Embodiment
Now in detail with reference to the embodiment that describes in the accompanying drawing.For complete understanding the present invention, numerous details in following detailed description, have been mentioned.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In other embodiments, be not described in detail known method.Process, assembly and circuit are in order to avoid unnecessarily make embodiment fuzzy.
Ultra material antenna is based on the artificial electromagnetic material art designs and forms among the present invention; Artificial electromagnetic material is meant the topological metal structure of sheet metal being engraved into given shape; And the topological metal structure of said given shape is arranged on certain dielectric constant and the magnetic permeability base material and the equivalent extraordinary electromagnetic material of processing and manufacturing, its performance parameter depends primarily on the topological metal structure of the given shape of its sub-wavelength.In resonance band, artificial electromagnetic material embodies the dispersion characteristics of height usually, in other words, the impedance of antenna, holds perception, equivalent dielectric constant and magnetic permeability along with violent variation can take place frequency.Thereby can adopt the artificial electromagnetic material technology that the fundamental characteristics of above-mentioned antenna is transformed, the medium substrate that makes metal structure depend on it has been formed a highly dispersed extraordinary electromagnetic material equivalently, thereby realizes the new antenna that radiation characteristic is abundant.
Structural representation referring to the antenna element for the ultra material antenna of the present invention illustrated in figures 1 and 2; This antenna element 33 comprises medium substrate 331, radiating element 332, feeder line (not marking among the figure), feed connection 334, ground plate (not marking among the figure), distributing point 336 and earth point 337; Medium substrate 331 has two surfaces, and radiating element 332, feeder line (not marking among the figure), feed connection 334, distributing point 336 and earth point 337 are arranged at the same surface of medium substrate 331.Radiating element comprises sheet metal 3321 and groove 3322, these sheet metal 3321 rectangular shapes, and groove 3322 hollow out sheet metals 3321 backs form, and this groove 3322 is the double helix shape of symmetry, and symmetrical centre is sheet metal 3321 center line longitudinally.Feeder line and radiating element 332 are of coupled connections; This feeder line comprises first feeder line 3331 and second feeder line 3332; First feeder line 3331 and second feeder line 3332 respectively spacer ring around the both sides that are arranged on radiating element 332, wherein, the free end of first feeder line 3331 extends to the end of radiating element 332; The free end of second feeder line 3332 extends to the middle part of radiating element 332; First feeder line 3331 and second feeder line 3332 are compiled in a place, and feed connection 334 is electrically connected first feeder line 3331 and second feeder line 3332 through connecting this intersection with distributing point 336, and the width of feed connection 334 is slightly larger than the width of first feeder line 3331 and second feeder line 3332.Ground plate comprises earth connection 3351 and ground strip 3352; Earth connection 3351 has two, the both sides that are arranged at feed connection 334 at interval, and ground strip 3352 is arranged at another surface of medium substrate 331; Be inverted T shape; Earth connection 3351 is electrically connected through the plated-through hole 3353 that runs through medium substrate 331 with ground strip 3352, and earth point 337 and earth connection 3351 are arranged at the same surface of medium substrate 331, and this earth point 337 is electrically connected on ground strip 3352 " one " parts through plated-through hole 3371.
Should can further include signal transmission ends (not shown) by ultra material antenna, for example: signal transmssion line or sub-miniature A connector etc. make ultra material antenna and electric room can carry out the signal transmission.
Among the present invention,,, can adopt various manufactures as long as satisfy design principle of the present invention about the processing and manufacturing of ultra material antenna.Prevailing method is to use the manufacturing approach of all kinds of printed circuit board (PCB)s (PCB), as the PCB that covers copper makes and all can satisfy processing request of the present invention.Remove this processing mode, can also introduce other manufacturing process according to the needs of reality, but like the flexible PCB processing of conductive silver paste printing ink processing mode, all kinds of deformation devices, the processing mode of iron plate antenna and the processing mode of iron plate and PCB combination.Wherein, iron plate and PCB combination processing mode is meant that the accurate processing that utilizes PCB accomplishes the processing of groove structure, accomplishes other slave part with iron plate.Owing to adopt cheaply copper product to form radiating element, therefore expose in the air oxidizedly easily and ultra material antenna resonant frequency skew or performance are sharply descended, so ultra material antenna surface is provided with nonmetallic anti-oxidation film.
Medium substrate 331 components comprise glass cloth, epoxy resin and with the compound of this epoxy resin generation cross-linking reaction, below through this medium substrate of embodiment explanation.
First kind execution mode is following:
In such execution mode, be used for the infiltration solution of some low dielectric constant and low loss of production and processing the present invention's medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier spare or similar application part etc.).Said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.Wherein first component and second component dispose mixing according to a certain percentage.Above-mentioned first component, second component and said one or more solvents are made into said infiltration solution.Said infiltration solution is through stirring the back, will a said glass cloth soaking into first component and second component are adsorbed in the glass cloth perhaps on the surface; Baking is copied said glass cloth and is made said one or more solvent evaporates then, and makes first component and the mutual chemical combination of second component be cross-linked to form semi-solid preparation thing or solidfied material.The semi-solid preparation thing is meant to be copied the glass cloth of absorption first component and second component in the relatively low environment of temperature in baking, and first component comprises the soft mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Solidfied material be meant with the glass cloth of absorption first component and second component baking copy temperature relatively than high ambient in, first component comprises the relative harder mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.
In this execution mode; The glass cloth of said infiltration forms semi-solid preparation thing (in the form of sheets) through low-temperature bake; Said then semi-solid preparation thing is cut into cuts out sheet, and it is superimposed and be hot pressed into this and implement described multilayer dielectricity substrate (being multilayer layer pressing plate or sheet) according to the thickness needs said multi-disc to be cut out sheet.Wherein the hot pressing process purpose makes the component of winning comprise epoxy resin and the chemical combination cross-linking reaction all takes place the second component inclusion compound exactly.
Can certainly understand, the glass cloth of said infiltration directly forms solidfied material, single-layer medium substrate promptly of the present invention (being individual layer laminated sheet or sheet) through high-temperature baking.
In concrete embodiment, the compound of said second component can be selected the copolymer that comprises by polarity macromolecule and non-polar high polymer chemical combination for use, like styrene maleic anhydride copolymer.It is understandable that, can all can be used for the prescription composition of this execution mode with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6,8 styrene or any number in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, said epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, add the certain amount of solvent wiring solution-forming then.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process; Like common agitator and agitated reactor epoxy resin is evenly mixed with styrene maleic anhydride copolymer, thus make in the said solution epoxy resin with promptly be infiltration solution according to the invention after styrene maleic anhydride copolymer evenly mixes.
In concrete embodiment; Impel above-mentioned infiltration solution 200-400 gel in second (selecting 171 ℃ of gel ambient temperatures for use) through adding certain promoter, promote wherein about the above-mentioned 260 seconds infiltration solution gelatinizing time that (like 258-260 second or 250-270 second etc.) effect is better.Said promoter can be selected for use and included but not limited to tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, mix the mixed solvent that forms in dinethylformamide, EGME, the toluene between any one or the above-mentioned two or more solvent.
In another embodiment, said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of said second component selects for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.Wherein said cyanate performed polymer concentration 75%.Promoter is selected methylimidazole for use; Said solvent is selected butanone for use.This execution mode soaks into solution specifically fills a prescription like following table:
In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, the chemical combination cross-linking reaction all can take place with epoxy resin in both.
Second type of execution mode is following:
In second type of execution mode of the present invention; The composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate among production the present invention (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier spare or similar application part etc.); Said composition comprises glass cloth, first component and second component, and first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction.
Said composition fabrication processes also comprises following technology:
At first, second component is comprised the compound and the said epoxy resin that crosslinked reaction take place with said epoxy resin prepare, add the certain amount of solvent wiring solution-forming then according to the ratio of sense value.In concrete embodiment, said compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and wherein the copolymer of preferred embodiment can be selected styrene maleic anhydride copolymer for use.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, and like common agitator and agitated reactor epoxy resin are evenly mixed with styrene maleic anhydride copolymer.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6 or 8 styrene in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, make epoxy resin and styrene maleic anhydride copolymer in the said solution can carry out the chemical combination cross-linking reaction under certain condition, take place to depend on said glass cloth after the chemical combination cross-linking reaction, thereby form medium substrate of the present invention.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, in dinethylformamide, EGME, the toluene any one or above-mentioned between mixed solvent.
Said various component ratios of solution one specific embodiment such as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, both are all crosslinked with epoxy resin ability chemical combination.
Then, from above-mentioned solution, extract said a small amount of test sample book,, regulate said solution at this fixed temperature environment gel time through adding promoter in a certain specified temp environmental testing said solution gelatinizing time.Can impel above-mentioned solution in 200-400 gel in time second through adding one or more promoter; Wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures; At this execution mode; Carry out gel time through being set in 171 degrees centigrade of environment, make above-mentioned solution preferable in gel time about 260 seconds (like 258-260 second or 250-270 second etc.) effect.Said promoter can be selected for use and included but not limited to select for use tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
The 3rd step is when above-mentioned test sample book during gel, is soaked into the back with glass cloth and taken out oven dry in 200-400 time range second, the formation composition in said solution.In these concrete steps; Glass cloth immersed fully to soak in the solution guarantee that said epoxy resin and styrene maleic anhydride copolymer are adsorbed in the glass cloth perhaps on the surface; The glass cloth that immerses solution then is through hanging on air dry oven 180 ℃ of bakings about 5 minutes; Purpose is fully volatilized the solvent butanone exactly, and makes said epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, and the product of glass cloth and said chemical combination cross-linking reaction makes the semi-solid preparation composition.It is understandable that, prolong stoving time with or improve baking temperature, can form hardening composition.General a large amount of commercial production adopts in the vertical gluing machine and accomplishes in the impregnation subsystem and baking oven subsystem.
At last, change composition and the conductive foil with oven dry carries out pressing.In these concrete steps, with change composition (prepreg or prepreg) and conductive foil pressing in the vacuum hotpressing machine of oven dry.Said conductive foil is selected for use and is comprised the electric conducting material that copper, silver, gold, aluminium or above-mentioned material alloy material etc. make.Because the price of copper product is relatively low, the conductive foil of therefore selecting for use copper to become is suitable for industrialization.
In order to be suitable for antenna or some performance parameter requirements of electronic equipment, multi-disc prepreg or prepreg are carried out lamination formation multilayer layer pressing plate simultaneously.Use these laminated sheets and can effectively reduce the antenna recombination loss, and then guarantee the aerial radiation yield value.
Utilize above-mentioned composition, single-layer sheet prepreg or prepreg, multilayer layer pressing plate to be processed into antenna substrate; Form through introducing polarity and non-polar high polymer copolymer reduces the dielectric constant and the dielectric loss of antenna substrate, thereby satisfies its demands of applications in electronic equipment.
As shown in Figure 1, the figure shows a concrete ultra material antenna, the long 60mm of this antenna radiation unit; Wide 6mm; The one-sided spiral angle of double helix shape groove is about 540 °, is limit with the one-sided starting point of groove promptly, and the groove bearing of trend is a pole axis; The horizontal original position at the one-sided starting point of groove place is 0 °, and the pole axis anglec of rotation when groove coil rotates to the groove line of symmetry is slightly larger than 540 °.
Be illustrated in figure 2 as ultra material antenna S11 parameters simulation figure, choose specific frequency and mark, as shown in the table:
Frequency/GHz |
Loss/dB |
0.88 |
-11.88 |
0.92 |
-29.839 |
0.96 |
-11.622 |
1.71 |
-0.42094 |
1.8 |
-11.03 |
1.88 |
-3.9723 |
Through last table; Should ultra material antenna under 880MHz ~ 960MHz wave band, have-loss below the 10dB; Bigger in 1710MHz ~ 1880MHz loss, have near the 1800GHz-loss below the 10dB, be illustrated under 880MHz ~ 960MHz wave band and have the excellent communications effect; Communication bandwidth is narrower under 1710MHz ~ 1880MHz frequency range, can satisfy the communicating requirement of this interval special frequency scope.
Referring to Fig. 3-shown in Figure 5 is the structural representation of electronic equipment of the present invention and for the clear partial enlarged drawing of being selected for use of expressing; This electronic equipment comprises housing 1, circuit board (not shown), connector 2, GPRS antenna 3 and signal transmssion line 5; Be provided with circular socket holes 11 and catch 12 on its side; It is approximate rectangular-shaped that this catch 12 is, be hole wall by jack 11 after the center position of jack 11 extends a segment length, extend to the inboard of housing 1 again and form; The scheme of circuit board (not shown) and existing electronic equipment is the same, is placed in the housing 1.
One through hole 21, plug 22, containing cavity 23 and annular groove 231 are set on the connector 2, and through hole 21 can let signal transmssion line 5 grades pass connector 2, and plug 22 is arranged on an end of connector 2; Be provided with a restrictions 221 on the outer surface of this plug 22, this restrictions 221 is a platform, and this restrictions 221 can limit the axial rotation of connector 2; Also have the plug of cutting apart 22 on the plug 22 and be two-part groove 222; Containing cavity 23 has certain space, and this space is cylindric, and annular groove 231 is cannelures that the chamber wall from containing cavity 23 extends outward; These annular groove 231 part hollow out containing cavities 23, the part of hollow out comprises two and symmetrical distribution in the present embodiment.
GPRS antenna 3 comprises antenna body 31 and Plug Division 32, and antenna body 31 comprises the antenna case (not marking among the figure) of fastening and be packed in the antenna element (not shown) in the antenna case that Plug Division 32 is cylindric; Insert back and containing cavity 23 interference fits in the containing cavity 23; This Plug Division 32 is provided with line hole 321, narrow slit 322 and projection 323, and line hole 321 can let signal transmssion line 5 pass, and narrow slit 322 is divided into two parts with Plug Division 32; These two parts can be to narrow slit 322 direction elastic deformations; Projection 323 is arranged on the outer surface of Plug Division 32, and after containing cavity 23 was inserted in Plug Division 32, projection 323 snapped in the annular groove 231.
Signal transmssion line 5 is a coaxial line, stretches out behind warp hole 321, the through hole 21 successively behind the antenna element of these signal transmssion line 5 connection GPRS antennas 3, is connected on the circuit board of electronic equipment.
The catch 12 of housing 1 makes the cross section of jack 11 demonstrate the scarce shape of circle; After connector 2 plugs 22 insert this jack 11; Can prevent the rotation of connector 2 in jack 11; Plug 22 and jack 11 interference fits can make in the fixing insertion jack 11 of plug 22, and connector 2 is fixedly mounted on the housing 1.
The plug 22 of connector 2 inserts in the jack 11 of housing 1, catch 12 Elastic Contact of these plug 22 restrictions 221 and housing 1; Insert in the containing cavity of connector 2 Plug Division 32 of GPRS antenna 3, and with the containing cavity interference fits, projection 323 snaps in the annular groove 231; Owing to be interference fits; Under external force, Plug Division 32 can drive antenna and in containing cavity, rotate, and projection 323 prevents that Plug Division 32 from deviating from from containing cavity.
Groove 222 plugs 22 on the plug 22 are divided into two parts; Two parts after cutting apart can be towards the direction generation elastic deformation of groove 222 under external force; Chamfered is carried out in the end of plug 22, can play the effect of guiding, is convenient to plug 22 and inserts in the jack 11; In like manner; Narrow slit 322 on the Plug Division 32 is divided into two parts with Plug Division 32, and these two parts can be towards the direction generation elastic deformation of narrow slit under external force, and the end of Plug Division 32 can also be provided with a chamfering; Can play the effect of guiding, be convenient to the Plug Division and insert in the containing cavity 23.
Antenna body 31 and Plug Division 32 be connected formula linearly, also can be antenna body 31 vertical Plug Divisions 32 formulas, can confirm according to the needs in space and the position of jack 11; Projection 323 on 32 outer circumference surfaces of Plug Division can symmetry setting, and be separately positioned on two parts of being cut apart by narrow slit 322.Antenna body 31 can comprise antenna case, also can be antenna element, and for example pcb board radiating element etc. also can comprise the antenna case that antenna part is exposed.
This electronic equipment includes but not limited to STB, WAP, router, PDA, PAD, mobile multimedia player, mobile phone, notebook, electric paper book, digital photo frame, digital camera, DV, broadcast receiver, television set etc.
Because the tie point of signal transmssion line on antenna element is at the middle part of antenna element; Therefore to be arranged in the length of antenna body longer for signal transmssion line; And on the medium substrate of antenna element, be provided with some through holes; Signal transmssion line passes through hole can make signal transmssion line be distributed in two surfaces of medium substrate, makes can be in the antenna body fixing placement of signal transmssion line, and the good electrical of the tie point on inhibit signal transmission line and the antenna element is connected.
Combine accompanying drawing that preferred embodiment of the present invention is described above; But the present invention is not limited to above-mentioned embodiment; Those of ordinary skill in the art also can make a lot of forms under enlightenment of the present invention, these all belong within the protection of the present invention.