CN102745640A - Covering member for micro electro mechanical device and manufacturing method thereof - Google Patents
Covering member for micro electro mechanical device and manufacturing method thereof Download PDFInfo
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- CN102745640A CN102745640A CN2011101068239A CN201110106823A CN102745640A CN 102745640 A CN102745640 A CN 102745640A CN 2011101068239 A CN2011101068239 A CN 2011101068239A CN 201110106823 A CN201110106823 A CN 201110106823A CN 102745640 A CN102745640 A CN 102745640A
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- electroplated metal
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Abstract
The invention discloses a covering member for a micro electro mechanical device and a manufacturing method thereof. The covering member for the micro electro mechanical device comprises a core plate, a sealing plate, a through hole and an electroplating metal layer, wherein the core plate comprises a first surface and a second surface, and an opening which penetrates through the first adhesive layer and the first and second surface; a first adhesive layer is arranged on the first surface; a second adhesive layer is arranged on the second surface; the sealing plate is combined to the first adhesive layer so as to seal one end of the opening; a part of surface of the sealing plate is exposed in the opening; the through hole penetrates through the sealing plate, the first and second adhesive layer and the core plate; and the electroplating metal layer is arranged on the exposed surface of the second adhesive layer, the wall of the through hole and the exposed surface of the sealing plate. By means of electric communication of various electroplating metal layers, the micro electro mechanical device and the covering member have high electromagnetic matching property, so that a shielding effect is achieved.
Description
Technical field
The present invention relates to a kind of encapsulating structure and method for making thereof, relate in particular to a kind of covering member and method for making thereof of microelectromechanicdevices devices.
Background technology
Present microelectromechanicdevices devices for example loudspeaker (microphone) is widely used in mobile communication equipment, audio device etc., and for to avoid this microelectromechanicdevices devices to influence the function of other assembly, and must be located on this microelectromechanicdevices devices with covering member.For solving above-mentioned shortcoming, industry is used to use this covering member internal layer as with metal material, to reach the effect of shielding; See also Fig. 1; It is existing covering member 1 in order to be covered with microelectromechanicdevices devices; On a plate body 11 with adhesion layer 12 combine one have an opening 100 core board 10, again at the hole wall of this opening 100 and be exposed on the plate body 11 of this opening 100 and form metal level 13, to constitute this covering member 1.
Yet,, tend to cause conductibility electromagnetic interference (Electromagnetic interference because this covering member 1 inwall is to belong to metal material; EMI) or Radio frequency interference (Radio Frequency Interference; RFI) problem; In addition, when only other electrical functionality not being provided, will limit microelectromechanicdevices devices structure dress towards light, thin, short, little kenel development as the screen layer that prevents electromagnetic interference with this metal level 13.
Therefore; How to make and have good electromagnetism matching (Electromagnetic compatibility between microelectromechanicdevices devices and this covering member; EMC) to reach the screen effect that prevents electromagnetic interference; And the metal level that can make this covering member has other purposes, has become the problem of desiring most ardently solution at present in fact.
Summary of the invention
In view of the various shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of covering member and method for making thereof that can promote the microelectromechanicdevices devices of screen effect.
For reaching above-mentioned and other purpose; The present invention discloses a kind of covering member of microelectromechanicdevices devices; Comprise: core board has opposite first and second surface, and has first adhesion layer on the first surface of this core board; And have and run through this first adhesion layer, first and second surperficial opening, and has second adhesion layer on the part second surface of this core board; Hush panel is incorporated on this first adhesion layer, sealing an end of this opening, and the part surface of this hush panel is exposed in this opening; Through hole runs through first and second surface of this hush panel, first and second adhesion layer, core board; And electroplated metal layer; Hole wall and this hush panel of being located at a side surface that this second adhesion layer do not join with this core board, this through hole is relatively on the surface of this open side; Wherein, be positioned at this second adhesion layer and this hush panel relatively the lip-deep electroplated metal layer of this open side electrically connect the electroplated metal layer on the hole wall of this through hole.
The present invention also provides a kind of method for making of covering member of microelectromechanicdevices devices, comprising: a core board is provided, has opposite first and second surface, and on the first surface of this core board, form first adhesion layer; First and second surface of running through this first adhesion layer, this core board is to form opening; The hush panel that on this first adhesion layer, is sticked sealing an end of this opening, and forms second adhesion layer, to seal the other end of this opening on the second surface of this core board; Run through this core board, hush panel, first and second adhesion layer to form through hole; On the hole wall of the exposed surface of the exposed surface of this second adhesion layer, this hush panel and this through hole, form electroplated metal layer with plating mode; And remove the electroplated metal layer and second adhesion layer on should opening, to expose outside this opening, the part surface of this hush panel is exposed in this opening.
Comply with the covering member and the method for making thereof of the microelectromechanicdevices devices of the above, have initial metal layer on first and second surface of this core board.This hush panel combines a metal level to constitute by insulating barrier, and this metal level is incorporated on this first adhesion layer.
Covering member and method for making thereof according to above-mentioned microelectromechanicdevices devices also are included on the electroplated metal layer on this hush panel and form welding resisting layer, and in this welding resisting layer, form a plurality of perforates, expose electroplated metal layer partly with correspondence.
Covering member and method for making thereof according to above-mentioned microelectromechanicdevices devices; Also comprise surface-treated layer, be located on the electroplated metal layer on this second adhesion layer, the electroplated metal layer that is exposed to this welding resisting layer perforate and the metal level in this opening or be located on this second adhesion layer electroplated metal layer be exposed on the electroplated metal layer of this welding resisting layer perforate; And the material that forms this surface-treated layer is chemical nickel plating/gold, changes nickel and soak gold (ENIG), change the nickel palladium and soak gold (ENEPIG), chemical plating stannum (Immersion Tin) or organic solderability preservative (OSP).
In addition, one embodiment of the invention also comprise the hush panel that runs through in this opening and the sound hole of electroplated metal layer.
By on can know; The covering member of microelectromechanicdevices devices of the present invention and method for making thereof make to have good electromagnetism matching (EMC) between microelectromechanicdevices devices and this covering member to reach the screen effect that prevents electromagnetic interference by on this hush panel and second adhesion layer, forming electroplated metal layer.In addition, the electroplated metal layer on the hush panel of this covering member and second adhesion layer electrically connects, thereby has ground connection or other electrical functionality.
Description of drawings
Fig. 1 is the cross-sectional schematic of the covering member on the existing microelectromechanicdevices devices; And
Fig. 2 A to Fig. 2 K is the covering member of microelectromechanicdevices devices of the present invention and the cutaway view of method for making thereof; Wherein Fig. 2 D ' is another embodiment of Fig. 2 E, and Fig. 2 J ' is another embodiment of Fig. 2 J.
The main element symbol description
1 covering member
10,20 core boards
100,200 openings
11 plate bodys
12 adhesion layers
13, the 22b metal level
The 20a first surface
The 20b second surface
201 through holes
The 201a conductive through hole
21 initial metal layer
21a first adhesion layer
21b second adhesion layer
22,22 ' hush panel
The 22a insulating barrier
23 crystal seed layers
24 electroplated metal layers
240 electric contact mats
25 consent materials
26 welding resisting layers
260 perforates
27 surface-treated layers
28 sound holes.
The specific embodiment
Below by particular specific embodiment embodiment of the present invention is described, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.
See also Fig. 2 A to Fig. 2 K, be the method for making of the covering member of a kind of microelectromechanicdevices devices that the present invention disclosed.
Shown in Fig. 2 A, at first, a core board 20 is provided, have opposite first 20a and second surface 20b, and this first surface 20a and second surface 20b have initial metal layer 21.
Shown in Fig. 2 B, on the first surface 20a of this core board 20, form the first adhesion layer 21a.
Shown in Fig. 2 C, then,, run through first and second surperficial 20a of this first adhesion layer 21a, initial metal layer 21, this core board 20 with mechanical hole milling mode, 20b is to form at least one opening 200.
Shown in Fig. 2 D, the hush panel 22 that on this first adhesion layer 21a, is sticked sealing an end of this opening 200, and forms the second adhesion layer 21b, to seal the other end of this opening 200 on the initial metal layer 21 of the second surface 20b of this core board 20.In the present embodiment, this hush panel 22 combines a metal level 22b to constitute by insulating barrier 22a, and this metal level 22b is incorporated on this first adhesion layer 21a.In another embodiment, shown in Fig. 2 D ', this hush panel 22 ' only is made up of the insulation material.
Shown in Fig. 2 E, with the machine drilling mode, run through this core board 20, initial metal layer 21, hush panel 22, first and second adhesion layer 21a, 21b is to form a plurality of through holes 201.Those through holes 201 and this opening 200 with mechanical hole fabrication do equally, thereby can quicken the carrying out of processing procedure, improving speed of production, and can reduce the complexity of processing procedure.
Shown in Fig. 2 F; On the hole wall of the exposed surface of the exposed surface of this hush panel 22, the second adhesion layer 21b and those through holes 201, form crystal seed layer 23; Current conduction path when relending by the 23 conduct plating of this crystal seed layer; Form electroplated metal layer 24 on this crystal seed layer 23, to electroplate, and those through holes 201 form conductive through hole 201a.
Shown in Fig. 2 G, optionally in those through holes 201, fill consent material 25 again.
Shown in Fig. 2 H, optionally on the electroplated metal layer 24 on this hush panel 22, form welding resisting layer 26, and in this welding resisting layer 26, form a plurality of perforates 260, expose electroplated metal layer 24 partly with correspondence, for as electric contact mat 240.
Shown in Fig. 2 I, remove the electroplated metal layer 24 and the second adhesion layer 21b on should opening 200, to expose outside this opening 200, the metal level 22b part surface of this hush panel 22 is exposed in this opening 200.
Shown in Fig. 2 J; Form surface-treated layer 27 on the metal level 22b of the hush panel 22 in the electroplated metal layer 24 on this second adhesion layer 21b and this opening 200, and the material that forms this surface-treated layer 27 is chemical nickel plating/gold, changes that nickel soaks gold (ENIG), change nickel palladium soaks gold (ENEPIG), chemical plating stannum (Immersion Tin) or organic solderability preservative (OSP).
If the part surface that optionally makes the electroplated metal layer 24 on this hush panel 22 as electric contact mat 240, then also can respectively form this surface-treated layer 27 on this electric contact mat 240.
The hole wall of opening 200 of the present invention need not form the metal material, makes to have good electromagnetism matching (EMC) between microelectromechanicdevices devices and this covering member, to reach the screen effect that prevents electromagnetic interference; In addition, can make the electroplated metal layer 24 of the both sides up and down of this covering member have ground connection or other electrical functionality through conductive through hole 201a electrical communication.
In addition, the present invention can use the hush panel 22 of unlike material according to the electrical demand of microelectromechanicdevices devices, with satisfied best electromagnetism matching (EMC), and effectively reaches screen effect; In the present embodiment, be to use hush panel 22, and this metal level 22b part surface is exposed in this opening 200 with metal level 22b; Also can be shown in Fig. 2 J ', the hush panel 22 ' of using the insulation material to constitute.
Yet if this hush panel 22 ' only is made up of the insulation material, the hush panel 22 ' that need not in this opening 200 goes up formation surface-treated layer 27.
Shown in Fig. 2 K, optionally run through hush panel 22 and electroplated metal layer 24 in this opening 200 to form sound hole 28.
The present invention also provides a kind of covering member of microelectromechanicdevices devices; Comprise: core board 20; Have opposite first 20a and second surface 20b; And have the first adhesion layer 21a on the first surface 20a of this core board 20, and have and run through this first adhesion layer 21a, first and second surperficial 20a, the opening 200 of 20b; The second adhesion layer 21b is located on the second surface 20b of this core board 20; Hush panel 22 is incorporated on this first adhesion layer 21a, seals an end of this opening 200 to make this hush panel 22, and the part surface of this hush panel 22 is exposed in this opening 200; Through hole 201 runs through first and second surperficial 20a of this first adhesion layer 21a, the second adhesion layer 21b, hush panel 22, core board 20,20b; And electroplated metal layer 24; Be located at a side surface that this second adhesion layer 21b do not join with this core board 20, respectively on the hole wall of this through hole 201 and on the surface of these hush panel 22 relative these opening 200 sides; Wherein, the lip-deep electroplated metal layer 24 that is positioned at this second adhesion layer 21b and this hush panel 22 relative these opening 200 sides electrically connects the electroplated metal layer 24 on the hole wall of these through holes 201.
The surperficial 20a of first and second of described core board 20,20b is last to have initial metal layer 21; Described hush panel 22 can combine a metal level 22b to constitute by insulating barrier 22a, and this metal level 22b is incorporated on this first adhesion layer 21a.
Described covering member also comprises welding resisting layer 26, is formed on the electroplated metal layer 24 on this hush panel 22, and in this welding resisting layer 26, forms a plurality of perforates 260, exposes electroplated metal layer 24 partly with correspondence.
Described covering member also comprises surface-treated layer 27, be located at electroplated metal layer 24 on this second adhesion layer 21b, be exposed to the electroplated metal layer 24 of these welding resisting layer 26 perforates 260 and metal level 22b in this opening 200 go up or be located on this second adhesion layer 21b electroplated metal layer 24 be exposed on the electroplated metal layer 24 of these welding resisting layer 26 perforates 260; And the material that forms this surface-treated layer 27 can be chemical nickel plating/gold, changes nickel and soak gold (ENIG), change the nickel palladium and soak gold (ENEPIG), chemical plating stannum (Immersion Tin) or organic solderability preservative (OSP).
In addition, described covering member also comprises sound hole 28, runs through hush panel 22 and electroplated metal layer 24 in this opening 200.
In sum; The covering member of microelectromechanicdevices devices of the present invention and method for making thereof; Through (i.e. the upper and lower side of this covering member) formation electroplated metal layer on this hush panel and second adhesion layer, make to have good electromagnetism matching (EMC) between microelectromechanicdevices devices and this covering member to reach the screen effect that prevents electromagnetic interference.In addition, the upside electroplated metal layer of this covering member electrically connects the underside electrical metal cladding, thereby has ground connection or other electrical functionality.In addition, the processing procedure time of the present invention is short, so can increase output.
The foregoing description is in order to illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.So rights protection scope of the present invention, should be listed like the claim scope.
Claims (18)
1. the covering member of a microelectromechanicdevices devices comprises:
Core board; Have opposite first and second surface; And have first adhesion layer on the first surface of this core board, and have and run through this first adhesion layer, first and second surperficial opening, and have second adhesion layer on the part second surface of this core board;
Hush panel is incorporated on this first adhesion layer, sealing an end of this opening, and the part surface of this hush panel is exposed in this opening;
Through hole runs through first and second surface of this hush panel, first adhesion layer, second adhesion layer, core board; And
Electroplated metal layer; Hole wall and this hush panel of being located at a side surface that this second adhesion layer do not join with this core board, this through hole is relatively on the surface of this open side; Wherein, be positioned at this second adhesion layer and this hush panel relatively the lip-deep electroplated metal layer of this open side electrically connect the electroplated metal layer on the hole wall of this through hole.
2. the covering member of microelectromechanicdevices devices according to claim 1 is characterized in that, has initial metal layer on first and second surface of this core board.
3. the covering member of microelectromechanicdevices devices according to claim 1 is characterized in that, this hush panel combines a metal level to constitute by insulating barrier, and this metal level is incorporated on this first adhesion layer.
4. the covering member of microelectromechanicdevices devices according to claim 3; It is characterized in that this covering member also comprises welding resisting layer, be located on the lip-deep electroplated metal layer of relative this open side of this hush panel; And in this welding resisting layer, form a plurality of perforates, expose electroplated metal layer partly with correspondence.
5. the covering member of microelectromechanicdevices devices according to claim 4; It is characterized in that; This covering member also comprises surface-treated layer, is located at electroplated metal layer on this second adhesion layer, is exposed on the electroplated metal layer and the metal level in this opening of this welding resisting layer perforate.
6. the covering member of microelectromechanicdevices devices according to claim 1; It is characterized in that this covering member also comprises welding resisting layer, be located on the lip-deep electroplated metal layer of relative this open side of this hush panel; And in this welding resisting layer, form a plurality of perforates, expose electroplated metal layer partly with correspondence.
7. the covering member of microelectromechanicdevices devices according to claim 6 is characterized in that, this covering member also comprises surface-treated layer, be located on this second adhesion layer electroplated metal layer be exposed on the electroplated metal layer of this welding resisting layer perforate.
8. according to the covering member of claim 5 or 7 described microelectromechanicdevices devices, it is characterized in that the material that forms this surface-treated layer is that chemical nickel plating/gold, change nickel soak gold, change nickel palladium soaks gold, chemical plating stannum or organic solderability preservative.
9. the covering member of microelectromechanicdevices devices according to claim 8 is characterized in that, this covering member also comprises the hush panel that runs through in this opening and the sound hole of electroplated metal layer.
10. the method for making of the covering member of a microelectromechanicdevices devices comprises:
One core board is provided, has opposite first and second surface, and on the first surface of this core board, form first adhesion layer;
First and second surface of running through this first adhesion layer, this core board is to form opening;
The hush panel that on this first adhesion layer, is sticked sealing an end of this opening, and forms second adhesion layer, to seal the other end of this opening on the second surface of this core board;
Run through this core board, hush panel, first and second adhesion layer to form through hole;
On the hole wall of the exposed surface of the exposed surface of this second adhesion layer, this hush panel and this through hole, form electroplated metal layer with plating mode; And
Remove the electroplated metal layer and second adhesion layer on should opening,, the part surface of this hush panel is exposed in this opening to expose outside this opening.
11. the method for making of the covering member of microelectromechanicdevices devices according to claim 10 is characterized in that, has initial metal layer on first and second surface of this core board.
12. the method for making of the covering member of microelectromechanicdevices devices according to claim 10 is characterized in that, this hush panel combines metal level to constitute by insulating barrier, and this metal level is incorporated on this first adhesion layer.
13. the method for making of the covering member of microelectromechanicdevices devices according to claim 12; It is characterized in that; This method for making is included on the electroplated metal layer on this hush panel and forms welding resisting layer, and in this welding resisting layer, forms a plurality of perforates, exposes electroplated metal layer partly with correspondence.
14. the method for making of the covering member of microelectromechanicdevices devices according to claim 13; It is characterized in that this method for making also comprises and forms the electroplated metal layer of surface-treated layer on this second adhesion layer, is exposed on the electroplated metal layer and the metal level in this opening of this welding resisting layer perforate.
15. method for making according to the covering member of claim 10 a described microelectromechanicdevices devices; It is characterized in that; This method for making also is included on the electroplated metal layer on this hush panel and forms welding resisting layer, and in this welding resisting layer, forms a plurality of perforates, exposes electroplated metal layer partly with correspondence.
16. the method for making of the covering member of microelectromechanicdevices devices according to claim 15 is characterized in that, this method for making also comprises the electroplated metal layer of formation surface-treated layer on this second adhesion layer and is exposed on the electroplated metal layer of this welding resisting layer perforate.
17. the method for making according to the covering member of claim 14 or 16 described microelectromechanicdevices devices is characterized in that, the material that forms this surface-treated layer is chemical nickel plating/gold, change nickel soaks gold, changes the nickel palladium and soak gold, chemical plating stannum or organic solderability preservative.
18. the method for making of the covering member of microelectromechanicdevices devices according to claim 17 is characterized in that, this method for making comprises that also the hush panel that runs through in this opening and electroplated metal layer are to form sound hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106823.9A CN102745640B (en) | 2011-04-22 | 2011-04-22 | Covering member for micro electro mechanical device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106823.9A CN102745640B (en) | 2011-04-22 | 2011-04-22 | Covering member for micro electro mechanical device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102745640A true CN102745640A (en) | 2012-10-24 |
| CN102745640B CN102745640B (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201110106823.9A Active CN102745640B (en) | 2011-04-22 | 2011-04-22 | Covering member for micro electro mechanical device and manufacturing method thereof |
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| TW201112381A (en) * | 2009-09-28 | 2011-04-01 | Unimicron Technology Corp | Lid component and method of forming same, package structure having lid component and method of forming same |
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| US20060199297A1 (en) * | 2005-03-07 | 2006-09-07 | Samsung Electronics Co., Ltd. | MEMS device package and method of manufacturing the same |
| CN1975956A (en) * | 2005-11-30 | 2007-06-06 | 三星电子株式会社 | Piezoelectric RF MEMS device and method of fabricating the same |
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