CN102769995A - Attaching and packaging method of substrate and substrate - Google Patents
Attaching and packaging method of substrate and substrate Download PDFInfo
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- CN102769995A CN102769995A CN2011101672799A CN201110167279A CN102769995A CN 102769995 A CN102769995 A CN 102769995A CN 2011101672799 A CN2011101672799 A CN 2011101672799A CN 201110167279 A CN201110167279 A CN 201110167279A CN 102769995 A CN102769995 A CN 102769995A
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Abstract
The invention discloses an attaching and packaging method of a substrate and the substrate, the method comprises the following steps: manufacturing a first substrate, the surface of which is provided with a net-shaped vertical convex pattern; attaching a second substrate to the surface of the first substrate with the net-shaped vertical convex pattern, and carrying out vacuum-pump treatment on the second substrate; and packaging the second substrate on the first substrate. According to the technical scheme, the problem that air bubbles are generated during attaching and packaging the substrates is solved.
Description
Technical field
The present invention relates to the attaching encapsulation technology of substrate, relate in particular to a kind of attaching method for packing and substrate of substrate.
Background technology
Flexible display technologies is the important development direction of Display Technique of future generation; It has flexible, non-friable, ultralight is ultra-thin, low-power consumption, characteristics such as portable; In fields such as e-book, mobile communication terminal, notebook computer, TV, public informations, have broad application prospects and good development expection.At present, the used baseplate material of flexible demonstration can be organic plastics, thin metal foil, ultra-thin glass etc.Wherein, ultra-thin substrate is called soft base plate again, its because of have the transparency height, characteristics that chemical property is stable more and more receive people's attention, still, the attaching encapsulation technology of high performance soft base plate is the technological difficulties that the researcher is badly in need of solving always.
In the prior art, the attaching encapsulation technology of soft base plate mainly contains two kinds: adhesive attaches and vacuum attaches.Wherein, adhesive is a kind of chemical agent, when carrying out the vacuum moulding machine membrane process, inevitably can influence the cleanliness factor of equipment, makes the soft base plate surface with particle, reduces the product yield; And adhesive attaches technology can not solve the air bubble problem that produces in the attaching process.Though attaching, vacuum can obtain desirable soft base plate attaching effect; But, there is moisture in static during owing to attaching between soft base plate and the backboard and the air, can produce bubble between soft base plate and the backboard; And in the process of vacuum attaching, soft base plate is difficult to take off from backboard again.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of attaching method for packing and substrate of substrate, has solved the problem that in the attaching encapsulation process of substrate, can produce bubble.
For achieving the above object, technical scheme of the present invention is achieved in that
The present invention provides a kind of attaching method for packing of substrate, comprising:
Make first substrate that the surface has the vertical raised design of net form;
Second substrate is attached on the surface that has the vertical raised design of net form in first substrate, and vacuumizes processing;
With second substrate package on first substrate.
In the said method, first substrate that said making surface has the vertical raised design of net form is:
On one of them surface of first substrate of selecting, deposit one deck insulation film and apply one deck photoresist; The zone that on first substrate, has second substrate lip-deep to be attached of insulation film and photoresist; Utilize mask board to explosure, development, etching and photoresist lift off to handle, on the insulation film of first substrate, form the vertical raised design of net form.
In the said method, this method also comprises:
In said exposure-processed process, after forming the vertical raised design of net form on the photoresist of first substrate, utilize mask plate, be the zone of 0mm～10mm to wide beyond the edge in the zone of second substrate to be attached on first substrate simultaneously, carry out exposure-processed; This zone forms the vertical raised design of net form after handling through exposure-processed, development treatment, dry etching processing and photoresist lift off.
In the said method, said mask plate is the mask plate of pixel electrode pattern or the mask plate of Active pattern.
In the said method, said second substrate is attached on the surface that has the vertical raised design of net form in first substrate, and vacuumizes and be treated to:
With second substrate according to predefined position; Be attached in first substrate that obtains and have on the surface of the vertical raised design of net form; And utilize high temperature resistant adhesive tape that second substrate is fixed on first substrate, second substrate that fixes and first substrate are put into vacuum annealing furnace vacuumize processing.
In the said method, the pressure of said vacuum annealing furnace is 0.1pa～1pa, and temperature is 20 ℃～25 ℃, and the duration that vacuumizes processing is 30 minutes～50 minutes.
In the said method, saidly on first substrate be with second substrate package:
The high temperature resistant adhesive tape of fixing first substrate is removed; And will through and vacuumizing the edge of handling and removing second substrate behind the high temperature resistant adhesive tape; Encapsulate with the high-temperature plastic band; Make being fixed on first substrate of second base plate seals, accomplish that the attaching of two substrates is encapsulated in the technological process on first substrate.
The present invention also provides a kind of substrate, and the zone of other substrates to be attached has the insulation film of vertical raised design on the surface of this substrate.
In the aforesaid substrate, the wide insulation film that has vertical raised design for the zone of 0mm～10mm on the surface of said substrate beyond the edge in the zone of other substrates to be attached.
The attaching method for packing and the substrate of substrate provided by the invention are made first substrate that the surface has the vertical raised design of net form; Second substrate is attached on the surface that has the vertical raised design of net form in first substrate, and vacuumizes processing; With second substrate package on first substrate; Like this,, can solve the problem that produces bubble in the prior art in the substrate attaching process, improve the product yield, avoid raw-material waste, practice thrift production cost owing to adopted first substrate that has the vertical raised design of net form to paste second substrate.
Description of drawings
Fig. 1 is the schematic flow sheet that the present invention realizes the attaching method for packing of substrate;
Fig. 2 is that the present invention utilizes the mask plate of pixel electrode pattern on first substrate, to form the sketch map of the vertical raised design of net form;
Fig. 3 is that the present invention utilizes the mask plate of Active pattern on first substrate, to form the sketch map of the vertical raised design of net form;
Fig. 4 is that the present invention's second substrate is attached to the sketch map on first substrate;
Fig. 5 is that the present invention is with the sketch map of second substrate package on first substrate;
Fig. 6 is with the horizontal tangent plane sketch map of second substrate package behind first substrate among Fig. 5 of the present invention.
Embodiment
Basic thought of the present invention is: make first substrate that the surface has the vertical raised design of net form; Second substrate is attached on the surface that has the vertical raised design of net form in first substrate, and vacuumizes processing; With second substrate package on first substrate.
Through accompanying drawing and specific embodiment the present invention is done further detailed description more below.
The present invention provides a kind of attaching method for packing of substrate, and Fig. 1 is the schematic flow sheet that the present invention realizes the attaching method for packing of substrate, and is as shown in Figure 1, and this method may further comprise the steps:
Step 101 is made first substrate that the surface has the vertical raised design of net form;
Concrete; The substrate that to choose a thickness be 0.5mm～1.1mm is as first substrate; Using plasma strengthens chemical vapour deposition (CVD) (PECVD; Plasma Enhanced Chemical Vapor Deposition) technology, deposition one deck insulation film on one of them surface of this first substrate; Wherein, this insulation film can be the silicon dioxide (SiO of insulation
2) silicon nitride (SiN of film or insulation
x) film, the thickness of this insulation film is 6000
The uniformity of test insulation film is if the uniformity smaller or equal to 10%, then can continue technological process, if the uniformity greater than 10%, then needs to make again;
On the insulation film of deposition, apply one deck photoresist; Fig. 2 is that the present invention utilizes the mask plate of pixel electrode pattern on first substrate, to form the sketch map of the vertical raised design of net form; Fig. 3 is that the present invention utilizes the mask plate of Active pattern on first substrate, to form the sketch map of the vertical raised design of net form; As shown in Figures 2 and 3; After applying photoresist, utilize the mask plate of pixel electrode pattern or the mask plate of Active pattern, carry out exposure-processed in the zone of second substrate lip-deep to be attached that has deposited insulation film and photoresist on first substrate; And then carry out this regional development treatment and dry etching and handle; With all photoresist lift offs on first substrate, on the insulation film of first substrate, form the vertical raised design of net form at last, obtain first substrate that on insulation film, contains the vertical raised design of net form;
Here, better vacuumize effect in order in subsequent technique, to reach, preferred; In above-mentioned exposure-processed process; Can also utilize the mask plate of pixel electrode pattern or the mask plate of Active pattern, be the zone of 0mm～10mm to wide beyond the edge in the zone of second substrate to be attached on first substrate simultaneously, carries out exposure-processed; This zone also forms the vertical raised design of net form after handling through exposure-processed, development treatment, dry etching processing and photoresist lift off; This zone is the zone that is about to attach high temperature resistant adhesive tape, and therefore, this regional width need be consistent with the width of high temperature resistant adhesive tape to be attached; Here, exposure-processed, development treatment and dry etching processing are not carried out in all the other zones on first substrate; Just on the photoresist of first substrate, formed the vertical raised design of net form through after the exposure-processed, the thickness of photoresist does not change;
Utilize mask plate simultaneously wide beyond the edge in the zone of second substrate to be attached on first substrate to be the zone of 0mm～10mm; The detailed process of carrying out exposure-processed is following: if the mask plate that utilizes is enough big; The wide vertical raised design of net form on first substrate beyond the edge in the zone of second substrate to be attached for forming in the zone of 0mm～10mm, the vertical raised design of net form in the zone of second substrate to be attached forms together on first substrate that can coexist; But; Because the mask plate that generally uses at present is less; And wide beyond the edge in the zone of second substrate to be attached is that the zone of 0mm～10mm is light tight fully on first substrate, therefore, and can be with the outside translation of mask plate; Be about to mask plate and move to four direction successively, accomplishing wide beyond the edge in the zone of second substrate to be attached on first substrate is the exposure-processed in the zone of 0mm～10mm;
In the present embodiment; Be that example describes only with the mask plate of pixel electrode pattern or the mask plate of Active pattern; But,, the mask plate that utilizes forms the vertical raised design of net form on the insulation film of substrate as long as can making not only for due to these two kinds of mask plates.
Step 102 is attached to second substrate on the surface that has the vertical raised design of net form in first substrate, and vacuumizes processing;
Concrete, Fig. 4 is that the present invention's second substrate is attached to the sketch map on first substrate, and is as shown in Figure 4, and second substrate according to predefined position, is attached in first substrate that obtains in the step 101 and has on the surface of the vertical raised design of net form; Utilize high temperature resistant adhesive tape then, second substrate is fixed on first substrate, for example can four angles of second substrate be fixed on first substrate; Wherein, the thickness of second substrate is generally 0.1mm～0.3mm; Said high temperature resistant adhesive tape can be Kapton Tape;
Second substrate that fixes and first substrate are put into vacuum annealing furnace together vacuumize processing, the pressure of vacuum annealing furnace is 0.1pa～1pa; Temperature is a room temperature, promptly 20 ℃～25 ℃; The duration that vacuumizes processing is 30 minutes～50 minutes, and like this, the bubble that just can will in the attaching process, remain in the vertical raised design of net form is got rid of clean.
Step 103, with second substrate package on first substrate;
Concrete, vacuumize processing after, need the artificial high temperature resistant adhesive tape that will be used for fixing second substrate to remove; Fig. 5 is that the present invention is with the sketch map of second substrate package on first substrate; As shown in Figure 5; To through the edge that vacuumizing second substrate after handling the back and removing high temperature resistant adhesive tape, encapsulate, make being fixed on first substrate of second base plate seals with the high-temperature plastic band; Completion attaches second substrate and is encapsulated in the technological process on first substrate, and second substrate is attached the horizontal tangent plane sketch map that is encapsulated on first substrate can be as shown in Figure 6.
The present invention also provides a kind of substrate, and the zone of other substrates to be attached has the insulation film of vertical raised design on the surface of this substrate.
The wide insulation film that has vertical raised design for the zone of 0mm～10mm on the surface of said substrate beyond the edge in the zone of other substrates to be attached.
The above is merely preferred embodiment of the present invention, is not to be used to limit protection scope of the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. the attaching method for packing of a substrate is characterized in that, this method comprises:
Make first substrate that the surface has the vertical raised design of net form;
Second substrate is attached on the surface that has the vertical raised design of net form in first substrate, and vacuumizes processing;
With second substrate package on first substrate.
2. method according to claim 1 is characterized in that, first substrate that said making surface has the vertical raised design of net form is:
On one of them surface of first substrate of selecting, deposit one deck insulation film and apply one deck photoresist; The zone that on first substrate, has second substrate lip-deep to be attached of insulation film and photoresist; Utilize mask board to explosure, development, etching and photoresist lift off to handle, on the insulation film of first substrate, form the vertical raised design of net form.
3. method according to claim 2 is characterized in that, this method also comprises:
In said exposure-processed process, after forming the vertical raised design of net form on the photoresist of first substrate, utilize mask plate, be the zone of 0mm～10mm to wide beyond the edge in the zone of second substrate to be attached on first substrate simultaneously, carry out exposure-processed; This zone forms the vertical raised design of net form after handling through exposure-processed, development treatment, dry etching processing and photoresist lift off.
4. according to claim 2 or 3 described methods, it is characterized in that said mask plate is the mask plate of pixel electrode pattern or the mask plate of Active pattern.
5. method according to claim 1 is characterized in that, said second substrate is attached on the surface that has the vertical raised design of net form in first substrate, and vacuumizes and be treated to:
With second substrate according to predefined position; Be attached in first substrate that obtains and have on the surface of the vertical raised design of net form; And utilize high temperature resistant adhesive tape that second substrate is fixed on first substrate, second substrate that fixes and first substrate are put into vacuum annealing furnace vacuumize processing.
6. method according to claim 5 is characterized in that, the pressure of said vacuum annealing furnace is 0.1pa～1pa, and temperature is 20 ℃～25 ℃, and the duration that vacuumizes processing is 30 minutes～50 minutes.
7. method according to claim 5 is characterized in that, saidly with second substrate package on first substrate is:
The high temperature resistant adhesive tape of fixing first substrate is removed; And will through and vacuumizing the edge of handling and removing second substrate behind the high temperature resistant adhesive tape; Encapsulate with the high-temperature plastic band; Make being fixed on first substrate of second base plate seals, accomplish that the attaching of two substrates is encapsulated in the technological process on first substrate.
8. a substrate is characterized in that, the zone of other substrates to be attached has the insulation film of vertical raised design on the surface of this substrate.
9. substrate according to claim 8 is characterized in that, the wide insulation film that has vertical raised design for the zone of 0mm～10mm on the surface of said substrate beyond the edge in the zone of other substrates to be attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110167279.9A CN102769995B (en) | 2011-06-21 | 2011-06-21 | A kind of attaching method for packing and substrate of substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110167279.9A CN102769995B (en) | 2011-06-21 | 2011-06-21 | A kind of attaching method for packing and substrate of substrate |
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| CN102769995A true CN102769995A (en) | 2012-11-07 |
| CN102769995B CN102769995B (en) | 2016-05-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110576593A (en) * | 2018-08-01 | 2019-12-17 | 蓝思科技（长沙）有限公司 | Film pasting method and application thereof and glass panel |
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| CN110576593A (en) * | 2018-08-01 | 2019-12-17 | 蓝思科技（长沙）有限公司 | Film pasting method and application thereof and glass panel |
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| CN102769995B (en) | 2016-05-04 |
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