CN102711299B - Commercial induction cooker movement structure - Google Patents
Commercial induction cooker movement structure Download PDFInfo
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- CN102711299B CN102711299B CN201210143975.0A CN201210143975A CN102711299B CN 102711299 B CN102711299 B CN 102711299B CN 201210143975 A CN201210143975 A CN 201210143975A CN 102711299 B CN102711299 B CN 102711299B
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- electric capacity
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- frequency filter
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- 230000006698 induction Effects 0.000 title abstract description 7
- 239000003990 capacitor Substances 0.000 claims abstract description 70
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 abstract 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 230000007812 deficiency Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
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Abstract
The invention relates to a commercial induction cooker movement structure comprising a resonant capacitor, a machine shell, a first high-frequency filtering capacitor, a rectifier bridge, a second high-frequency filtering capacitor, an IGBT (Insulated Gate Bipolar Translator) module, an absorbing capacitor and a PCB (Printed Circuit Board). The commercial induction cooker movement structure is characterized in that the resonant capacitor is fixedly arranged on the outer side wall of the machine shell; the first high-frequency filtering capacitor, the rectifier bridge, the second high-frequency filtering capacitor, the IGBT module and the absorbing capacitor are sequentially mounted on the PCB and are electrically connected; a terminal of the IGBT module is electrically connected with a through-wall terminal fixed on the side wall of the machine shell through a lead wire; and a terminal of a coil disc is respectively electrically connected with a terminal of the resonant capacitor and the through-wall terminal. The commercial induction cooker movement structure has the advantages that the temperature of the resonant capacitor is greatly reduced and the problems that the reliability and the service life are reduced caused by that the temperature of an inner cavity of a commercial induction cooker movement is higher are effectively solved; balanced instant current can be supplied to the IGBT module and the resonant capacitor; the temperature rise of devices of the high-frequency filtering capacitors is reduced; and the current density, the cost and the current radiation strength of the PCB are greatly reduced.
Description
Technical field
The present invention relates to a kind of fixed form of resonant capacitance and the distribution mode of high-frequency filter capacitor of commercial electromagnetic oven core structure, particularly a kind of commercial electromagnetic oven core.
Background technology
The work under bad environment of commercial induction cooker, oil smoke and salt fog etc. seriously corroded to circuit board, traditional open cassette mechanism structure, life-span wretched insufficiency, cannot meet actual requirements for life.Three anti-movements can solve the problem of movement life-span deficiency, but face movement internal cavity excess Temperature, the problem of the excess Temperature of internal core device.
Summary of the invention
The object of the invention is to provide in order to overcome the deficiencies in the prior art a kind of commercial electromagnetic oven core structure, it can effectively solve the excess Temperature of core devices resonant capacitance and high-frequency filter capacitor, effectively eliminates unbalanced the caused too high problem of high-frequency filter capacitor temperature rise of high-frequency current of moment.
Technical scheme of the present invention is: a kind of commercial electromagnetic oven core structure, comprise resonant capacitance, casing, the first high-frequency filter capacitor, rectifier bridge, the second high-frequency filter capacitor, IGBT module, Absorption Capacitance and pcb board, it is characterized in that described resonant capacitance is fixed on the lateral wall of casing; Described the first high-frequency filter capacitor, rectifier bridge, the second high-frequency filter capacitor, IGBT module and Absorption Capacitance are arranged on pcb board and electrical connection successively, the terminal of IGBT module is electrically connected with the terminal through walls being fixed on chassis sidewall by wire, and the terminal of coil panel is electrically connected with terminal and the terminal through walls of resonant capacitance respectively.
Described the first high-frequency filter capacitor and the second high-frequency filter capacitor are symmetrically distributed in the both sides of rectifier bridge.
Described IGBT module comprises the first bipolar transistor, the second bipolar transistor, inductance L, the 3rd electric capacity and the 4th electric capacity; Described the first high-frequency filter capacitor comprises the first electric capacity, and described the second high-frequency filter capacitor comprises the second electric capacity; Described resonant capacitance comprises the 5th electric capacity and the 6th electric capacity; One end of described the first electric capacity is electrically connected respectively the C utmost point of the first bipolar transistor, one end of the 3rd electric capacity, one end, one end of the second electric capacity and an output of rectifier bridge of the 5th electric capacity, and the other end of the first electric capacity is electrically connected respectively another output of one end, one end of the 6th electric capacity and the other end of the second electric capacity and the rectifier bridge of the E utmost point, the 4th electric capacity of the second bipolar transistor; The other end of described the 3rd electric capacity is electrically connected with the E utmost point of the first bipolar transistor, the C utmost point, the 4th other end of electric capacity and one end of inductance of the second bipolar transistor respectively; The other end of described inductance is electrically connected respectively the other end of the 5th electric capacity and the other end of the 6th electric capacity.
The present invention's advantage is compared with prior art: on the sidewall of resonant capacitance in casing, the temperature of resonant capacitance declines to a great extent, effectively solve commercial induction cooker three higher the caused reliability of anti-movement internal cavity temperature and degradation problem under the life-span, can provide balanced immediate current for IGBT module and resonant capacitance, reduce the device temperature rise of high-frequency filter capacitor, greatly reduced pcb board current density, cost and electric current radiation intensity.
Accompanying drawing explanation
Fig. 1 is device distributed architecture schematic diagram of the present invention;
Fig. 2 is circuit theory schematic diagram of the present invention.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention is further described.
As shown in Figure 1, a kind of commercial electromagnetic oven core structure, comprise resonant capacitance 1, casing 2, the first high-frequency filter capacitor 3, rectifier bridge 4, the second high-frequency filter capacitor 5, IGBT module 6, Absorption Capacitance 7 and pcb board 9, feature of the present invention is that described resonant capacitance 1 is fixed on the lateral wall of casing 2, the exposed outside at casing 2 of resonant capacitance 1 like this, be conducive to the cooling of resonant capacitance 1, reduce the impact of resonant capacitance 1 on the first high-frequency filter capacitor 3, rectifier bridge 4, the second high-frequency filter capacitor 5, IGBT module 6, Absorption Capacitance 7 and pcb board 9; Described the first high-frequency filter capacitor 3, rectifier bridge 4, the second high-frequency filter capacitor 5, IGBT module 6 and Absorption Capacitance 7 are arranged on pcb board 9 and electrical connection successively, the terminal 61 of IGBT module 6 is electrically connected with the terminal through walls 11 being fixed on casing 2 sidewalls by wire 10, and the terminal of coil panel 12 is electrically connected with terminal and the terminal through walls 11 of resonant capacitance 1 respectively.
In the present embodiment, described the first high-frequency filter capacitor 3 and the second high-frequency filter capacitor 5 are symmetrically distributed in the both sides of rectifier bridge 4, can realize like this current-sharing effect of high-frequency filter capacitor, can effectively reduce the temperature rise of high-frequency filter capacitor.
As shown in Figure 2, in the present embodiment, described IGBT module 6 comprises the first bipolar transistor IGBT 1, the second bipolar transistor IGBT 2, inductance L, the 3rd capacitor C 3 and the 4th capacitor C 4; Described the first high-frequency filter capacitor 3 comprises the first capacitor C 1, and described the second high-frequency filter capacitor 5 comprises the second capacitor C 2; Described resonant capacitance 1 comprises that the 5th capacitor C 5 and the 6th capacitor C 6, the five capacitor C 5 and the 6th capacitor C 6 are arranged on the lateral wall of casing 2, can effectively reduce the temperature rise of first and second high-frequency filter capacitor of three anti-movement inside; One end of described the first capacitor C 1 is electrically connected respectively the C utmost point of the first bipolar transistor IGBT 1, one end of the 3rd capacitor C 3, one end, one end of the second capacitor C 2 and an output of rectifier bridge 4 of the 5th capacitor C 5, and the other end of the first capacitor C 1 is electrically connected respectively the E utmost point of the second bipolar transistor IGBT 2, one end of the 4th capacitor C 4, one end, the other end of the second capacitor C 2 and another output of rectifier bridge 4 of the 6th capacitor C 6; The other end of described the 3rd electric capacity 3 is electrically connected with the E utmost point of the first bipolar transistor IGBT 1, the C utmost point, the 4th other end of capacitor C 4 and one end of inductance L of the second bipolar transistor IGBT 2 respectively; The other end of described inductance L is electrically connected respectively the other end of the 5th capacitor C 5 and the other end of the 6th capacitor C 6.
When work, when the first 1 conducting moment of bipolar transistor IGBT, the first capacitor C 1 provides transient energy; When the moment second of the second bipolar transistor IGBT 2 conductings capacitor C 2 transient energy is provided, can realize like this current-sharing effect of high-frequency filter capacitor, can effectively reduce the temperature rise of high-frequency filter capacitor.In addition, be divided into two from the electric current of rectifier bridge output, flow to respectively IGBT module 6 and the first high-frequency filter capacitor 3, rectifier bridge 4, the second high-frequency filter capacitor 5, greatly reduced current density, cost and the electric current radiation intensity of pcb board 9.
Claims (1)
1. a commercial electromagnetic oven core structure, comprise resonant capacitance (1), casing (2), the first high-frequency filter capacitor (3), rectifier bridge (4), the second high-frequency filter capacitor (5), IGBT module (6), Absorption Capacitance (7) and pcb board (9), described resonant capacitance (1) is fixed on the lateral wall of casing (2), described the first high-frequency filter capacitor (3), rectifier bridge (4), the second high-frequency filter capacitor (5), IGBT module (6) and Absorption Capacitance (7) are arranged on successively pcb board (9) and go up and be electrically connected, the terminal (61) of IGBT module (6) is electrically connected with the terminal through walls (11) being fixed on casing (2) sidewall by wire (10), the terminal of coil panel (12) is electrically connected with terminal and the terminal through walls (11) of resonant capacitance (1) respectively, described the first high-frequency filter capacitor (3) and the second high-frequency filter capacitor (5) are symmetrically distributed in the both sides of rectifier bridge (4), it is characterized in that: described IGBT module (6) comprises the first bipolar transistor (IGBT1), the second bipolar transistor (IGBT2), inductance L, the 3rd electric capacity (C3) and the 4th electric capacity (C4), described the first high-frequency filter capacitor (3) comprises the first electric capacity (C1), and described the second high-frequency filter capacitor (5) comprises the second electric capacity (C2), described resonant capacitance (1) comprises the 5th electric capacity (C5) and the 6th electric capacity (C6), one end of described the first electric capacity (C1) is electrically connected respectively the C utmost point of the first bipolar transistor (IGBT1), one end of the 3rd electric capacity (C3), one end, one end of the second electric capacity (C2) and an output of rectifier bridge (4) of the 5th electric capacity (C5), and the other end of the first electric capacity (C1) is electrically connected respectively another output of one end, one end of the 6th electric capacity (C6) and the other end of the second electric capacity (C2) and the rectifier bridge (4) of the E utmost point, the 4th electric capacity (C4) of the second bipolar transistor (IGBT2), the other end of described the 3rd electric capacity (3) is electrically connected with the E utmost point of the first bipolar transistor (IGBT1), the C utmost point, the other end of the 4th electric capacity (C4) and one end of inductance (L) of the second bipolar transistor (IGBT2) respectively, the other end of described inductance (L) is electrically connected respectively the other end of the 5th electric capacity (C5) and the other end of the 6th electric capacity (C6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210143975.0A CN102711299B (en) | 2012-05-11 | 2012-05-11 | Commercial induction cooker movement structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210143975.0A CN102711299B (en) | 2012-05-11 | 2012-05-11 | Commercial induction cooker movement structure |
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| Publication Number | Publication Date |
|---|---|
| CN102711299A CN102711299A (en) | 2012-10-03 |
| CN102711299B true CN102711299B (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210143975.0A Active CN102711299B (en) | 2012-05-11 | 2012-05-11 | Commercial induction cooker movement structure |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797027B (en) * | 2014-01-20 | 2018-01-02 | 美的集团股份有限公司 | Coil panel component |
| CN106658802A (en) * | 2017-03-01 | 2017-05-10 | 广东海明晖电子科技有限公司 | DC bus heat dissipation structure of high-power machine core |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11144854A (en) * | 1997-11-07 | 1999-05-28 | Matsushita Electric Ind Co Ltd | Induction cooking appliance |
| CN202177467U (en) * | 2011-07-05 | 2012-03-28 | 佛山市顺德区美的电热电器制造有限公司 | Temperature measurement circuit and commercial induction cooker using same |
| CN202617397U (en) * | 2012-05-11 | 2012-12-19 | 美的集团有限公司 | Commercial electromagnetic oven core structure |
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2012
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| CN102711299A (en) | 2012-10-03 |
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Address after: 528311 Guangdong, Foshan, Beijiao, the United States, the United States and the United States on the avenue of the United States, the headquarters of the United States building B floor, District, 26-28 Applicant after: MIDEA GROUP Co.,Ltd. Address before: 528311 Beijiao, Foshan, Shunde District, the town of Guangdong, the United States Avenue, No. 6 Applicant before: Midea Group |
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Free format text: CORRECT: APPLICANT; FROM: MEIDI GROUP CO. LTD. TO: MIDEA GROUP CO., LTD. |
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