magnesium, aluminum and silicon and are mixed according to certain proportions. The organic carriers consist of mixed solvent, binder, dispersing agent, thixotropic agent and coloring agent, wherein the mixed solvent is made of ethanol and terpineol according to certain proportions; and the binder is made of at least one of polyvinyl butyral, polypropylene carbonate and ethyl cellulose. The invention additionally discloses a preparation method of the solder resist. The solder resist disclosed by the invention has the advantages that the cost of raw materials is low, the preparation process is simple, a multilayer ceramic processing technology and a high-temperature co-firing technology are compatible with each other, the solder resisting effect is good, the strength of bonding between a solder resisting coating layer and a ceramic substrate is high, the thermal expansion matching performance is good and the salt mist is resisted.
Description
Technical field
The present invention relates to a kind of solder resist, specifically, is a kind of solder resist that is applied to the high temperature co-firing multilayer ceramic.The present invention discloses its preparation method.
Background technology
The high temperature co-firing multilayer ceramic is the important technology in Electronic Packaging field; Through forming with the metallization communicating aperture that runs through pottery and be electrically connected having printed metallization figure on the ceramic matrix of multilayered structure; At high temperature carry out common burning, obtain highly reliable ceramic packing.Based on the design of electrical property, need hinder weldering to some zone of high temperature co-firing multilayer ceramic, stop the coating growth, the trickling of control scolder.Solder resist main body solder resist material commonly used is an organic materials, can only on the ripe porcelain after accomplishing high temperature co-firing, use, and has big limitation on the technology.And use the bonding force of the field of highly reliable ceramic packing to solder mask, erosion resistance has higher requirements, and organic solder resist commonly used is difficult to satisfy.
Summary of the invention
Goal of the invention: the object of the present invention is to provide a kind of bonding force strong, the solder resist of corrosion resistance simultaneously, the invention provides the preparation method of this kind solder resist.
Technical scheme: the present invention realizes through following technique means: a kind of solder resist that is applied to the high temperature co-firing multilayer ceramic, constitute by inorganic powder and organic carrier, and said inorganic powder is made up of main body solder resist material and sintering agent; The main body solder resist material is made up of in aluminum oxide, Natural manganese dioxide, the zirconium white one or more, and sintering agent mixes by a certain percentage and forms by containing in calcium, magnesium, aluminium, the silicon a kind of several kinds of compounds of element at least; Organic carrier is formed mixed solvent by a certain percentage, is formed with polyvinyl butyral, a kind of sticker of processing and the dispersion agent, thixotropic agent, the tinting material that gather in propylene carbonate, the TKK 021 at least by ethanol, Terpineol 350.
Said sintering agent is no more than 5% of inorganic powder quality total amount, and dispersion agent, thixotropic agent, tinting material are no more than 5% of organic composition total amount.
A kind of preparation method of high temperature co-firing multilayer ceramic solder resist may further comprise the steps:
1) inorganic powder preparation: the main body solder resist material is mixed, grinds with sintering agent;
2) organic carrier preparation: mixed solvent, sticker, dispersion agent, thixotropic agent, tinting material are stirred;
3) slurry ball milling: inorganic powder is mixed with organic carrier, obtain finished product behind the ball milling.
The median particle diameter of the inorganic powder after the grinding is at 1 to 10 μ m, and specific surface area is at 2m
2More than/the g.
Organic carrier prepares through the mode of heated and stirred.
Inorganic powder that accounts for total amount 62% to 78% and surplus organic carrier are formed stable solder resist slurry through ball milling.
Beneficial effect: said solder resist raw materials cost is low, and the preparation process is simple, compatible multilayer ceramic complete processing of ability and high temperature co-firing technology, and the resistance weldering is effective, and resistance welding coating and ceramic matrix bonding strength are high, thermal expansion matching, salt spray resistance.
Embodiment
Carry out concrete detailed description in the face of technical scheme of the present invention down:
High temperature co-firing multilayer ceramic solder resist of the present invention is applicable to the alumina-ceramic to be the high temperature co-firing multilayer ceramic of matrix.Said solder resist is made up of inorganic powder and organic carrier; Inorganic powder is made up of main body solder resist material and the sintering agent that is no more than inorganic components total amount 5%, and the main body solder resist material is made up of in aluminum oxide, Natural manganese dioxide, the zirconium white one or more; Sintering agent is mixed by 1:2:2:1 by several kinds of compounds that contain a kind of element in calcium, magnesium, aluminium, the silicon at least and forms.Described organic carrier comprises mixed solvent, sticker, dispersion agent, thixotropic agent and tinting material; Mixed solvent is mixed by 3:7 by ethanol, Terpineol 350; Sticker at least with polyvinyl butyral, gather a kind of the processing in propylene carbonate, the TKK 021, described powder, thixotropic agent, tinting material are no more than 5% of organic composition total amount.
The present invention discloses the preparation process of above-mentioned solder resist, comprise following three steps:
1, powder prepares: amass through the inorganic powder raw material of selecting median particle diameter 2 to 15 μ m and join, use the liquid phase ball-milling technology to obtain and mix, particle diameter is at the powder of certain limit class.Among the present invention, the median particle diameter of the inorganic powder after the grinding is at 1 to 10 μ m, and specific surface area is at 2m
2More than/the g.
2, organic carrier preparation: mixed solvent, sticker, dispersion agent, thixotropic agent, tinting material are prepared through the mode of heated and stirred;
3, slurry ball milling: by a certain percentage inorganic powder and organic carrier are formed stable solder resist slurry through ball milling, among the present invention, inorganic powder that accounts for total amount 62% to 78% and surplus organic carrier are formed stable solder resist slurry through ball milling.
Solder resist according to the invention can form required figure through the method for silk screen printing, some glue, manual application on the high temperature co-firing multilayer ceramic; In the high temperature co-firing process of multilayer ceramic, the organic carrier composition of solder resist through volatilization, decompose to discharge, the main body resistance is welded into branch and under the sintering agent effect, forms and have the coating of certain figure; This coating has intercepted the growth of coating in the follow-up electroplating process of multilayer ceramic, in brazing process, do not soak into silver-copper brazing alloy commonly used, realizes hindering the weldering effect with this.
Claims (6)
1. solder resist that is applied to the high temperature co-firing multilayer ceramic, it is characterized in that: be made up of inorganic powder and organic carrier, said inorganic powder is made up of main body solder resist material and sintering agent; The main body solder resist material is made up of in aluminum oxide, Natural manganese dioxide, the zirconium white one or more, and sintering agent is mixed by 1:2:2:1 by several kinds of compounds that contain a kind of element in calcium, magnesium, aluminium, the silicon at least and forms; Organic carrier is formed mixed solvent, forms with polyvinyl butyral, a kind of sticker of processing and the dispersion agent, thixotropic agent, the tinting material that gather in propylene carbonate, the TKK 021 at least by 3:7 by ethanol, Terpineol 350.
2. a kind of solder resist that is applied to the high temperature co-firing multilayer ceramic according to claim 1 is characterized in that: said sintering agent is no more than 5% of inorganic powder quality total amount, and dispersion agent, thixotropic agent, tinting material are no more than 5% of organic composition total amount.
3. preparation method of high temperature co-firing multilayer ceramic solder resist according to claim 1 is characterized in that: may further comprise the steps:
1) inorganic powder preparation: the main body solder resist material is mixed, grinds with sintering agent;
2) organic carrier preparation: mixed solvent, sticker, dispersion agent, thixotropic agent, tinting material are stirred;
3) slurry ball milling: inorganic powder is mixed with organic carrier, obtain finished product behind the ball milling.
4. the preparation method of solder resist according to claim 3, it is characterized in that: the median particle diameter of the inorganic powder after the grinding is at 1 to 10 μ m, and specific surface area is at 2m
2More than/the g.
5. the preparation method of solder resist according to claim 3, it is characterized in that: organic carrier prepares through the mode of heated and stirred.
6. the preparation method of solder resist according to claim 3, it is characterized in that: the inorganic powder and the surplus organic carrier that will account for total amount 62% to 78% form stable solder resist slurry through ball milling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210242327.0A CN102807374B (en) | 2012-07-12 | 2012-07-12 | Solder resist for high-temperature co-fired multilayer ceramic and preparation method of solder resist |
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|---|---|---|---|
| CN201210242327.0A CN102807374B (en) | 2012-07-12 | 2012-07-12 | Solder resist for high-temperature co-fired multilayer ceramic and preparation method of solder resist |
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| CN102807374A true CN102807374A (en) | 2012-12-05 |
| CN102807374B CN102807374B (en) | 2014-09-24 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103224389A (en) * | 2013-04-19 | 2013-07-31 | 天津大学 | Lead-free electrostrictive ceramic based on barium titanate, and preparation method thereof |
| CN107877037A (en) * | 2017-12-04 | 2018-04-06 | 温州宏丰电工合金股份有限公司 | A kind of stop-off gent for titanium alloy vacuum brazing |
| CN108044259A (en) * | 2017-12-01 | 2018-05-18 | 温州宏丰电工合金股份有限公司 | A kind of preparation method of stop-off gent for stainless-steel vacuum soldering |
| CN108067765A (en) * | 2017-12-02 | 2018-05-25 | 温州宏丰电工合金股份有限公司 | A kind of preparation method for the stop-off gent for protecting small pore passage structure in vacuum brazing |
| CN108080816A (en) * | 2017-12-04 | 2018-05-29 | 温州宏丰电工合金股份有限公司 | A kind of preparation method of stop-off gent for titanium alloy vacuum brazing |
| CN108098093A (en) * | 2017-12-01 | 2018-06-01 | 温州宏丰电工合金股份有限公司 | A kind of stop-off gent for stainless-steel vacuum soldering |
| CN109524310A (en) * | 2018-10-11 | 2019-03-26 | 中国电子科技集团公司第四十三研究所 | A kind of ltcc substrate cofiring welding resistance layer manufacturing method thereof |
| CN110293339A (en) * | 2019-07-06 | 2019-10-01 | 佛山市创渡科技有限公司 | A kind of aqueous solder resist and preparation method thereof |
| CN111545951A (en) * | 2020-06-29 | 2020-08-18 | 王莹 | High-temperature-resistant welding stopper |
| CN115124351A (en) * | 2022-07-18 | 2022-09-30 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
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| EP0393226A1 (en) * | 1989-04-21 | 1990-10-24 | NHK SPRING CO., Ltd. | A method of manufacturing ceramic products, in particular, a method of manufacturing ceramic springs |
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| CN102249724A (en) * | 2011-04-06 | 2011-11-23 | 上海远登环保科技发展有限公司 | Low temperature co-fired porous ceramic electrode protective layer slurry and preparation method thereof |
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| EP0393226A1 (en) * | 1989-04-21 | 1990-10-24 | NHK SPRING CO., Ltd. | A method of manufacturing ceramic products, in particular, a method of manufacturing ceramic springs |
| KR20000010218A (en) * | 1998-07-31 | 2000-02-15 | 유철진 | Ceramic carrier and preparation method thereof |
| US6287510B1 (en) * | 1999-11-23 | 2001-09-11 | Corning Incorporated | Method of firing green structures containing organics |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103224389A (en) * | 2013-04-19 | 2013-07-31 | 天津大学 | Lead-free electrostrictive ceramic based on barium titanate, and preparation method thereof |
| CN108044259B (en) * | 2017-12-01 | 2020-04-03 | 温州宏丰电工合金股份有限公司 | Preparation method of flow resisting agent for stainless steel vacuum brazing |
| CN108044259A (en) * | 2017-12-01 | 2018-05-18 | 温州宏丰电工合金股份有限公司 | A kind of preparation method of stop-off gent for stainless-steel vacuum soldering |
| CN108098093B (en) * | 2017-12-01 | 2020-04-03 | 温州宏丰电工合金股份有限公司 | Flow resisting agent for stainless steel vacuum brazing |
| CN108098093A (en) * | 2017-12-01 | 2018-06-01 | 温州宏丰电工合金股份有限公司 | A kind of stop-off gent for stainless-steel vacuum soldering |
| CN108067765A (en) * | 2017-12-02 | 2018-05-25 | 温州宏丰电工合金股份有限公司 | A kind of preparation method for the stop-off gent for protecting small pore passage structure in vacuum brazing |
| CN107877037B (en) * | 2017-12-04 | 2020-02-21 | 温州宏丰电工合金股份有限公司 | Flow resisting agent for titanium alloy vacuum brazing |
| CN108080816A (en) * | 2017-12-04 | 2018-05-29 | 温州宏丰电工合金股份有限公司 | A kind of preparation method of stop-off gent for titanium alloy vacuum brazing |
| CN107877037A (en) * | 2017-12-04 | 2018-04-06 | 温州宏丰电工合金股份有限公司 | A kind of stop-off gent for titanium alloy vacuum brazing |
| CN108080816B (en) * | 2017-12-04 | 2020-05-19 | 温州宏丰电工合金股份有限公司 | Preparation method of flow resisting agent for titanium alloy vacuum brazing |
| CN109524310A (en) * | 2018-10-11 | 2019-03-26 | 中国电子科技集团公司第四十三研究所 | A kind of ltcc substrate cofiring welding resistance layer manufacturing method thereof |
| CN110293339A (en) * | 2019-07-06 | 2019-10-01 | 佛山市创渡科技有限公司 | A kind of aqueous solder resist and preparation method thereof |
| CN111545951A (en) * | 2020-06-29 | 2020-08-18 | 王莹 | High-temperature-resistant welding stopper |
| CN111545951B (en) * | 2020-06-29 | 2021-09-24 | 王莹 | High-temperature-resistant welding stopper |
| CN115124351A (en) * | 2022-07-18 | 2022-09-30 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
| CN115124351B (en) * | 2022-07-18 | 2023-10-20 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
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|---|---|
| CN102807374B (en) | 2014-09-24 |
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