CN102804012A - Methods for passively aligning opto-electronic component assemblies on substrates - Google Patents
Methods for passively aligning opto-electronic component assemblies on substrates Download PDFInfo
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- CN102804012A CN102804012A CN2010800430103A CN201080043010A CN102804012A CN 102804012 A CN102804012 A CN 102804012A CN 2010800430103 A CN2010800430103 A CN 2010800430103A CN 201080043010 A CN201080043010 A CN 201080043010A CN 102804012 A CN102804012 A CN 102804012A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Wire Bonding (AREA)
- Electroluminescent Light Sources (AREA)
- Photovoltaic Devices (AREA)
Abstract
A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.
Description
Background technology
The benefit of priority that No. the 61/563rd, 449, the U.S. Patent application that the application required submit on 09 21st, 2009 according to 35USC 119 (e).
Technical background
The optoelectronic components assembly all has multiple application at consumer electronics and industrial electronic.For example, the semiconductor laser diode of visible emitting can be used for sensor, HIGH-DENSITY OPTICAL STORAGE device and the projection display.In addition, the high-power semiconductor laser diode can be used in materials processing application, patient treatment system and the free-space communication system.Except semiconductor laser diode, this device also can comprise other optoelectronic components, such as lens, waveguide and/or can produce desired light from the device that comprises it and export needed various other optoelectronic components.
The optoelectronic components assembly can be attached to or be welded to metal or ceramic substrate usually to form sub-component.This sub-component can be included in Electronic Packaging then, and here, sub-component is aimed at other sub-components and Electronic Packaging itself.In order to ensure the appropriate function of the device that is obtained, when making up sub-component, need be with optoelectronic components assembly and substrate alignment.Required alignment accuracy can be depending on particular application change.For example, use for some, required alignment accuracy can be tens of micron dimensions between photoelectron subassembly and substrate, and uses for other, and required alignment accuracy can be less than 1 micron.
Therefore, exist improvement and be aligned in method on the substrate to realize needed alignment accuracy with the optoelectronic components sub-component is passive.
Technical field
This instructions generally relates to the method that is used for the alignment optical element, and more particularly, relates to the method for optoelectronic components assembly alignment on substrate.
Summary of the invention
According to an embodiment, be used for that optoelectronic components assembly (OECA) is aligned in method on the substrate and comprise substrate alignment is aligned in substrate on the assembling surface and with OECA, make the OECA aligning surface of winning outstanding from the first substrate alignment face.After this, substrate and OECA are advanced towards the surface of contact of the first assembling aligning guide, make the surface of contact that the first substrate alignment face and first is assembled aligning guide after the surface of contact that an OECA aligning surface and first is assembled aligning guide contacts contact.When the surface of contact of an OECA aligning surface and the first assembling aligning guide when contact OECA be shifted with respect to the first substrate alignment face, and the substrate continuation moves towards surface of contact, thus with the OECA on the substrate with respect to the first substrate alignment face.Between the surface of contact of the first substrate alignment face and the first assembling aligning guide to contact can be 2 contacts, this restriction substrate is in the motion of the above degree of freedom in the surperficial upper edge of assembling.Similarly, between the surface of contact of an OECA aligning surface and the first assembling aligning guide to contact can be 2 contacts, this restriction optoelectronic components assembly is in the motion of the above degree of freedom in substrate upper edge.
In another embodiment; Be used for the method that optoelectronic components assembly (OECA) is aligned on the substrate is comprised substrate orientation on the assembling surface; Make the substrate alignment face contact, and OECA is positioned at makes OECA on the substrate along the first direction rough alignment with the surface of contact of assembling aligning guide.After this, OECA advances towards the surface of contact of assembling aligning guide,, thus OECA is aligned on the substrate along second direction with till the surface of contact of assembling aligning guide contacts up to the OECA of OECA aligning surface.Between the surface of contact of the first substrate alignment face and the first assembling aligning guide to contact be 2 contacts, this restriction substrate is in the motion of the above degree of freedom in the surperficial upper edge of assembling.Similarly, between the surface of contact of an OECA aligning surface and the first assembling aligning guide to contact be 2 contacts, this restriction OECA is in the motion of the above degree of freedom in substrate upper edge.
To in following detailed description, set forth supplementary features of the present invention and advantage; These feature and advantage will be conspicuous according to this description to a certain extent for a person skilled in the art, perhaps through implementing to comprise that the embodiment as herein described of following detailed description, claims and accompanying drawing can recognize.
Should be understood that above general description and following detailed description have been described various embodiment, and they aim to provide essence and the general survey or the framework of characteristic that is used to understand the protection theme that requires.Included accompanying drawing is used to the further understanding to each embodiment is provided, and is incorporated in this instructions and constitutes its part.Accompanying drawing illustrates each embodiment as herein described, and with this description be used to explain require the protection theme principle and operation.
Brief Description Of Drawings
Fig. 1 illustrate according to shown in this paper with the sub-component that is used for optical package of described at least one embodiment, comprise substrate and optoelectronic components;
Fig. 2 illustrate according to shown in this paper with being used for of described at least one embodiment with the passive aligning equipment of aiming at of optoelectronic components assembly and substrate;
Fig. 3 A-3C illustrates according to the aligning equipment of use Fig. 2 of described at least one embodiment optoelectronic components being aligned in the method on the substrate shown in this paper;
Fig. 4 illustrate according to shown in this paper with described at least one embodiment, before optoelectronic components assembly and substrate alignment, the relative orientation of substrate, photoelectricity part assembly and aligning equipment;
Fig. 5 illustrate according to shown in this paper with described at least one embodiment, be used for surface of contact towards the assembling aligning guide the advance aligning equipment and the detent mechanism of substrate and optoelectronic components assembly;
Fig. 6 A illustrates the relative orientation of assembling aligning guide with described at least one embodiment substrate, photoelectricity part assembly, the first assembling aligning guide and second according to shown in this paper; Wherein, the photoelectric subassembly parts are aligned on the substrate along first direction and second direction;
Fig. 6 B illustrate according to shown in this paper with being used for along both direction of described at least one embodiment with two aligning equipments on the optoelectronic components assembly alignment substrate; And
Fig. 7 schematically show according to shown in this paper with being used for of described at least one embodiment with the method for optoelectronic components assembly alignment on substrate.
Embodiment
Fig. 1 always illustrates the sub-component that is used for according to the optical package of described method aligning.This sub-component always comprises the optoelectronic components assembly that is positioned on the substrate.This optoelectronic components assembly through with substrate orientation on the assembling surface and with the optoelectronic components assembly be placed on the substrate and and substrate alignment.This substrate is advanced till substrate and optoelectronic components assembly and the first assembling aligning guide contacts towards the first assembling aligning guide along assembling is surperficial then.Detailed reference is used for each embodiment with the method for optoelectronic components assembly alignment on substrate, the example of each embodiment shown in the drawings.Whenever and wherever possible, in institute's drawings attached, use identical Reference numeral to represent identical or similar part.
With reference to Fig. 1, the schematically illustrated sub-component 100 that is used for optical package.This sub-component 100 always comprises substrate 102 and optoelectronic components assembly (OECA) 110.In one embodiment, OECA110 comprises waveguiding structure or the similar waveguiding structure such as semiconductor laser diode.For example, OECA110 can comprise distribution Bragg reflector (DBR) laser instrument that can operate with the output beam of coherent light of sending the 1060nm wavelength.In other embodiment as herein described, OECA110 comprises the Wavelength converter such as photonic crystal.For example, OECA110 can comprise that periodically poled lithium niobate (PPLN) the second harmonic generator (SHG) photonic crystal maybe can operate will import the similar crystal that beam of coherent light converts the high-order harmonic wave output beam to.OECA110 generally includes at least one OECA aligning surface 112, this at least one OECA aligning surface 112 can operate with the surface, be preferably flat surfaces and form at 2 and contact.In the embodiment of optoelectronic architecture shown in Figure 1, OECA aligning surface 112 is smooth facets, such as input facet or output facet.But, should be appreciated that in other embodiments OECA aligning surface 112 can be the edge, such as intersecting the edge that forms by two surfaces of OECA110.
Location and aligning have the substrate 102 of OECA110 to generally include the plate that is made up of metal or stupalith above.In embodiment as herein described, substrate 102 is made up of steel alloy.But in other embodiments, substrate 102 can be made up of different-alloy, stupalith or organic material.There were flat top surface 104, the lower surface 106 of OECA110 and a plurality of sides 107,108,109 of between top surface 104 and lower surface 106, extending in the location above the substrate of this embodiment roughly comprised.Substrate 102 generally includes at least one substrate alignment face 120, and this at least one substrate alignment face 120 can form at 2 with flat surfaces and contact.For example, in the embodiment shown in fig. 1, substrate 102 is rectangular slabs, and substrate alignment face 120 is sides (for example the side 108) of rectangular slab, and it is smooth making the substrate alignment face 120 of winning.
Although it is smooth that this paper has been described as the first substrate alignment face 120, the first substrate alignment face 120 that should be appreciated that also can have other structure.For example, this substrate one side that can form substrate has the wedge or the similar projections of extending from a side of substrate and can operate to form substrate and contacts with line between the flat surfaces.Perhaps, the first substrate alignment face 120 can be the edge of substrate 102.
The top surface 104 of substrate 102 comprises the liner 122 of binding material so that OECA110 is bonded to substrate 102 behind aligning.For example, binding material can comprise the scolder or the polymeric material that can adhere to substrate 102 and OECA110.
Existing with reference to Fig. 2 and 3A, the aligning equipment 200 that schematically illustrated A110 aims at substrate 102.Aligning equipment 200 roughly comprises assembling the surface 202 and first assembling aligning guide 204 that is arranged in the apparatus body 206.Shown in this paper with described embodiment in, apparatus body 206 is processed by aluminium alloy.But, should be appreciated that apparatus body 206 can be by various other metal or alloy or processed by other material that comprises pottery, carbon and/or glass.
Assembling the surface 202 and first assembling aligning guide 204 is general planar; And the extension of the length L of upper edge, the relative both sides apparatus body 206 of the V-shaped groove 203 that in apparatus body 206, forms, the surface of contact 208 that making the assembling aligning guide 204 of winning is towards assembling surface 202.Angle [alpha] between surface of contact 208 and the assembling surface 202 can be about 60 ° to about 120 °, thereby realizes desired orientation between OECA and the substrate, as this paper incites somebody to action in greater detail.The semi-cylindrical canyon passage 210 that the summit that the aligning equipment 200 of Fig. 2 and 3A also is included in V-shaped groove is formed in the apparatus body 206 and extends along the length L of mounting equipment.Recess channel 210 be convenient to substrate on the summit of V-shaped groove directly against the first assembling aligning guide.
In the embodiment of the aligning equipment shown in Fig. 2 200, assembling surface 202 is integrally formed with apparatus body 206.But in another embodiment (not shown), assembling surface 202 can comprise material piece or the plate of material that is permanently attached to apparatus body 206 with bonding agent, scolder, securing member etc.In addition, in the embodiment shown in Figure 2, assembling surface 202 comprises a plurality of separators 212 that the assembling surface are divided into a plurality of grooves 214.Separator 212 can be integrally formed with assembling surface 202, or alternatively, can be the discreet component that is permanently attached to the assembling surface with bonding agent, scolder or securing member.
Although the embodiment of aligning equipment shown in Figure 2 200 comprises the assembling surface 202 that is divided into a plurality of grooves 214 with separator 212; But in other embodiment (not shown); Assembling surface 202 does not comprise separator (for example, the assembling surface is the continuous surface along the length L of aligning equipment).
Still with reference to Fig. 2 and 3A, in one embodiment, the first assembling aligning guide 204 is the glass plates that are positioned on V-shaped groove 203 1 sides.Glass plate prevents OECA110, and more specifically prevents it is to be bonded to aligning equipment 200 during being used for the binding material that OECA is attached to substrate is aligned to the process of substrate at OECA.Glass plate also is provided for OECA is aligned in the general planar surface in contact on the substrate.Surface of contact 208 is preferably smooth and smooth, has no undesired particle or dirt.Surface flatness should be preferably less than 25 μ m, more preferably less than 10 μ m and even more preferably less than 1 μ m.Glass plate remains in the V-shaped groove 203 with vacuum source 216, and vacuum source 216 is via being formed on vacuum ports 218 fluid coupled in the apparatus body 206 to V-shaped groove.Aspiration vacuum on vacuum ports is pumped to glass plate one side of V-shaped groove 203.In the alternate embodiment (not shown), glass plate can be removably attached to V-shaped groove with one or more clips or the securing member of being convenient to remove and change glass plate.
Comprise glass plate although this paper has described this first assembling aligning guide 204, should be appreciated that the first assembling aligning guide alternately comprises the plate that is formed by stupalith and/or carbon.In more another embodiment, the first assembling aligning guide 204 can be formed in the aligning equipment 200, especially when aligning equipment is formed by carbon, stupalith or glass.
With reference to Fig. 3 A, in one embodiment, aligning equipment 200 also comprises the vibration source 220 that is permanently attached to apparatus body 206.Vibration source 220 can comprise the ultrasonic transducer that is made up of piezoelectric or give energy of vibration to similar source to aligning equipment.In Fig. 3 A illustrated embodiment, the side 222 adjacent that vibration source 220 is attached to apparatus body 206 with assembling surface 202.But in other embodiments, vibration source may be attached to a side 224 adjacent with the first assembling aligning guide of apparatus body or the bottom 226 of apparatus body.Vibration source 220 is launched during the process with OECA and substrate alignment, makes the aligning equipment vibration thus.The vibration aligning equipment help (i) overcome when substrate along assembling surface 202 when the surface of contact 208 of the first assembling aligning guide is advanced the friction force between substrate and the assembling surperficial 202; (ii) between assembling surface 202 and surface of contact 208, provide contact at suitable 2.
Comprise the vibration source that is permanently attached to apparatus body 206 although Fig. 3 A illustrates aligning equipment 200, in the alternate embodiment (not shown), can be placed on the shaking platform at aligning equipment during the alignment procedures.This shaking platform is given aligning equipment 200 with energy of vibration during being used in alignment procedures, and as stated, this helps to overcome the friction force between assembling surface 202 and the substrate.
Existing with reference to Fig. 3 A-3C and 4, a schematically illustrated embodiment who OECA110 is aligned in the method on the substrate 102 with aligning equipment 200.This aligning equipment 200 at first is oriented and makes alignment surface 202 approximate horizontal, in Fig. 3 A-3C level promptly be parallel to shown in the x-y plane of coordinate axis.Directed aligning equipment 200 realizes that through aligning equipment 200 being rotated about it axis 230 rotations pivot center 230 is parallel to the y axle of coordinate system.
After this, substrate orientation make the basal surface (not shown) of substrate 102 contact with assembling surface 202, and the first substrate alignment face 120 is towards the surface of contact 208 of the first assembling aligning guide 204 on the assembling surface.When assembling surface 202 was divided into a plurality of groove as stated, substrate 102 can be positioned in one of them groove also as stated with respect to assembling the surface 202 and first assembling aligning guide, 204 orientations.In one embodiment, available routine pick up-place machine or equipment carries out the location of substrate 102 on assembling surface 202.In other embodiments, can manually carry out the location of substrate.
After this, OECA110 is positioned on the top surface 104 of substrate 102, and more specifically is positioned on the liner 122 of top surface 104 of substrate 102.OECA110 can pick up place machine or equipment is positioned on the substrate 102 with routine.OECA110 is positioned on the substrate 112, makes OECA aligning surface 112 towards the surface of contact 208 of the first assembling aligning guide 204, and is D from the outstanding amounts of the first substrate alignment face 120, and is as shown in Figure 4.In one embodiment, amount D can be from about 20 microns to 50 microns.But the amount of should be appreciated that D can change according to the desired final relative orientation of the OECA aligning surface 112 and the first substrate alignment face 120, and this desired final relative orientation is confirmed by the angle [alpha] between surface of contact 208 and the assembling surface 202.
In case OECA110 is positioned on the substrate 102, substrate 102 is just advanced towards the first assembling aligning guide 204 along assembling surface 202 with OECA110, and the substrate alignment face 120 of winning is contacted with the surface of contact 208 of OECA aligning surface with the first assembling aligning guide 204.
In one embodiment, substrate 102 goes forward one by one towards surface of contact 208 through gravity on assembling surface 202 with OECA110.This can rotate and accomplish along rotate rotation axis 230 of the counter clockwise direction in Fig. 3 B illustrated embodiment through making aligning equipment 200.Making aligning equipment shown in Fig. 3 B, turn over angle beta increases the inclination angle of assembling surface with respect to the x-y plane, and substrate 102 and OECA110 are advanced towards the surface of contact 208 of the first assembling aligning guide 204 under gravity effect.Fig. 3 C illustrates the equipment of use gravity ancillary technique and the final orientation of OECA and substrate.Available vibration source 220 or external source are applied to aligning equipment 200 with energy of vibration, overcome the friction force between substrate and the assembling surface 202 to help (i), promote auxiliary slip of the gravity of substrate 102 on assembling surface 202 thus; And/or (ii) substrate 102 is suitably aimed at surface of contact 208.
Existing with reference to Fig. 5, in another embodiment, substrate 102 is mechanically advanced towards surface of contact 208 on assembling surface 202 with OECA110.For example, mechanical walking mechanism 205 can contact with substrate 102, makes mechanical walking mechanism 205 that substrate 102 is pushed towards surface of contact 208.Machinery walking mechanism 250 can comprise the contact head 252 that is attached to actuating arm 254.Actuating arm 254 can be mechanically actuated, pneumatically actuated or electromechanically and can operating with flexible along the x direction, thus contact head 152 compressed substrate 102 and substrate 102 and OECA110 are gone forward one by one towards surface of contact 208.In one embodiment, when substrate 102 goes forward one by one, can apply energy of vibration and assist the friction force that overcomes between assembling as stated surperficial 202 and the substrate 102 aligning equipment 200.Such as being positioned at shaking platform when aligning equipment 200 or otherwise being attached to vibration during the energy, available vibration source 220 or external source apply energy of vibration.But; Be to be understood that; When substrate 102 was advanced on assembling surface 202 with OECA110, applying of energy of vibration was optional, because the power that is applied on the substrate 202 by mechanical walking mechanism possibly be enough to overcome the friction force between substrate 102 and the assembling surface 202.
In arbitrary embodiment, because the initial relative positioning of the OECA aligning surface 112 and the first substrate alignment face 120, OECA aligning surface 112 contacts with surface of contact 208 2 of formation at least before the first substrate alignment face 120 contacts with surface of contact 208.But with after surface of contact 208 contacts, substrate 102 continues to advance towards surface of contact 208 at OECA aligning surface 112, makes OECA110 with respect to substrate 102 displacements thus, and more specifically with respect to 120 displacements of the first substrate alignment face.Substrate 102 is advanced towards surface of contact 208, till surface of contact 208 2 of the formation of the first substrate alignment face 120 and the first assembling aligning guide 204 contact.
As described herein, each forms at 2 with the surface of contact 208 of the first assembling aligning guide 204 and contacts in OECA aligning surface 112 and the first substrate alignment face 120.In 2 contact restriction OECA110 and the substrate 102 each along first assemble the surface of contact 208 of aligning guide 204 the moving of direction.In addition, it is also understood that the point between each in surface of contact 208 and OECA110 and the substrate 102 contacts also restriction or prevents that substrate 102 is with respect to the rotation on assembling surface 202 and the OECA110 rotation with respect to assembling surface 202 and substrate 102.Accordingly, it should be understood that 2 contacts between OECA aligning surface 112 and the surface of contact 208 limit the motion (that is, along the sideway movement of surface of contact direction with respect to substrate and/or assembling surperficial rotation) of OECA110 in the above degree of freedom in substrate upper edge.Similarly, should be appreciated that 2 contacts between the first substrate alignment face 120 and the surface of contact 208 limit the motion (that is, along the sideway movement of surface of contact direction and with respect to assembling surperficial rotation) of substrates in the above degree of freedom in the surperficial upper edge of assembling.Controlled the applying in energy of vibration ground is convenient to overcome the friction/stiction between substrate and the assembling surface, and is convenient to OECA and substrate surface aimed at the assembling aligning guide reproduciblely.
It is definite that relative between OECA110 and the substrate 102 aimed at the angle [alpha] of aiming at first between the surface of contact 208 of assembling mechanism 204 through assembling surface 202.When angle [alpha] during greater than 90 °, OECA110 can be from the first substrate alignment face 120 outstanding (that is, OECA110 gives prominence to from the edge of substrate 102) of substrate 102 after aiming at.But when angle [alpha] during less than 90 °, OECA110 can be recessed into (that is, OECA110 is from the edge offset of substrate 102) from the first substrate alignment face 120 of substrate 102 after aiming at.When angle [alpha] was 90 °, the first substrate alignment face 120 and OECA110 were aligned in the plane perpendicular to the assembling surface of aligning equipment 200.
With after substrate 102 is aimed at, the binding material of available formation liner 122 is bonded to substrate 102 with OECA110 at OECA110.In one embodiment, for the ease of OECA110 being bonded to substrate 102, can the aligning equipment 200 that comprise OECA110 and substrate 102 being placed in the stove and is heated to the temperature of the binding material that is suitable for activation liner 122.For example, when binding material was scolder, stove possibly be heated to the temperature that is suitable for making scolder to flow again.Similarly, be under the situation of polymeric material at binding material, stove can be heated to and be used to solidify the proper temperature that OECA110 is bonded to the polymeric material of substrate.In another embodiment, be under the situation of UV curable resin at binding material, stove can be the UV curing oven, the UV curing oven can be used for activation and UV curing curable resin, thus OECA is fixed to substrate.
Based on aforementioned content, should be appreciated that now aligning equipment 200 can be used for OECA110 is aligned on the substrate 102 along at least one direction.In addition, should be appreciated that when aligning equipment 200 comprises the assembling surface with a plurality of grooves,, comprise that a plurality of sub-components of substrate and OECA can roughly be aimed at aligning equipment simultaneously such as aligning equipment shown in Figure 2.Accordingly, it should be understood that method as herein described is suitable for producing in enormous quantities the sub-component of aligning.
In addition; Although the alignment surface and the first assembling aligning guide are described as forming or otherwise being included in the single aligning equipment at this paper; But should be appreciated that method as herein described can be used for the first assembling aligning guide and conduct separates and the assembling substrate of discrete piece.
Be used for OECA is aligned in the method on the substrate along a direction although Fig. 3 A-3C is schematically illustrated, should be appreciated that can use identical technology along both direction with OECA and substrate alignment.
Existing with reference to Fig. 6 A and 6B, the embodiment that is used for the method on the substrate 102 that OECA150 is aligned in along first direction (for example x direction) and second direction (for example y direction) is shown with figure.For the ease of locating OECA150 along x direction and y direction, OECA150 comprises movable locating piece 130 and optoelectronic components 140.In this embodiment, the first assembling aligning guide 204 is positioned to aim at OECA150 along the x direction, and the second assembling aligning guide 201 is positioned to aim at OECA150 along the y direction.The first assembling aligning guide that accordingly, it should be understood that Fig. 6 A is vertical each other with the second assembling aligning guide.
Locating piece 130 generally can by non-caked to the top surface 104 of substrate 102 material of the binding material of liner 122 constitute.This is convenient to optoelectronic components 140 and is bonded to substrate 102 moving of locating piece afterwards.Thereby locating piece 130 can be processed by glass, pottery, carbon or any other material that can not be bonded to the binding material of liner 122.In the embodiment shown in Fig. 6 A and the 6B, locating piece is a glass.Locating piece also comprises the locating piece aligning surface, and this locating piece aligning surface is an OECA aligning surface 113 in this embodiment.The one OECA aligning surface 113 is suitable for forming at 2 with flat surfaces and contacts.For example, in the embodiment of locating piece 130 shown in Fig. 6 A, an OECA aligning surface 113 is general planar.Locating piece 130 also can have second aligning surface, block aligning surface 115, and it can be on locating piece 130 and an OECA aligning surface 113 opposite orientation.In the embodiment shown in Fig. 6 A, an OECA aligning surface 113 is not parallel with block aligning surface 115, makes the OECA aligning surface of winning have the inclination angle with respect to block alignment face 115.
Locating piece can have the lip-deep any geometric configuration that is suitable for optics is aligned in substrate.For example, as stated and shown in Fig. 6 A, an OECA aligning surface 113 has the inclination angle with respect to block aligning surface 115.OECA aligning surface with this structure capable of using rotates with respect to the edge displacement of substrate and with optoelectronic components optoelectronic components on substrate, as this paper incites somebody to action in greater detail.This can for example be used for optoelectronic components 140 is aligned in substrate when optoelectronic components has the inclined end portion facet shown in Fig. 6 A.
Although locating piece 130 is described as having the tilt alignment face, make alignment block be trapezoidal, should be appreciated that locating piece 130 can be the square of rectangle, any suitable geometric configuration or the shape that is used to realize optoelectronic components 140 desired aligning on substrate.In addition, should be appreciated that from following explanation the size of locating piece can specifically be chosen to realize desired aligning.For example, maybe be desirable make optoelectronic components be parallel to the first substrate alignment face 320 and from the first substrate alignment face, 320 skew even amounts.Thereby locating piece 130 can be general square shape or rectangle, along the width of x direction corresponding to from first aligning surface, 320 desired offset distances.
The optoelectronic components 140 of OECA150 can comprise waveguiding structure or luminescent crystal as stated.For example, optoelectronic components 140 can comprise that periodically poled lithium niobate (PPLN) the second harmonic generator (SHG) photonic crystal maybe can operate will import the similar crystal that beam of coherent light converts the high-order harmonic wave output beam to.In Fig. 6 A illustrated embodiment, optoelectronic components has the inclined end portion facet, and one of inclined end portion facet can be used as the 2nd OECA aligning surface 132, the two OECA aligning surfaces 132 and is suitable for contacting with 2 of flat surfaces formation.In the embodiment of optoelectronic component shown in Fig. 6 A, the 2nd OECA aligning surface 132 is smooth facets, such as input facet or output facet.
As stated, location and aligning have the substrate 302 of OECA150 to generally include the plate that is made up of metal or stupalith above.Substrate comprises that roughly there is the flat top surface 304 and the lower surface (not shown) that contacts with assembling surface 202 of OECA150 the location.Substrate 102 generally includes the first substrate alignment face 320 and the second substrate alignment face 321, and the both can operate to form at 2 with flat surfaces contact at least.For example; In Fig. 6 A illustrated embodiment, substrate 302 is rectangular slabs, and the first substrate alignment face 320 is sides of rectangular slab; And the second substrate alignment face 321 is second sides perpendicular to first side of rectangular slab, makes the first and second substrate alignment faces the 320, the 321st, and is smooth.Substrate 302 also can comprise the liner 122 that is positioned at binding material on the top surface 104 as stated.
With reference to Fig. 6 A; In order to locate OECA150 along first direction (being the x direction) and second direction (being the y direction); At first substrate 302 is positioned on the assembling surface; Make win substrate alignment face 320 towards first the assembling aligning guide 204 surface of contact 208, and the second substrate alignment face 321 towards second the assembling aligning guide 201 surface of contact 209.Using routine to pick up apparatus for placing can realize with this orientation position substrate 302.
After this, locating piece 130 is positioned on the top surface 304 of substrate 302, makes the OECA aligning surface 113 of winning towards the surface of contact 208 of the first assembling aligning guide 204, and outstanding from the first substrate alignment face 320.The one OECA aligning surface 113 can be from the first substrate alignment face, 120 outstanding distance B, and this distance B is about 20 microns to about 50 microns as stated.The same with substrate 302, available routine is picked up place machine locating piece 130 is positioned on the substrate 102.
In case optoelectronic components 140 is positioned on the substrate 302; Then substrate 302 is advanced (shown in arrow 500) towards the surface of contact 208 of the first assembling aligning guide 204 with OECA150, thereby along first direction (being the x direction in this example) OECA150 is aligned on the surface of substrate 302.In one embodiment, substrate and OECA150 advance towards surface of contact 208 under gravity effect as stated.For example, advance towards surface of contact 208 in order to make substrate 302 and OECA150, the assembling surface can tilt around the pivot center that is roughly parallel to the y axle, makes substrate 302 tilt towards surface of contact 208.Perhaps, substrate 302 is advanced towards surface of contact 208 with mechanical walking mechanism (not shown) with OECA150 as stated.In arbitrary embodiment, can apply vibration source with the auxiliary friction force that overcomes between substrate 302 and the assembling surface to assembling the surface.
When substrate 302 and OECA150 when surface of contact 208 is advanced; Because the initial relative positioning of an OECA aligning surface 113 and the first substrate alignment face 320, an OECA aligning surface 113 contacts with surface of contact 208 2 of formation at least before the first substrate alignment face 320 contacts with surface of contact 208.But with after surface of contact 208 contacts, substrate 302 continues to advance towards surface of contact 208 at an OECA aligning surface 113, makes OECA150 with respect to substrate 302 displacements thus, and more specifically with respect to 320 displacements of the first substrate alignment face.Thereby locating piece 130 all is shifted along the x direction with respect to the first substrate alignment face 320 with optoelectronic components 140.Substrate 302 is advanced towards surface of contact 208, till surface of contact 208 2 of the formation of the first substrate alignment face 320 and the first assembling aligning guide 204 contact.
When an OECA aligning surface 113 shown in Fig. 6 A and surface of contact 208 are not parallel; The one OECA aligning surface 113 is advanced against surface of contact 208 make locating piece on the top surface 304 of substrate 302, rotate, this makes optoelectronic components 140 also on the top surface 304 of substrate 302, rotate again.This has the faceted optoelectronic components 140 of inclined end portion for the location and is particularly useful, and makes the 2nd OECA aligning surface 132 be parallel to the second substrate alignment face 321.
At OECA150 after first direction location; Then substrate 302 is advanced (shown in arrow 502) towards the surface of contact 209 of the second assembling aligning guide 201 with OECA150, thereby along second direction (being the y direction in this example) OECA150 is aligned on the surface of substrate 302.Substrate 302 mechanically or under gravity effect is advanced towards surface of contact 208 with OECA150.For example, advance towards surface of contact 209 in order to make substrate 302 and OECA150, the assembling surface can tilt around the pivot center that is roughly parallel to the x axle, makes substrate 302 tilt towards surface of contact 209.
When substrate 302 and OECA150 when surface of contact 209 is advanced; Because the initial relative positioning of the 2nd OECA aligning surface 132 and the second substrate alignment face 321, the 2nd OECA aligning surface 132 contacts with surface of contact 209 2 of formation at least before the second substrate alignment face 321 contacts with surface of contact 209.But with after surface of contact 209 contacts, substrate 302 continues to advance towards surface of contact 209 at the 2nd OECA aligning surface 132, makes OECA150 with respect to substrate 302 displacements thus, and more specifically with respect to 321 displacements of the second substrate alignment face.Thereby optoelectronic components 140 is shifted along the y direction with respect to the second substrate alignment face 321 at least.Substrate 302 is advanced towards surface of contact 209, till surface of contact 209 2 of the formation of the second substrate alignment face 321 and the second assembling aligning guide 201 contact.
In case the second substrate alignment face contacts with the surface of contact 209 of the second assembling aligning guide 201, then OECA150 is aligned on the substrate 302 along first direction and second direction.Optoelectronic components 140 can use binding material to be bonded to substrate 302 as stated then.But, should be appreciated that locating piece 130 is not bonded to liner 122, and locating piece 130 can be from substrate removal after optoelectronic components is bonded to substrate 302 thus.
Existing with reference to Fig. 6 B, available two aligning equipments 200,500 that are similar to aligning equipment shown in Figure 2 carry out OECA150 is aligned in the method on the substrate 302.At first substrate 302, locating piece 130 and optoelectronic components 140 are positioned on the assembling surface 202 of aligning equipment 200 as stated.Substrate 302 is advanced, to aim at optoelectronic components along first direction against the surface of contact 208 of the first assembling aligning guide 204.In the embodiment shown in Fig. 6 B, tilt substrate 302 is advanced towards surface of contact 208 through making aligning equipment 200.
After this, aligning equipment 200 is positioned on the assembling surface 233 of second aligning equipment 255.This carries out with the fixed equipment 200 that is oriented surperficial 233 approximate horizontal of assembling.With being positioned at that aligning equipment 200, the second aligning equipments on second aligning equipment 255 rotate so that substrate 302 advance towards the surface of contact 209 of second assembly positioning device 201 on the assembling surface, lower edge 202 of influencing of gravity.When substrate 302 contacted with surface of contact 209 with optoelectronic components 140, as stated, optoelectronic components was aligned on the substrate along second direction.
Existing with reference to Fig. 7, schematically illustrated second embodiment that OECA110 is aligned in the method on the substrate 102.In this embodiment, at first substrate 102 is placed on the assembling surface 202, makes substrate 102 directly contact, and contact with 2 of surface of contact formation with the surface of contact 208 of the first assembling aligning guide 204.After this, at first OECA110 is positioned on the top surface of substrate 102 and along the y direction and is aligned on the liner (not shown), make OECA aligning surface 112 towards surface of contact 208.The available initial alignment that carries out OECA110 with place machine or similar locating device that picks up.In case the OECA initial alignment is good, then OECA advances towards surface of contact 208 on the top surface of substrate 102.In the embodiment shown in fig. 7, OECA advances towards surface of contact 208 with locating device 400.Locating device 400 comprises the attached head 404 that is attached to supporting bracket 402.In the embodiment shown in fig. 7, attached head 404 is can operate to contact with OECA110 and the attached head of the vacuum of aspiration vacuum on OECA110.Supporting bracket 402 can be attached to computer numerical control (CNC) (CNC) positioning system, makes that locating device can be along x, y and z direction location.
In order OECA110 to be aligned on the substrate 102, attached head 404 is attached to OECA110 through aspiration vacuum on OECA110.Make contact force surpass predetermined value if can set the contact that makes between the controlled aligning surface in the vacuum tightness of aspirating on the OECA, then attached head 404 slides with respect to OECA110, prevents that thus OECA from going up excessive power.This allows OECA110 to aim at surface of contact 208, prevents to damage OECA simultaneously.Similar controlled contact force possibly be useful when locating device adopts spring-loaded or similar walking mechanism.After this, locating device 400 applies downward power (that is, along the power of z direction), forces the top surface and the pressing of OECA110 against substrate 102 thus.Locating device slides along the x direction substrate towards surface of contact 208 then, forms up to OECA aligning surface 112 at 2 with surface of contact 208 and contacts.When OECA aligning surface and surface of contact 208 forms at 2 when contact, attached head 404 continues to move towards surface of contact 208, and does not give OECA110 with any additional movement (that is, attached head along the OECA110 slip but OECA is moved) along the x direction.After this, can OECA110 be bonded to substrate 102, as stated.
Based on aforementioned content, be to be understood that at present the techniques described herein can be used for one or more optoelectronic components being aligned on the substrate with repeatable with the height alignment precision.For example, but methods described herein make the optoelectronic components can be to be positioned on the substrate with the repeatable accuracy that is low to moderate 0.5 micron less than about 1 micron.In addition, the equipment that is used to carry out this method can use low cost easily to realize and convergent-divergent easily.Accordingly, it should be understood that method and apparatus as herein described can easily be applicable to than current employing based on the machine vision of die bonder significantly low cost carry out a large amount of manufacturing operations and can not reduce alignment precision.In fact, the alignment precision of methods described herein is actually with remarkable low cost improvements over the prior art.
It should be apparent to those skilled in the art that and under the situation that does not deviate from the spirit and scope of the present invention, to make various modifications and variation embodiment as herein described.Therefore, mean that instructions covers modification and the variation of various embodiment described herein, this modification and variation are in the scope of appended claims and its equivalent.
Claims (17)
1. one kind with the method for optoelectronic components assembly alignment on substrate, and said method comprises:
Said substrate orientation is being assembled on the surface;
(OECA) is positioned on the said substrate with the optoelectronic components assembly, makes the OECA aligning surface of winning outstanding from the first substrate alignment face; And
Said substrate and said OECA are advanced towards the surface of contact of the first assembling aligning guide; Make the said surface of contact that the said first substrate alignment face and said first is assembled aligning guide after the said surface of contact that a said OECA aligning surface and said first is assembled aligning guide contacts contact, wherein:
Between the said surface of contact of said first substrate alignment face and the said first assembling aligning guide to contact be 2 contacts, this limits the motion of said substrate in the above degree of freedom in the surperficial upper edge of said assembling;
Between the said surface of contact of a said OECA aligning surface and the said first assembling aligning guide to contact be 2 contacts, this limits the motion of said optoelectronic components assembly in the above degree of freedom in said substrate upper edge; And
Said OECA is shifted with respect to the said first substrate alignment face when a said OECA aligning surface contacts with the said surface of contact of the said first assembling aligning guide; And said substrate continues to move towards the said surface of contact of the said first assembling aligning guide, thus with the said OECA on the said substrate with respect to the said first substrate alignment face.
2. the method for claim 1 is characterized in that, (i) through making said assembling surface tilt; Or (ii) said substrate is advanced towards the said surface of contact of the said first assembling aligning guide with locating device.
3. like the described method of claim 1-2, it is characterized in that said OECA is selected from one group that is made up of laser diode and luminescent crystal.
4. like the described method of claim 1-3, it is characterized in that the said surface of contact of the said first assembling aligning guide and the angle between the said assembling surface are from about 60 ° to about 120 °.
5. like the described method of claim 1-4, it is characterized in that the said surface of contact of the said first assembling aligning guide is a glass.
6. like the described method of claim 1-5, it is characterized in that, also comprise: when said substrate makes said assembling surface vibration when the said surface of contact of the said first assembling aligning guide is advanced.
7. like claim 1 or 3 described methods, it is characterized in that:
Said OECA is positioned on the binding material that is applied to said substrate; And
Said method also comprises the said assembling of heating surface, said substrate and said OECA, so that said OECA is bonded to said substrate.
8. the method for claim 1 is characterized in that, said assembling surface is a side of V-shaped groove in the aligning equipment, and the said first assembling aligning guide is directed on the opposition side of said V-shaped groove.
9. method as claimed in claim 8 is characterized in that, said aligning equipment comprises the recess channel at place, said V-shaped groove summit.
10. method as claimed in claim 8 is characterized in that, said assembling surface comprises a plurality of grooves.
11. the method for claim 1 is characterized in that:
Said optoelectronic components assembly comprises optoelectronic components and locating piece;
A said OECA aligning surface is the locating piece aligning surface;
Said OECA is positioned on the said substrate, makes the 2nd OECA aligning surface outstanding from the second substrate alignment face; And
Said method also comprises makes said substrate and said OECA advance towards the surface of contact of the second assembling aligning guide; Make the said surface of contact that the said second substrate alignment face and said second is assembled aligning guide after the said surface of contact that said the 2nd OECA aligning surface and said second is assembled aligning guide contacts contact, wherein:
Between the said surface of contact of said second substrate alignment face and the said second assembling aligning guide to contact be 2 contacts, this limits the motion of said substrate in the above degree of freedom in the surperficial upper edge of said assembling;
Between the said surface of contact of said the 2nd OECA aligning surface and the said second assembling aligning guide to contact be 2 contacts, this limits the motion of said OECA in the above degree of freedom in said substrate upper edge; And
Said optoelectronic components is shifted with respect to the said second substrate alignment face when said the 2nd OECA aligning surface contacts with the said surface of contact of the said second assembling aligning guide, and said substrate continues to move towards the said surface of contact of the said second assembling aligning guide.
12. method as claimed in claim 11 is characterized in that, (i) said optoelectronic components and the said first substrate alignment face are not parallel when the said first substrate alignment face contacts with the said surface of contact of the said first assembling aligning guide; And/or (ii) advance, and through making said assembling surface said substrate advanced towards the said second assembling aligning guide around second axis tilt through making said assembling surface tilt to make said substrate to assemble aligning guide towards said first around first axle.
13. one kind with the method for optoelectronic components assembly alignment on substrate, said method comprises:
On the assembling surface, make the substrate alignment face contact said substrate orientation with the surface of contact of assembling aligning guide;
(OECA) is positioned on the said substrate with the optoelectronic components assembly, makes said OECA along the first direction rough alignment;
Said OECA is advanced towards the said surface of contact of said assembling aligning guide, contact with the said surface of contact of said assembling aligning guide, thus said OECA is aligned on the said substrate along second direction up to the OECA of said OECA aligning surface; Wherein:
Contacting between the said surface of contact of said substrate alignment face and said assembling aligning guide is 2 contacts, and this limits the motion of said substrate in the above degree of freedom in the surperficial upper edge of said assembling; And
Between the said surface of contact of a said OECA aligning surface and the said first assembling aligning guide to contact be 2 contacts, this limits the motion of said optoelectronic components assembly in the above degree of freedom in said substrate upper edge.
14. method as claimed in claim 13 is characterized in that: said OECA is advanced towards the said surface of contact of said assembling aligning guide with locating device.
15. like the described method of claim 13-14, it is characterized in that, also comprise: when said assembling aligning guide is advanced, make said assembling surface vibration at said OECA.
16., it is characterized in that said OECA (i) comprises luminescent crystal like the described method of claim 13-15; And/or (ii), said assembling aligning guide compresses said substrate when advancing at OECA.
17., it is characterized in that the said surface of contact of the said first assembling aligning guide and the angle between the said assembling surface are from about 60 to about 120 ° like the described method of claim 13-16.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/563,449 US8036508B2 (en) | 2009-09-21 | 2009-09-21 | Methods for passively aligning opto-electronic component assemblies on substrates |
| US12/563,449 | 2009-09-21 | ||
| PCT/US2010/049213 WO2011035086A2 (en) | 2009-09-21 | 2010-09-17 | Methods for passively aligning opto-electronic component assemblies on substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102804012A true CN102804012A (en) | 2012-11-28 |
| CN102804012B CN102804012B (en) | 2016-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080043010.3A Expired - Fee Related CN102804012B (en) | 2009-09-21 | 2010-09-17 | Optoelectronic components assembly is passively aligned in the method on substrate |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8036508B2 (en) |
| JP (1) | JP5847718B2 (en) |
| KR (1) | KR101795084B1 (en) |
| CN (1) | CN102804012B (en) |
| TW (1) | TWI510831B (en) |
| WO (1) | WO2011035086A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110967790A (en) * | 2018-09-30 | 2020-04-07 | 济南量子技术研究院 | Optical fiber coupling method for PPLN waveguide device, waveguide device and single photon detector |
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| US8036508B2 (en) * | 2009-09-21 | 2011-10-11 | Corning Incorporated | Methods for passively aligning opto-electronic component assemblies on substrates |
| US8836942B2 (en) * | 2010-09-30 | 2014-09-16 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical component with a passive alignment member |
| US8866041B2 (en) | 2012-04-12 | 2014-10-21 | Tdk Corporation | Apparatus and method of manufacturing laser diode unit utilizing submount bar |
| US9364925B2 (en) * | 2012-04-30 | 2016-06-14 | Globalfoundries Inc. | Assembly of electronic and optical devices |
| US9104039B2 (en) | 2012-05-08 | 2015-08-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods and systems for performing vision-aided passive alignment during the assembly of an optical communications module |
| US9684133B2 (en) | 2014-09-23 | 2017-06-20 | International Business Machines Corporation | Component assembly apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110069929A1 (en) | 2011-03-24 |
| WO2011035086A2 (en) | 2011-03-24 |
| WO2011035086A3 (en) | 2011-06-23 |
| US8036508B2 (en) | 2011-10-11 |
| JP2013505486A (en) | 2013-02-14 |
| KR101795084B1 (en) | 2017-11-07 |
| KR20120075470A (en) | 2012-07-06 |
| TW201142398A (en) | 2011-12-01 |
| CN102804012B (en) | 2016-07-20 |
| TWI510831B (en) | 2015-12-01 |
| JP5847718B2 (en) | 2016-01-27 |
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