CN102730985A - Coated article and its preparation method - Google Patents
Coated article and its preparation method Download PDFInfo
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- CN102730985A CN102730985A CN2011100909063A CN201110090906A CN102730985A CN 102730985 A CN102730985 A CN 102730985A CN 2011100909063 A CN2011100909063 A CN 2011100909063A CN 201110090906 A CN201110090906 A CN 201110090906A CN 102730985 A CN102730985 A CN 102730985A
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Abstract
The invention provides a coated article, which comprises a substrate of glass. The coated article also includes a titanium dioxide layer, a metallic silver layer, a metallic titanium layer, a titanium cerium oxygen layer and a titanium nitride layer form on the substrate surface in order, and the titanium nitride layer is the outermost layer of the coated article. The coated article of the invention has films of good layer-by-layer transition, and no obvious stress is generated in the films. The coated films can make the coated article reach the effects of low radiation and ultraviolet protection. Meanwhile, the outermost titanium nitride layer is conducive to enhance the wear resistance of the coated article. Moreover, the invention also provides a preparation method of the coated article.
Description
Technical field
The present invention relates to a kind of plated film spare and preparation method thereof.
Background technology
Infrared rays can see through the glass radiation usually, and room temp is raise, and makes winter indoor heat to outdoor, and this all can cause air conditioner refrigerating or heat electric energy increasing.Therefore low radiation coated glass is the research focus of industry always.
Ultraviolet radiation can make macromolecule organic aging, need stop ultraviolet injecting in some special occasions.It in the routine office work buildings influence that reduces ultraviolet radiation; Usually in glass ingredient, add cerium ion; Can reduce ultraviolet (uv) transmission to a certain extent, but produce complicacy of the common used fusion process technology of the glass that contains cerium, and the addition of cerium ion is wayward.
Summary of the invention
In view of this, be necessary to provide a kind of plated film spare that can reduce infrared rays and ultraviolet radiation.
In addition, also be necessary to provide a kind of preparation method of above-mentioned plated film spare.
A kind of plated film spare comprises base material, and this base material is a glass, and this plated film spare also comprises titanium dioxide layer, metallic silver layer, layer of titanium metal, titanium cerium oxygen layer and the titanium nitride layer that is formed at substrate surface successively, and said titanium nitride layer is the outermost layer of plated film spare.
A kind of preparation method of plated film spare, it comprises the steps:
One glass baseplate is provided;
Surface at this glass baseplate forms titanium dioxide layer;
Surface at this titanium dioxide layer forms metallic silver layer;
Surface in this metallic silver layer forms layer of titanium metal;
Form titanium cerium oxygen layer on the surface of this layer of titanium metal;
Surface at this titanium cerium oxygen layer forms titanium nitride layer.
Plated film spare film according to the invention is that successively transition is good, and rete inside does not have obvious stress to produce, and is applying under the situation of external force like this, and the rete that is plated can not cause because of the stress defective of inside losing efficacy; Said metallic silver layer can block infrared rays and said titanium cerium oxygen layer can absorb ultraviolet ray, thereby makes plated film spare reach the effect of low radiation and antiultraviolet; Simultaneously the outermost layer titanium nitride layer has good wear resistance, corrosion resistance nature, thereby in the wear resistance that titanium nitride layer helps to promote plated film spare that plates of whole rete, can prolong the work-ing life of plated film spare.
Description of drawings
Fig. 1 is the sectional view of the plated film spare of the present invention's one preferred embodiment;
Fig. 2 is the schematic top plan view of the present invention's one preferred embodiment vacuum plating unit.
The main element nomenclature
| Plated film spare | 10 |
| |
11 |
| |
13 |
| |
15 |
| Layer of |
17 |
| Titanium |
18 |
| |
19 |
| |
20 |
| |
21 |
| The |
23 |
| The |
24 |
| The |
26 |
| |
25 |
| |
30 |
Following embodiment will combine above-mentioned accompanying drawing to further specify the present invention.
Embodiment
See also Fig. 1; The plated film spare 10 of the present invention's one preferred embodiments comprises base material 11, reaches the titanium dioxide layer 13, metallic silver layer 15, layer of titanium metal 17, titanium cerium oxygen layer 18 and the titanium nitride layer 19 that are formed at base material 11 surfaces successively, and this titanium nitride layer 19 is the outermost layer of plated film spare 10.
The material of this base material 11 is a glass.
This titanium dioxide layer 13 can sputter mode form, its thickness is 30～50nm.This titanium dioxide layer 13 plays the effect of transition layer, to improve the film-substrate cohesion of plated film spare 10.
This metallic silver layer 15 can sputter mode form, its thickness is 15～25nm.This metallic silver layer 15 plays the ultrared effect of blocking, and it has higher reflectivity to region of ultra-red, but reflected infrared.
This layer of titanium metal 17 can sputter mode form, its thickness is 1～4nm.This layer of titanium metal 17 can improve the bonding force between the film system between metallic silver layer 15 and titanium cerium oxygen layer 18.
This titanium cerium oxygen layer 18 can sputter mode form, its thickness is 20～50nm.This titanium cerium oxygen layer 18 can absorb ultraviolet ray preferably.Contain in this titanium cerium oxygen layer 18 titanium oxide mutually with cerium oxide mutually, wherein the mass percent of titanium oxide is 30～50%, the mass percent of cerium oxide is 50～70%.
This titanium nitride layer 19 can sputter mode form, its thickness is 40～60nm.This titanium nitride layer 19 is as outermost layer, and its hardness is higher, can protect other retes to avoid the wearing and tearing scraping, thereby prolong the work-ing life of plated film spare 10.
The preparation method of the plated film spare 10 of the present invention's one preferred embodiments, it comprises the steps:
One base material 11 is provided, and the material of this base material 11 is a glass.
This base material 11 is carried out surface preparation.This surface preparation can comprise conventional carries out steps such as removing oil-removing wax, absolute ethyl alcohol ultrasonic cleaning and oven dry to base material 11.
In conjunction with consulting Fig. 2, a vacuum plating unit 20 is provided, this vacuum plating unit 20 comprises a coating chamber 21 and is connected in a vacuum pump 30 of coating chamber 21 that vacuum pump 30 is in order to vacuumize coating chamber 21.Be provided with pivoted frame (not shown), titanium target 23, silver-colored target 24 and cerium target 26 in this coating chamber 21.Pivoted frame drives base material 11 along 25 revolution of circular track, and base material 11 also rotation along track 25 revolution the time.
Adopt sputtering method at surperficial sputter titanium dioxide layer 13 through pretreated base material 11.This titanium dioxide layer 13 of sputter carries out in said vacuum plating unit 20.During sputter, in coating chamber 21, feed the working gas argon gas, argon flow amount is 100～300sccm; Feed reactant gases oxygen, oxygen flow is 50～200sccm, to base material 11 apply-100～-bias voltage of 300V; Open titanium target 23; The power that titanium target 23 is set is 2.5～3.5kW, and coating temperature is 100～200 ℃, and the plated film time is 10～15min.The thickness of this titanium dioxide layer 13 is 30～50nm.
Continue to adopt the surperficial jet-plating metallization silver layer 15 of sputtering method at said titanium dioxide layer 13.During sputter, the maintenance argon flow amount is 100～300sccm, the bias voltage that base material 11 is applied is-100～-300V, open silver-colored target 24, the power that silver-colored target 24 is set is 2.0～3.5kW, and coating temperature is 80～150 ℃, and the plated film time is 2～6min.The thickness of this metallic silver layer 15 is 15～25nm.
Continue to adopt the surperficial jet-plating metallization titanium layer 17 of sputtering method in said metallic silver layer 15.During sputter, the maintenance argon flow amount is 100～300sccm, to base material 11 apply-100～-bias voltage of 300V, open titanium target 23, the power that titanium target 23 is set is 2.5～3.5kW, coating temperature is 100～200 ℃, the plated film time is 2～4min.The thickness of this layer of titanium metal 17 is 1～4nm.
Continue to adopt the surperficial sputter titanium cerium oxygen layer 18 of sputtering method in said layer of titanium metal 17.During sputter, the maintenance argon flow amount is 100～300sccm, feeds reactant gases oxygen; Oxygen flow is 100～200sccm, to base material 11 apply-100～-bias voltage of 300V, open titanium target 23 and cerium target 26 simultaneously; The power that titanium target 23 is set is 2.5～3.5kW; The power that cerium target 26 is set is 2.5～3.5kW, and coating temperature is 100～200 ℃, and the plated film time is 10～20min.The thickness of this titanium cerium oxygen layer 18 is 20～50nm.
Continue to adopt the surperficial sputter titanium nitride layer 19 of sputtering method at said titanium cerium oxygen layer 18.During sputter, the maintenance argon flow amount is 100～300sccm, feeds reactant gases nitrogen or ammonia; Nitrogen or ammonia flow are 50～100sccm; To base material 11 apply-100～-bias voltage of 300V, open titanium target 23, the power that titanium target 23 is set is 2.5～3.5kW; Coating temperature is 100～200 ℃, and the plated film time is 10～20min.The thickness of this titanium nitride layer 19 is 40～60nm.
Come the present invention is specified through embodiment below.
Embodiment 1
The employed vacuum plating unit 20 of present embodiment is the magnetically controlled DC sputtering coating equipment.
Sputter titanium dioxide layer 13: argon flow amount is 300sccm, and oxygen flow is 100sccm, and base material 11 is applied-bias voltage of 150V, and the power of titanium target 23 is 3kW, and coating temperature is 120 ℃, and the plated film time is 10min; The thickness of this titanium dioxide layer 13 is 40nm.
Jet-plating metallization silver layer 15: argon flow amount is 300sccm, base material 11 is applied bias voltage be-100V, and the power of silver-colored target 24 is 2kW, and coating temperature is 80 ℃, and the plated film time is 3min; The thickness of this metallic silver layer 15 is 15nm.
Jet-plating metallization titanium layer 17: argon flow amount is 300sccm, and base material 11 is applied-bias voltage of 100V, and the power of titanium target 23 is 3kW, and coating temperature is 120 ℃, and the plated film time is 2min; The thickness of this layer of titanium metal 17 is 1 ~ 2nm.
Sputter titanium cerium oxygen layer 18: argon flow amount is 300sccm, and oxygen flow is 120sccm, and base material 11 is applied-bias voltage of 100V, and the power of titanium target 23 is 3kW, and the power of cerium target 26 is 3kW, and coating temperature is 120 ℃, and the plated film time is 10min; The thickness of this titanium cerium oxygen layer 18 is 25nm.
Sputter titanium nitride layer 19: argon flow amount is 300sccm, and nitrogen or ammonia flow are 65sccm, and base material 11 is applied-bias voltage of 100V, and the power of titanium target 23 is 3kW, and coating temperature is 120 ℃, and the plated film time is 13min; The thickness of this titanium nitride layer 19 is 46nm.
Embodiment 2
The employed vacuum plating unit 20 of present embodiment is the magnetically controlled DC sputtering coating equipment.
Sputter titanium dioxide layer 13: argon flow amount is 300sccm, and oxygen flow is 120sccm, and base material 11 is applied-bias voltage of 150V, and the power of titanium target 23 is 3kW, and coating temperature is 150 ℃, and the plated film time is 13min; The thickness of this titanium dioxide layer 13 is 47nm.
Jet-plating metallization silver layer 15: argon flow amount is 300sccm, base material 11 is applied bias voltage be-100V, and the power of silver-colored target 24 is 2kW, and coating temperature is 150 ℃, and the plated film time is 5min; The thickness of this metallic silver layer 15 is 22nm.
Jet-plating metallization titanium layer 17: argon flow amount is 300sccm, and base material 11 is applied-bias voltage of 100V, and the power of titanium target 23 is 2.5kW, and coating temperature is 150 ℃, and the plated film time is 3min; The thickness of this layer of titanium metal 17 is 2 ~ 3nm.
Sputter titanium cerium oxygen layer 18: argon flow amount is 300sccm, and oxygen flow is 150sccm, and base material 11 is applied-bias voltage of 150V, and the power of titanium target 23 is 3kW, and the power of cerium target 26 is 3kW, and coating temperature is 150 ℃, and the plated film time is 15min; The thickness of this titanium cerium oxygen layer 18 is 40nm.
Sputter titanium nitride layer 19: argon flow amount is 300sccm, and nitrogen or ammonia flow are 85sccm, and base material 11 is applied-bias voltage of 150V, and the power of titanium target 23 is 3kW, and coating temperature is 150 ℃, and the plated film time is 15min; The thickness of this titanium nitride layer 19 is 52nm.
Plated film spare 10 films according to the invention are that successively transition is good, and rete inside does not have obvious stress to produce, and are applying under the situation of external force like this, and the rete that is plated can not cause because of the stress defective of inside losing efficacy; Said metallic silver layer 15 can block infrared rays and said titanium cerium oxygen layer 18 can absorb ultraviolet ray, thereby makes plated film spare 10 reach the effect of low radiation and antiultraviolet; Simultaneously outermost layer titanium nitride layer 19 has good wear resistance, corrosion resistance nature, thereby in the wear resistance that titanium nitride layer 19 helps to promote plated film spare 10 that plates of whole rete, can prolong the work-ing life of plated film spare 10.
Claims (13)
1. plated film spare; Comprise base material; This base material is a glass, it is characterized in that: this plated film spare also comprises titanium dioxide layer, metallic silver layer, layer of titanium metal, titanium cerium oxygen layer and the titanium nitride layer that is formed at substrate surface successively, and said titanium nitride layer is the outermost layer of plated film spare.
2. plated film spare as claimed in claim 1 is characterized in that: said titanium dioxide layer forms with the mode of sputter, and its thickness is 30～50nm.
3. plated film spare as claimed in claim 1 is characterized in that: said metallic silver layer forms with the mode of sputter, and its thickness is 15～25nm.
4. plated film spare as claimed in claim 1 is characterized in that: said layer of titanium metal forms with the mode of sputter, and its thickness is 1～4nm.
5. plated film spare as claimed in claim 1 is characterized in that: said titanium cerium oxygen layer forms with the mode of sputter, and its thickness is 20～50nm.
6. plated film spare as claimed in claim 1 is characterized in that: contain in the said titanium cerium oxygen layer titanium oxide mutually with cerium oxide mutually, wherein the mass percent of titanium oxide is 30～50%, the mass percent of cerium oxide is 50～70%.
7. plated film spare as claimed in claim 1 is characterized in that: said titanium nitride layer forms with the mode of sputter, and its thickness is 40～60nm.
8. the preparation method of a plated film spare, it comprises the steps:
One glass baseplate is provided;
Surface at this glass baseplate forms titanium dioxide layer;
Surface at this titanium dioxide layer forms metallic silver layer;
Surface in this metallic silver layer forms layer of titanium metal;
Form titanium cerium oxygen layer on the surface of this layer of titanium metal;
Surface at this titanium cerium oxygen layer forms titanium nitride layer.
9. like the preparation method of the said plated film spare of claim 8, it is characterized in that: the step that forms said titanium dioxide layer adopts following mode to realize: adopt magnetron sputtering method, use the titanium target; With the argon gas is working gas, and argon flow amount is 100～300sccm, is reactant gases with oxygen; Oxygen flow is 50～200sccm, the bias voltage that glass baseplate is applied is-100～-300V, the power of titanium target is 2.5～3.5kW; Coating temperature is 100～200 ℃, and the plated film time is 10～15min.
10. like the preparation method of the said plated film spare of claim 8, it is characterized in that: the step that forms said metallic silver layer adopts following mode to realize: adopt magnetron sputtering method, use silver-colored target,
With the argon gas is working gas, and argon flow amount is 100～300sccm, the bias voltage that glass baseplate is applied is-100～-300V, the power of silver-colored target is 2.0～3.5kW, and coating temperature is 80～150 ℃, and the plated film time is 2～6min.
11. the preparation method like the said plated film spare of claim 8 is characterized in that: the step that forms said layer of titanium metal adopts following mode to realize: adopt magnetron sputtering method, use the titanium target; With the argon gas is working gas; Argon flow amount is 100～300sccm, the bias voltage that glass baseplate is applied is-100～-300V, the power of titanium target is 2.5～3.5kW; Coating temperature is 100～200 ℃, and the plated film time is 2～4min.
12. the preparation method like the said plated film spare of claim 8 is characterized in that: the step that forms said titanium cerium oxygen layer adopts following mode to realize: adopt magnetron sputtering method, use titanium target and cerium target; With the argon gas is working gas, and argon flow amount is 100～300sccm, the bias voltage that glass baseplate is applied is-100～-300V; The power of titanium target is 2.5～3.5kW; The power of cerium target is 2.5～3.5kW, and coating temperature is 100～200 ℃, and the plated film time is 10～20min.
13. the preparation method like the said plated film spare of claim 8 is characterized in that: the step that forms said titanium nitride layer adopts following mode to realize: adopt magnetron sputtering method, use the titanium target; With the argon gas is working gas; Argon flow amount is 100～300sccm, is reactant gases with nitrogen or ammonia, and nitrogen or ammonia flow are 50～100sccm; The bias voltage that glass baseplate is applied is-100～-300V; The power of titanium target is 2.5～3.5kW, and coating temperature is 100～200 ℃, and the plated film time is 10～20min.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100909063A CN102730985A (en) | 2011-04-12 | 2011-04-12 | Coated article and its preparation method |
| TW100113066A TW201241200A (en) | 2011-04-12 | 2011-04-15 | Coated article and method for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100909063A CN102730985A (en) | 2011-04-12 | 2011-04-12 | Coated article and its preparation method |
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| Publication Number | Publication Date |
|---|---|
| CN102730985A true CN102730985A (en) | 2012-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100909063A Pending CN102730985A (en) | 2011-04-12 | 2011-04-12 | Coated article and its preparation method |
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| Country | Link |
|---|---|
| CN (1) | CN102730985A (en) |
| TW (1) | TW201241200A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105884210A (en) * | 2014-12-23 | 2016-08-24 | 北京金晶智慧有限公司 | Ultraviolet ray and infrared ray shielding glass capable of being subsequently processed |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1524721A (en) * | 2003-09-18 | 2004-09-01 | 上海耀华皮尔金顿玻璃股份有限公司 | Glass for sun-shading type locomotive |
| WO2006048463A1 (en) * | 2004-11-08 | 2006-05-11 | Glaverbel | Glazing |
| CN101054268A (en) * | 2007-05-24 | 2007-10-17 | 卢秀强 | Coating glass with function of sunlight control low radiation, ultraviolet radiation stopping and photocatalysis sterilization, and preparation method thereof |
| CN101157522A (en) * | 2007-09-26 | 2008-04-09 | 武汉理工大学 | Visible light anti-reflection and ultraviolet radiation cut-off bifunctional coated glass and preparation method thereof |
-
2011
- 2011-04-12 CN CN2011100909063A patent/CN102730985A/en active Pending
- 2011-04-15 TW TW100113066A patent/TW201241200A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1524721A (en) * | 2003-09-18 | 2004-09-01 | 上海耀华皮尔金顿玻璃股份有限公司 | Glass for sun-shading type locomotive |
| WO2006048463A1 (en) * | 2004-11-08 | 2006-05-11 | Glaverbel | Glazing |
| CN101054268A (en) * | 2007-05-24 | 2007-10-17 | 卢秀强 | Coating glass with function of sunlight control low radiation, ultraviolet radiation stopping and photocatalysis sterilization, and preparation method thereof |
| CN101157522A (en) * | 2007-09-26 | 2008-04-09 | 武汉理工大学 | Visible light anti-reflection and ultraviolet radiation cut-off bifunctional coated glass and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105884210A (en) * | 2014-12-23 | 2016-08-24 | 北京金晶智慧有限公司 | Ultraviolet ray and infrared ray shielding glass capable of being subsequently processed |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201241200A (en) | 2012-10-16 |
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Application publication date: 20121017 |