CN102699573A - High temperature brazing filler metal for brazing non-oxide ceramic and composite material as well as preparation method of high temperature brazing filler metal - Google Patents
High temperature brazing filler metal for brazing non-oxide ceramic and composite material as well as preparation method of high temperature brazing filler metal Download PDFInfo
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Abstract
The invention provides a high temperature brazing filler metal for brazing a non-oxide ceramic and a composite material as well as a preparation method of the high temperature brazing filler metal, relating to a high temperature brazing filler metal and a preparation method thereof. The invention aims to solve a problem that the property of the high temperature brazing filler metal in the traditional welding joint between the non-oxide ceramic and the composite material is unreliable at more than 500 DEG C. According to the invention, the high temperature brazing filler metal comprises the following components in parts by weight: 47-52 parts of Ni, 25-28 parts of Cr,18-21 parts of Nb, 0-2 parts of B, 0-2 parts of Ti and 0-6 parts of W; and the preparation method comprises the following steps of: (1) weighing the components and mixing the components to obtain a mixed material; and (2) putting the mixed material into a grinding ball according to a ball material mass ratio of (8-20):1, intermittently ball-milling the mixed material for 4-20 h at a speed of 250-350 r/min to reach a filler ratio of 45-55%, so as to obtain the high temperature brazing filler metal. The shear strengths of the joint obtained according to the invention at room temperature and high temperature of 800 DEG C are respectively 18-48 MPa and 11-27 MPa. The high temperature brazing filler metal for brazing the non-oxide ceramic and the composite material as well as the preparation method of the high temperature brazing filler metal, provided by the invention, are applied to the aerospace field.
Description
Technical field
The present invention relates to a kind of high-temp solder and preparation method thereof.
Background technology
SiC, Si
3N
4, ZrB
2Deng non-oxide ceramics is the important superhigh temperature structural material of aerospace field.C/SiC composite, ZSC composite etc. have further improved the mechanical performance and the high-temperature oxidation resistance of material through in the one-component ceramic matrix, adding C fiber or other ceramic particle (graphite) wild phase of certain volume mark.Because the restriction of these non-oxide ceramicses and Composite Preparation and manufacturing process, realize they self or with being connected of other material be its key of being used widely of assurance in above-mentioned field.
The method of attachment about pottery and ceramic matric composite of report at present has: mechanical connection, diffusion welding (DW) and soldering etc.But mechanical connection exists passive quality excessive, and air-tightness such as can't guarantee at problem; And diffusion welding (DW) be owing to need apply bigger pressure, and its welding version is very limited; With respect to preceding two kinds of methods, soldering has bigger advantage: do not have that heavier passive quality, air-tightness are good, need not apply big pressure in the welding like joint, joint form is unrestricted etc.
The reported solder that is used for non-oxide ceramics and composite connection thereof mainly contains the AgCuTi solder, commercial Ni-based and palladium base solder.Because resistance to high temperature oxidation of AgCuTi solder own and croop property are poor, soldered fitting can't satisfy the high temperature user demand.Palladium base solder costs an arm and a leg, and the use prospect is very limited.And existing commercial nickel-based solder exists and non-oxide ceramics SiC, Si
3N
4, ZrB
2Deng vigorous reaction, the problem of joint interface structure property difference.Therefore, design is a kind of can soldering ZrB
2Base ceramic material, and make joint become problem demanding prompt solution at the high-temp solder that also has reliable serviceability more than 500 ℃.
Summary of the invention
The present invention will solve existing welding non-oxide ceramics and composite thereof, and joint is in the insecure problem of high-temp solder performance more than 500 ℃, and a kind of soldering non-oxide ceramics and composite high-temp solder and preparation method thereof are provided.
A kind of soldering non-oxide ceramics of the present invention and composite high-temp solder are made up of 47 ~ 52 parts Ni, 25 ~ 28 parts Cr, 18 ~ 21 parts Nb, 0 ~ 2 part B, 0 ~ 2 part Ti and 0 ~ 6 part W by weight.
The preparation method of a kind of soldering non-oxide ceramics of the present invention and composite high-temp solder carries out according to following steps: one, weighing: take by weighing 47 ~ 52 parts Ni powder, 25 ~ 28 parts Cr powder, 18 ~ 21 parts Nb powder, 0 ~ 2 part B powder, 0 ~ 2 part Ti powder and 0 ~ 6 part W powder by weight; Mix, get batch mixing; Two, homogenising mechanical mixture: the batch mixing that step 1 is obtained places in the ball grinder; In ball material mass ratio is that 8 ~ 20:1 ratio is put into abrading-ball; Wherein the filler ratio is 45% ~ 55%, under the condition of hydrogen or argon shield, with the intermittent ball milling 4 ~ 20h of the speed of 250 ~ 350r/min; Promptly get high-temp solder.
Advantage of the present invention is:
Solder of the present invention fusing point for soldering connects non-oxide ceramics and composite and multiple high temperature alloy is suitable, and wetability is good, and can satisfy 800 ℃ of instructions for uses of soldered fitting.And do not contain noble metals such as Ag, Pd in the solder composition of the present invention, with low cost.Compare with other commercial nickel-based solder; Si or B that nickel-based solder used in the present invention does not rely on high-load reduce the solder fusing point; But rely on Ni, Cr, Nb ternary eutectic to be reflected under the brazing temperature and to form liquid phase; The content of active element Cr and Nb and activity are all higher in the solder system; Can avoid the generation of fragility phase in the joint microstructure through forming the rich Cr of continuous densification and the adverse reaction that rich Nb conversion zone suppresses Ni and non-oxide ceramics at non-oxide ceramics or its composite one side; The adding of a small amount of B element can further be regulated the solder fusing point to OK range, and it is mobile to improve solder; Ti and W can effectively promote soldered fitting pottery or the reaction of composite one side metallurgical interface.
Solder of the present invention is incubated soldering Si under 1 ~ 120min condition at 1160 ~ 1220 ℃
3N
4, SiC, ZrB
2, C/SiC, ZrB
2-SiC-C non-oxide ceramicses such as (ZSC) and composite thereof and metal (nickel base superalloy, niobium and niobium alloy etc.), the gentle 800 ℃ of high temperature shearing strengths in the junction chamber of acquisition can reach 18 ~ 48MPa and 11 ~ 27MPa respectively.Solder of the present invention is not only applicable to being connected of non-oxide ceramics and composite thereof and metal, is applicable to these potteries or ceramic matric composite self and connection each other simultaneously yet.
Description of drawings
Fig. 1 is the ZSC of test 1 and the soldered fitting Electronic Speculum picture of GH99.
The specific embodiment
Technical scheme of the present invention is not limited to the following cited specific embodiment, also comprises the combination in any between each specific embodiment.
The specific embodiment one: a kind of soldering non-oxide ceramics of this embodiment and composite high-temp solder are made up of 47 ~ 52 parts Ni, 25 ~ 28 parts Cr, 18 ~ 21 parts Nb, 0 ~ 2 part B, 0 ~ 2 part Ti and 0 ~ 6 part W by weight.
The solder of this embodiment fusing point for soldering connects non-oxide ceramics and composite and multiple high temperature alloy is suitable, and wetability is good, and can satisfy 800 ℃ of instructions for uses of soldered fitting.And do not contain noble metals such as Ag, Pd in the solder composition of this embodiment, with low cost.Compare with other commercial nickel-based solder; Si or B that nickel-based solder used in the present invention does not rely on high-load reduce the solder fusing point; But rely on Ni, Cr, Nb ternary eutectic to be reflected under the brazing temperature and to form liquid phase; The content of active element Cr and Nb and activity are all higher in the solder system; Can avoid the generation of fragility phase in the joint microstructure through forming the rich Cr of continuous densification and the adverse reaction that rich Nb conversion zone suppresses Ni and non-oxide ceramics at non-oxide ceramics or its composite one side; The adding of a small amount of B element can further be regulated the solder fusing point to OK range, and it is mobile to improve solder; Ti and W can effectively promote soldered fitting pottery or the reaction of composite one side metallurgical interface.
The solder of this embodiment is incubated soldering Si under 1～120min condition at 1160 ~ 1220 ℃
3N
4, SiC, ZrB
2, C/SiC, ZrB
2-SiC-C non-oxide ceramicses such as (ZSC) and composite thereof and metal (nickel base superalloy, niobium and niobium alloy etc.), the gentle 800 ℃ of high temperature shearing strengths in the junction chamber of acquisition can reach 18 ~ 48MPa and 11 ~ 27MPa respectively.This embodiment solder is not only applicable to being connected of non-oxide ceramics and composite thereof and metal, is applicable to these potteries or ceramic matric composite self and connection each other simultaneously yet.
The specific embodiment two: what this embodiment and the specific embodiment one were different is: the purity of described Ni is 99.0% ~ 99.9%, the purity of Cr is 99.0% ~ 99.9%, the purity of Nb is 99.0% ~ 99.9%, the purity of B is 99.0% ~ 99.9%, the purity of Ti be 99.0% ~ 99.9% with the purity of W be 99.0% ~ 99.9%.Other is identical with the specific embodiment one.
The specific embodiment three: what this embodiment and the specific embodiment one to two were different is: described high-temp solder is made up of 48 parts Ni, 25.5 parts Cr, 18.5 parts Nb, 2 parts B, 2 parts Ti and 6 parts W by mass percentage.Other is identical with the specific embodiment one to two.
The specific embodiment four: what this embodiment was different with one of specific embodiment one to three is: described Ni, Cr, Nb, B, Ti and W are metal dust.Other is identical with one of specific embodiment one to three.
The specific embodiment five: a kind of soldering non-oxide ceramics of this embodiment and the preparation method of composite high-temp solder carry out according to following steps: one, weighing: take by weighing 47 ~ 52 parts Ni powder, 25 ~ 28 parts Cr powder, 18 ~ 21 parts Nb powder, 0 ~ 2 part B powder, 0 ~ 2 part Ti powder and 0 ~ 6 part W powder by weight; Mix, get batch mixing; Two, homogenising mechanical mixture: the batch mixing that step 1 is obtained places in the ball grinder; In ball material mass ratio is that 8 ~ 20:1 ratio is put into abrading-ball; Wherein the filler ratio is 45% ~ 55%, under the condition of hydrogen or argon shield, with the intermittent ball milling 4 ~ 20h of the speed of 250 ~ 350r/min; Promptly get high-temp solder.
The solder of this embodiment fusing point for soldering connects non-oxide ceramics and composite and multiple high temperature alloy is suitable, and wetability is good, and can satisfy 800 ℃ of instructions for uses of soldered fitting.And do not contain noble metals such as Ag, Pd in the solder composition of this embodiment, with low cost.Compare with other commercial nickel-based solder; Si or B that nickel-based solder used in the present invention does not rely on high-load reduce the solder fusing point; But rely on Ni, Cr, Nb ternary eutectic to be reflected under the brazing temperature and to form liquid phase; The content of active element Cr and Nb and activity are all higher in the solder system; Can avoid the generation of fragility phase in the joint microstructure through forming the rich Cr of continuous densification and the adverse reaction that rich Nb conversion zone suppresses Ni and non-oxide ceramics at non-oxide ceramics or its composite one side; The adding of a small amount of B element can further be regulated the solder fusing point to OK range, and it is mobile to improve solder; Ti and W can effectively promote soldered fitting pottery or the reaction of composite one side metallurgical interface.
The solder of this embodiment is incubated soldering Si under 1～120min condition at 1160 ~ 1220 ℃
3N
4, SiC, ZrB
2, C/SiC, ZrB
2-SiC-C non-oxide ceramicses such as (ZSC) and composite thereof and metal (nickel base superalloy, niobium and niobium alloy etc.), the gentle 800 ℃ of high temperature shearing strengths in the junction chamber of acquisition can reach 18 ~ 48MPa and 11 ~ 27MPa respectively.This embodiment solder is not only applicable to being connected of non-oxide ceramics and composite thereof and metal, is applicable to these potteries or ceramic matric composite self and connection each other simultaneously yet.
The specific embodiment six: what this embodiment and the specific embodiment five were different is: the purity of the Ni described in the step 1 is 99.0% ~ 99.9%, the purity of Cr is 99.0% ~ 99.9%, the purity of Nb is 99.0% ~ 99.9%, the purity of B is 99.0% ~ 99.9%, the purity of Ti be 99.0% ~ 99.9% with the purity of W be 99.0% ~ 99.9%.Other is identical with the specific embodiment five.
The specific embodiment seven: what this embodiment and the specific embodiment five to six were different is: take by weighing 48 parts Ni powder, 25.5 parts Cr powder, 18.5 parts Nb powder, 2 parts B powder, 2 parts Ti powder and 6 parts W powder by weight described in the step 1.Other and the specific embodiment five to six phase are together.
Through following verification experimental verification effect of the present invention:
Test 1
A kind of soldering non-oxide ceramics of this test and the preparation method of composite high-temp solder carry out according to following steps: one, take by weighing the Ni powder of 4.8g, the Cr powder of 2.55g, the Nb powder of 1.85g, the Ti powder of 0.2g, the W powder of 0.6g and the B powder of 0.2g; Two, mechanical alloying: each component that step 1 is taken by weighing is that the ratio of 6:1 is put into graphite crucible in ratio of grinding media to material, vacuumizes that (vacuum is 2.0x10
-2Pa) charging into argon gas after, is under the condition of 300r/min at rotating speed, and intermittent ball milling 3h promptly obtains being used for the high-temp solder of non-oxide ceramics and composite soldering thereof.
Greasy dirt, the oxide of ZSC composite and GH99 high temperature alloy welding surface are cleaned out with the mechanical chipping method.With the solder powder compressing tablet and be processed into and by the small pieces that equate of weldering surface area; Then ZSC composite and GH99 high temperature alloy are put into acetone; Carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min; Behind the material natural air drying after cleaning, according to assembling for the form of ZSC composite/configuration high-temp solder compressing tablet/GH99 from top to bottom, and fix at the pressure that the ZSC composite material surface applies 2MPa; The workpiece that assembles is put into vacuum furnace, when vacuum is 1 * 10
-3During Pa, beginning is heated to 1200 ℃ with the speed of 10 ℃/min, insulation 60min, and the speed with 10 ℃/min cools to 400 ℃ then, cools to room temperature thereafter with the furnace, promptly accomplishes the soldering of ZSC and GH99.
The purity of the Ni powder of this test is 99.9%, the purity of Cr powder is 99.9%, the purity of Nb powder is 99.9%, the purity of B powder is 99.9%, the purity of Ti powder be 99.9% and the purity of W powder be 99.9%.
Through test, the joint room temperature shearing strength of ZSC and GH99 is up to 48MPa, and the shearing strength in the time of 800 ℃ reaches 27MPa.
ZSC that this test is obtained and the soldered fitting of GH99 carry out electron microscopic observation; The result is as shown in Figure 1; Can know from the joint microstructure photo and can find out that active component Cr and Nb have very high activity by Fig. 1 in this solder system, can effective interfacial reaction take place with the ZSC composite; Form fine and close boride conversion zone; Thereby effectively suppress the adverse reaction of Ni and ZSC composite, postwelding brazing seam structure is mainly well behaved NiCr solid solution, and joint has favorable tissue and mechanical property.
Test 2
A kind of soldering non-oxide ceramics of this test and the preparation method of composite high-temp solder carry out according to following steps: one, take by weighing the Ni powder of 4.8g, the Cr powder of 2.55g, the Nb powder of 1.85g, the Ti powder of 0.2g, the W powder of 0.6g and the B powder of 0.2g; Two, mechanical alloying: each component that step 1 is taken by weighing is that the ratio of 6:1 is put into graphite crucible in ratio of grinding media to material, vacuumizes that (vacuum is 2.0x10
-2Pa) charging into argon gas after, is under the condition of 300r/min at rotating speed, and intermittent ball milling 2h promptly obtains being used for the high-temp solder of non-oxide ceramics and composite soldering thereof.
Greasy dirt, the oxide of SiC pottery and GH99 high temperature alloy welding surface are cleaned out with the mechanical chipping method.With the solder powder compressing tablet and be processed into and by the small pieces that equate of weldering surface area; Then SiC pottery and GH99 high temperature alloy are put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, behind the material natural air drying after cleaning; According to assembling for the form of SiC pottery/configuration high-temp solder compressing tablet/GH99 from top to bottom; And fix at the pressure that the SiC ceramic surface applies 2MPa, the workpiece that assembles is put into vacuum furnace, when vacuum is 1 * 10
-3During Pa, beginning is heated to 1180 ℃ with the speed of 10 ℃/min, insulation 20min, and the speed with 10 ℃/min cools to 400 ℃ then, cools to room temperature thereafter with the furnace, promptly accomplishes the soldering of SiC pottery and GH99.
The purity of the Ni powder of this test is 99.9%, the purity of Cr powder is 99.9%, the purity of Nb powder is 99.9%, the purity of B powder is 99.9%, the purity of Ti powder be 99.9% and the purity of W powder be 99.9%.
Through test, the SiC pottery is up to 18MPa with the joint room temperature shearing strength of GH99.
Test 3
A kind of soldering non-oxide ceramics of this test and the preparation method of composite high-temp solder carry out according to following steps: one, take by weighing the Ni powder of 4.8g, the Cr powder of 2.55g, the Nb powder of 1.85g, the Ti powder of 0.2g, the W powder of 0.6g and the B powder of 0.2g; Two, mechanical alloying: each component that step 1 is taken by weighing is that the ratio of 6:1 is put into graphite crucible in ratio of grinding media to material, vacuumizes that (vacuum is 2.0x10
-2Pa) charging into argon gas after, is under the condition of 300r/min at rotating speed, and intermittent ball milling 2h promptly obtains being used for the high-temp solder of non-oxide ceramics and composite soldering thereof.
Greasy dirt, the oxide of C/SiC composite and GH99 high temperature alloy welding surface are cleaned out with the mechanical chipping method.With the solder powder compressing tablet and be processed into and by the small pieces that equate of weldering surface area; Then C/SiC composite and GH99 high temperature alloy are put into acetone; Carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min; Behind the material natural air drying after cleaning, according to assembling for the form of C/SiC composite/configuration high-temp solder compressing tablet/GH99 from top to bottom, and fix at the pressure that the C/SiC composite material surface applies 2MPa; The workpiece that assembles is put into vacuum furnace, when vacuum is 1 * 10
-3During Pa, beginning is heated to 1180 ℃ with the speed of 10 ℃/min, insulation 40min, and the speed with 10 ℃/min cools to 400 ℃ then, cools to room temperature thereafter with the furnace, promptly accomplishes the soldering of C/SiC composite and GH99.
The purity of the Ni powder of this test is 99.9%, the purity of Cr powder is 99.9%, the purity of Nb powder is 99.9%, the purity of B powder is 99.9%, the purity of Ti powder be 99.9% and the purity of W powder be 99.9%.
Through test, the joint room temperature shearing strength of C/SiC composite and GH99 is up to 45MPa, and the shearing strength in the time of 800 ℃ reaches 11MPa.
Test 4
A kind of soldering non-oxide ceramics of this test and the preparation method of composite high-temp solder carry out according to following steps: one, take by weighing the Ni powder of 4.8g, the Cr powder of 2.55g, the Nb powder of 1.85g, the Ti powder of 0.2g, the W powder of 0.6g and the B powder of 0.2g; Two, mechanical alloying: each component that step 1 is taken by weighing is that the ratio of 6:1 is put into graphite crucible in ratio of grinding media to material, vacuumizes that (vacuum is 2.0x10
-2Pa) charging into argon gas after, is under the condition of 300r/min at rotating speed, and intermittent ball milling 2h promptly obtains being used for the high-temp solder of non-oxide ceramics and composite soldering thereof.
Greasy dirt, the oxide of ZSC composite and Nb high temperature alloy welding surface are cleaned out with the mechanical chipping method.With the solder powder compressing tablet and be processed into and by the small pieces that equate of weldering surface area; Then ZSC composite and Nb high temperature alloy are put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, behind the material natural air drying after cleaning; According to assembling for the form of ZSC composite/configuration high-temp solder compressing tablet/Nb from top to bottom; And fix at the pressure that the ZSC composite material surface applies 2MPa, the workpiece that assembles is put into vacuum furnace, when vacuum is 1 * 10
-3During Pa, beginning is heated to 1220 ℃ with the speed of 10 ℃/min, insulation 30min, and the speed with 10 ℃/min cools to 400 ℃ then, cools to room temperature thereafter with the furnace, promptly accomplishes the soldering of ZSC composite and Nb.
The purity of the Ni powder of this test is 99.9%, the purity of Cr powder is 99.9%, the purity of Nb powder is 99.9%, the purity of B powder is 99.9%, the purity of Ti powder be 99.9% and the purity of W powder be 99.9%.
Through test, the joint room temperature shearing strength of ZSC composite and Nb is up to 21MPa.
Claims (7)
1. soldering non-oxide ceramics and composite high-temp solder is characterized in that soldering non-oxide ceramics and composite high-temp solder be made up of 47 ~ 52 parts Ni, 25 ~ 28 parts Cr, 18 ~ 21 parts Nb, 0 ~ 2 part B, 0 ~ 2 part Ti and 0 ~ 6 part W by weight.
2. a kind of soldering non-oxide ceramics according to claim 1 and composite high-temp solder, the purity that it is characterized in that described Ni are 99.0% ~ 99.9%, the purity of Cr is 99.0% ~ 99.9%, the purity of Nb is 99.0% ~ 99.9%, the purity of B is 99.0% ~ 99.9%, the purity of Ti be 99.0% ~ 99.9% with the purity of W be 99.0% ~ 99.9%.
3. a kind of soldering non-oxide ceramics according to claim 1 and composite high-temp solder is characterized in that described high-temp solder is made up of 48 parts Ni, 25.5 parts Cr, 18.5 parts Nb, 2 parts B, 2 parts Ti and 6 parts W by mass percentage.
4. a kind of soldering non-oxide ceramics according to claim 1 and composite high-temp solder is characterized in that described Ni, Cr, Nb, B, Ti and W are metal dust.
5. the preparation method of a kind of soldering non-oxide ceramics as claimed in claim 1 and composite high-temp solder; The preparation method who it is characterized in that a kind of soldering non-oxide ceramics and composite high-temp solder carries out according to following steps: one, weighing: take by weighing 47 ~ 52 parts Ni powder, 25 ~ 28 parts Cr powder, 18 ~ 21 parts Nb powder, 0 ~ 2 part B powder, 0 ~ 2 part Ti powder and 0 ~ 6 part W powder by weight; Mix, get batch mixing; Two, homogenising mechanical mixture: the batch mixing that step 1 is obtained places in the ball grinder; In ball material mass ratio is that 8 ~ 20:1 ratio is put into abrading-ball; Wherein the filler ratio is 45% ~ 55%, under the condition of hydrogen or argon shield, with the intermittent ball milling 4 ~ 20h of the speed of 250 ~ 350r/min; Promptly get high-temp solder.
6. the preparation method of a kind of soldering non-oxide ceramics according to claim 5 and composite high-temp solder, the purity that it is characterized in that the Ni described in the step 1 are 99.0% ~ 99.9%, the purity of Cr is 99.0% ~ 99.9%, the purity of Nb is 99.0% ~ 99.9%, the purity of B is 99.0% ~ 99.9%, the purity of Ti be 99.0% ~ 99.9% with the purity of W be 99.0% ~ 99.9%.
7. the preparation method of a kind of soldering non-oxide ceramics according to claim 5 and composite high-temp solder is characterized in that taking by weighing 48 parts Ni powder, 25.5 parts Cr powder, 18.5 parts Nb powder, 2 parts B powder, 2 parts Ti powder and 6 parts W powder by weight described in the step 1.
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Cited By (4)
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|---|---|---|---|---|
| CN104625284A (en) * | 2015-02-09 | 2015-05-20 | 李家侬 | Metal and nonmetal welding method |
| CN104690385A (en) * | 2015-02-02 | 2015-06-10 | 哈尔滨工业大学 | Composite interlayer and method for brazing metal with ceramic and ceramic matrix composite material by utilizing same |
| CN105499834A (en) * | 2016-01-27 | 2016-04-20 | 江苏科技大学 | Brazing material for brazing molybdenum-rhenium alloy, preparation method and brazing method |
| CN115106675A (en) * | 2022-08-09 | 2022-09-27 | 哈尔滨工业大学（威海） | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
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| CN105499834A (en) * | 2016-01-27 | 2016-04-20 | 江苏科技大学 | Brazing material for brazing molybdenum-rhenium alloy, preparation method and brazing method |
| CN115106675A (en) * | 2022-08-09 | 2022-09-27 | 哈尔滨工业大学（威海） | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
| CN115106675B (en) * | 2022-08-09 | 2024-02-27 | 哈尔滨工业大学（威海） | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
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