CN102729000A - Shell manufacturing process with perforation and extrusion processes - Google Patents
Shell manufacturing process with perforation and extrusion processes Download PDFInfo
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- CN102729000A CN102729000A CN201110097507XA CN201110097507A CN102729000A CN 102729000 A CN102729000 A CN 102729000A CN 201110097507X A CN201110097507X A CN 201110097507XA CN 201110097507 A CN201110097507 A CN 201110097507A CN 102729000 A CN102729000 A CN 102729000A
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Abstract
The invention discloses a shell manufacturing process with perforation and extrusion processes. The shell serves as a luminous element on a backlight module of a display and a carrier of a light guide plate, and at least two corresponding side edges of the shell are respectively and convexly provided with a supporting wall so as to form an accommodating space between the supporting walls. The shell manufacturing process comprises the following steps of: executing a first perforation process on the supporting walls to form a plurality of perforated holes; executing an extrusion process at a position of the supporting wall surface opposite to the accommodating space to form a groove at a position corresponding to the holes, and reducing the depth of the holes; executing a second perforation process at the position of the holes, so that a light-emitting diode light bar can be fixed to the outer side faces of the supporting walls, and the light-emitting diodes on the light-emitting diode light bar can be accommodated in the corresponding hole. Therefore, compared with the conventional known shell manufacturing process, the shell manufacturing process with the perforation and extrusion processes has the advantages that the required shell can be rapidly and accurately manufactured through a milling process of a milling machine table, and the production cost of a provider is effectively reduced.
Description
Technical field
The present invention relates to a kind of housing manufacturing process, particularly relate to a kind of program that sees through the perforation extruding, and can on housing, produce a plurality of holes, can hold the housing manufacturing process of light emitting diode.
Background technology
Because flat panel TV (Flat Panel Display is called for short FPD) is compared to kinescope (Cathode ray tube is called for short CRT) TV; Its integral body thinner thickness can not take too much indoor placement space, is beneficial to the demand that people plan indoor design; And overall weight is lighter; Advantage such as be convenient for people to move voluntarily,, form the first-selection of buying TV for people so replace the conventional picture tube TV gradually.General speech, on the whole flat panel TV can be divided into two kinds, first liquid crystal panel (Liquid Crystal Display; Be called for short LCD) TV, it two is plasma panel (Plasma Display Panel is called for short PDP) TVs; Because the present main flow TV size of nuclear family, be mostly 32 cun to 42 inch, but the size of plasma panel TV; Basically be more than 42 inch, and the TV of its 42 inch and the HD video form can't be provided, be not suitable for most user of family; So the liquid crystal panel TV has almost become the main product in the TV market.
General speech, for reducing the thickness of liquid crystal panel TV, on the whole the dealer adopts the backlight module of " side-light type "; See also shown in Figure 1ly, be the portion of element of backlight module, comprise a housing 11 and a light-emitting diode light bar 13; This housing 11 is processed through aluminium extruded type by aluminium, and can be as the carrier of this light-emitting diode light bar 13 (being light-emitting component) with the LGP (not shown), again; One side of this housing 11 is provided with a supporting walls 111, can form an accommodation space 110 between a side of this supporting walls 111 and this housing 11, for placing this LGP; In addition, this light-emitting diode light bar 13 is arranged on this supporting walls 111, and it comprises a circuit board 131 and a plurality of light emitting diode 132; Said light emitting diode 132 can the light source that sent be projected to exactly the corresponding lateral margin of this LGP, makes this LGP demonstrate uniform backlight illumination towards this accommodation space 110; So, can bring into play the effect of backlight module, and reduce the integral thickness of this backlight module.
Hold; Though the thickness of liquid crystal panel TV; Meet the market demand of " thin typeization " development, can know the seal ring thickness of current liquid crystal panel TV but hold the above; Thickness addition (as shown in Figure 1) for supporting walls 111, circuit board 131 and light emitting diode 132 threes; But for can pursue housing attractive in appearance, promote visual effect and the design concept that takes up room is saved in maximization, the frame of liquid crystal panel TV also becomes the primary object that the dealer " cuts out ", makes the deisgn product of " narrow limitization (Narrow Border) " become one of powerful means of dealer competitive market.The dealer reaches the mode of " narrow limitization " at present; Mainly contain and change locking mode (as: screw being located at the side locking of backlight module side), or dwindle electronic component with superfineization of interface circuit, or change assembling mode (as: light emitting diode is built-in to the housing of backlight module) etc.; So; By the design of dwindling frame, promptly can comprehensively highlight the visual effect of whole screen, to change user's impression visually.
The existing technological means that only just changes assembling mode describes, and sees also shown in Fig. 2 A, and a side of a housing 21 is provided with a supporting walls 211; The circuit board 231 that this supporting walls 211 is provided with a plurality of hole 213, one light-emitting diode light bars 23 reclines to the lateral surface of this supporting walls 211, and a plurality of light emitting diodes 232 on it hold respectively to the hole 213 of correspondence, again; For the lateral margin that makes a LGP 25 can more be pressed close to said light emitting diode 232, improving the backlight illumination of this LGP 25, on this supporting walls 211 corresponding to the position of described hole 213; Be concaved with a depressed part, can hold wherein (shown in the void circle of Fig. 2 A), so for the lateral margin of this LGP 25; See through aforesaid assembling mode, just can make the seal ring thickness of liquid crystal panel TV, be reduced to the thickness that supporting walls 211 adds circuit board 231; Since be subject to the technological limits of aluminium extruded type now, the thickness of the supporting walls 211 of this housing 21, and minimum only can be compressed into 1.5 millimeters (mm); But therefore the thickness of light emitting diode 232 then can, see also shown in Fig. 2 B for below 0.8 millimeter; The dealer is for producing aforesaid housing 21 structures, and at first, the dealer can be fed through a punching board with housing 21; And to these housing 21 execution punching programs, can on this supporting walls 211, run through a plurality of holes 213, the dealer can be fed through the housing 21 of punching one milling machine board; And this housing 21 carried out mill washing procedure, with can be on this supporting walls 211, milling goes out this depressed part.
But aforesaid manufacturing process but has many shortcomings, sees also again shown in Fig. 2 A and Fig. 2 B, and the cost of first milling machine board is expensive; When the dealer needs to produce this housing 21 in a large number, certainly will need many milling machine boards of preparation, just be enough to deal with many production lines, this measure; Having strengthened dealer's production cost undoubtedly, secondly is that the staff mills in the process of washing procedure at this milling machine board of operation, if this housing 21 itself squints accidentally, or the skew of the moving direction of milling cutter; Promptly can cause this depressed part to depart from the position that the dealer expects, influence the production yield of this housing 21, last; Because milling washing procedure mainly is to move by the rotation of milling cutter, and housing 21 is carried out cut, except this milling cutter easy abrasion; The high temperature that its process produced also can force this housing 21 softening transforms, causes the error rate in the assembling.
Therefore, how to design a kind of brand-new manufacturing process, with effective solution foregoing problems, and can reduce dealer's production cost, the production yield with improving product promptly becomes the important goal that the present invention desires to reach.
This shows that above-mentioned existing housing manufacturing process obviously still has inconvenience and defective, and demands urgently further improving in processing method and use.In order to solve the problem of above-mentioned existence; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion; And general processing method does not have appropriate processing method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new tool perforation and the housing manufacturing process of extruding program, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to; Overcome the defective that existing housing manufacturing process exists, and a kind of new tool perforation and the housing manufacturing process of extruding program are provided, technical problem to be solved is that development and Design goes out a kind of new manufacturing manufacturing process; In the hope of by whole manufacturing process of the present invention; Can effectively solve the problem of existing convention, and improve dealer's the market competitiveness, be very suitable for practicality.
Another object of the present invention is to, a kind of new tool perforation and the housing manufacturing process of extruding program are provided, technical problem to be solved provides the housing manufacturing process of a kind of tool perforation and extruding program; Mainly be to see through simple perforation program and extruding program, just can promptly produce the housing that meets narrow limit product, to reduce dealer's production cost; And improve and produce yield, the housing that this housing manufacturing process is produced is as the carrier of light-emitting component (as: light emitting diode) and LGP on the display backlight module; And a side of this housing is provided with a supporting walls, and between a side of this supporting walls and this housing, to be formed with the accommodation space of a depression, this manufacturing process is at first sent this housing into a punching board or boring board; And on the supporting walls of this housing, carry out the program of perforation for the first time, on this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space; The housing that forms described hole is sent into an extruding board, and in this support wall in order respectively for the position of this accommodation space, carry out the extruding program; To form a groove, respectively this groove corresponds respectively to the described hole on this supporting walls respectively, can reduce the degree of depth of described hole; And supply setting-in one LGP, and last, the housing that forms said groove is sent into this punching board or boring board; And the program of perforation is for the second time carried out in the position of described hole; So that respectively this hole all can meet a preliminary dimension, the hole of said preliminary dimension can hold the light emitting diode on the light-emitting diode light bar, and making respectively, this light-emitting diode light bar can be fixed to the respectively lateral surface of this supporting walls respectively; And the said light emitting diode on it can be received the described hole to correspondence; And,, make this LGP demonstrate uniform backlight illumination the light source that is sent is projected to exactly the corresponding lateral margin of this LGP towards this accommodation space.Thereby, be suitable for practicality more.
An also purpose of the present invention is, a kind of new tool perforation and the housing manufacturing process of extruding program are provided, and technical problem to be solved is to make it can shorten the production time of this housing; The dealer can be in the aforesaid housing manufacturing process; Omit the program of perforation for the first time, after direct supporting walls to this housing carries out the extruding program, carry out the perforation program again; With the speed of production and the output of raising housing, thereby be suitable for practicality more.
The object of the invention and solve its technical problem and adopt following technical scheme to realize.Its that proposes according to the present invention is applied on the housing of aluminium extruded type or sheet metal moulding; This housing is as the carrier of light-emitting component and LGP on the display backlight module; At least two respective side edge of this housing convex with a supporting walls respectively, are formed with an accommodation space between said supporting walls, for holding a LGP; This housing manufacturing process comprises: this housing is sent into a punching board or boring board; And on the supporting walls of this housing, carry out the program of perforation for the first time, on this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space; The housing that forms described hole is sent into an extruding board, and in this support wall in order respectively for the position of this accommodation space, carry out the extruding program, with the degree of depth of reduction described hole; And with this housing send into this punching board or boring board; And the program of perforation is for the second time carried out in the position of described hole; So that respectively this hole all can meet a preliminary dimension, the hole of this preliminary dimension can hold the light emitting diode on the light-emitting diode light bar, makes the circuit board of this light-emitting diode light bar respectively can be fixed to the lateral surface of this supporting walls; And the said light emitting diode on it can be received the described hole to correspondence, and towards this accommodation space.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
The housing manufacturing process of aforesaid tool perforation and extruding program; Wherein said its to after respectively this supporting walls is carried out extruding program; Can form a groove for the position of this accommodation space in this support wall in order respectively, this groove is corresponding to the described hole on this supporting walls, for this LGP of setting-in.
The object of the invention and solve its technical problem and also adopt following technical scheme to realize.Its that proposes according to the present invention is applied on the housing of aluminium extruded type or sheet metal moulding; This housing is as the carrier of light-emitting component and LGP on the display backlight module; At least two respective side edge of this housing convex with a supporting walls respectively, are formed with an accommodation space between said supporting walls, for holding a LGP; This housing manufacturing process comprises: this housing is sent into a punching board or boring board; And on the supporting walls of this housing, carry out the program of perforation for the first time, on this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space; And the housing that will form described hole is sent into an extruding board; And in this support wall in order respectively for the position of this accommodation space; Carry out the extruding program,, and make respectively that this hole all can meet a preliminary dimension with the degree of depth of reduction described hole; The hole of this preliminary dimension can hold the light emitting diode on the light-emitting diode light bar; Make the circuit board of this light-emitting diode light bar respectively can be fixed to the lateral surface of this supporting walls, and the said light emitting diode on it can be received the described hole to correspondence, and towards this accommodation space.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
The housing manufacturing process of aforesaid tool perforation and extruding program; Wherein said its to after respectively this supporting walls is carried out extruding program; Can form a groove for the position of this accommodation space in this support wall in order respectively, this groove is corresponding to the described hole on this supporting walls, for this LGP of setting-in.
The object of the invention and solve its technical problem and also adopt following technical scheme to realize in addition.Its that proposes according to the present invention is applied on the housing of aluminium extruded type or sheet metal moulding; This housing is as the carrier of light-emitting component and LGP on the display backlight module; At least two corresponding edge of this housing convex with a supporting walls respectively, are formed with an accommodation space between said supporting walls, for holding a LGP; This housing manufacturing process comprises: this housing is sent into an extruding board; And for the position of this accommodation space, carry out the extruding program, can reduce the thickness of this supporting walls in this support wall in order respectively; And the housing that will push is sent into this punching board or boring board; And on this supporting walls, carry out the perforation program; On this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space, and respectively this hole all can meet a preliminary dimension; The hole of this preliminary dimension can hold the light emitting diode on the light-emitting diode light bar; Make the circuit board of this light-emitting diode light bar can be fixed to the lateral surface of this supporting walls, and the said light emitting diode on it can be received the described hole to correspondence, and towards this accommodation space.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
The housing manufacturing process of aforesaid tool perforation and extruding program; Wherein said its to after respectively this supporting walls is carried out extruding program; Can form a groove for the position of this accommodation space in this support wall in order respectively, this groove is corresponding to the described hole on this supporting walls, for this LGP of setting-in.
By technique scheme, tool perforation of the present invention has advantage and beneficial effect at least with the housing manufacturing process of extruding program: because this punching board or the spent cost of extruding board, far below the milling machine board; Therefore, see through the washing procedure that mills of milling machine board in the housing manufacturing process of existing convention, housing manufacturing process of the present invention can significantly reduce dealer's production cost; In addition, because the present invention sees through the extruding program, on the supporting walls of housing, to produce groove; Or reduce the thickness of this supporting walls; Cause the distortion of this supporting walls so can not produce high temperature, simultaneously, the vertical strength that is only applied to a side of this supporting walls; Can not cause this housing deviation position yet, effectively improve the production yield of housing.
In sum; The present invention is applied on the housing of aluminium extruded type or sheet metal moulding; This housing is as the carrier of light-emitting component and LGP on the display backlight module, and at least two respective side edge of this housing convex with a supporting walls respectively, between said supporting walls, to form an accommodation space; This housing manufacturing process comprises: this supporting walls is carried out the program of perforation for the first time, to form a plurality of holes that run through; In the position of this support wall in order for accommodation space, carry out the extruding program, with in position, form a groove corresponding to described hole, and the degree of depth of reduction described hole; Carry out the program of perforation for the second time in the position of described hole, so that a light-emitting diode light bar can be fixed to the lateral surface of this supporting walls, and the said light emitting diode on it can be received the described hole to correspondence.So, see through the washing procedure that mills of milling machine board in the housing manufacturing process of existing convention, the present invention can be more fast and is produced required housing accurately, effectively reduces dealer's production cost.The present invention has apparent progress technically, and has tangible good effect, really is a novelty, progress, practical new design.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of specification, and for let above and other objects of the present invention, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is the sketch map of a backlight module of existing convention;
Fig. 2 A is the sketch map of another backlight module of existing convention;
Fig. 2 B is the flow chart of another backlight module of existing convention;
Fig. 3 A is tool of the present invention perforation and the generalized section of first embodiment of the housing manufacturing process of extruding program;
Fig. 3 B is tool of the present invention perforation and the schematic side view of first embodiment of the housing manufacturing process of extruding program;
Fig. 3 C is tool of the present invention perforation and the flow chart of first, second embodiment of the housing manufacturing process of extruding program;
Fig. 3 D is tool of the present invention perforation and the generalized section of second embodiment of the housing manufacturing process of extruding program;
Fig. 4 A is tool of the present invention perforation and the generalized section of the 3rd embodiment of the housing manufacturing process of extruding program;
Fig. 4 B is tool of the present invention perforation and the schematic side view of the 3rd embodiment of the housing manufacturing process of extruding program;
Fig. 4 C is tool of the present invention perforation and the flow chart of the 3rd, the 4th embodiment of the housing manufacturing process of extruding program;
Fig. 4 D is tool of the present invention perforation and the generalized section of the 4th embodiment of the housing manufacturing process of extruding program;
Fig. 5 A is tool of the present invention perforation and the generalized section of the 5th embodiment of the housing manufacturing process of extruding program;
Fig. 5 B is tool of the present invention perforation and the schematic side view of the 5th embodiment of the housing manufacturing process of extruding program; And
Fig. 5 C is tool of the present invention perforation and the flow chart of the 5th embodiment of the housing manufacturing process of extruding program.
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and preferred embodiment; To the tool perforation that proposes according to the present invention its specific embodiment of housing manufacturing process, processing method, step, characteristic and effect thereof with the extruding program, specify as after.
The present invention is the housing manufacturing process of a kind of tool perforation and extruding program, in the first embodiment of the present invention, sees also shown in Fig. 3 A-Fig. 3 C; This housing manufacturing process is applied on the housing 31 of aluminium extruded type or sheet metal moulding, and wherein this housing 31 can be as the carrier of light-emitting component (as: light emitting diode 413) and LGP 43 on the display backlight module, this special person of carrying; The housing 31 that the present invention is alleged; As can be shown in Fig. 3 A, be by a plurality of element assembly units be integrated (section configuration like individual component is L-shaped), perhaps; The housing 31 that can directly use section configuration to take the shape of the letter U closes first Chen Ming.At least two respective side edge of this housing 31 convex with a supporting walls 311 (because said supporting walls 311 is for symmetrical structure, so only draw out one of them supporting walls 311) respectively, and 311 of said supporting walls are formed with the accommodation space 310 of a depression; This special person of carrying, be convenient follow-up explanation, a side of these supporting walls 311 contiguous these accommodation spaces 310; Medial surface for this supporting walls 311; Its corresponding another side then is the lateral surface of this supporting walls 311, and this housing manufacturing process comprises:
(101) perforation program for the first time: the staff is that this housing 31 of 1.5 millimeters is sent into a punching board or boring board with thickness; And make this punching board or boring board on the supporting walls 311 of this housing 31, carry out punching or boring; Make to form the hole 313 (shown in Fig. 3 B (1)) that a plurality of equidistance are arranged on this supporting walls 311, and this hole 313 be connected with this accommodation space 310 (shown in Fig. 3 A (1)) respectively;
(102) extruding program: the staff sends the housing that forms described hole 313 31 into an extruding board according to the height of the light emitting diode 413 of desire assembling, and regards to the position of this accommodation space 310 at this supporting walls 311; Push; To form a groove 315, respectively this groove 315 corresponds respectively to the described hole 313 on this supporting walls 311 respectively, with the degree of depth (shown in Fig. 3 A (2)) that can reduce described hole 313; Make the degree of depth of described hole 313 meet the height of light emitting diode 413 (as: 0.8 millimeter); At this moment, owing to this supporting walls 311 is squeezed, so can force supporting walls 311 parts around the contiguous described hole 313; Towards the direction extensional of described hole 313, make the size of described hole 313 less than dealer's preliminary dimension (shown in Fig. 3 B (2)); And
(103) program of perforation for the second time: the staff will form the housing 31 of this groove 315 and send into this punching board or boring board; And punching or boring are carried out in the position to described hole 313; So that respectively this hole 313 all can meet dealer's preliminary dimension (shown in Fig. 3 A (3) and Fig. 3 B (3)), the hole 313 of said preliminary dimension mainly can hold the light emitting diode 413 (shown in Fig. 3 A (4)) on the light-emitting diode light bar 41.
Hold, the staff can be fixed to the circuit board 411 of light-emitting diode light bar 41 on the lateral surface of this supporting walls 311 respectively, makes that the said light emitting diode 413 on this light-emitting diode light bar 41 can be received the described hole 313 to correspondence; And towards this accommodation space 310 (shown in Fig. 3 A (4)); The staff just can hold this LGP 43 to this accommodation space 310, and the lateral margin inlay card that makes this LGP 43 is to this groove 315, and the light source that makes said light emitting diode 413 sent can be projected to the corresponding lateral margin of this LGP 43 exactly; Make this LGP 43 demonstrate uniform backlight illumination; In the previous embodiment, though being equidistance, arranges described hole 313, in other embodiments of the invention; The dealer can be according to producing or design requirement; And change described hole 313 distance to each other, and form the not pattern of equidistance arrangement, close first Chen Ming.
In addition, in the second embodiment of the present invention, under same housing manufacturing process; The dealer still can not produce groove on this housing, see also shown in Fig. 3 C and Fig. 3 D, after chat among the embodiment; Only renumber to the element that changes to some extent, the section of a housing 31A is the U type, and its two respective side edge is provided with a supporting walls 311 respectively; 311 of this two supporting walls are formed with the accommodation space 310 of a depression, and at first, the dealer can be to the supporting walls 311 of this housing 31A; Carry out the program of perforation for the first time, respectively forming the hole 313 (shown in Fig. 3 D (1)) that a plurality of equidistance are arranged on this supporting walls 311, and respectively this hole 313 is connected with this accommodation space 310; The dealer can carry out the extruding program to this housing 31A, with the degree of depth (shown in Fig. 3 D (2)) that can reduce described hole 313, at this moment; Respectively this supporting walls 311 can deform because of extruding, causes the preliminary dimension of the aperture of this hole 313 respectively less than the dealer, and is last; The dealer can carry out perforation second time program to the position of described hole 313, and with the size of adjustment described hole 313, making respectively, this hole 313 all can meet this preliminary dimension (shown in Fig. 3 D (3)); So, the dealer just can hold LGP 43 in this accommodation space 310, and respectively this light-emitting diode light bar 41 is assembled to this housing 31A; So that respectively this circuit board 411 can recline to the lateral surface of this supporting walls 311 respectively, and respectively this light emitting diode 413 can hold to this hole 313 respectively (shown in Fig. 3 D (4)), makes and uses housing manufacturing process of the present invention; Formed backlight module, its seal ring thickness can be reduced to the thickness of light-emitting diode light bar 41.
Moreover, for significantly shortening the program of housing manufacturing process, with faster production; The dealer still can omit the program of perforation for the first time; See also shown in Fig. 4 A-Fig. 4 C, in the third embodiment of the present invention, two respective side edge of a housing 51 are provided with a supporting walls 511 respectively; 511 of said supporting walls are formed with the accommodation space 510 of a depression, and this housing manufacturing process comprises:
(201) extruding program: the staff sends this housing 51 into an extruding board; And regard to the position of this accommodation space 510 at this supporting walls 511 respectively; Push; Forming a groove 515 (shown in Fig. 4 A (1) and Fig. 4 B (1)) respectively, and respectively this supporting walls 511 corresponding to the thickness of the position of this groove 515 respectively, the height of light emitting diode 613 (as: 0.8 millimeter); And
(202) perforation program: the staff will form respectively the housing 51 of this groove 515 and send into a punching board or boring board; And make this punching board or boring board respectively carry out punching or boring on this supporting walls 511; So that respectively can form the hole 513 (shown in Fig. 4 A (2) and Fig. 4 B (2)) that a plurality of equidistance are arranged respectively on this supporting walls 511; And described hole 513 all meets dealer's a preliminary dimension, can hold the light emitting diode 613 (shown in Fig. 4 A (3)) on the light-emitting diode light bar 61 respectively, simultaneously; Making respectively, the circuit board 611 of this light-emitting diode light bar 61 can be fixed to the respectively lateral surface of this supporting walls 511 respectively; So, the dealer can assemble a LGP 63 in this accommodation space 510, and the lateral margin of this LGP 63 meeting inlay card is to this groove 515; So that the light source that said light emitting diode 613 is sent, can be projected to the corresponding lateral margin of this LGP 63 exactly.
Again, likewise, according to the housing manufacturing process of previous embodiment; The dealer can not produce groove yet on this housing, see also shown in Fig. 4 C and Fig. 4 D, after chat among the embodiment; Still only renumber to the element that changes to some extent, two corresponding side surface of a housing 51A are respectively equipped with a supporting walls 511, and 511 of this two supporting walls are formed with the accommodation space 510 of a depression; And respectively this supporting walls 511 has one first thickness L1 (1.5 millimeters), and at first, the dealer can be to the supporting walls 511 of this housing 51A; Carry out the extruding program, make that respectively the thickness of this supporting walls 511 changes to the second thickness L2 (as: 0.8 millimeter), and this second thickness L2 meets the height (shown in Fig. 4 D (1)) of light emitting diode 613; The dealer can carry out the perforation program to this supporting walls 511 respectively, and respectively forming the hole 513 that a plurality of equidistance are arranged on this supporting walls 511, and the size of described hole 513 all can meet dealer's preliminary dimension (shown in Fig. 4 D (2)); So, see through housing manufacturing process of the present invention, the dealer can be according on the light-emitting diode light bar 61; The position of each light emitting diode 613; On the corresponding supporting walls 511 of this housing 51A, produce corresponding a plurality of holes 513 apace,, form the required backlight module of dealer so that this housing 51A can be assembled into one with said light-emitting diode light bar 61 and LGP 63 respectively fast.
In addition, in the 5th embodiment of the present invention, if the metal material of housing is density stabilized; Then the dealer can be by the deflection after calculating housing and being extruded; Omit the program of perforation for the second time, see also shown in Fig. 5 A-Fig. 5 C, two respective side edge of a housing 71 are provided with a supporting walls 711 respectively; 711 of said supporting walls are formed with an accommodation space 710, and this housing manufacturing process comprises:
(301) perforation program: the staff sends this housing 71 into a punching board or boring board; And make this punching board or boring board on the supporting walls 711 of this housing 71, carry out punching or boring; Make respectively to form a plurality of holes 713 (shown in Fig. 5 B (1)) on this supporting walls 711, and this hole 713 be connected with this accommodation space 710 (shown in Fig. 5 A (1)) respectively;
(302) extruding program: the staff sends the housing that forms described hole 713 71 into an extruding board according to the height of the light emitting diode 813 of desire assembling, and regards to the position of this accommodation space 710 at this supporting walls 711; Push, to form a groove 715, respectively this groove 715 corresponds respectively to the described hole 713 on this supporting walls 711 respectively; The degree of depth (shown in Fig. 5 A (2)) can reduce described hole 713 makes the degree of depth of described hole 713 meet the height of light emitting diode 813, simultaneously; Because respectively this supporting walls 711 is squeezed; So can force around the contiguous described hole 713 supporting walls 711 partly, towards the direction extensional of described hole 713, make size conforms dealer's the preliminary dimension (shown in Fig. 5 B (2)) of described hole 713; So; The dealer can assemble a LGP 83 in this accommodation space 710, so that the light source that said light emitting diode 813 is sent, can be projected to the corresponding lateral margin of this LGP 83 exactly.
Hold, in the aforementioned embodiment, the dealer also can not be provided with groove on supporting walls; Because by shown in Fig. 3 D and Fig. 4 D; Can spread to out easily among the 5th embodiment of the present invention, the supporting walls 711 of this housing 71 is not provided with the structure of groove 715, so do not repeat them here.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the technology contents of above-mentioned announcement capable of using is made a little change or is modified to the equivalent embodiment of equivalent variations; In every case be not break away from technical scheme content of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.
Claims (6)
1. the housing manufacturing process of tool perforation and extruding program; Be applied on the housing of aluminium extruded type or sheet metal moulding; It is characterized in that the carrier of this housing as light-emitting component and LGP on the display backlight module, at least two respective side edge of this housing convex with a supporting walls respectively, are formed with an accommodation space between said supporting walls; For holding a LGP, this housing manufacturing process comprises:
This housing is sent into a punching board or boring board, and on the supporting walls of this housing, carry out the program of perforation for the first time, on this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space;
The housing that forms described hole is sent into an extruding board, and in this support wall in order respectively for the position of this accommodation space, carry out the extruding program, with the degree of depth of reduction described hole; And
This housing is sent into this punching board or boring board; And the program of perforation is for the second time carried out in the position of described hole; So that respectively this hole all can meet a preliminary dimension, the hole of this preliminary dimension can hold the light emitting diode on the light-emitting diode light bar, makes the circuit board of this light-emitting diode light bar respectively can be fixed to the lateral surface of this supporting walls; And the said light emitting diode on it can be received the described hole to correspondence, and towards this accommodation space.
2. the housing manufacturing process of tool perforation as claimed in claim 1 and extruding program; It is characterized in that it is to after respectively this supporting walls is carried out extruding program; Can form a groove for the position of this accommodation space in this support wall in order respectively; This groove is corresponding to the described hole on this supporting walls, for this LGP of setting-in.
3. the housing manufacturing process of tool perforation and extruding program; It is applied on the housing of aluminium extruded type or sheet metal moulding; It is characterized in that the carrier of this housing as light-emitting component and LGP on the display backlight module, at least two respective side edge of this housing convex with a supporting walls respectively, are formed with an accommodation space between said supporting walls; For holding a LGP, this housing manufacturing process comprises:
This housing is sent into a punching board or boring board, and on the supporting walls of this housing, carry out the program of perforation for the first time, on this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space; And
The housing that forms described hole is sent into an extruding board; And in this support wall in order respectively for the position of this accommodation space; Carry out the extruding program,, and make respectively that this hole all can meet a preliminary dimension with the degree of depth of reduction described hole; The hole of this preliminary dimension can hold the light emitting diode on the light-emitting diode light bar; Make the circuit board of this light-emitting diode light bar respectively can be fixed to the lateral surface of this supporting walls, and the said light emitting diode on it can be received the described hole to correspondence, and towards this accommodation space.
4. the housing manufacturing process of tool perforation as claimed in claim 3 and extruding program; It is characterized in that it is to after respectively this supporting walls is carried out extruding program; Can form a groove for the position of this accommodation space in this support wall in order respectively; This groove is corresponding to the described hole on this supporting walls, for this LGP of setting-in.
5. the housing manufacturing process of tool perforation and extruding program; It is applied on the housing of aluminium extruded type or sheet metal moulding; It is characterized in that the carrier of this housing as light-emitting component and LGP on the display backlight module, at least two corresponding edge of this housing convex with a supporting walls respectively, are formed with an accommodation space between said supporting walls; For holding a LGP, this housing manufacturing process comprises:
This housing is sent into an extruding board, and in this support wall in order respectively for the position of this accommodation space, carry out the extruding program, can reduce the thickness of this supporting walls; And
The housing that has pushed is sent into this punching board or boring board; And on this supporting walls, carry out the perforation program; On this supporting walls, to form a plurality of holes, respectively this hole is connected with this accommodation space, and respectively this hole all can meet a preliminary dimension; The hole of this preliminary dimension can hold the light emitting diode on the light-emitting diode light bar; Make the circuit board of this light-emitting diode light bar can be fixed to the lateral surface of this supporting walls, and the said light emitting diode on it can be received the described hole to correspondence, and towards this accommodation space.
6. the housing manufacturing process of tool perforation as claimed in claim 5 and extruding program; It is characterized in that it is to after respectively this supporting walls is carried out extruding program; Can form a groove for the position of this accommodation space in this support wall in order respectively; This groove is corresponding to the described hole on this supporting walls, for this LGP of setting-in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110097507XA CN102729000A (en) | 2011-04-15 | 2011-04-15 | Shell manufacturing process with perforation and extrusion processes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110097507XA CN102729000A (en) | 2011-04-15 | 2011-04-15 | Shell manufacturing process with perforation and extrusion processes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102729000A true CN102729000A (en) | 2012-10-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110097507XA Pending CN102729000A (en) | 2011-04-15 | 2011-04-15 | Shell manufacturing process with perforation and extrusion processes |
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| Country | Link |
|---|---|
| CN (1) | CN102729000A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB281930A (en) * | 1927-04-27 | 1927-12-15 | Charles Percy Marrison | Improvements in the process or method of manufacturing hollow drill steel, hollow shafts and the like |
| DE3140164C2 (en) * | 1980-10-24 | 1985-11-21 | Jobst Ulrich Glen Williams Ontario Gellert | Sprue bushing and method for making them |
| CN101020285A (en) * | 2007-02-11 | 2007-08-22 | 陈勇 | Stretching process of clutch casing |
| CN101032790A (en) * | 2007-04-16 | 2007-09-12 | 吴建均 | Technique of forming air conditioning compressor casing |
| CN101176900A (en) * | 2006-11-09 | 2008-05-14 | 凡润电子（无锡）有限公司 | LCD module housing and manufacturing method therefor |
| CN101704179A (en) * | 2009-11-11 | 2010-05-12 | 沈阳黎明航空发动机(集团)有限责任公司 | Shell-machining process |
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2011
- 2011-04-15 CN CN201110097507XA patent/CN102729000A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB281930A (en) * | 1927-04-27 | 1927-12-15 | Charles Percy Marrison | Improvements in the process or method of manufacturing hollow drill steel, hollow shafts and the like |
| DE3140164C2 (en) * | 1980-10-24 | 1985-11-21 | Jobst Ulrich Glen Williams Ontario Gellert | Sprue bushing and method for making them |
| CN101176900A (en) * | 2006-11-09 | 2008-05-14 | 凡润电子（无锡）有限公司 | LCD module housing and manufacturing method therefor |
| CN101020285A (en) * | 2007-02-11 | 2007-08-22 | 陈勇 | Stretching process of clutch casing |
| CN101032790A (en) * | 2007-04-16 | 2007-09-12 | 吴建均 | Technique of forming air conditioning compressor casing |
| CN101704179A (en) * | 2009-11-11 | 2010-05-12 | 沈阳黎明航空发动机(集团)有限责任公司 | Shell-machining process |
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Application publication date: 20121017 |