CN102791105B - Heat abstractor and use the electronic installation of this heat abstractor - Google Patents
Heat abstractor and use the electronic installation of this heat abstractor Download PDFInfo
- Publication number
- CN102791105B CN102791105B CN201110125670.2A CN201110125670A CN102791105B CN 102791105 B CN102791105 B CN 102791105B CN 201110125670 A CN201110125670 A CN 201110125670A CN 102791105 B CN102791105 B CN 102791105B
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- Prior art keywords
- plate
- heat
- shell fragment
- heat abstractor
- evaporator section
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Abstract
A kind of electronic installation, including heat abstractor, circuit board, if the first electronic component on circuit boards and the second electronic component, heat abstractor includes centrifugal fan, radiating fin group and heat pipe, centrifugal fan is provided with air outlet, radiating fin group is arranged on the air outlet place of centrifugal fan, heat pipe includes evaporator section and the condensation segment of spontaneous evaporation section extension, condensation segment is connected with radiating fin group, evaporator section is for thermally contacting with the first electronic component and the second electronic component, centrifugal fan includes fan frame, fan frame is provided with shell fragment, shell fragment is pressed on the top of the evaporator section of heat pipe so that evaporator section has a downward pressure.The present invention by adding a shell fragment in fan frame, and is pressed on heat pipe by shell fragment, makes shell fragment that evaporator section to produce a downward power, so that the heat that heater element produces conducts better to heat abstractor, improve radiating efficiency, and minimizing assembles man-hour, reduces cost.
Description
Technical field
The present invention relates to a kind of heat abstractor and a kind of electronic installation using this heat abstractor.
Background technology
At present in computer product, the heat that CPU on circuit board and wafer produce in the course of the work is continuously increased, it is therefore desirable to they are dispelled the heat simultaneously.Conventional heat abstractor generally comprises heat absorption frame, heat pipe, fan and by the stacking radiating fin group formed of radiating fin, this heat absorption frame includes the first absorber plate and the second absorber plate being connected with the first absorber plate, this first absorber plate and a CPU fit, this second heat absorbing sheet and wafer fit, thus absorbing the heat that they produce, this heat is transferred to heat pipe by the frame that absorbs heat, and then is transferred to radiating fin group, and is distributed by heat by radiating fin group and fan.
Being usually brill locking hole near CPU at present, the first absorber plate is secured on circuit board by recycling Spring screws.Around do not have the wafer of locking hole can rely on the second absorber plate pressing thereon in order to absorb its heat, but owing to this pressure force is heterogeneous, easily cause loose contact between the second absorber plate and wafer, or well but cause between the first absorber plate and CPU pressure excessive and pressure break CPU to make to contact between the second absorber plate and wafer；If but heat-generating electronic elements quantity is more, when all boring locking hole around all heat-generating electronic elements, this some holes position must being avoided when line guy and design, thus increasing the difficulty of electron circuit layout, have impact on the continuity of electronic circuit.
Summary of the invention
In consideration of it, be necessary the heat abstractor providing a kind of pressure force to heat-generating electronic elements uniformly and making electron circuit layout easy.
A kind of heat abstractor, including centrifugal fan, radiating fin group and heat pipe, this centrifugal fan is provided with air outlet, this radiating fin group is arranged on the air outlet place of centrifugal fan, this heat pipe includes evaporator section and the condensation segment extended from this evaporator section, this condensation segment is connected with this radiating fin group, this evaporator section is for thermally contacting with the first electronic component and the second electronic component, this centrifugal fan includes fan frame, this fan frame is provided with shell fragment, and this shell fragment is pressed on the top of the evaporator section of this heat pipe so that this evaporator section has a downward pressure.
A kind of electronic installation, including heat abstractor as above, circuit board, sets the first electronic component on circuit boards and one second electronic component, and the evaporator section of this heat pipe thermally contacts with this first electronic component and the second electronic component respectively.
By adding a shell fragment in the fan frame of centrifugal fan in the present invention, and it is pressed on the evaporator section of heat pipe by shell fragment, so that the evaporator section of shell fragment opposite heat tube produces a downward power, heat abstractor is made more to be closely adhered to the top of electronic component, so that the heat that electronic component produces conducts better to heat abstractor, improve radiating efficiency；And without drill-through many holes on circuit boards, make circuit board more coherent when carrying out electron circuit layout；Without using Spring screws, provide cost savings.
Accompanying drawing explanation
Fig. 1 is the three-dimensional assembly diagram of the electronic installation of first embodiment of the invention.
Fig. 2 is the three-dimensional exploded view of the electronic installation removing circuit plate in Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of the base plate of second embodiment of the invention and shell fragment.
Fig. 4 is the three-dimensional assembly diagram of the base plate of third embodiment of the invention and shell fragment.
Fig. 5 is the three-dimensional assembly diagram of the base plate of fourth embodiment of the invention and shell fragment.
Main element symbol description
| Electronic installation | 100 |
| Heat abstractor | 1 |
| Centrifugal fan | 10 |
| Fan frame | 11 |
| Air inlet | 111 |
| Air outlet | 112 |
| Base plate | 113、113a、113b、113c |
| Framework | 114 |
| Sidewall | 115 |
| Impeller sets | 12 |
| Radiating fin group | 20 |
| Top board | 21 |
| Base plate | 22 |
| Radiating fin | 23 |
| Body | 231 |
| Upper flap | 232 |
| Lower flap portion | 233 |
| Air intake surface | 24 |
| Outlet air surface | 25 |
| Heat pipe | 30 |
| Evaporator section | 31 |
| Condensation segment | 32 |
| Heat absorption frame | 40 |
| First absorber plate | 41 |
| Sealed plate | 411 |
| Second absorber plate | 42 |
| Connecting plate | 43 |
| Cavities | 44 |
| Shell fragment | 50、50a、50b、50c |
| Gripper shoe | 51、51a、51b、51c |
| Elastic plate | 52、52a、52b、52c |
| Thickening plate | 53、53a、53c |
| Flap | 54a、54b |
| Groove | 55b |
| Central processing unit | 60 |
| Wafer | 70 |
| Circuit board | 80 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
As shown in Figures 1 and 2, the electronic installation 100 of first embodiment of the invention, including heat abstractor 1, circuit board 80, central processing unit 60 and wafer 70.Central processing unit 60 and wafer 70 are arranged on circuit board 80, and heat abstractor 1 is for dispelling the heat to central processing unit 60 and wafer 70.
Heat abstractor 1 includes a centrifugal fan 10, and is arranged on radiating fin group 20, heat pipe 30 of centrifugal fan 10 side, one end of heat pipe 30 is fixed on the heat absorption frame 40 of central processing unit 60 and wafer 70 and is installed in centrifugal fan 10 and opposite heat tube 30 has the shell fragment 50 of a downward pressure.
Centrifugal fan 10 includes a fan frame 11 and the impeller sets 12 being arranged in fan frame 11, the D-shaped housing that fan frame 11 is substantially empty in one, it has an air outlet 112 being positioned at top and bottom center and the air inlet 111 run through and the lengthwise that is positioned at fan frame 11 side.Fan frame 11 includes a generally d-shaped base plate 113 and is located at the framework 114 above base plate 113.Framework 114 includes the sidewall 115 of an arc, and air outlet 112 forms the side at sidewall 115.
Radiating fin group 20 is located at air outlet 112 place of centrifugal fan 10 and is close to air outlet 112.Radiating fin group 20 is mutually fastened by some radiating fins 23 and is formed, and radiating fin 23 includes a body 231 and from the vertically extending upper flap 232 of body 231 opposite sides and lower flap portion 233, the combination of these some upper flaps 232 forms a top board 21, and the combination of these some lower flap portions 233 forms a base plate 22.The stepped setting of top board 21, the height of its step is suitable with the thickness of heat pipe 30.Radiating fin group 20 is formed with an air intake surface 24 at air outlet 112 place near this centrifugal fan, is formed with an outlet air surface 25 in the side away from this centrifugal fan.The height of air intake surface 24 is lower than the height of the air outlet 112 of centrifugal fan 10；The upper end of outlet air surface 25 is downwardly projecting arc surface, and lower end is parallel with air intake surface 24 and highly less than the plane of air intake surface 24.It is formed with gas channel between two adjacent radiating fins 23.In other embodiments, radiating fin group 20 also can be formed by modes such as welding by top board 21, base plate 22 and some radiating fins being placed between top board 21 and base plate 22.
The U-shaped of heat pipe 30 generally flat, the substantially L-shaped evaporator section 31 that it includes the condensation segment 32 of a lengthwise, autocondensation section 32 one end extends.The condensation segment 32 of heat pipe 30 is close to the top board 21 of radiating fin group 20 near one end of the air outlet 112 of centrifugal fan 10, and itself and radiating fin group 20 stop the air outlet 112 of centrifugal fan 10 jointly.The condensation segment 32 of heat pipe 30 is to be fixed in radiating fin group 20 by welding or other modes.
Heat absorption frame 40 is fixed on circuit board 80, and it includes substantially square first absorber plate 41, another second substantially square absorber plate 42 and connects a plate 43 of the first absorber plate 41 and the second absorber plate 42.First absorber plate 41 and the second absorber plate 42 are all made by the higher material of heat transfer efficiency, and such as copper etc., and the area of the first absorber plate 41 to the second absorber plate 42 is big.First absorber plate 41 fits to absorb the heat that central processing unit 60 distributes with central processing unit 60, and the second absorber plate 42 fits to absorb the heat that wafer 70 distributes with wafer 70.A sealed plate 411 is respectively extended in the corner of the first absorber plate 41, sealed plate 411 is provided with through hole and wears heat absorption frame 40 is fixed to circuit board 80 for Spring screws.Connecting plate 43 is disposed therein near a sealed plate 411.The upper surface of heat absorption frame 40 is additionally provided with a cavities 44, cavities 44 is transverse in the upper surface of the first absorber plate 41, connecting plate 43 and the second absorber plate 42 successively, and the evaporator section 31 of cavities 44 and heat pipe 30 matches, in order to house evaporator section 31 in the inner.Preferably, the evaporator section 31 of heat pipe 30 can be fixed on heat absorption frame 40 by scolding tin or bonding mode.
Shell fragment 50 stretches out along the edge of the base plate 113 of centrifugal fan 10 formation.The elastic plate 52 that shell fragment 50 includes a gripper shoe 51 and self-supporting slab 51 top extends laterally.Gripper shoe 51 is a thin plate, and it is close to the sidewall 115 of framework 114 of centrifugal fan 10, and its height is less than the height of sidewall 115.The other end relative with gripper shoe 51 of elastic plate 52 is have the free end being pressed downward against making a concerted effort.In the present embodiment, the substantially right angle of the angle between gripper shoe 51 and elastic plate 52, certainly, it is possible in obtuse angle or acute angle；The free end of elastic plate 52 slightly bends to the direction of the base plate 13 of centrifugal fan 10, and the free end of elastic plate 52 is separately with a thickening plate 53, and thickening plate 53 is parallel and is attached on a surface of free end of elastic plate 52, thus strengthening the intensity of shell fragment 50 end.The gripper shoe 51 of shell fragment 50, elastic plate 52 and thickening plate 53 can be integrated and be bent to form.In the present embodiment, shell fragment 50 is located near wafer 70, and its thickening plate 53 is pressed on the evaporator section 31 of heat pipe 30 and makes evaporator section 31 to have a downward pressure, so that heat pipe 30 is combined more tight with wafer 70.It is to be appreciated that shell fragment 50 also can stretch out along the outer rim of the sidewall 115 of centrifugal fan 10, now, it is possible to need not gripper shoe 51.
After electronic installation 100 assembles, the elastic plate 52 of shell fragment 50 is inclined upwardly along the top of gripper shoe 51, so that the free end of elastic plate 52 and thickening plate 53 are resisted against the top of the evaporator section 31 of heat pipe 30 jointly, now, angle between elastic plate 52 and the gripper shoe 51 of shell fragment 50 is slightly larger than 90 degree, so that the evaporator section 31 of thickening plate 53 opposite heat tube 30 produces a downward power, the second absorber plate 42 below this place is made more to be closely adhered to the top of wafer 70, from the problem that can solve to fit tightly between the second absorber plate 42 and wafer 70 without boring the circuit board 80 near wafer 70, and make circuit board 80 more coherent when carrying out electron circuit layout.Heat produced by central processing unit 60 is absorbed and conducts the evaporator section 31 to heat pipe 30 by the first absorber plate 41 of the frame 40 that absorbs heat, heat produced by wafer 70 is absorbed and conducts the evaporator section 31 to heat pipe 30 by the second absorber plate 42 of the frame 40 that absorbs heat, and then passes to radiating fin group 20 via the condensation segment 32 of heat pipe 30.Running due to the impeller sets 12 of centrifugal fan 10, air-flow enters from the air inlet 111 in fan frame 11, flow to the air intake surface 24 of radiating fin group 20 again from air outlet 112, and then flowed in ambient air by outlet air surface 25, thus taking away the heat of radiating fin group 20.
Referring to Fig. 3, it show the three-dimensional assembly diagram of a base plate 113a and a shell fragment 50a of second embodiment of the invention.This embodiment is similar to the base plate 113 in first embodiment and shell fragment 50, it differs only in: in the present embodiment, shell fragment 50a also includes the flap 54a respectively extended along the both sides of the edge of elastic plate 52a to the direction of base plate 113a, the width of flap 54a is suitable with the thickness of thickening plate 53a, this bifoldable plate 54a further enhances the intensity of shell fragment 50a, and the gripper shoe 51a of shell fragment 50a, elastic plate 52a, thickening plate 53a and flap 54a can be integrated and be bent to form.
Referring to Fig. 4, it show the three-dimensional assembly diagram of a base plate 113b and a shell fragment 50b of third embodiment of the invention.The elastic plate 52b that this shell fragment 50b also includes a gripper shoe 51b and a self-supporting slab 51b top extends laterally, and the both sides of the edge of elastic plate 52b are respectively extended with a flap 54b to the direction of base plate 113b, wherein, with differing only in of the second embodiment: in the present embodiment, shell fragment 50b is not provided with thickening plate, and is provided with a groove 55b at the middle part of elastic plate 52b.
Referring to Fig. 5, it show the three-dimensional assembly diagram of a base plate 113c and a shell fragment 50c of fourth embodiment of the invention.The elastic plate 52c that this shell fragment 50c also includes a gripper shoe 51c and a self-supporting slab 51c top extends laterally, wherein, with differing only in of first embodiment: in the present embodiment, the thin plate that elastic plate 52c is a lengthwise of shell fragment 50c, the end of the thickening plate 53c and elastic plate 52c of shell fragment 50c is connected and is perpendicular to elastic plate 52c.
By adding a shell fragment 50/50a/50b/50c on the base plate 113/113a/113b/113c of fan frame 11 in the present invention, and it is pressed on the evaporator section 31 of position of the corresponding wafer 70 of heat pipe 30 by shell fragment 50/50a/50b/50c, so that the evaporator section 31 of shell fragment 50/50a/50b/50c opposite heat tube 30 produces a downward power, the second absorber plate 42 below this place is made more to be closely adhered to the top of wafer 70, make the heat that wafer 70 produces conduct better to heat abstractor 1, improve radiating efficiency；And without many holes drill-through on circuit board 80, make circuit board 80 more coherent when carrying out electron circuit layout；Without using Spring screws, provide cost savings.
The technology contents of the present invention and technical characterstic are disclosed above, but those skilled in the art are still likely to base and make all replacements without departing substantially from spirit of the present invention and modification in teachings of the present invention and announcement.Therefore, protection scope of the present invention should be not limited to the content that embodiment is disclosed, and should include the various replacement without departing substantially from the present invention and modification, and is contained by appended claim.
Claims (9)
- null1. a heat abstractor，Including centrifugal fan、Radiating fin group and heat pipe，This centrifugal fan is provided with air outlet，This radiating fin group is arranged on the air outlet place of centrifugal fan，This heat pipe includes evaporator section and the condensation segment extended from this evaporator section，This condensation segment is connected with this radiating fin group，This evaporator section is for thermally contacting with the first electronic component and the second electronic component，It is characterized in that: this centrifugal fan includes fan frame，This fan frame is provided with shell fragment，This shell fragment is pressed on the top of the evaporator section of this heat pipe so that this evaporator section has a downward pressure，Described heat abstractor still further comprises a heat absorption frame，This heat absorption frame includes the first absorber plate、The connecting plate of the second absorber plate and this first absorber plate of connection and the second absorber plate，Described first absorber plate and the second absorber plate are all attached to the evaporator section of this heat pipe，Described first absorber plate and the second absorber plate are respectively used to thermally contact with the first electronic component and the second electronic component.
- 2. heat abstractor as claimed in claim 1, it is characterised in that: this fan frame includes base plate and the upwardly extending sidewall of the periphery from this base plate, and this shell fragment is located on this sidewall.
- 3. heat abstractor as claimed in claim 1, it is characterised in that: this fan frame includes base plate and the upwardly extending sidewall of the periphery from this base plate, and this shell fragment is located on this base plate.
- 4. heat abstractor as claimed in claim 3, it is characterised in that: this shell fragment includes gripper shoe and the elastic plate of self-supporting slab edge extension, and this gripper shoe is located at the outside of this sidewall and is close to this sidewall, and this elastic plate extends laterally from this gripper shoe top.
- 5. heat abstractor as claimed in claim 4, it is characterised in that: the height of this gripper shoe is less than the height of this sidewall.
- 6. heat abstractor as claimed in claim 5, it is characterised in that: the both sides of the edge of this elastic plate are respectively extended with a flap along this base plate side.
- 7. heat abstractor as claimed in claim 5, it is characterised in that: the terminal edge of this elastic plate is extended with a plate body along this base plate side.
- 8. heat abstractor as claimed in claim 5, it is characterised in that: the middle part of this elastic plate is provided with a groove.
- 9. an electronic installation, including the heat abstractor as described in claim 1 to 8 any one, circuit board, setting the first electronic component on circuit boards and the second electronic component, the evaporator section of this heat pipe thermally contacts with this first electronic component and the second electronic component respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110125670.2A CN102791105B (en) | 2011-05-16 | 2011-05-16 | Heat abstractor and use the electronic installation of this heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110125670.2A CN102791105B (en) | 2011-05-16 | 2011-05-16 | Heat abstractor and use the electronic installation of this heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102791105A CN102791105A (en) | 2012-11-21 |
| CN102791105B true CN102791105B (en) | 2016-07-06 |
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ID=47156371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110125670.2A Expired - Fee Related CN102791105B (en) | 2011-05-16 | 2011-05-16 | Heat abstractor and use the electronic installation of this heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102791105B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624399Y (en) * | 2003-05-07 | 2004-07-07 | 英业达股份有限公司 | Heat radiation module structure in electronic installation |
| CN101198242A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Double-heat source radiating module |
| CN101861078A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7779894B2 (en) * | 2006-07-31 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| CN101840257A (en) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件（昆山）有限公司 | Heat dissipation module and fixing device thereof |
-
2011
- 2011-05-16 CN CN201110125670.2A patent/CN102791105B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624399Y (en) * | 2003-05-07 | 2004-07-07 | 英业达股份有限公司 | Heat radiation module structure in electronic installation |
| CN101198242A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Double-heat source radiating module |
| CN101861078A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102791105A (en) | 2012-11-21 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20160706 Termination date: 20180516 |