CN102723160B - 一种超导磁体接头及其制作方法 - Google Patents
一种超导磁体接头及其制作方法 Download PDFInfo
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- CN102723160B CN102723160B CN201210176553.3A CN201210176553A CN102723160B CN 102723160 B CN102723160 B CN 102723160B CN 201210176553 A CN201210176553 A CN 201210176553A CN 102723160 B CN102723160 B CN 102723160B
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- superconducting
- joint
- plinth
- line
- copper sheathing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 54
- 239000010949 copper Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000010955 niobium Substances 0.000 claims description 63
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- 229910001275 Niobium-titanium Inorganic materials 0.000 claims description 22
- RJSRQTFBFAJJIL-UHFFFAOYSA-N niobium titanium Chemical compound [Ti].[Nb] RJSRQTFBFAJJIL-UHFFFAOYSA-N 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 229910001868 water Inorganic materials 0.000 claims description 19
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 18
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 17
- 229910000634 wood's metal Inorganic materials 0.000 claims description 17
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 15
- 229910017604 nitric acid Inorganic materials 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 229910052758 niobium Inorganic materials 0.000 claims description 10
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- UDRRLPGVCZOTQW-UHFFFAOYSA-N bismuth lead Chemical compound [Pb].[Bi] UDRRLPGVCZOTQW-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 4
- 230000011218 segmentation Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000013021 overheating Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 238000005728 strengthening Methods 0.000 abstract 1
- 239000002023 wood Substances 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000002887 superconductor Substances 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
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CN102723160A CN102723160A (zh) | 2012-10-10 |
CN102723160B true CN102723160B (zh) | 2014-01-29 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103617860B (zh) * | 2013-11-26 | 2016-06-01 | 中国科学院电工研究所 | 一种Nb3Al超导接头 |
CN105655084B (zh) * | 2016-03-31 | 2018-06-08 | 宁波健信核磁技术有限公司 | 一种超导磁体 |
CN106825834B (zh) * | 2017-03-21 | 2018-03-30 | 合肥中科离子医学技术装备有限公司 | 一种用于NbTi/Cu超导线圈内部超导接头的焊接装置及其方法 |
CN108808408B (zh) * | 2018-06-29 | 2019-11-29 | 苏州超磁半导体科技有限公司 | 一种柔性导热部件接头及其制作方法 |
CN109285648B (zh) * | 2018-10-23 | 2021-08-24 | 上海联影医疗科技股份有限公司 | 超导接头、超导磁体系统及超导接头制备方法 |
CN110600896B (zh) * | 2019-09-27 | 2024-08-16 | 中国科学院理化技术研究所 | 一种多股超导金属线接头结构 |
CN111243818B (zh) * | 2020-03-13 | 2021-07-27 | 中国科学院电工研究所 | 一种铌三锡超导线和铌钛超导线的超导接头及其制备方法 |
CN114496453B (zh) * | 2022-01-29 | 2023-12-22 | 中国科学院电工研究所 | 一种带有失超保护的铌三锡超导磁体及其制作方法 |
CN115740715A (zh) * | 2022-11-29 | 2023-03-07 | 北京工业大学 | 一种电子束焊接制备铌钛线材和铌三锡混合超导接头的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3590150B2 (ja) * | 1994-10-27 | 2004-11-17 | ゼネラル・エレクトリック・カンパニイ | セラミック超伝導リード線アセンブリ |
CN101794655A (zh) * | 2010-03-12 | 2010-08-04 | 中国科学院电工研究所 | 具有高屏蔽特性的低电阻超导接头的制作方法 |
CN101923936A (zh) * | 2010-07-30 | 2010-12-22 | 中国科学院合肥物质科学研究院 | 低电阻超导磁体内接头 |
CN101958172A (zh) * | 2010-07-30 | 2011-01-26 | 中国科学院合肥物质科学研究院 | 双室低电阻管内电缆导体的超导接头 |
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2012
- 2012-05-31 CN CN201210176553.3A patent/CN102723160B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3590150B2 (ja) * | 1994-10-27 | 2004-11-17 | ゼネラル・エレクトリック・カンパニイ | セラミック超伝導リード線アセンブリ |
CN101794655A (zh) * | 2010-03-12 | 2010-08-04 | 中国科学院电工研究所 | 具有高屏蔽特性的低电阻超导接头的制作方法 |
CN101923936A (zh) * | 2010-07-30 | 2010-12-22 | 中国科学院合肥物质科学研究院 | 低电阻超导磁体内接头 |
CN101958172A (zh) * | 2010-07-30 | 2011-01-26 | 中国科学院合肥物质科学研究院 | 双室低电阻管内电缆导体的超导接头 |
Non-Patent Citations (1)
Title |
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JP特许3590150B2 2004.08.27 |
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