CN102703002A - Environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive for electronic industry and preparation method thereof - Google Patents
Environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive for electronic industry and preparation method thereof Download PDFInfo
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Abstract
The invention relates to an environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive for electronic industry and a preparation method thereof. The preparation method comprises the following steps of: 1, mixing water serving as a solvent with polyvinyl alcohol, a phosphorus-containing flame retardant, a negative ion surfactant, an emulsifier and a PH regulator uniformly, heating to the temperature of 50 DEG C, adding an acrylic monomer, a crosslinking monomer and a polymerization degree regulator, and reacting at the temperature of between 60 and 65 DEG C for 1 hour to obtain pre-emulsified liquid; 2, mixing 25 percent of pre-emulsified liquid and 40 percent of initiator uniformly, heating to the temperature of between 80 and 85 DEG C, starting to drip the residual pre-emulsified liquid when the liquid is blue, dripping 20 percent of initiator at intervals of 1 hour, dripping completely within 3 hours, adding the residual initiator, keeping the temperature of 90 DEG C and refluxing for 1 to 1.5 hours; and 3, cooling the reaction liquid to the temperature of 40 DEG C, adding a bridging agent, mixing uniformly, and cooling to the room temperature. The invention provides the environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive for the electronic industry. The environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive has the advantages of high heat resistance, high caking property, high water resistance, low cost and the like, and is easy to strip, and suitable for the fixing of electronic components and particularly the fixing between the electronic components and radiating members.
Description
Technical field
The present invention relates to pressure sensitive adhesive, be specifically related to used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off and preparation method thereof, can be used for the fixing of electronic unit.
Background technology
Pressure sensitive adhesive is the abbreviation of pressure-sensitive adhesive, is one type and has the tackiness agent that pressure is had susceptibility, is mainly used in the preparation Pressuresensitive Tape.Pressure sensitive adhesive can be divided into solvent-borne type pressure sensitive adhesive and water-borne pressure sensitive adhesive according to the dispersion medium difference.The solvent-borne type pressure sensitive adhesive adopts organic solvents such as toluene, ETHYLE ACETATE as reaction medium, and it has good pressure-sensitive and cohesiveness, and has advantages such as stability to aging, photostabilization, water tolerance, oil-proofness, rippability.Water-borne pressure sensitive adhesive adopts water as solvent, have cheap, throughput rate is fast, advantage such as pollution-free, but its tackiness agent performance is not high.Therefore the solvent-borne type pressure sensitive adhesive is replaced by water-borne pressure sensitive adhesive because contaminate environment and cost are higher gradually.
The fixing general bonding method of tackiness agent that adopts in the electronics between each electronic unit; But the most gums stick is selected organic solvent for use; When temperature is higher in the electronics; The gasification of low boiling point organic solvent can cause the corrosion of electronic unit, and at high temperature the gasification expansion of tackiness agent makes it be prone to peel off or slippage.Therefore, the fixing tackiness agent that needs employing to suit in the electronics between each electronic unit is adhesively fixed, as selects the strong and strippable water-borne pressure sensitive adhesive of high temperature resistant bonding power for use.Strippable pressure sensitive adhesive is when when base material is removed, and must be no cull and removes completely, promptly can not stay visible tackiness agent vestige on the base material.The used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant that the present invention relates to is prone to peel off; Through adding bridging agent and phosphonium flame retardant, make its inside gluing, form the reticulated structure that is evenly distributed; Finally being implemented in does not have cull and leaves over when peeling off; And performances such as thermotolerance, cohesiveness, weather resisteant, water tolerance are all better, are suitable for the fixing of electronic unit, particularly fixing between electronic unit and the radiating component.
Summary of the invention
The purpose of this invention is to provide used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off and preparation method thereof; Have that thermotolerance height, cohesiveness are strong, water-tolerant, be prone to peel off, advantage such as cost is low; Avoid the solvent-borne type pressure sensitive adhesive serial problem that the organic solvent gasification causes when high temperature; Overcome blistered shortcoming when selecting release control agent for use simultaneously; Be a kind of environment-friendly type thermostable releasable pressure sensitive adhesive, be suitable for the fixing of electronic unit, particularly fixing between electronic unit and the radiating component.
The objective of the invention is to reach: be solvent with water, adopt acrylic acid copolymer, make its inside gluing, and form reticulated structure, thereby make the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off through final adding bridging agent through following measure.
The used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant among the present invention is prone to peel off is made up of following components in weight portions: 40%-50% pure water, 2%-3% Z 150PH, 0.5%-2% phosphonium flame retardant, 0.2%-0.4% AS, 0.5%-1.0% emulsifying agent, PH regulator, 30%-40% Bing Xisuandingzhi, 3%-5% Isooctyl acrylate monomer, 1%-2% Propylene glycol monoacrylate, 0.5%-1% vinylformic acid, 8%-10% vinyl-acetic ester, 1%-2% cross-linking monomer, 0.1%-0.2% polymerization degree regulator, 0.1%-0.2% initiator and 1%-1.5% bridging agent.
The used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant among the present invention is prone to peel off is characterized in that the preparation method comprises following step:
1) a certain amount of Z 150PH, phosphonium flame retardant, AS and emulsifying agent are dissolved in mixing in the pure water; Adding the PH regulator transfers pH value to 5-6, to be warming up to 50 ℃; Add Bing Xisuandingzhi, Isooctyl acrylate monomer, Propylene glycol monoacrylate, vinylformic acid, vinyl-acetic ester, cross-linking monomer and polymerization degree regulator; 60-65 ℃ of reaction 1h gets pre-emulsion;
2) get 25% pre-emulsion and mix, be warming up to 80-85 ℃, stirring and refluxing with 40% of initiator; Treat that liquid begins to drip the residue pre-emulsion when becoming blue, and whenever add 20% initiator, in 3h, dropwise at a distance from 1h; Add the residue initiator at last, and 90 ℃ are incubated backflow 1-1.5h down;
3) above-mentioned reaction solution is cooled to 40 ℃ after, drip and to reduce to room temperature after bridging agent mixes.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described AS is a sodium laurylsulfonate.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described emulsifying agent is a TX10.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that the usage ratio of described AS and emulsifying agent is about 1:2.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described PH regulator is a sodium hydrogencarbonate.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described cross-linking monomer is a N hydroxymethyl acrylamide.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described letex polymerization degree regulator is a n-dodecyl mercaptan.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described initiator is any one in ydrogen peroxide 50, ammonium persulphate and the Potassium Persulphate.
Press such scheme, the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant is prone to peel off is characterized in that described bridging agent is DJJL-02.
The used in electronic industry pressure sensitive adhesive that environment friendly heat resistant is prone to peel off has following characteristics: 1. do not add organic solvent, electronic unit corrosion or glue that solvent gasification causes at high temperature can not occur and come off, also can not cause environmental pollution when reducing cost; 2. that it is passed through is inner gluing in the adding of bridging agent, forms reticulated structure, and finally being implemented in does not have cull and leave over when peeling off; 3. adopt Z 150PH can reduce the consumption of emulsifying agent, further improve its water tolerance; 4. thermotolerance, pressure-sensitive, cohesiveness, oxidative stability, UV stability etc. are all better; 5. cheap, throughput rate is fast, has widely to use.
The used in electronic industry pressure sensitive adhesive that environment friendly heat resistant is prone to peel off, its performance is: 1. first viscous force >=18# ball (first viscous force test is pressed GB/T4852-2002 and measured); 2. hold viscous force >=48h/GB (holding the viscous force test measures by GB/T4851-1998); 3. 180 ° of stripping strengths are 11-13N/25mm (180 ° of peel strength tests are pressed GB/T2792-1998 and measured).
Embodiment
Further introduce the present invention through embodiment below, but embodiment can not be construed as limiting the invention.
Embodiment 1
1) 7g Z 150PH, 4g phosphonium flame retardant, 0.9g sodium laurylsulfonate, 1.8g TX10 are dissolved in the 140mL pure water; Adding sodium hydrogencarbonate transfers pH value to 5-6, to be warming up to 50 ℃; Add 105g Bing Xisuandingzhi, 11g Isooctyl acrylate monomer, 5g Propylene glycol monoacrylate, 1.6g vinylformic acid, 30.4g vinyl-acetic ester, 3.6gN-NMA and 0.44g n-dodecyl mercaptan; 60 ℃ are reacted 1h down, get pre-emulsion;
2) the 0.44g ammonium persulphate is dissolved in the 3.6mL pure water, gets 25% pre-emulsion and mix, be warming up to 80 ℃ with 40% of ammonium persulfate solution; Stirring and refluxing; Treat that liquid begins to drip the residue pre-emulsion when becoming blue, and whenever add 20% ammonium persulfate solution, in 3h, dropwise at a distance from 1h; Add the residue ammonium persulfate solution at last, and 90 ℃ are incubated backflow 1h down;
3) above-mentioned reaction solution is cooled to 40 ℃ after, drip 4gDJJL-02, reduce to room temperature after mixing.
Embodiment 2
1) 7g Z 150PH, 4g phosphonium flame retardant, 0.9g sodium laurylsulfonate, 1.8g TX10 are dissolved in the 140mL pure water; Adding sodium hydrogencarbonate transfers pH value to 5-6, to be warming up to 50 ℃; Add 105g Bing Xisuandingzhi, 11g Isooctyl acrylate monomer, 5g Propylene glycol monoacrylate, 1.6g vinylformic acid, 30.4g vinyl-acetic ester, 3.6gN-NMA and 0.44g n-dodecyl mercaptan; 62 ℃ are reacted 1h down, get pre-emulsion;
2) the 0.44g ammonium persulphate is dissolved in the 3.6mL pure water, gets 25% pre-emulsion and mix, be warming up to 82 ℃ with 40% of ammonium persulfate solution; Stirring and refluxing; Treat that liquid begins to drip the residue pre-emulsion when becoming blue, and whenever add 20% ammonium persulfate solution, in 3h, dropwise at a distance from 1h; Add the residue ammonium persulfate solution at last, and 90 ℃ are incubated backflow 1h down;
3) above-mentioned reaction solution is cooled to 40 ℃ after, drip 4gDJJL-02, reduce to room temperature after mixing.
Embodiment 3
1) 7g Z 150PH, 4g phosphonium flame retardant, 0.9g sodium laurylsulfonate, 1.8g TX10 are dissolved in the 140mL pure water; Adding sodium hydrogencarbonate transfers pH value to 5-6, to be warming up to 50 ℃; Add 105g Bing Xisuandingzhi, 11g Isooctyl acrylate monomer, 5g Propylene glycol monoacrylate, 1.6g vinylformic acid, 30.4g vinyl-acetic ester, 3.6gN-NMA and 0.44g n-dodecyl mercaptan; 60 ℃ are reacted 1h down, get pre-emulsion;
2) the 0.44g ammonium persulphate is dissolved in the 3.6mL pure water, gets 25% pre-emulsion and mix, be warming up to 80 ℃ with 40% of ammonium persulfate solution; Stirring and refluxing; Treat that liquid begins to drip the residue pre-emulsion when becoming blue, and whenever add 20% ammonium persulfate solution, in 3h, dropwise at a distance from 1h; Add the residue ammonium persulfate solution at last, and 90 ℃ are incubated backflow 1.5h down;
3) above-mentioned reaction solution is cooled to 40 ℃ after, drip 4gDJJL-02, reduce to room temperature after mixing.
Claims (10)
1. the used in electronic industry pressure sensitive adhesive that environment friendly heat resistant is prone to peel off is made up of following components in weight portions: 40%-50% pure water, 2%-3% Z 150PH, 0.5%-2% phosphonium flame retardant, 0.2%-0.4% AS, 0.5%-1.0% emulsifying agent, PH regulator, 30%-40% Bing Xisuandingzhi, 3%-5% Isooctyl acrylate monomer, 1%-2% Propylene glycol monoacrylate, 0.5%-1% vinylformic acid, 8%-10% vinyl-acetic ester, 1%-2% cross-linking monomer, 0.1%-0.2% polymerization degree regulator, 0.1%-0.2% initiator and 1%-1.5% bridging agent.
2. the used in electronic industry pressure sensitive adhesive that a kind of environment friendly heat resistant as claimed in claim 1 is prone to peel off; It is characterized in that the preparation method comprises following step: 1. a certain amount of Z 150PH, phosphonium flame retardant, AS and emulsifying agent are dissolved in mixing in the pure water; Adding the PH regulator transfers pH value to 5-6, to be warming up to 50 ℃; Add Bing Xisuandingzhi, Isooctyl acrylate monomer, Propylene glycol monoacrylate, vinylformic acid, vinyl-acetic ester, cross-linking monomer and polymerization degree regulator; 60-65 ℃ is reacted 1h down, gets pre-emulsion; 2. get 25% pre-emulsion and mix, be warming up to 80-85 ℃, stirring and refluxing with 40% of initiator; Treat that liquid begins to drip the residue pre-emulsion when becoming blue, and whenever add 20% initiator, in 3h, dropwise at a distance from 1h; Add the residue initiator at last, and 90 ℃ are incubated backflow 1-1.5h down; 3. after above-mentioned reaction solution being cooled to 40 ℃, dripping and reduce to room temperature after bridging agent mixes.
3. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described AS is a sodium laurylsulfonate.
4. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described emulsifying agent is a TX10.
5. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that the usage ratio of described AS and emulsifying agent is about 1:2.
6. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described PH regulator is a sodium hydrogencarbonate.
7. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described cross-linking monomer is a N hydroxymethyl acrylamide.
8. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described letex polymerization degree regulator is a n-dodecyl mercaptan.
9. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described initiator is any one in ydrogen peroxide 50, ammonium persulphate and the Potassium Persulphate.
10. the used in electronic industry pressure sensitive adhesive that is prone to peel off like claim 1 and 2 described a kind of environment friendly heat resistants is characterized in that described bridging agent is DJJL-02.
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| CN2012102110007A CN102703002A (en) | 2012-06-26 | 2012-06-26 | Environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive for electronic industry and preparation method thereof |
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| CN2012102110007A CN102703002A (en) | 2012-06-26 | 2012-06-26 | Environment-friendly high temperature-resistant and easily-stripped pressure-sensitive adhesive for electronic industry and preparation method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105949362A (en) * | 2016-05-12 | 2016-09-21 | 上海保立佳新材料有限公司 | Water-based acrylic pressure-sensitive adhesive emulsion and preparation method thereof |
| CN107418482A (en) * | 2017-08-30 | 2017-12-01 | 浙江欧丽数码喷绘材料有限公司 | A kind of waterborne flame retardant ash glue-type gum PVC fire retardant pressure sensitive glue and preparation method thereof |
| CN107488425A (en) * | 2017-08-30 | 2017-12-19 | 浙江欧丽数码喷绘材料有限公司 | A kind of cold lamination film flame-proof acrylic ester pressure-sensitive and preparation method thereof |
| CN107573528A (en) * | 2017-08-30 | 2018-01-12 | 浙江欧丽数码喷绘材料有限公司 | A kind of water-based back spray lamp flame-retardant glue and preparation method thereof |
| CN107603529A (en) * | 2017-08-30 | 2018-01-19 | 浙江欧丽数码喷绘材料有限公司 | A kind of water-based white bright gum PVC fire retardant pressure sensitive glue and preparation method thereof |
| CN107603531A (en) * | 2017-08-30 | 2018-01-19 | 浙江欧丽数码喷绘材料有限公司 | Fire-retardant positive spray lamp flame-retardant glue of a kind of Weak solvent and preparation method thereof |
| CN107603530A (en) * | 2017-08-30 | 2018-01-19 | 浙江欧丽数码喷绘材料有限公司 | A kind of fire-retardant cold lamination film |
| CN109266257A (en) * | 2018-09-29 | 2019-01-25 | 广州都邦材料科技有限公司 | Acrylic Pressure Sensitive Adhesive and preparation method thereof, electronic product |
| CN112143424A (en) * | 2020-09-11 | 2020-12-29 | 陈会杰 | High-performance inorganic flame-retardant acrylic pressure-sensitive adhesive and preparation method thereof |
| WO2023031825A1 (en) * | 2021-08-31 | 2023-03-09 | 3M Innovative Properties Company | Fire-retardant pressure sensitive adhesives, articles, and uses |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105949362A (en) * | 2016-05-12 | 2016-09-21 | 上海保立佳新材料有限公司 | Water-based acrylic pressure-sensitive adhesive emulsion and preparation method thereof |
| CN105949362B (en) * | 2016-05-12 | 2018-03-27 | 上海保立佳新材料有限公司 | A kind of water soluble acrylic acid pressure-sensitive adhesive emulsion and preparation method thereof |
| CN107418482A (en) * | 2017-08-30 | 2017-12-01 | 浙江欧丽数码喷绘材料有限公司 | A kind of waterborne flame retardant ash glue-type gum PVC fire retardant pressure sensitive glue and preparation method thereof |
| CN107488425A (en) * | 2017-08-30 | 2017-12-19 | 浙江欧丽数码喷绘材料有限公司 | A kind of cold lamination film flame-proof acrylic ester pressure-sensitive and preparation method thereof |
| CN107573528A (en) * | 2017-08-30 | 2018-01-12 | 浙江欧丽数码喷绘材料有限公司 | A kind of water-based back spray lamp flame-retardant glue and preparation method thereof |
| CN107603529A (en) * | 2017-08-30 | 2018-01-19 | 浙江欧丽数码喷绘材料有限公司 | A kind of water-based white bright gum PVC fire retardant pressure sensitive glue and preparation method thereof |
| CN107603531A (en) * | 2017-08-30 | 2018-01-19 | 浙江欧丽数码喷绘材料有限公司 | Fire-retardant positive spray lamp flame-retardant glue of a kind of Weak solvent and preparation method thereof |
| CN107603530A (en) * | 2017-08-30 | 2018-01-19 | 浙江欧丽数码喷绘材料有限公司 | A kind of fire-retardant cold lamination film |
| CN109266257A (en) * | 2018-09-29 | 2019-01-25 | 广州都邦材料科技有限公司 | Acrylic Pressure Sensitive Adhesive and preparation method thereof, electronic product |
| CN112143424A (en) * | 2020-09-11 | 2020-12-29 | 陈会杰 | High-performance inorganic flame-retardant acrylic pressure-sensitive adhesive and preparation method thereof |
| WO2023031825A1 (en) * | 2021-08-31 | 2023-03-09 | 3M Innovative Properties Company | Fire-retardant pressure sensitive adhesives, articles, and uses |
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Application publication date: 20121003 |