CN102800663B - 具有多管芯的蝙蝠翼透镜设计 - Google Patents
具有多管芯的蝙蝠翼透镜设计 Download PDFInfo
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- CN102800663B CN102800663B CN201210062378.5A CN201210062378A CN102800663B CN 102800663 B CN102800663 B CN 102800663B CN 201210062378 A CN201210062378 A CN 201210062378A CN 102800663 B CN102800663 B CN 102800663B
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- led die
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- lens
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (18)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510307237.9A CN104916768B (zh) | 2011-05-24 | 2012-03-09 | 具有多管芯的蝙蝠翼透镜设计 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/114,787 | 2011-05-24 | ||
US13/114,787 US8759854B2 (en) | 2011-05-24 | 2011-05-24 | Bat-wing lens design with multi-die |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510307237.9A Division CN104916768B (zh) | 2011-05-24 | 2012-03-09 | 具有多管芯的蝙蝠翼透镜设计 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102800663A CN102800663A (zh) | 2012-11-28 |
CN102800663B true CN102800663B (zh) | 2015-07-08 |
Family
ID=47199725
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510307237.9A Active CN104916768B (zh) | 2011-05-24 | 2012-03-09 | 具有多管芯的蝙蝠翼透镜设计 |
CN201210062378.5A Active CN102800663B (zh) | 2011-05-24 | 2012-03-09 | 具有多管芯的蝙蝠翼透镜设计 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510307237.9A Active CN104916768B (zh) | 2011-05-24 | 2012-03-09 | 具有多管芯的蝙蝠翼透镜设计 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8759854B2 (zh) |
CN (2) | CN104916768B (zh) |
TW (1) | TWI464923B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI517452B (zh) * | 2011-03-02 | 2016-01-11 | 建準電機工業股份有限公司 | 發光晶體之多晶封裝結構 |
KR101284796B1 (ko) * | 2011-10-05 | 2013-07-10 | (주)포인트엔지니어링 | 캔 패지키 타입의 광 디바이스 제조 방법 및 이에 의해 제조된 광 디바이스 |
CN103378263A (zh) * | 2012-04-27 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管封装结构的制造方法 |
US9506624B2 (en) | 2013-10-31 | 2016-11-29 | GE Lighting Solutions, LLC | Lamp having lens element for distributing light |
WO2017196824A1 (en) * | 2016-05-12 | 2017-11-16 | Koninklijke Philips N.V. | Collimating on-die optic |
EP3485521B1 (en) * | 2016-05-12 | 2020-09-23 | Lumileds Holding B.V. | Collimating on-die optic, light-emitting diode package with the same and method for manufacturing the same |
EP3584171B1 (en) | 2018-06-19 | 2023-07-26 | Goodrich Lighting Systems GmbH | Aircraft beacon light and aircraft comprising an aircraft beacon light |
CN112271172A (zh) * | 2020-07-29 | 2021-01-26 | 深圳市聚飞光电股份有限公司 | 一种led发光件及其制作方法 |
CN114692554A (zh) * | 2022-03-31 | 2022-07-01 | 本源科仪(成都)科技有限公司 | 量子比特版图的导电盘布图方法、系统、介质及设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201673936U (zh) * | 2010-01-29 | 2010-12-15 | 琉明斯光电科技股份有限公司 | 表面黏着led封胶体 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100586968B1 (ko) * | 2004-05-28 | 2006-06-08 | 삼성전기주식회사 | Led 패키지 및 이를 구비한 액정표시장치용 백라이트어셈블리 |
TWI266079B (en) * | 2005-01-10 | 2006-11-11 | Shiu-Hua Huang | Steering lens and light emitting system using the same |
JP4962685B2 (ja) * | 2005-04-26 | 2012-06-27 | 日本精機株式会社 | 照明装置及びその照明装置を備えた液晶表示装置 |
TWI279604B (en) * | 2005-07-25 | 2007-04-21 | Coretronic Corp | Light emitting module and LED package structure |
TW200717131A (en) | 2005-08-19 | 2007-05-01 | Lg Chemical Ltd | Side emitting lens, light emitting device using the side emitting lens, mold assembly for preparing the side emitting lens and method for preparing the side emitting lens |
TWI276890B (en) * | 2005-12-23 | 2007-03-21 | Coretronic Corp | Light emitting module and plane light source device |
US7798678B2 (en) * | 2005-12-30 | 2010-09-21 | 3M Innovative Properties Company | LED with compound encapsulant lens |
JP2007200730A (ja) * | 2006-01-27 | 2007-08-09 | Casio Comput Co Ltd | 光源ユニット、光源装置及びプロジェクタ |
KR20090005194A (ko) * | 2006-04-18 | 2009-01-12 | 라미나 라이팅, 인크. | 피제어 색 혼합용 광 디바이스 |
CN101150159B (zh) * | 2006-09-22 | 2011-05-11 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管及其透镜体 |
US7618163B2 (en) * | 2007-04-02 | 2009-11-17 | Ruud Lighting, Inc. | Light-directing LED apparatus |
TW200843135A (en) * | 2007-04-23 | 2008-11-01 | Augux Co Ltd | Method of packaging light emitting diode with high heat-dissipating efficiency and the structure thereof |
CN101527338A (zh) * | 2008-03-06 | 2009-09-09 | 中盟光电股份有限公司 | 透镜组件及其组合结构 |
CN101769499A (zh) * | 2009-01-05 | 2010-07-07 | 富准精密工业(深圳)有限公司 | 发光二极管单元 |
CN101504123B (zh) * | 2009-03-13 | 2011-05-18 | 华南理工大学 | 用于led室内灯具的透镜及包含该透镜的格栅灯 |
JP2011044315A (ja) * | 2009-08-20 | 2011-03-03 | Panasonic Electric Works Co Ltd | 光学レンズおよびこれを用いた照明器具 |
CN101639197A (zh) * | 2009-08-24 | 2010-02-03 | 深圳市九拓光电有限公司 | 一种发光二极管透镜、照明装置和背光装置 |
CN102054925B (zh) * | 2009-10-29 | 2013-12-11 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
-
2011
- 2011-05-24 US US13/114,787 patent/US8759854B2/en active Active
-
2012
- 2012-03-09 TW TW101108023A patent/TWI464923B/zh active
- 2012-03-09 CN CN201510307237.9A patent/CN104916768B/zh active Active
- 2012-03-09 CN CN201210062378.5A patent/CN102800663B/zh active Active
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2014
- 2014-06-13 US US14/303,628 patent/US9306136B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201673936U (zh) * | 2010-01-29 | 2010-12-15 | 琉明斯光电科技股份有限公司 | 表面黏着led封胶体 |
Also Published As
Publication number | Publication date |
---|---|
TW201248940A (en) | 2012-12-01 |
CN102800663A (zh) | 2012-11-28 |
US20140295592A1 (en) | 2014-10-02 |
US9306136B2 (en) | 2016-04-05 |
US8759854B2 (en) | 2014-06-24 |
CN104916768B (zh) | 2019-12-27 |
CN104916768A (zh) | 2015-09-16 |
TWI464923B (zh) | 2014-12-11 |
US20120299018A1 (en) | 2012-11-29 |
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