CN102778305A - temperature sensor and induction cooker - Google Patents
temperature sensor and induction cooker Download PDFInfo
- Publication number
- CN102778305A CN102778305A CN2012102381780A CN201210238178A CN102778305A CN 102778305 A CN102778305 A CN 102778305A CN 2012102381780 A CN2012102381780 A CN 2012102381780A CN 201210238178 A CN201210238178 A CN 201210238178A CN 102778305 A CN102778305 A CN 102778305A
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- Prior art keywords
- temperature sensor
- housing
- thermistor
- electromagnetic oven
- power model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000006698 induction Effects 0.000 title abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 6
- 230000003044 adaptive effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000009529 body temperature measurement Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a temperature sensor and an induction cooker with the temperature sensor, wherein the temperature sensor comprises a shell and a thermistor encapsulated in the shell, two electrodes of the thermistor extend out of the shell, the shell is provided with a first surface which can be attached to the outer surface of a power module of the induction cooker, and the first surface is in surface contact with the outer surface of the power module of the induction cooker. According to the invention, the surface of the shell is in surface contact with the outer surface of the power module, so that the shell of the sensor can be tightly attached to the power module, the temperature of the power module can be rapidly conducted to the thermistor through the shell, and the response speed in temperature measurement is accelerated.
Description
Technical field
The present invention relates to the electromagnetic oven field, relate in particular to a kind of temperature sensor and electromagnetic oven.
Background technology
Electromagnetic oven is a kind of energy-efficient kitchen tools; It has broken traditional naked light cooking method; Adopt the heating principle of magnetic field induction electric current, through the electronic circuit board ingredient produce alternating magnetic field, when bottom chalybeate pan, being placed on the electromagnetic oven road surface, pan promptly cuts the alternation magnetic line of force and partly produces the electric current (being eddy current) of alternation in the pan bottom metal; Thereby make the bottom of a pan heating, reach culinary purpose.
Too high and damage electromagnetic oven for fear of the heating-up temperature of pan, present commercial electromagnetic oven power module mainly adopts temperature sensor as shown in Figure 11 to carry out thermometric, and all there is following shortcoming in its structure:
1. because the package casing of this sensor 1 is set to circularly, so it can not be close to module when installing, and the heat radiator that this sensor mainly leans on the bottom to install conducts heat, so test reaction is blunt.
2. the volume of this sensor 1 is big, and self-radiating is very fast when experiencing heat, thus big with the actual temperature error, influence the temperature survey degree of accuracy of sensor.
3. this sensor 1 adopts the PPS plastic casing to add the aluminium holder structure, so its insulating property are relatively poor, when especially installing in the forceful electric power zone, must reserve enough creepage distances.
Summary of the invention
Fundamental purpose of the present invention provides a kind of temperature sensor, is intended to accelerate thermometric response speed.
The invention provides a kind of temperature sensor; Comprise housing and be encapsulated in the thermistor in the housing; Two electrodes of said thermistor extend outside the said housing; Said housing has the first surface that can fit with the outside surface of the power model of electromagnetic oven, contacts for face between the power model outside surface of said first surface and electromagnetic oven.
Preferably; Said housing also has the second surface that laterally arranges with said first surface; This second surface set to the concave form one with the adaptive accepting groove of said thermistor; The body of said thermistor is housed in the said accepting groove fully, and two electrodes of thermistor extend outside the said thermistor housing; The gap of said thermistor and accepting groove also is provided with the epoxy resin layer of the said thermistor of encapsulation.
Preferably, said housing has the 3rd surface that connects first surface and second surface, and said the 3rd surface is provided with the mounting hole that runs through said housing.
Preferably, said mounting hole is U type hole.
Preferably, said housing is rectangular parallelepiped, and long more than or equal to 8mm, is wider than or equals 5mm, and is high more than or equal to 4mm.
Preferably, the said lead that also comprises two electrodes of terminal and splicing ear and said thermistor.
Preferably, the material of said housing is a brass.
The present invention also provides a kind of electromagnetic oven; Comprise power model and the temperature sensor of fitting with said power model; Said temperature sensor comprises housing and is encapsulated in the thermistor in the housing; Two electrodes of said thermistor extend outside the said housing, and said housing has the first surface that can fit with the outside surface of the power model of electromagnetic oven, contact for face between the power model outside surface of said first surface and electromagnetic oven.
Preferably, also comprise interior environment-development heat coil, outer shroud heat coil and be arranged on the heat insulating belt between said interior environment-development heat coil and the outer shroud heat coil, said temperature sensor also is set on this heat insulating belt.
Preferably, heat conductive silica gel also is set between said temperature sensor and the power model.
The present invention is that face contacts through the surface with housing with the outside surface of power model; Thereby make the housing of this sensor to fit tightly with power model; The temperature of power model can conduct to thermistor rapidly through housing, the response speed when having accelerated temperature survey.
Description of drawings
Fig. 1 is the structural representation of temperature sensor of temperature that is used to measure the electromagnetic oven power module of prior art;
Fig. 2 is the mounting structure synoptic diagram of the power model of temperature sensor of the present invention and electromagnetic oven;
Fig. 3 is the local enlarged diagram of A portion among Fig. 2;
Fig. 4 is the structural representation of temperature sensor preferred embodiment of the present invention;
Fig. 5 is the structural representation of another embodiment of temperature sensor of the present invention;
Fig. 6 is the structural representation of the heater coil of electromagnetic oven of the present invention.
The realization of the object of the invention, functional characteristics and advantage will combine embodiment, further specify with reference to accompanying drawing.
Embodiment
Further specify technical scheme of the present invention below in conjunction with Figure of description and specific embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
With reference to Fig. 2 to Fig. 4, Fig. 2 is the mounting structure synoptic diagram of the power model of temperature sensor of the present invention and electromagnetic oven; Fig. 3 is the local enlarged diagram of A portion among Fig. 2; Fig. 4 is the structural representation of temperature sensor preferred embodiment of the present invention.This temperature sensor 100 is mainly used in the temperature detection in the electromagnetic oven; It comprises housing 10 and is encapsulated in the thermistor 20 in the housing 10; Two electrodes 21 of said thermistor 20 extend outside the said housing 10, said housing 10 have one with the first surface 101 of the binding face 201 adaptive applyings of the power model 200 of electromagnetic oven.
Particularly, this temperature sensor 100 is fitted with arriving power model 200, is used for measuring the temperature of electromagnetic oven power model 200.Therefore the first surface 101 of this housing 10 contacts with the outside surface formation face of the power model 200 of said electromagnetic oven; For example; The outside surface of the power model 200 of electromagnetic oven is the plane, and then this first surface 101 also is the plane, can be so that housing 10 fits tightly with power model 200; The surface temperature of power model 200 can conduct to thermistor 20 rapidly through housing 10, the response speed when having accelerated temperature survey.It is understandable that in order to strengthen the heat-conducting effect of housing 10, the material of its housing 10 can be selected the preferable brass of heat-conducting effect for use, certainly, also can select the material of other good heat conduction effect.In addition, in order to accelerate response speed, can also be when temperature sensor 100 to be fitted with power model 200, between adds heat-conducting silicone grease 60.
Further; Said housing 10 also has the second surface 102 that laterally arranges with said first surface 101; This second surface 102 sets to the concave and forms an accepting groove 11 adaptive with said thermistor 20; The body 22 of said thermistor 20 is housed in the said accepting groove 11 fully, and two electrodes 21 of thermistor 20 extend to outside the said housing 10; Thermistor 20 also is provided with the epoxy resin layer 30 that encapsulates said thermistor 20 with the gap of accepting groove 11.
Thermistor 20 comprises the electrode 21 that extend at body 22 and body 22 two ends.When temperature sensor is assembled, at first thermistor 20 is inserted in the accepting groove 11 of housing 10, make the body 22 of thermistor 20 be housed in fully in the accepting groove 11, electrode 21 extends outside the housing 10; Then, in accepting groove 11, insert epoxy resin, make it fill the gap of thermistor 20 and accepting groove 11; Make this epoxy resin cure at last, and form epoxy resin layer 30.
Because the first surface 101 and the second surface 102 of housing 10 laterally arrange; And the body 22 of thermistor 20 is housed in the accepting groove 11 fully; Therefore this thermistor 20 is oppositely arranged with first surface 101; It can accurately measure the temperature of said power model 200, and thermometric response speed is accelerated.In addition; Because this thermistor 20 is to encapsulate through epoxy resin; Make the shell of this temperature sensor 100 and the insulation resistance between lead-in wire reach direct current 500V, more than the 100M Ω, dielectric voltage withstand exchanges 1500V; Leakage current is less than 1mA, especially can install flexibly in the forceful electric power zone and is not afraid of puncture.
Further; Above-mentioned housing 10 has the 3rd surface 103 that connects first surface 101 and second surface 102; And said the 3rd surface 103 is provided with the mounting hole 12 that runs through housing 10, and this mounting hole 12 can supply screw to pass and be installed in the fixed orifice (not shown) on the heat sink 300 of electromagnetic oven.The the 3rd surperficial 103 also can be adaptive with the surface of heat sink 300, and for example the binding face of heat sink 300 is the plane, and then the 3rd surface 103 also is the plane, therefore makes temperature sensor 100 more firm with fixing of heat sink 300.
Further, above-mentioned mounting hole 12 is U type hole.Mounting hole 12 through this U type hole is provided with makes this housing 10 can in the scope of mounting hole 12, move in the fixed position on the heat sink 300.Because the fixed orifice and the distance between said power model 200 binding faces of heat sink 300 are certain; So when screw moves and be fixed in the fixed orifice of heat sink 300 through the direction of arrow shown in Figure 3, can change the applying degree between housing 10 and the power model 200.
Further, above-mentioned housing 10 is rectangular parallelepiped, and long more than or equal to 8mm, is wider than or equals 5mm, and is high more than or equal to 4mm.Because the specification limits of existing thermistor 20, the long L1 of its housing 10 (being the length of first surface 101) minimum can be 8mm, and wide L2 (promptly the 3rd surface 103 is wide) minimum can be 5mm, and high L3 (being the wide of first surface 101) minimum can be 4mm.Because the height of the copper base (being heating part) of power model 200 bottoms is about 4mm; So the housing 10 that this high L3 is 4mm can be close on the heating part of power model 200; Not only improve thermometric precision, also accelerated thermometric response speed.It is understandable that, because the size of this housing 10 is directly by the size decision of thermistor 20, so along with the change in size of thermistor 20, the size of this housing 10 is also with respective change.Because housing 10 volumes of this temperature sensor 100 are little, so the heat radiation of itself is also little, has further improved its thermometric precision.
Further, in conjunction with reference to Fig. 5, Fig. 5 is the structural representation of another embodiment of temperature sensor of the present invention.On the basis of said temperature sensor embodiment, this temperature sensor 100 also comprises the lead 50 of two electrodes 21 of terminal 40 and splicing ear 40 and said thermistor 20.This lead 50 is preferably the lead of Teflon pipe; These thermistor 20 temperature sensors and the signal that produces are delivered to terminal 40 through two electrodes 21, lead 50; Be delivered to the control chip of electromagnetic oven again through terminal 40, so that control chip is handled according to detected temperature accordingly.
The present invention also provides a kind of electromagnetic oven, and it comprises power model 200 and the temperature sensor 100 of fitting with said power model 200, and the concrete structure of said temperature sensor 100 can be with reference to noted earlier and with reference to Fig. 2 to Fig. 5.
Further, with reference to Fig. 6, Fig. 6 is the structural representation of the heater coil of electromagnetic oven of the present invention.Above-mentioned electromagnetic oven also comprises interior environment-development heat coil 70, outer shroud heat coil 80 and is arranged on the heat insulating belt 90 between said interior environment-development heat coil 70 and the outer shroud heat coil 80, also is provided with said temperature sensor 100 on this heat insulating belt 90.Because the structural design of this temperature sensor 100, thereby make that the volume of this temperature sensor 100 can be very little, therefore make the width of this isolation strip 90 to reduce more than the 10mm than the width of the isolation strip of prior art.It is understandable that,, can between isolation strip 90 and temperature sensor 80, heat conductive silica gel be set in order to accelerate the heat-conducting effect of isolation strip 90 and temperature sensor 80.
The above is merely the preferred embodiments of the present invention; Be not so limit its claim; Every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to be done; Directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. temperature sensor; It is characterized in that; Comprise housing and be encapsulated in the thermistor in the housing; Two electrodes of said thermistor extend outside the said housing, and said housing has the first surface that can fit with the power model outside surface of electromagnetic oven, contact for face between the power model outside surface of said first surface and electromagnetic oven.
2. temperature sensor according to claim 1; It is characterized in that; Said housing also has the second surface that laterally arranges with said first surface; This second surface set to the concave form one with the adaptive accepting groove of said thermistor, the body of said thermistor is housed in the said accepting groove fully, and two electrodes of thermistor extend outside the said thermistor housing; The gap of said thermistor and accepting groove also is provided with the epoxy resin layer of the said thermistor of encapsulation.
3. temperature sensor according to claim 2 is characterized in that, said housing has the 3rd surface that connects first surface and second surface, and the 3rd surface is provided with the mounting hole that runs through said housing.
4. temperature sensor according to claim 3 is characterized in that, said mounting hole is U type hole.
5. temperature sensor according to claim 1 is characterized in that said housing is rectangular parallelepiped, and long more than or equal to 8mm, is wider than or equals 5mm, and is high more than or equal to 4mm.
6. temperature sensor according to claim 1 is characterized in that, the said lead that also comprises two electrodes of terminal and splicing ear and said thermistor.
7. according to each described temperature sensor among the claim 1-6, it is characterized in that the material of said housing is a brass.
8. an electromagnetic oven is characterized in that, comprises that power model reaches like each described temperature sensor of claim 1-7.
9. electromagnetic oven according to claim 8 is characterized in that, also comprises interior environment-development heat coil, outer shroud heat coil and is arranged on the heat insulating belt between said interior environment-development heat coil and the outer shroud heat coil, and said temperature sensor also is set on this heat insulating belt.
10. electromagnetic oven according to claim 8 is characterized in that, heat conductive silica gel also is set between said temperature sensor and the power model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210238178.0A CN102778305B (en) | 2012-07-10 | 2012-07-10 | Temperature sensor and electromagnetic oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210238178.0A CN102778305B (en) | 2012-07-10 | 2012-07-10 | Temperature sensor and electromagnetic oven |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102778305A true CN102778305A (en) | 2012-11-14 |
| CN102778305B CN102778305B (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210238178.0A Active CN102778305B (en) | 2012-07-10 | 2012-07-10 | Temperature sensor and electromagnetic oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102778305B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552708A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Mold for producing heat-conduction silica gel sheet and use method of mold |
| CN104576555A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Power semiconductor module with heat conducting silicon sheet and manufacturing method for power semiconductor module |
| CN106644145A (en) * | 2016-11-23 | 2017-05-10 | 安徽瑞鑫自动化仪表有限公司 | Portable temperature sensor |
| CN106644146A (en) * | 2016-11-23 | 2017-05-10 | 安徽瑞鑫自动化仪表有限公司 | Convenient-to-use temperature sensor |
| CN106644147A (en) * | 2016-11-23 | 2017-05-10 | 安徽瑞鑫自动化仪表有限公司 | Temperature sensor capable of easily measuring fluid temperature |
| CN106768455A (en) * | 2016-11-23 | 2017-05-31 | 安徽瑞鑫自动化仪表有限公司 | A kind of temperature sensor assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001133331A (en) * | 1999-11-02 | 2001-05-18 | Denso Corp | Temperature sensor |
| CN1916445A (en) * | 2005-08-17 | 2007-02-21 | 上海怡力工程设备有限公司 | Drive structure of gear worm |
| CN201348294Y (en) * | 2009-01-04 | 2009-11-18 | 刘显武 | Temperature sensor of electromagnetic oven |
| CN201535697U (en) * | 2009-10-28 | 2010-07-28 | 美的集团有限公司 | Temperature detection device of electromagnetic oven radiator |
| CN202734994U (en) * | 2012-07-10 | 2013-02-13 | 美的集团股份有限公司 | Temperature sensor and induction cooker |
-
2012
- 2012-07-10 CN CN201210238178.0A patent/CN102778305B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001133331A (en) * | 1999-11-02 | 2001-05-18 | Denso Corp | Temperature sensor |
| CN1916445A (en) * | 2005-08-17 | 2007-02-21 | 上海怡力工程设备有限公司 | Drive structure of gear worm |
| CN201348294Y (en) * | 2009-01-04 | 2009-11-18 | 刘显武 | Temperature sensor of electromagnetic oven |
| CN201535697U (en) * | 2009-10-28 | 2010-07-28 | 美的集团有限公司 | Temperature detection device of electromagnetic oven radiator |
| CN202734994U (en) * | 2012-07-10 | 2013-02-13 | 美的集团股份有限公司 | Temperature sensor and induction cooker |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552708A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Mold for producing heat-conduction silica gel sheet and use method of mold |
| CN104576555A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Power semiconductor module with heat conducting silicon sheet and manufacturing method for power semiconductor module |
| CN104552708B (en) * | 2014-06-24 | 2017-11-07 | 深圳青铜剑科技股份有限公司 | A kind of mould and its application method for making heat-conducting silica gel sheet |
| CN106644145A (en) * | 2016-11-23 | 2017-05-10 | 安徽瑞鑫自动化仪表有限公司 | Portable temperature sensor |
| CN106644146A (en) * | 2016-11-23 | 2017-05-10 | 安徽瑞鑫自动化仪表有限公司 | Convenient-to-use temperature sensor |
| CN106644147A (en) * | 2016-11-23 | 2017-05-10 | 安徽瑞鑫自动化仪表有限公司 | Temperature sensor capable of easily measuring fluid temperature |
| CN106768455A (en) * | 2016-11-23 | 2017-05-31 | 安徽瑞鑫自动化仪表有限公司 | A kind of temperature sensor assembly |
| CN106644145B (en) * | 2016-11-23 | 2019-10-25 | 安徽瑞鑫自动化仪表有限公司 | A kind of portable temperature sensor |
| CN106644147B (en) * | 2016-11-23 | 2019-10-25 | 安徽瑞鑫自动化仪表有限公司 | A kind of temperature sensor being convenient for fluid temperature (F.T.) measurement |
| CN106768455B (en) * | 2016-11-23 | 2019-11-29 | 安徽瑞鑫自动化仪表有限公司 | A kind of temperature sensor assembly |
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| Publication number | Publication date |
|---|---|
| CN102778305B (en) | 2015-04-29 |
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Address after: 528311 Guangdong, Foshan, Beijiao, the United States, the United States and the United States on the avenue of the United States, the headquarters of the United States building B floor, District, 26-28 Applicant after: MIDEA GROUP Co.,Ltd. Address before: 528311 Beijiao, Foshan, Shunde District, the town of Guangdong, the United States Avenue, No. 6 Applicant before: Midea Group |
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