CN102695914B - Luminous, photovoltaic or other electronic installation and system and manufacture its method - Google Patents
Luminous, photovoltaic or other electronic installation and system and manufacture its method Download PDFInfo
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- CN102695914B CN102695914B CN201080048098.8A CN201080048098A CN102695914B CN 102695914 B CN102695914 B CN 102695914B CN 201080048098 A CN201080048098 A CN 201080048098A CN 102695914 B CN102695914 B CN 102695914B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0475—PV cell arrays made by cells in a planar, e.g. repetitive, configuration on a single semiconductor substrate; PV cell microarrays
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Abstract
The invention provides a kind of electronic installation, such as, the luminescence component be made up of LED or comprise the power generating device of photovoltaic diode, it can use semiconductor or other substrate particle ink or suspension and use lens particle ink or suspension, creates via printing process.Wherein a kind of exemplary device comprises: substrate; At least one first conductor; Multiple diode, they can be coupled at least one first conductor described; At least one second conductor, they can be coupled to described multiple diode; And the multiple lens be suspended among polymer, they can be deposited over or be attached at the top of described diode.In some embodiment, described lens and diode are that the ratio of essence spherical and average diameter or length is between about between 10: 1 and 2: 1.Described diode may be LED or photovoltaic diode, and in some embodiment.
Description
Technical field
The present invention is substantially about luminous and photovoltaic technology; And more particularly, the invention relates to luminescence, photovoltaic or other electronic installation and system, and manufacture the method for luminous, photovoltaic or other electronic installation or system.
Background technology
The light-emitting device with light-emitting diode (LightEmittingDiode, LED) needs to use multiple tracks integrated circuit manufacture process step to create described LED on semiconductor wafer usually.Then can split this wafer, other LED individual can be placed among reflexive housing, and many bonding wires can be attached to each LED separately.This is consuming time, labour-intensive and expensive processing procedure, thus makes the luminescence component based on LED usually too expensive and cannot be used in the application of numerous consumer.
Similarly, energy generating devices (such as photovoltaic panel) also needs to use multiple tracks integrated circuit manufacture process step to create described photovoltaic diode on semiconductor crystal wafer or other substrate usually.Then, the wafer generated or other substrate can packed and assembling in order to create described photovoltaic panel.This is consuming time, labour-intensive and expensive processing procedure equally, thus makes photovoltaic module equally can be too expensive and do not subsidizing or cannot popularize use under not having other rewarding fund of the government.
Other method manufacturing photovoltaic module is equally just under development.For example, the people such as Hammerbacher are in No. 2008/0289688th, the U.S. Patent Application Publication case disclosed in 27 days November in 2008, the title of this case is " photovoltaic devices (PhotovoltaicApparatusIncludingSphericalSemiconductingPar ticles) comprising spheric semiconductor particle ", and the United States Patent (USP) case the 6th that the people such as Hamakawa won on March 16th, 2004, 706, No. 959, the title of this case is " photovoltaic devices and a large amount of process unitss (PhotovoltaicApparatusandMassProducingApparatusforMassPro ducingSphericalSemiconductingParticles) for producing spheric semiconductor particle in a large number ", two cases all disclose a kind of method just having brought into use spherical diode, described spherical diode has a pn junction formed centered by whole spheroid, but, then because need to each other diode carry out corresponding micro Process process in order to remove this spheroid and pn junction thereof a large amount of section so that an inside core among form a depression, thus have the problem of manufacture.Just start, one spherical diode can through micro Process process, obviously or significantly to become aspheres, create the substantial planar concave side with an exposed internal core segment, N-shaped in this diode (or equivalent saying is N-type) or p-type (or equivalent saying is P type) internal base plate part can be contacted, to be soldered to an electrode.Once after micro Process process, described other non-spherical diode just must be properly oriented, placed individually and be soldered to conductor, to produce final assembly in the place, two, inside of the outside of this diode and depression simultaneously.Again, this is consuming time, labour-intensive and expensive processing procedure equally, reach universal use and have suitable difficulty.
The United States Patent (USP) case the 4th that Ebert won on January 20th, 1987,638, the another kind of method manufacturing photovoltaic module is disclosed in No. 110, the title of this case is " method and apparatus (MethodsandApparatusRelatingtoPhotovoltaicSemiconductorDe vices) relevant with photovoltaic semiconductors assembly ", it uses a kind of transparent solid sheet to have the integrally formed of single refractive index to adjoin solar energy polymerizable lens array, have a curvature array on the first side of this transparent solid sheet.This lens panel has a second smooth side further, and it can be coupled and be fixed to a panel made in advance, and this panel made in advance has the multiple solid conducting layer be separated by an insulating barrier.In the method, one radium-shine meeting is advanced along each the individual lenses stepping in this thin plate, it can focus on radium-shine beam, panel in order to make in advance this carry out micro Process and in this panel made in advance the hole of Drilling one correspondence, run through described solid, the conductive layer formed in advance and insulating barrier.The array produced has a large amount of very little punchinging, then, just can utilize a semiconductive material or multiple diode made in advance fill up described in punching, in order to create photovoltaic cell born of the same parents, each polymerizable lens all can be designed to than large 50 to 100 times produced of photovoltaic cell born of the same parents.Due to the relation of the focussing force of this lens array, need the solar-tracking assembly parts using separation to move whole assembly, in order to follow the trail of solar position, because light only can be focused on from very little angular range on described solar cell born of the same parents, so, on other non-solar cell batteries born of the same parents part that can be focused on this panel made in advance from the light of other incident at angles.The acceptance of this micro-processing method is not popularized, and may be because there is the relations of many still unsolved difficult problems, such as: directed, align the diode that makes in advance and be placed on each punching among problem; The semiconductor that crystalline texture quality is enough to reach effective efficiency cannot be created among described punchinging; A pn junction cannot be formed among the region (being focused light in order to be exposed to this) of punchinging covered by this lens panel; Because described in the manufacturing issue that causes of the small size of punchinging; Cannot punching described in conforming filling; The semiconductive material applied described in cannot welding or the diode that makes in advance are in order to have complete function and reliable nurse contact difficult to understand with being created by residue (not ablated) solid conducting layer be formed in advance in this panel; Because the relation of radium-shine machining chips can produce short circuit current between the conductive layers; ... to wait and without any restriction.In addition, the method and the device that generates cannot in order to create addressable or dynamic light-emitting diode display.
With regard to luminescence component, the development of other light-emitting device various and method is towards the quantity improved from the actual light sent of this luminescence component.For example, Lu is in No. 2007/0108459th, the U.S. Patent Application Publication case disclosed in 17 days Mays in 2007, the title of this case is " method (MethodsofManufacturingLightEmittingDevices) manufacturing luminescence component ", just disclose various lens and light is extracted structure out and develops multiple geometry to attempt to minimize internal reflection, in fact can export from this assembly in order to do the light making to send from LED.
Except other a variety of causes, due to the relation of complexity, the material of light source assembly and the assembly based on LED and manufacturing cost are still too high, and cannot popularize employing.Therefore, still need and can be designed to more not expensive light-emitting device and/or photovoltaic devices being incorporated in assembly and in ease of manufacture.In addition, also still need to utilize more expensive and more not durable processing procedure to manufacture the method for these luminescence components or photovoltaic module, thus produce and can popularize and the luminescence component based on LED adopted and photovoltaic panel for consumer and enterprise.
Summary of the invention
One exemplary embodiment of the present invention provides a kind of novel luminescence component based on LED and photovoltaic module, and uses printing technology and coating technique to manufacture the new method of these assemblies.The luminescence component based on photovoltaic and/or LED of described novelty can be made into size miscellaneous, from the size (or larger) of the size to billboard display that are equivalent to mobile telephone display.The luminescence component based on photovoltaic and/or LED of described exemplary novelty is also very durable and under can operating in condition miscellaneous, described condition comprises open air and other harsh environmental condition.The process of the suitable low temperature of exemplary novel approach application of the luminescence component of described manufacture based on photovoltaic and/or LED and instantly can just create corresponding diode what manufacture this assembly, not use and to have completed or through the diode (rear end manufactures) of encapsulation, described completed or diode through encapsulation then sequentially indivedual and separated at a products in an extra manufacture circulates.The exemplary novel lensing structure of described luminescence component based on photovoltaic and/or LED can also supply a pattern coupling and wider incidence or scatter angle, and does not need separately to follow the trail of or other panel moves.The exemplary novel method of the luminescence component of described manufacture based on photovoltaic and/or LED can provide the final products of very low cost, thus reaches the universal object adopting these energy production and energy saving modules further.
In wherein a kind of one exemplary embodiment, device comprises: substrate, and it comprises many passages separated; Multiple first conductor, they can be coupled to this substrate, and each first conductor is all arranged among channel corresponding to described many separated channels; The spherical diode of multiple essence, they can be coupled to described multiple first conductor; Multiple second conductor, they can be coupled to the spherical diode of described multiple essence; And multiple essence spherical lens, they have at least one first refractive rate, and described multiple essence spherical lens can be suspended among the first polymer, this first polymer have at least one second, different refractive indexes.
In various one exemplary embodiment, the spherical diode of all in fact described multiple essence may have essence hemispherical shell pn junction.In addition, in various one exemplary embodiment, in the spherical diode of all described multiple essence of essence each diode surface in about 10 five to percent five ten five can have penetrated bed or region, this layer or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy.In extra various one exemplary embodiment, each diode in the spherical diode of described multiple essence all can comprise: Part I, its pn junction having the hemispherical shell of essence or have lid; And Part II, it has the substrate of at least part of orbicule.
In several one exemplary embodiment, the ratio of the average diameter of described multiple essence spherical lens and the average diameter of the spherical diode of described multiple essence may be about in fact five to one (5: 1).In other various one exemplary embodiment, the ratio of the average diameter of described multiple essence spherical lens and the average diameter of the spherical diode of described multiple essence may between about ten to one (10: 1) and two-to-one (2: 1).In various one exemplary embodiment, the contrast size of described multiple essence spherical lens or interval can supply a pattern and be coupled to the spherical diode of described multiple essence.In addition, in various one exemplary embodiment, the average diameter of the spherical diode of described multiple essence may be greater than about 20 (20) microns and be less than about 40 (40) microns.
In any described various one exemplary embodiment, the spherical diode of described multiple essence may be semiconductor light-emitting-diode, Organic Light Emitting Diode, Organic Light Emitting Diode, polymer LED or photovoltaic diode through being encapsulated.For example, the spherical diode of described multiple essence may comprise gallium nitride, GaAs or silicon.
In any described various one exemplary embodiment, multiple 3rd conductor may be coupled to described multiple second conductor.This substrate may comprise reflector or refractor further, such as, and Bragg reflector or reflectivity plastics or polyester coating.Multiple conductive through holes (via) may extend in the first side of this substrate and is coupled to described multiple first conductor in this first side place by corresponding with between the second side.This substrate also may comprise conducting back plane further, and it can be coupled to described multiple conductive through holes and can be coupled to or be integrated into the second side of this substrate.In various one exemplary embodiment, described multiple conductive through holes may comprise multiple essence random distribution, the spherical conductor of essence.
In addition; in various one exemplary embodiment; multiple insulator may be coupled to the spherical diode of multiple essence described in each by correspondence and may comprise multiple inorganic dielectric particle; described particle can be suspended among the second polymer or resin together with light initiator compound (photoinitiatorcompound), or may comprise light initiator compound and the second polymer or resin.
In various one exemplary embodiment, this substrate has the monnolithic case factor of substantial planar, and it has or does not have surface characteristics pattern, and thickness is less than about two millimeters.For example, this substrate may comprise below one of them: paper, have the paper of coating, the paper that plastic material has coating, card-cut paper, fibre paper, hardboard, placard paper, placard cardboard, timber, plastics, rubber, fabric, glass and/or pottery.Described many passages separated may be essentially parallel, or, may at least partly for hemispherical and can be arranged in an array, or, may be parabolical at least partly.This substrate may comprise multiple angled spine further.Described many passages separated also may comprise multiple integrally formed protuberance or support portion further.Concerning this one exemplary embodiment, described multiple first conductor can be coupled to described multiple integrally formed protuberance inside described many divider passages or support portion, and the spherical diode of described multiple essence by alloying or to be annealed or can by chemical Coupling to described multiple first conductor.
Described multiple first conductor may comprise the electrically conductive ink solidified or the conducting polymer solidified.For example, described multiple first conductor may comprise one of them in the types of conductors of cured form below: silver conductive ink, copper electrically conductive ink, golden electrically conductive ink, aluminium matter electrically conductive ink, tin matter electrically conductive ink, carbonaceous electrically conductive ink, carbon nanotube polymer or conducting polymer.In other various one exemplary embodiment, described multiple first conductor includes in fact sputter, have coating, have vapour deposition or have the metal of plating, metal alloy or the combination of various metals, such as, for example, aluminium, copper, silver, nickel or gold.
Described multiple second conductor may comprise and is suspended in printing opacity conductor among polymer, resin or other medium or conductive compound.For example, described multiple second conductor may comprise be suspended in below among a polymer, resin or other medium in compound one of them: carbon nanotube, antimony tin, tin indium oxide or poly-ethylenedioxythiophene (polyethylene-dioxithiophene).
In several one exemplary embodiment, described multiple lens may comprise borosilicate glass or polystyrene latex.
In various one exemplary embodiment, the spherical diode of described multiple essence can be annealed or by alloying to described multiple first conductor or be positioned at inside described multiple first conductor.In other various one exemplary embodiment, the spherical diode of described multiple essence can by chemical Coupling to described multiple first conductor or be positioned at inside described multiple first conductor.In another one exemplary embodiment, described multiple diode can be coupled to described multiple first conductor by adjacent or be positioned at inside described multiple first conductor.
Wherein demonstration equipment or system may comprise further: for being inserted into the interface among standard luminescent slot, such as, and the interface of E12, E14, E26, E27 or GU-10 emission standards compatibility; For being inserted into the interface among the luminous slot of standard Edison-type; Or for being inserted into the interface among the luminous slot of standard fluorescence type.
Another one exemplary embodiment is a kind of device, and it comprises: substrate; At least one first conductor, they can be coupled to this substrate; The spherical diode of multiple essence, they can be coupled at least one first conductor described; At least one second conductor, they can be coupled to the spherical diode of described multiple essence; And multiple essence spherical lens, they to be suspended among the first polymer and can be coupled to the spherical diode of described multiple essence.In wherein a kind of one exemplary embodiment, described multiple essence spherical lens there is at least one first refractive rate and this first polymer have at least one second, different refractive indexes.
Another exemplary device comprises: substrate; At least one first conductor, they can be coupled to this substrate; Multiple substantial optical resonance diode, they can be coupled at least one first conductor described; At least one second conductor, they can be coupled to described multiple substantial optical resonance diode; And multiple lens, they to be suspended among the first polymer and can be coupled to described multiple substantial optical resonance diode, described multiple lens have at least one first refractive rate and this first polymer have at least one second, different refractive indexes.In various one exemplary embodiment, described multiple substantial optical resonance diode may be that essence is spherical, essence toroid or essence column.In addition, in various one exemplary embodiment, described multiple lens may be in fact spherical, hemispherical, multiaspect shape, ellipse, oblong (oblong), cube, prismatic, trapezoidal, triangle or pyramid.
In various one exemplary embodiment, this device may be pliability or foldable or can fold.
The present invention also discloses a kind of exemplary system, and it comprises: interface, for being inserted among standard luminescent slot; Substrate; At least one first conductor, they can be coupled to this substrate; The spherical diode of multiple essence, they can be coupled at least one first conductor described, and the average diameter of the spherical diode of described multiple essence may be greater than about 20 (20) microns and be less than about 40 (40) microns; At least one insulator, they can be coupled to the spherical diode of described multiple essence; At least one second conductor, they can be coupled to the spherical diode of described multiple essence; And multiple essence spherical lens, they to be suspended among polymer and can be coupled to the spherical diode of described multiple essence, described multiple essence spherical lens there is at least one first refractive rate and this polymer have at least one second, different refractive indexes, wherein, the ratio of the average diameter of described multiple essence spherical lens and the average diameter of the spherical diode of described multiple essence is between about ten to one (10: 1) and two-to-one (2: 1).
Another exemplary device comprises: substrate, and it has many passages separated, and each passage in described many divider passages all comprises multiple integrally formed protuberance; Conducting back plane, it can be coupled to this substrate or can be integrally formed with this substrate; Multiple conductive through holes, they can be coupled to this conducting back plane inside this substrate; At least one first conductor, they can be coupled to described multiple conductive through holes and can be coupled to described integrally formed protuberance; The spherical diode of multiple essence, they can be coupled at least one first conductor described, in the spherical diode of all described multiple essence of essence each diode surface in about 10 five to percent five ten five have penetrated bed or region, this layer or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy; At least one second conductor, they can be coupled to the spherical diode of described multiple essence; And multiple essence spherical lens, they to be suspended among polymer and can be coupled to the spherical diode of described multiple essence.
In several one exemplary embodiment, device comprises: substrate, and it has many passages separated; Multiple first conductor, they can be coupled to this substrate, and each first conductor is all arranged among channel corresponding to described many separated channels; Multiple diode, they can be coupled to described multiple first conductor; Multiple second conductor, they can be coupled to described multiple diode; And multiple essence spherical lens, they have at least one first refractive rate, and described multiple essence spherical lens can be suspended among the first polymer, this first polymer have at least one second, different refractive indexes.In various one exemplary embodiment, described multiple diode may be that essence is spherical, essence toroid, essence column, essence multiaspect shape, essence rectangle, essence plane or essence oval.
In another one exemplary embodiment, device comprises: substrate; At least one first conductor, they can be coupled to this substrate; Multiple diode, they can be coupled at least one first conductor described; At least one second conductor, they can be coupled to described multiple diode; And multiple essence spherical lens, they to be suspended among the first polymer and can be coupled to described multiple diode.In several one exemplary embodiment, described multiple essence spherical lens may have at least one first refractive rate and this first polymer have at least one second, different refractive indexes.
Wherein exemplary system also may comprise: an interface, for being inserted among standard luminescent slot; Substrate; At least one first conductor, they can be coupled to this substrate; Multiple diode, they can be coupled at least one first conductor described; At least one second conductor, they can be coupled to described multiple diode; And multiple lens, they to be suspended among the first polymer and can be coupled to described multiple diode, described multiple lens there is at least one first refractive rate and this first polymer have at least one second, different refractive indexes.In various one exemplary embodiment, described multiple diode may be that essence is spherical, essence toroid, essence column, essence multiaspect shape, essence rectangle, essence plane or essence oval; And described multiple lens may be in fact spherical, hemispherical, multiaspect shape, ellipse, oblong, cube, prismatic, trapezoidal, triangle or pyramid.
In wherein a kind of one exemplary embodiment, device comprises: substrate; At least one first conductor, they can be coupled to this substrate; Multiple diode, they can be coupled at least one first conductor described, in all described multiple diodes of essence each diode a surface in about 10 five to percent five ten five have one deck or region, this layer or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy; At least one second conductor, they can be coupled to described multiple diode; And multiple lens, they to be suspended among the first polymer and can be coupled to described multiple diode, described multiple lens there is at least one first refractive rate and this first polymer have at least one second, different refractive indexes.
Another exemplary device comprises: substrate; At least one first conductor, they can be coupled to this substrate; Multiple diode, they can be coupled at least one first conductor described; At least one second conductor, they can be coupled to described multiple diode; And lens arrangement, it can be coupled to described multiple diode, this lens arrangement comprises multiple lens and has multiple refractive index further, wherein, the average diameter of described multiple lens or length and the described average diameter of multiple diode or the ratio of length are between about ten to one (10: 1) and two-to-one (2: 1).
Various one exemplary embodiment also comprises the method manufacturing electronic installation, and wherein a kind of exemplary method comprises: form multiple first conductor, they can be coupled to substrate; Spherical for multiple essence substrate particle is coupled to described multiple first conductor; After being coupled to described multiple first conductor, convert described multiple essence spherical substrate particle to multiple essence spherical diode; And forming multiple second conductor, they can be coupled to the spherical diode of described multiple essence.
Wherein exemplary method may comprise the multiple essence spherical lens of deposition further, and described essence spherical lens can be suspended among the first polymer; And in various one exemplary embodiment, described multiple essence spherical lens may have at least one first refractive rate, and wherein, this first polymer may have at least one second, different refractive indexes.The described multiple essence spherical lens be suspended among this first polymer are printed in the top that this deposition step may be included in the spherical diode of described multiple essence and described multiple second conductor further.
Wherein exemplary method embodiment may comprise further the layer made in advance is attached to the spherical diode of described multiple essence, and this layer made in advance comprises multiple essence spherical lens, and described essence spherical lens can be suspended among the first polymer.In various one exemplary embodiment, depositing first conductive medium inside many passages that described multiple first conductor of this formation may be included in this substrate further, such as, electrically conductive ink or conducting polymer.Wherein exemplary method embodiment may comprise this first conductive media partially cured further, and the step that described multiple essence spherical substrate particle is coupled to described multiple first conductor may comprise by further: inside described many passages, deposit the spherical substrate particle of described multiple essence be suspended among carrier medium; And solidify this first conductive media completely.
In several one exemplary embodiment, the step of this depositing first conductive medium may comprise sputter, coating, vapour deposition or the combination of plated metal, metal alloy or various metals.
In various one exemplary embodiment, the step that described multiple essence spherical substrate particle is coupled to described multiple first conductor may comprise by further: inside described many passages, deposit the spherical substrate particle of described multiple essence be suspended among reactive carrier medium; Remove this reactive carrier medium; And solidify or solidify this first conductive media again.In other various one exemplary embodiment, the step that described multiple essence spherical substrate particle is coupled to described multiple first conductor may comprise by further: inside described many passages, deposit the spherical substrate particle of described multiple essence be suspended among anisotropic conductive medium; And compress the spherical substrate particle of described multiple essence be suspended among this anisotropic conductive medium.In other various one exemplary embodiment, the step that described multiple essence spherical substrate particle is coupled to described multiple first conductor may comprise by further: inside described many passages, deposit the spherical substrate particle of described multiple essence be suspended among volatile vehicle medium; And evaporate this volatile vehicle medium.Again, in other various one exemplary embodiment, the step that described multiple essence spherical substrate particle is coupled to described multiple first conductor may comprise by further: inside described many passages, deposit the spherical substrate particle of described multiple essence be suspended among carrier medium; And the spherical substrate particle of the described multiple essence inside described many passages is annealed or alloying.
In several one exemplary embodiment, when described multiple first conductor is coupled to multiple integrally formed protuberance inside described many passages or support portion, the step that described multiple essence spherical substrate particle is coupled to described multiple first conductor may comprise by further: inside described many passages, deposit the spherical substrate particle of described multiple essence be suspended among carrier medium; And described multiple essence spherical substrate particle is annealed, alloying or by their chemical Coupling to described multiple first conductor.
In various one exemplary embodiment, when the spherical substrate particle of each essence in described multiple essence spherical substrate particle comprises semiconductor, this step described multiple essence spherical substrate particle being converted to the spherical diode of described multiple essence may comprise further and among each essence spherical substrate particle, forms pn junction by mode below: on the spherical substrate particle of described multiple essence, deposit a dopant material; And utilize the spherical substrate particle of described multiple essence to anneal or alloying to this dopant material.For example, this annealing or alloying may be radium-shine or thermal annealing or alloying, and this dopant material may be substrate liquid or film, or this dopant material may be suspended in dopant elements among a carrier or compound.In several one exemplary embodiment, this dopant material may be deposited over the spherical substrate particle of described multiple essence first, on upper section, in order to form the hemispherical shell of essence or to have the pn junction of lid.
In several one exemplary embodiment, when described multiple essence spherical substrate particle comprises the first organic or polymer compound, this step described multiple essence spherical substrate particle being converted to the spherical diode of described multiple essence may comprise or polymer compound organic by second further and be deposited on the spherical substrate particle of described multiple essence.
Wherein a kind of exemplary method embodiment may comprise further: above described multiple second conductor or the inside deposition multiple 3rd conductor; Or reflector or refractor are coupled to this substrate, and such as, Bragg reflector or reflectivity plastics or polyester coating; Or attachment is for being inserted into the interface among a standard luminescent slot.
Wherein exemplary method embodiment may comprise deposition further and can be suspended in multiple inorganic dielectric particles among the second polymer or resin together with light initiator compound, in order to form the multiple insulators being coupled to the spherical diode of multiple essence described in each by correspondence.
In various one exemplary embodiment, the step of described multiple second conductor of this formation may comprise the printing opacity conductor or conductive compound that deposit and be suspended among polymer, resin or other medium further.
In addition, in various one exemplary embodiment, described formation, coupling and switch process can by or implement via printing process.
The present invention also discloses the another kind of exemplary method manufacturing electronic installation, and this exemplary method comprises: form at least one first conductor, they can be coupled to substrate; Spherical for multiple essence substrate particle is coupled at least one first conductor described; Convert described multiple essence spherical substrate particle to multiple essence spherical diode; And forming at least one second conductor, they can be coupled to the spherical diode of described multiple essence.In several one exemplary embodiment, wherein a kind of exemplary method may comprise the multiple essence spherical lens of deposition further, described essence spherical lens can be suspended among the first polymer, wherein, described multiple essence spherical lens has at least one first refractive rate, and wherein, this first polymer have at least one second, different refractive indexes.In other various one exemplary embodiment, wherein a kind of exemplary method may comprise further the layer made in advance is attached to the spherical diode of described multiple essence, this layer made in advance comprises multiple essence spherical lens, described essence spherical lens can be suspended among the first polymer, wherein, described multiple essence spherical lens has at least one first refractive rate, and wherein, this first polymer have at least one second, different refractive indexes.
In addition, in wherein a kind of one exemplary embodiment, the step of at least one the first conductor described in this formation can comprise depositing first conductive medium further, such as, silver conductive ink, copper electrically conductive ink, golden electrically conductive ink, aluminium matter electrically conductive ink, tin matter electrically conductive ink, carbonaceous electrically conductive ink, carbon nanotube polymer or a conducting polymer.In several one exemplary embodiment, the step of this depositing first conductive medium comprises sputter, coating, vapour deposition or the combination of plated metal, metal alloy or various metals (such as, aluminium, copper, silver, nickel or gold).
The present invention also discloses the another kind of exemplary method manufacturing light emitting electronic device, and this exemplary method comprises: form at least one first conductor, they can be coupled to substrate; Spherical for multiple essence substrate particle is coupled at least one first conductor described; After being coupled to described multiple first conductor, convert described multiple essence spherical substrate particle to multiple essence spherical light-emitting diode, the average diameter of the spherical light-emitting diode of described multiple essence is greater than about 20 (20) microns and is less than about 40 (40) microns; Form at least one second conductor, they can be coupled to the spherical light-emitting diode of described multiple essence; Deposit multiple essence spherical lens, described essence spherical lens can be suspended among polymer, described multiple essence spherical lens there is at least one first refractive rate and this polymer have at least one second, different refractive indexes, wherein, the ratio of the average diameter of described multiple essence spherical lens and the average diameter of the spherical light-emitting diode of described multiple essence is between about ten to one (10: 1) and two-to-one (2: 1); And attachment is for being inserted into the interface among standard luminescent slot.
The present invention also discloses the exemplary method of another kind of manufacture electronic installation and comprises: form at least one first conductor, they can be coupled to substrate; Spherical for multiple essence substrate particle is coupled at least one first conductor described; After being coupled at least one first conductor described, convert described multiple essence spherical substrate particle to multiple essence spherical diode, in the spherical diode of all described multiple essence of essence each diode surface in about 10 five to percent five ten five have penetrated bed or region, this layer or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy; Form at least one second conductor, they can be coupled to the spherical diode of described multiple essence; And deposit multiple essence spherical lens, described essence spherical lens can be suspended among a polymer, described multiple essence spherical lens there is at least one first refractive rate and this polymer have at least one second, different refractive indexes.
The another kind of exemplary method manufacturing electronic installation comprises: form multiple first conductor, they can be coupled to substrate; Multiple substrate particle is coupled to described multiple first conductor; After being coupled to described multiple first conductor, convert described multiple substrate particle to multiple diode; Form multiple second conductor, they can be coupled to described multiple diode; And deposit multiple essence spherical lens, described essence spherical lens can be suspended among the first polymer, described multiple essence spherical lens there is at least one first refractive rate and this first polymer have at least one second, different refractive indexes.In several one exemplary embodiment, described multiple diode may be that essence is spherical, essence toroid, essence column, essence multiaspect shape, essence rectangle, essence plane or essence oval.The described multiple essence spherical lens be suspended among this first polymer are printed in the top that this deposition step can be included in described multiple diode and described multiple second conductor further.
Again, the another kind of exemplary method manufacturing electronic installation comprises: form at least one first conductor, they can be coupled to substrate; Multiple substrate particle is coupled at least one first conductor described; After being coupled at least one first conductor described, convert described multiple substrate particle to multiple diode; Form at least one second conductor, they can be coupled to the spherical diode of described multiple essence; And deposit multiple essence spherical lens, described essence spherical lens can be suspended among the first polymer, and wherein, described multiple essence spherical lens has at least one first refractive rate, and wherein, this polymer have at least one second, different refractive indexes.
The present invention also discloses the exemplary method of another kind of manufacture electronic installation and comprises: form at least one first conductor, they can be coupled to substrate; Multiple substrate particle is coupled at least one first conductor described; Described multiple substrate particle is converted to multiple substantial optical resonance diode; Form at least one second conductor, they can be coupled to described multiple substantial optical resonance diode; Deposit multiple lens, described lens can be suspended among the first polymer, and wherein, described multiple lens have at least one first refractive rate, wherein, this first polymer have at least one second, different refractive indexes; And attachment is for being inserted into the interface among standard luminescent slot.
In various one exemplary embodiment, a kind of method manufacturing electronic installation can comprise: depositing first conductive medium inside many passages of substrate, in order to form multiple first conductor; The multiple semiconductor substrate particles be suspended among carrier medium are deposited inside described many passages; Nurse contact difficult to understand is formed between first conductor of each the semiconductor substrate particle in described multiple semiconductor substrate particle and described multiple first conductor; Convert described multiple semiconductor substrate particle to multiple semiconductor diode; Depositing second conductive medium is in order to form multiple second conductor, and described multiple second conductor can be coupled to described multiple semiconductor diode; And be suspended in the multiple lens among the first polymer at the disposed thereon of described multiple diode.For example, described deposition step may comprise one of them in sedimentation type below further: printing, coating, roller coating, spraying, layer painting, sputter, stacking, wire mark, ink jet printing, electric light printing, e-inks printing, photoresistance printing, hot stamping brush, radium-shine jet printing, magnetic printing, bat printing (padprinting), flexographic printing (flexographicprinting), combined type lithographic plate lithography (hybridoffsetlithography) or Gravure intaglio printing.In addition, for example, the step of this first conductive media of this deposition can comprise further and utilizes this first conductive media to be coated with described many passages and to utilize a medical scraper to carry out the first surface of this substrate of blade coating to remove the first unnecessary conductive media; And similarly, the step of the described multiple semiconductor substrate particle of this deposition can comprise further and to be suspended in multiple semiconductor substrate particles in carrier medium described in utilization to be coated with described many passages and to utilize medical scraper to carry out the first surface of this substrate of blade coating to remove unnecessary multiple spherical substrate particle.
Again, the another kind of exemplary method manufacturing electronic installation comprises: depositing first conductive medium in substrate, in order to form at least one first conductor; Deposit the multiple semiconductor substrate particles be suspended among carrier medium; Nurse contact difficult to understand is formed between described multiple semiconductor substrate particle and at least one first conductor described; Among each semiconductor substrate particle, pn junction is formed: dopant deposition thing material and anneal to form multiple semiconductor diode to described multiple semiconductor substrate particle on described multiple semiconductor substrate particle by mode below; Depositing second conductive medium is in order to form at least one second conductor, and at least one second conductor described can be coupled to described multiple semiconductor diode; And be suspended in the multiple essence spherical lens among the first polymer at the disposed thereon of described multiple diode, described multiple essence spherical lens has at least one first refractive rate, and this first polymer have at least one second, different refractive indexes.
In another one exemplary embodiment, a kind of method manufacturing electronic installation comprises: inside multiple recesses of substrate, print the first conductive media, in order to form multiple first conductor; The spherical substrate particle of multiple essence be suspended among carrier medium is printed inside described multiple recess; Described multiple essence spheric semiconductor substrate particle first, print alloy on upper section; Described multiple essence spheric semiconductor substrate particles through doping are annealed, in order to form the spherical diode of multiple essence with hemispherical shell pn junction at least partially; Electric insulation medium is printed above the Part I of the spherical diode of described multiple essence; The second conductive media is printed, in order to form multiple second conductor above the Part II of the spherical diode of described multiple essence; And the multiple essence spherical lens be suspended among the first polymer are printed in the top of the spherical diode of described multiple essence, described multiple essence spherical lens has at least one first refractive rate, and this first polymer have at least one second, different refractive indexes.
From the present invention and embodiment the following detailed description of, claim and enclose graphic be just readily understood that other advantage numerous of the present invention and feature.
Accompanying drawing explanation
The graphic disclosure inquired into above of enclosing is coordinated can more easily to understand object of the present invention, feature and advantage, wherein, identical component symbol can be used in each view to carry out the identical assembly of identification, and wherein, the component symbol with numerical chracter can be used to represent through the additional type of selected Assemblies Example, example or change case in each view, wherein:
Shown in Fig. 1 is the perspective view of an exemplary substrates of device embodiment according to teachings of the present invention.
Shown in Fig. 2 is the cutaway view of the first exemplary substrates of device embodiment according to teachings of the present invention.
Shown in Fig. 3 is the cutaway view of the second exemplary substrates of device embodiment according to teachings of the present invention.
Shown in Fig. 4 is the cutaway view of the 3rd exemplary substrates of device embodiment according to teachings of the present invention.
Shown in Fig. 5 is the cutaway view of the 4th exemplary substrates of device embodiment according to teachings of the present invention.
Shown in Fig. 6 is the perspective view with the exemplary substrates of multiple first conductor of device embodiment according to teachings of the present invention.
Shown in Fig. 7 is the cutaway view with the exemplary substrates of multiple first conductor of device embodiment according to teachings of the present invention.
Shown in Fig. 8 is the cutaway view with the 5th exemplary substrates of multiple first conductor of device embodiment according to teachings of the present invention.
Shown in Fig. 9 is the cutaway view with the 6th exemplary substrates of multiple first conductor of device embodiment according to teachings of the present invention.
Shown in Figure 10 is the cutaway view with the 6th exemplary substrates of multiple first conductor of device embodiment according to teachings of the present invention.
Shown in Figure 11 is the perspective view with the exemplary substrates of multiple first conductor and multiple substrate particle of device embodiment according to teachings of the present invention.
Shown in Figure 12 is the cutaway view with the 5th exemplary substrates of multiple first conductor and multiple substrate particle of device embodiment according to teachings of the present invention.
Shown in Figure 13 is the transverse views of the 5th exemplary substrates, and described multiple substrate particle can pass through pinch rolloer in the optional step in the exemplary method for the formation of the device embodiment according to teachings of the present invention.
Shown in Figure 14 is the cutaway view with the 5th exemplary substrates of multiple first conductor and multiple diode of device embodiment according to teachings of the present invention.
Shown in Figure 15 is the cutaway view with the 5th exemplary substrates of multiple first conductor and multiple diode of device embodiment according to teachings of the present invention.
Shown in Figure 16 is the perspective view with the exemplary substrates of multiple first conductor, multiple diode and multiple insulator according to teachings one device embodiment of the present invention.
Shown in Figure 17 is the cutaway view with the 5th exemplary substrates of multiple first conductor, multiple diode and multiple insulator of device embodiment according to teachings of the present invention.
Shown in Figure 18 is the perspective view with the exemplary substrates of multiple first conductor, multiple diode, multiple insulator and multiple second conductor of device embodiment according to teachings of the present invention.
Shown in Figure 19 is the cutaway view with the 5th exemplary substrates of multiple first conductor, multiple diode, multiple insulator and multiple second conductor of device embodiment according to teachings of the present invention.
Shown in Figure 20 is the cutaway view with the 5th exemplary substrates of multiple first conductor, multiple diode, multiple insulator, multiple second conductor and luminescent layer of device embodiment according to teachings of the present invention.
Shown in Figure 21 is having multiple first conductor, multiple diode, multiple second conductor and being suspended in the perspective view of exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 22 is having multiple first conductor, multiple diode, multiple insulator, multiple second conductor, multiple 3rd conductor and being suspended in the cutaway view of the 5th exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 23 is having multiple first conductor, multiple diode, multiple insulator, multiple second conductor and being suspended in the perspective view of exemplary 7th substrate of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 24 is having multiple first conductor, multiple diode, multiple insulator, multiple second conductor, multiple 3rd conductor and being suspended in the cutaway view of the 7th exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 25 is the perspective view of exemplary 8th substrate of device embodiment according to teachings of the present invention.
Shown in Figure 26 is the perspective view with the exemplary substrates of multiple first conductor, multiple essence multiaspect shape diode, multiple second conductor and multiple 3rd conductor of device embodiment according to teachings of the present invention.
Shown in Figure 27 is the cutaway view with the 5th exemplary substrates of multiple first conductor, multiple essence multiaspect shape diode, multiple insulator, multiple second conductor and multiple 3rd conductor of device embodiment according to teachings of the present invention.
Shown in Figure 28 is the perspective view with the exemplary substrates of multiple first conductor, multiple essence ellipse (or oblong) diode and multiple second conductor of device embodiment according to teachings of the present invention.
Shown in Figure 29 is the cutaway view with the 5th exemplary substrates of multiple first conductor, multiple essence ellipse (or oblong) diode, multiple insulator and multiple second conductor of device embodiment according to teachings of the present invention.
Shown in Figure 30 is having multiple first conductor, the irregular diode of multiple essence, multiple insulator, multiple second conductor and being suspended in the perspective view of exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 31 is having multiple first conductor, the irregular diode of multiple essence, multiple insulator, multiple second conductor and being suspended in the cutaway view of the 5th exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 32 is having multiple first conductor, the spherical diode of multiple essence, multiple insulator, multiple second conductor, multiple 3rd conductor and being suspended in the perspective view of the 6th exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 33 is having multiple first conductor, the spherical diode of multiple essence, multiple insulator, multiple second conductor, multiple 3rd conductor and being suspended in the cutaway view of the 6th exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 34 is the perspective view with the exemplary substrates of the first conductor, the spherical diode of multiple essence, insulator, the second conductor and the 3rd conductor of device embodiment according to teachings of the present invention.
Shown in Figure 35 is having the first conductor, the spherical diode of multiple essence, insulator, the second conductor, the 3rd conductor and being suspended in the perspective view of exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 36 is having the first conductor, the spherical diode of multiple essence, insulator, the second conductor, the 3rd conductor and being suspended in the cutaway view of exemplary substrates of the multiple lens among polymer according to the device embodiment of teachings of the present invention.
Shown in Figure 37 is the perspective view of the 9th exemplary substrates with a conductor, the first conductor (or conduction) adhesion layer, multiple substrate particle and insulator according to the device embodiment of teachings of the present invention.
Shown in Figure 38 is the cutaway view with the 9th exemplary substrates of the first conductor, the first conductor adhesion layer, multiple substrate particle and insulator of device embodiment according to teachings of the present invention.
Shown in Figure 39 be according to the exemplary device embodiment of teachings of the present invention have be deposited the first conductor, the first conductor (or conduction) adhesion layer, utilize substrate (or semiconductor) layer that deposited or region to be formed on the perspective view of the 9th exemplary substrates of multiple diodes, insulator, the second conductor and multiple lens (being suspended among polymer (resin or other adhesive)) above multiple substrate particle.
Shown in Figure 40 be according to the exemplary device embodiment of teachings of the present invention have be deposited the first conductor, the first conductor (or conduction) adhesion layer, utilize substrate (or semiconductor) layer that deposited or region to be formed on the cutaway view of the 9th exemplary substrates of multiple diodes, insulator, the second conductor and multiple lens (being suspended among polymer (resin or other adhesive)) above multiple substrate particle.
Shown in Figure 41 is the calcspar of the first system embodiment according to teachings of the present invention.
Shown in Figure 42 is the calcspar of second system embodiment according to teachings of the present invention.
Shown in Figure 43 is the flow chart of embodiment of the method according to teachings of the present invention.
Embodiment
For embodiments of the invention will be solved technical problem, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
Although the present invention admits of numerous multi-form embodiment, can show in figure and their particular exemplary embodiment will be described herein in detail; But, will be appreciated that this disclosure should be regarded as the illustration of principle of the present invention and its purpose does not really want the present invention to be limited to explained specific embodiment herein.With regard in this respect, before explaining at least one embodiment conformed to the present invention in detail, will be appreciated that application of the present invention be not limited to above and below propose, the illustrated details of structure and the arrangement of assembly in the diagram of graphic middle institute or example.The method conformed to the present invention and device may have other embodiment and can carry out in every way and realize.In addition, will be appreciated that used wording and term and be incorporated to summary are only objects for reaching explanation and should be regarded as having limited significance herein above.
In selected embodiment, invention disclosed herein and on May 31st, 2007 put forward the U.S. patent application case sequence number the 11/756th of Shen, No. 616 relevant, the invention people of this case is the people such as WilliamJohnstoneRay, its title is " method (MethodsofManufacturingAddressableandStaticElectronicDisp lays) manufacturing addressable and static electronic displays ", and and on May 31st, 2007 put forward the U.S. patent application case sequence number the 11/756th of Shen, No. 619 relevant, the invention people of this case is the people such as WilliamJohnstoneRay, its title is " addressable or static luminous or electronic installation (AddressableorStaticLightEmittingorElectronicApparatus) ", herein two cases are called " related application ", two cases are all commonly assigned with this case, be incorporated to complete for their full content by reference herein, and advocate the priority of all main contents jointly disclosed.
Shown in Fig. 1 is an exemplary substrates 100 of a device embodiment, the perspective view of 100A, 100B, 100C, 100D according to teachings of the present invention.Shown in Fig. 2 is the cutaway view (running through 25-25 ' plane) of one first exemplary substrates 100 of a device embodiment according to teachings of the present invention.Shown in Fig. 3 is the cutaway view (running through 25-25 ' plane) of one second exemplary substrates 100A of a device embodiment according to teachings of the present invention.Shown in Fig. 4 is the cutaway view (running through 25-25 ' plane) of one the 3rd exemplary substrates 100B of a device embodiment according to teachings of the present invention.Shown in Fig. 5 is the cutaway view (running through 25-25 ' plane) of one the 4th exemplary substrates 100C of a device embodiment according to teachings of the present invention.It should be noted, in many described perspective views of all kinds or transverse views (such as Fig. 1,6,11,13,16,18,21,26,28,34,35), the substrate 100 of one or more correspondence any may be applied to, when this correspondence substrate as shown in FIG. as be used in a correspondence perspective view among time, cutaway view miscellaneous (such as Fig. 2 to 5,7,8,12,14,15,17,19,20,22,27,29) can be regarded as special exemplary embodiment or illustration.Should also be noted that, any when mentioning device herein, such as device 200,300,400,500,600 and/or 700 all should be understood to mean that and comprise it or their change case, vice versa, and it comprises device 200A, 200B, 300A, 300B, 400A, 400B, 500A, 500B, 600A, 600B, 700A and 700B discussed below.In addition, it should be noted, as hereafter discussed in more detail, device 200A, 200B, 300A, 300B, 400A, 400B, 500A, 500B, 600A, 600B, 700A and 700B below any one or more of middle may be different from each other: (1) is the existence of any recess, passage or groove 105 and/or shape inside their corresponding substrate 100; (2) shape of described substrate (or semiconductor) particle 120 and/or lens 150; (3) there is single-conductor and insulator, but not plural layer; (4) integrally formed or other conductive through holes 280,285 is comprised; (5) back flat 290 is comprised; (6) for creating the deposition process of described corresponding intrument; ... etc.Further it, as hereafter discussed in more detail, device 200A, 300A, 400A, 500A, 600A, 700A part is below different from device 200B, 300B, 400B, 500B, 600B, 700B, the diode 155 be incorporated in device 200A, 300A, 400A, 500A, 600A, 700A is light-emitting diode, and among device 200B, 300B, 400B, 500B, 600B, 700B is photovoltaic diode.Otherwise, anyly mention that in device 200,300,400,500,600 and/or 700, any one any feature or component all should be understood to equivalence to apply mechanically to other device 200,300,400,500,600 and/or 700 embodiment any and/or to combine these features or component individually, in order to do any combination making any device 200,300,400,500,600 and/or 700 may contain or comprise any component in any other device 200,300,400,500,600 and/or 700 embodiment described.In addition, any and all described depositions of all kinds, processing procedure and/or other manufacturing step all can be applied mechanically to any described device 200,300,400,500,600 and/or 700 of all kinds.
Should also be noted that, " substrate " one word can be used for expression two kinds of different assemblies: substrate (supporting or base substrate) 100 (they comprise 100A to 100H), it can form substrate or the support portion of other assembly, and it may be called " substrate " by equivalence in related application in this article, such as, for printing layer miscellaneous on a substrate; And multiple substrate particle 120, such as, in order to form multiple semiconductors of corresponding diode 155, polymer or organic light emission or photovoltaic substrate particle.Haveing the knack of literary composition and corresponding component symbol within the personage of this technology, just to understand those substrates of all kinds not identical, and for avoiding confusion, the substrate of support or basic type can be called " substrate " in this article, and " substrate " that use in the typical meaning of electronics and/or semiconductor technology then mean that and represent the material comprising substrate particle 120.
As as shown in Fig. 1 to 5, one exemplary substrates 100, 100A, 100B, 100C, 100D (and the 100E to 100G hereafter discussed) comprises multiple recess (passage, groove or space) 105, in selected embodiment, they can be formed long and narrow recess, thus effectively form passage, groove or slit (or, the saying of equivalence is, depression, trench, punching, opening, breach, aperture, cavity, crack, path or fold), they can be separated this exemplary substrates 100 each other, the multiple spines of correspondence in 100A to 100G (spike, protrusion or bizet) 115.Although the recess of the substrate 100 shown in figure, 100A, 100B, 100C, 100D, passage or groove bend (semicircle or half elliptic) and essence extends in (in the direction perpendicular to 25-25 ' plane) as the crow flies; But, any shape and/or size and any and all recesses, passage or the groove 105 extended in one or more direction any all can be regarded as equivalence and drop on inside the category of the invention of advocating herein, it comprises, but be not limited to square, rectangle, wavy, irregular shape, different size shape ... etc., there is discussion hereinafter in other graphic middle ills recess, passage or additional exemplary shape of groove 105.Described multiple recess, passage or groove 105 separate, and can be separated by spine's (spike, protrusion or bizet) 115 each other as shown in the figure, and in order to moulding multiple first conductors 110 with the selected embodiment of definition, as discussion hereafter.Although Fig. 1 and other graphic shown in recess or channel 105 be essentially parallel and by the substantially identical direction of orientation; But, the personage haveing the knack of this technology just can understand, countless change case is had to adopt, it comprises the degree of depth of described passage and width, channel direction or orientation (for example, circle, ellipse, curve-like, wavy, sinusoidal, triangle, various extraordinary-looking, exquisite shape, irregular shape ... etc.), interval variation, space or recess type (for example, passage, depression or punching ... etc., and these changes all are all regarded as equivalence and drop on inside category of the present invention.Also can explain with reference to figure 9,10,23 to 25,30 to 33 and 37 to 39 and the substrate 100 with additional form is discussed below.For example, meeting below be explained with reference to Figure 37 to 39 and discuss to have and be essentially the smooth monnolithic case factor and the exemplary substrates 100H changing (namely, without any recess, passage or groove 105) without any obvious surface.
Substrate 100,100A, 100B, 100C, 100D (and 100E, 100F, 100G, 100H of hereafter discussing) are made up of any suitable material or may comprise any suitable material, such as, for example, but be not limited to: plastics, paper, hardboard or have paper or the hardboard of coating.In an one exemplary embodiment, substrate 100 (it comprises 100A, 100B, 100C, 100D, 100E, 100F and/or 100G) comprises one and wherein has there is embossment and has paper or the plastics of coating of described multiple integrally formed recess 105 (such as via casting processing procedure), for example, it comprises the card-cut paper or card-cut hardboard that can buy from Sappi Co., Ltd.In addition, in an one exemplary embodiment, substrate 100 (it comprises 100A, 100B, 100C, 100D, 100E, 100F, 100G and/or 100H) comprises the material that its dielectric constant or can be applicable to providing essence electric insulation.In addition, for example, substrate 100,100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H also may comprise below any one or more: paper, have the paper of coating, paper that plastic material has coating, fibre paper, hardboard, placard paper, placard cardboard, book, magazine, newspaper, wood-based planet, clamping plate and other there is the product based on paper or timber of any selected form; Have the plastics of any selected form or polymeric material (thin plate, film, sheet material ... etc.); There is natural and tartan and the product of any selected form; There are the natural and synthetic fibers of any selected form; There is the derivative material of the glass of any selected form, pottery and other silicon or tripoli and product; Concrete (solidifying), stone and other construction material and product; Or any other products existing at present or can create future.In the first one exemplary embodiment, one substrate 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H may be deposited or be applied to this substrate 100 to provide to be enough to provide (it comprises 100A through selecting, 100B, 100C, 100D, 100E, 100F, 100G and/or 100H) first (front) side on one or more the first conductor 110 described electric insulation effect electric insulation degree (namely, there is dielectric constant or insulation characterisitic), its can each other electric insulation or with other device or system component electric insulation.For example, although be selection costly; But, glass plate or Silicon Wafer can also be utilized as substrate 100,100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H.But, in other one exemplary embodiment, plastic plate can be used or have the paper wood product of plastic-coated to form this substrate 100,100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, such as, the patent stock (patentstock) can buied to Sappi Co., Ltd and the big envelope stock (coverstock) of 100 pounds or the identical paper and other sheet paper products that have coating that can buy to other paper manufactory (such as, being positioned at the MitsubishiPaperMills in Mead town).In extra one exemplary embodiment, the substrate 100 of any type, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H can be used, it comprises, but be not limited to additional seal layer at one or more surface deposition of this substrate 100,100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H or be encapsulated the substrate of layer (such as, plastics, polish lacquer and ethene).
Described each graphic shown in the form factor of exemplary substrates 100 be essentially smooth in general, such as, comprise by a selected material (for example, paper or plastics) made by thin plate, for example, this selected material can by but be not limited to be fed to via printing machine, and the topology on first surface (or first side) comprises multiple recess, passage or groove 105 are (for example, netted, the substrate 100 of substantial planar, 100A, 100B, 100C, 100D, 100E, 100F, 100G), or its first surface is essence level and smooth (essence level and smooth and the substrate 100H of substantial planar), to drop on inside default tolerance (and do not comprise recess, passage or groove 105).The personage haveing the knack of this technology just can understand, and has countless additional shape and surperficial topology to adopt, and they are all regarded as equivalence and drop on inside the category of the invention of advocating herein.
With reference to figure 3, second exemplary substrates 100A comprises two extra assemblies or Eigen Structure further, any one among them can be integrated into a part of the second exemplary substrates 100A, or the top (such as substrate 100) of another material can be deposited over, in order to form the second exemplary substrates 100A.As shown in the figure, this second exemplary substrates 100A comprises reflector, refractor or face mirror 250 further, such as optics grid, Bragg reflector or face mirror, it (may be such as essentially transparent plastic paint (for example by coating 260, polyester, closely draw film ... etc.) or there is any suitable refractive index) cover, be essence level and smooth (for example, especially when this reflector, refractor or face mirror 250 can be embodied as a refraction type grid) in order to do making the inside of described recess, passage or groove 105.This reflector, refractor or face mirror 250 can be used to incident light back reflection to described recess, passage or groove 105 (and any diode 155 be incorporated in hereafter discussed photovoltaic application) or (first) surface reflexing to the device (200,300,400,500,600 and/or 700) with described recess, passage or groove 105.
With reference to figure 4,3rd exemplary substrates 100B comprises reflection paint 270 (such as scribbling polyester or the plastics of aluminium or silver) further, for example, it can be integrated into a part of the 3rd exemplary substrates 100B, or the top (such as substrate 100) of another material can be deposited over, in order to form the 3rd exemplary substrates 100B.This reflection paint 270 can be used to incident light back reflection equally to described recess, passage or groove 105 (and any diode 155 be incorporated in hereafter discussed photovoltaic application) or the surface reflexing to the device (200,300,400,500,600 and/or 700) with described recess, passage or groove 105.This recess, passage or groove 105 or this reflection paint 270 can depend upon selected application usually through selecting, and have the light of the wavelength of the selected energy gap being applicable to hereafter discussed multiple diodes 155 in order to reflection or refraction.
With reference to figure 5,4th exemplary substrates 100C may comprise any one in coating discussed above and/or reflector (250,260,270) and comprise any one in two additional assemblies or Eigen Structure, multiple conductive through holes 280 and a conducting back plane 290 further, any one among them all can be integrated into a part of the 4th exemplary substrates 100C, or can be deposited or be applied to top or the inside (such as the substrate 100) of another material, in order to form the 4th exemplary substrates 100C.For example, multiple exemplary conductive perforation 280 can be formed by utilizing between the depositional stage of described more than first conductor 110 discussed below an electrically conductive ink or polymer to a corresponding space of filling in the 4th exemplary substrates 100C.In addition, for example, described conductive through holes 280 may be integrally formed with the 4th exemplary substrates 100C, such as, by being embedded in inside sheet plastic in order to form the metal of the 4th exemplary substrates 100C, carbon or other conduction connects pin or electric wire formed.Hereafter can explain and another change case that conductive through holes is discussed (after disperseing (random or rule), it is the spherical conductive through holes 285 of essence) with reference to Figure 10 and 33.In addition, for example, the first conductor 110 of each correspondence may have one or more conductive through holes 280,285.With another example, conducting back plane 290 may be integrally formed or be deposited over the top of substrate (100) with this substrate 100C, such as, by the second (back side) side or the surface utilizing electrically conductive ink or polymer (such as exemplary conductive ink hereinafter described or polymer) to be coated with or to print this substrate 100.As shown in the figure, any one or both in multiple conductive through holes 280 (and/or conductive through holes 285) and/or a conducting back plane 290 all can be made up of any conductive materials of any kind or type, such as, metal, electrically conductive ink or polymer, other electric conducting material various (such as carbon or carbon nanotube), for example, but be not limited to comprise any material that may comprise the first conductor described below, the second conductor and/or the 3rd conductor (being respectively 110,140,145).Described conductive through holes 280 (and/or conductive through holes 285) can be used to coupling, connects and to conduct to and/or from one or more first conductor 110 (discussion as hereafter) described.The electrical couplings that this conducting back plane 290 can be provided convenience between described conductive through holes 280,285 and other system (350,375) assembly or connection, and for example, electrode can also be served as, in order to apply voltage or electric current to device 200,300,400,500,600,700, or in order to receive the voltage or electric current that are produced by device 200,300,400,500,600,700.In other one exemplary embodiment, may provide the electric wire of separation, wire or other connecting line to each, some or all described perforation 280 are to replace conducting back plane 290, or additionally provide except conducting back plane 290 electric wire of separation, wire or other connecting line to each, some or all described perforation 280, such as dissimilar addressability, as hereafter discussed in more detail.(in other one exemplary embodiment not utilizing perforation 280 (285) and/or conducting back plane 290 to implement, it can be the contact that described multiple first conductor 110 produces other type, such as, from side or the edge of device 200,300,400,500,600,700, as discussion hereafter.) conductive through holes 280 and/or conducting back plane 290 also may be comprised in inside any other substrate 100 described, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, and these changes all are all regarded as equivalence and drop on inside the category of the invention of advocating herein.
Hereafter with reference to figure 8, the 5th exemplary substrates 100D will be discussed, and it is in conjunction with the various features of the second exemplary substrates 100A and the 4th exemplary substrates 100C.The 6th extra substrate 100G, the 7th substrate 100E and the 8th substrate 100F hereafter also can be discussed, they have multi-form recess, passage or groove 105, such as, have the semi-circular channel 105 of internal projection (or support portion) 245, the path 10 5A of off-axis parabola (parabola) shape and the hemispherical recess 105B of essence, first side of the 9th exemplary substrates 100H or surface have the level and smooth surperficial topology of an essence and do not have recess, passage or groove 105.
Described various recess, passage or groove 105 may have the interval of any type or kind between which.For example, in one exemplary embodiment, multipair recess, passage or groove 105 each other can be comparatively tight, can provide corresponding interval between these every a pair recess, passage or grooves 105 compared with large-spacing for one or more first conductor 110 be deposited over inside described recess, passage or groove 105.
According to the invention of advocating herein, one or more first conductor 110 then can coated or to be deposited on inside multiple recesses of described correspondence, passage or groove 105 (the first side of substrate 100 or surface on) or the first surface of this substrate 100 or side all or part of above, such as, via printing process.Shown in Fig. 6 is have multiple exemplary substrates 100 of the first conductor 110, the perspective view of 100A, 100B, 100C, 100D according to the device embodiment of teachings of the present invention.Shown in Fig. 7 is the cutaway view (running through 30-30 ' plane) with the exemplary substrates 100 of multiple first conductor 110 of device embodiment according to teachings of the present invention.Shown in Fig. 8 is the cutaway view (running through 30-30 ' plane) with the exemplary substrates 100D of multiple first conductor 110 of a device embodiment according to teachings of the present invention.Mentioned by above, exemplary substrates 100D comprises further: multiple recess, passage or groove 105 (they are illustrated as in fig. 8 and are partially filled by one or more the first conductor 110); One reflector, refractor or face mirror 250; One coating 260; One or more conductive through holes 280 (or 285); And a conducting back plane 290.
In the described exemplary device 200 of manufacture, 300, 400, 500, in one exemplary method of 600 and/or 700, electrically conductive ink, polymer or other conducting liquid or gel are (such as, silver (Ag) ink or polymer, or carbon nanotube ink or polymer) substrate 100 can be deposited over, 100A, 100B, 100C, 100D, 100E, 100F, 100G, on 100H (such as, via printing or other deposition manufacture process), and then can be cured or by partially cured (such as, via ultraviolet (uv) curing process), so that (and these electrically conductive inks or polymer also can be used to form other conductor any to form described one or more the first conductor 110, such as, conductive through holes 280, 285 or conducting back plane 290).In another one exemplary embodiment, one or more first conductor 110 described, described conductive through holes 280,285 and/or this conducting back plane 290 can by sputter, rotation die casting (or spin coating), vapour deposition or plated conductive compound or element (such as metals, for example, aluminium, copper, silver, gold, nickel) formed.Dissimilar conductor and/or conductive compound or material (for example, ink, polymer, metal element ... etc.) combination can also be used for producing one or more compound first conductor 110.Multilayer and/or polytype metal or other electric conducting material can combine to form described one or more first conductor 110, described conductive through holes 280,285 and/or this conducting back plane 290, for example, it comprises, but be not limited to, comprise the first conductor 110 of the golden plate be positioned at above nickel.In various one exemplary embodiment, multiple first conductor 110 can be deposited over corresponding recess, passage or groove 105; And in other embodiment, the first conductor 110 may be deposited as single conductive plate (Figure 34 to 40) or can be attached (for example, an aluminium matter thin plate being coupled to substrate 100H).In addition, in various embodiment, can be used to be formed the electrically conductive ink of described multiple first conductor 110 or polymer may can not be cured before deposition multiple substrate (or semiconductor) particle 120 or may only can be partially cured, and then can be fully cured when contacting described multiple substrate (or semiconductor) particle 120, such as, in order to produce nurse contact difficult to understand, as discussion hereafter with described multiple substrate (or semiconductor) particle 120.
Other electrically conductive ink or material can also be used for being formed described first conductor 110, conductive through holes 280,285, conducting back plane 290, second conductor 140, the 3rd conductor 145 and other conductor any of hereafter discussing, such as, copper, tin, aluminium, gold, noble metal, carbon, carbon nanotube (CarbonNanoTube, CNT) or other organic or inorganic conducting polymer, ink, gel or other liquid or semisolid material.In addition, any other can print the conductive materials that maybe can be coated with and can be used for equally forming described first conductor 110, conductive through holes 280, 285, conducting back plane 290, second conductor 140 and/or the 3rd conductor 145, exemplary conductive compound then comprises: the AG-500 that (1) ConductiveCompounds (being positioned at the Londonderry town in U.S. Xin Han not Shi Er state) sells, AG-800 and AG-510 silver conductive ink, they also can comprise extra uV curable dielectric coating UV-1006S (such as, a part for one first dielectric layer 125), (2) DuPont sell 7102 carbonaceous conductors (if words of chromatography 5000 silver medal), 7105 carbonaceous conductors, 5000 silver conductors (equally for bus 310,315 and any terminal of Figure 42), 7144 carbonaceous conductors (there is UV encapsulant), 7152 carbonaceous conductors (there are 7165 encapsulants) and 9145 silver conductors (equally for bus 310,315 and any terminal of Figure 42), (3) the 128A silver conductive ink, the 129A that sell of SunPoly, Inc. is silver with carbonaceous electrically conductive ink, 140A electrically conductive ink and 150A silver conductive ink, (4) the silver ink of PI-2000 series of height conductor sold of DowCorning, Inc., and the 725A that (5) Henckel/Emerson & Cumings sells.As discussion hereafter, those compounds also can be used to form other conductor, and it comprises described multiple second conductor 140 and other conducting wire any or connecting line.In addition, electrically conductive ink and compound also can obtain from other source miscellaneous.
In fact can the conducting polymer of printing opacity also can be used to be formed one or more first conductor 110 described, conductive through holes 280,285, conducting back plane 290 and described multiple second conductor 140 and/or the 3rd conductor 145.For example, except other printing opacity conductor any of hereafter discussing and their equivalent, can also use poly-ethylenedioxythiophene, such as, the brand name that the AGFACorp. being positioned at New Jersey Li Zhifei park sells is the poly-ethylenedioxythiophene of " Orgacon ".For example, can comprise by equivalent other conducting polymer used, but be not limited to polyaniline polymer and polypyrrole polymers.In another one exemplary embodiment, suspension or the carbon nanotube be dispersed among Polymerizable ionic liquid can be used to form printing opacity or transparent conductor of all kinds, such as one or more second conductor 140 in fact.
Texture of all kinds can be provided for one or more first conductor 110 described, such as, there is more coarse or more sharp-pointed surface, the nurse contact difficult to understand of the multiple substrate particles 120 hereafter discussed to help follow-up formation.Corona disposal (coronatreatment) can also be carried out to one or more the first conductor 110 before the described multiple substrate particle 120 of deposition, it may have the tendency removing any oxide formed, and contributes to the nurse contact difficult to understand of the described multiple substrate particle 120 of follow-up formation.
In an one exemplary embodiment, card-cut substrate 100 can be used, 100A, 100B, 100C, 100D, 100E, 100F, 100G, in order to do making this substrate 100, 100A, 100B, 100C, 100D, 100E, 100F, the spine that 100G has alternate series forms (being generally level and smooth) spike (bizet) and valley (recess, passage or groove 105), it has the parallel orientation of an essence (it is one of them example) usually, protrusion (or non-passage) or bizet 115 and recess is illustrated as respectively (for example in figure, passage) 105.Then, for example, electrically conductive ink, polymer or other conductor may be deposited to remain among card-cut valley, thus create multiple first conductor 110, described multiple first conductor 110 is not only substantial parallel, and physical segregation distance each other also can depend on the described spine's (spike, protrusion or bizet) 115 provided via embossment processing procedure.Exactly, when described electrically conductive ink or polymer are deposited to described card-cut valley (recess, passage or groove 105), more than first conductor 110 of described correspondence can be separated by the described card-cut spine of this substrate 100 (spike, protrusion or bizet) 115 each other equally, except being spaced, also can create physical segregation distance and an electric insulation effect (insulation effect via corresponding dielectric constant) simultaneously.For example, first electrically conductive ink or polymer can be coated with or be deposited into a card-cut substrate completely, and then utilize one " medical scraper " that described electrically conductive ink or polymer can be removed from all described spikes (bizet or protrusion 115), such as by allowing this blade blade coating cross over this substrate 100, 100A, 100B, 100C, 100D, 100E, 100F, there is in 100G the surface of an electrically conductive ink coating, thus in described recess, described electrically conductive ink or polymer is left inside passage or groove 105, to form more than first conductor 110 with the parallel orientation of essence.The quantity remaining in electrically conductive ink inside described recess, passage or groove 105 or polymer can depend upon the type of this medical scraper and additional pressure.Or, electrically conductive ink or polymer also may be deposited over (use can ignore or be zero pressure) on described card-cut spike (bizet or protrusion 115), such as by tip printing, thus leave described electrically conductive ink or polymer in order to form multiple conductors with the parallel orientation of essence, such as, for the formation of described multiple second conductor 140 or multiple 3rd conductor 145.This printing may be implemented as the manufacturing step of the separation hereafter discussed.
For example, electrically conductive ink by excessive coating or may be deposited on whole or most top in this substrate 100, first side of 100A, 100B, 100C, 100D, 100E, 100F, 100G or surface, then other blade coating type known in " medical scraper " or printing technology can be utilized to remove this excessive electrically conductive ink, then, uv solidification can be carried out to the electrically conductive ink inside described multiple recess, passage or groove 105.Utilize this medical scraper, electrically conductive ink inside described multiple recess, passage or groove 105 just can be retained in correct place, the redundance of electrically conductive ink (such as, cover the electrically conductive ink of the non-channel part (bizet or protrusion 115) of this substrate) then can be removed by this blade coating processing procedure, such as, because touch the relation of this medical scraper.Look closely the type of printing and determine, it comprises the flintiness of this medical scraper and additional pressure, and for example, this electrically conductive ink may be formed crescent inside each in described multiple recess, passage or groove 105 or may bend upwards.The personage haveing the knack of electronics or printing technology just can understand has countless variation patterns can form described multiple first conductor 110, and these changes all are all regarded as equivalence and drop on inside category of the present invention.For example, one or more first conductor 110 described can also be via, but be not limited to, and sputter or vapour deposition deposit.In addition, in other various embodiment, to be somebody's turn to do (s) the first conductor 110 and can be deposited as single or pantostrat, such as, via coating, printing, sputter or vapour deposition, such as explains with reference to Figure 34 to 40 institute below and discussion one exemplary embodiment in.
Therefore, " deposition " used herein mean that, represent and comprise at present known or following can develop any and all printings, coating, roller coating, spraying, layer painting, sputter, plating, rotation die casting (or spin coating), vapour deposition, stacking, attach and/or other deposition manufacture process, no matter with or without impact; And " printing " mean that, represent and comprise at present known or following can develop any and all printings, coating, roller coating, spraying, layer painting, spin coating, stacking and/or attach processing procedure, no matter with or without impact, for example, it comprises, but be not limited to, wire mark, ink jet printing, electric light printing, e-inks printing, photoresistance and other resist printing printing (resistprinting), hot stamping brush, radium-shine jet printing, magnetic printing, bat printing, flexographic printing, combined type lithographic plate lithography, Gravure intaglio printing and other gravure art.These processing procedures all are all regarded as deposition manufacture process in this article, equivalence can use, and drop on inside category of the present invention.It is equally important that described exemplary deposition or printing process do not need to use obvious production control or restriction.It does not need to use any clear and definite temperature or pressure.It does not need to use any dust free room beyond the standard of known printing or other deposition manufacture process or filtered air.But, for reaching consistency, such as, for correctly align (arrangement) forms the various deposit successive layers of various embodiment, may wish that stationary temperature (possible exception is as discussion hereafter) and humidity are compared in use.In addition, for example, various compounds used herein all can be contained in can hot curing or oven dry, air oven dry or can inside the various polymer of uv solidification, adhesive or other dispersant can be carried out under ambient conditions, and these changes all drop on inside category of the present invention.
Use there is the substrate 100 of multiple recess 105, the special benefits of 100A, 100B, 100C, 100D, 100E, 100F, 100G is that printing arrangement does not need very accurate, and one dimensional arrangement or arranged opposite just may be enough to different materials and the layer that continuously coating forms this device 200,300,400,500,600 and/or 700.
Look closely in this selected embodiment and determine, the degree of depth of described multiple recess, passage or groove 105 can from deep (for example, the half of the diameter of substrate (semiconductor) particle 120 is even larger) be changed to more shallow (for example, being less than the half of the diameter of substrate (semiconductor) particle 120).In addition, as previously noted, the surperficial topology of substrate (100H) may be substantial planar, level and smooth or evenly, wherein can't integrally formed multiple recess, passage or groove 105, such as, one or more first conductor 110 described is applied as plain conductor plate or conductive layer and can not spaced or electric insulation.In other one exemplary embodiment, substrate may have substantial planar, smoothly or uniformly surface, wherein can't integrally formed multiple recess, passage or groove 105, and the substitute is, can construction or deposit multiple spine (bizet or protrusion 115) or the isolating construction of other form on this substrate, then they can form recess, passage or groove 105, or without any spine (bizet or protrusion 115).
Should also be noted that, usually for any coating of various compound herein, such as, via printing or other deposition, surface characteristic or surface energy also may be controlled, such as, via using photoresistance coating or " wettability " by this surface of correction, for example, such as, by revising surperficial hydrophilic profile, detesting water feature or electric (positive charge or negative electrical charge) feature: the surface of substrate 100 (it comprises 100A, 100B, 100C, 100D, 100E, 100F, 100G and/or 100H); The surface of each first conductor, the second conductor and/or the 3rd conductor (being respectively 110,140,145); And/or the surface of hereafter discussed described multiple substrate particles 120.The feature (such as, surface tension) of the compound that cooperation will be deposited, suspension, polymer or ink, described in the compound that is deposited can be adhered to the position of wishing or selecting, and effectively evicted from other area or region.
Shown in Fig. 9 is the cutaway view with the 6th exemplary substrates 100G of multiple first conductor 110 of device embodiment according to teachings of the present invention.Shown in Figure 10 is the cutaway view (running through 31-31 ' plane) with the 6th exemplary substrates 100G of multiple first conductor 110 of device embodiment according to teachings of the present invention.6th exemplary substrates 100G is different from other exemplary substrates 100 to 100F because the 6th exemplary substrates 100G also comprise multiple integrally formed protuberance or support portion (equivalent saying is extension, protuberance, jut ... etc.) 245 and multiple integrally formed conductive through holes 285 (it is the change case of perforation 280).As shown in the figure, protuberance described in each (or support portion) 245 for continuously and can as same solid, protuberance track to the whole length of downward-extension path 10 5; In other embodiment of not separately display in figure, described protuberance (or support portion) 245 may for be separated and discontinuous, such as, but be not limited to have by separating and the protuberance (or support portion) 245 of the shape formed along multiple indivedual feeler or the spike at length multiple spacing places (rule or irregular) down of path 10 5.Described protuberance (or support portion) 245 may have any suitable form, and it comprises level and smooth and continuous or sharp-pointed and discontinuous, and these changes all are all regarded as equivalence and drop on inside the category of the invention of advocating herein.In one exemplary embodiment, described protuberance (or support portion) 245 through moulding, to allow them be integrally formed as a part of this substrate 100G, such as, but can be not limited to by die casting or other casting method equally.
In addition, as shown in the figure, described multiple first conductor 110 has been deposited as conformal and can have follow the shape of described path 10 5, there is the uniform thickness of essence (namely, the uniform coating of essence, it can follow in fact the profile of first side (surface) of this substrate 100G).In one exemplary embodiment, conductor (such as metal) first may be deposited over the top of the whole first surface (side) of (the temperature place in lower) this substrate 100G by sputter, rotation die casting (or spin coating), coating or vapour deposition; Then, can by any conductor removed in fact in described spine (spike, protrusion or bizet) 115 (such as, by milling or husky described spine (spike, protrusion or bizet) 115 of grinding this substrate 100G), leave described multiple first conductors 110 remained in inside described path 10 5.In another one exemplary embodiment, photoresistance coating can be deposited to described spine (spike, protrusion or bizet) 115, and conductor (such as metal) first may be deposited over the top of the whole first surface of this substrate 100G by sputter, rotation die casting (or spin coating) or vapour deposition; Then, can by any conductor removed in fact in described spine (spike, protrusion or bizet) 115, such as, by this photoresistance of dissolving or by the conductor peeled off above described spine (spike, protrusion or bizet) 115 on this photoresistance, and thus dissolve any residual photoresistance.In the latter's method, this conductor may be directed deposition, the conductor be deposited in order to do making this is discontinuous in the edge of described spine (spike, protrusion or bizet) 115, thus can not affect the residual conductor be deposited over inside described path 10 5 when the conductor in described spine (spike, protrusion or bizet) 115 is removed.When this selected conductor is aluminium, except providing conductivity, described first conductor 110 also has obvious reflectivity and can serve as a reflective coating or mirror coating.
Below with reference to Figure 11,12 and 33 more discuss in detail, described protuberance (or support portion) 245 lifts the multiple substrate particles 120 on the bottom of (or support) this path 10 5 or remainder.When described multiple substrate particle 120 is suspended in carrier (for example, liquid or gel) among in order to be deposited on inside described path 10 5 time, when lifting by described protuberance 245 can multiple substrate particle 120 described in solid support and/or be separated described multiple substrate particle 120 and this suspending carrier (it is at least one start to remain on described path 10 5 bottom and/or may Bei Xiao Mao or remove (such as via evaporating)).Then, described first conductor 110 (being positioned on described protuberance 245) just can with described by support and the substrate particle 120 that is lifted form nurse contact difficult to understand, and can not be subject to the interference (or having less interference) from any suspending carrier that may remain (or polymer or resin).
As shown in the figure, described multiple integrally formed conductive through holes 285 may comprise as discussed earlier and not be limited to conductor or the conductive media of any type, and may have any suitable shape or form.In one exemplary embodiment, described conductive through holes 285 can form the spherical metal ball body of essence or other conductive bead body or ball body, and can be merged among this substrate 100G when being formed, such as, during casting processing procedure.Described multiple conductive through holes 285 then may in a random way (as shown in the figure) or in a periodic manner or in the mode of rule, be dispersed in inside this substrate 100G.When this substrate 100G is formed, at least multiple integrally formed conductive through holes 285 meeting material contact first conductor 110 and this conducting back plane 290 simultaneously described in some, thus electrical couplings effect is provided between described first conductor 110 and this conducting back plane 290.Concerning this one exemplary embodiment, the conductive through holes 285 of sufficient amount can be provided during making, in order to do making when being dispersed in a random way inside this substrate 100G, each first conductor 110 all can contact at least one conductive through holes 285, and described at least one conductive through holes 285 can contact this conducting back plane 290.In other one exemplary embodiment, described conductive through holes 285 meeting (in nonrandom mode) is dispersed in the position of multiple acquiescence, it can make each first conductor 110 all can contact at least one conductive through holes 285 equally, and described at least one conductive through holes 285 can contact this conducting back plane 290.
Shown in Figure 11 is have multiple first conductor 110 and the exemplary substrates 100 of multiple substrate particle 120, the perspective view of 100A, 100B, 100C, 100D according to the device embodiment of teachings of the present invention.Shown in Figure 12 is the cutaway view (running through 40-40 ' plane) with the 5th exemplary substrates 100D of multiple first conductor 110 and multiple substrate particle 120 of a device embodiment according to teachings of the present invention.After deposition one or more first conductor 110 described, material (such as electrically conductive ink or polymer) may be cured or by partially cured and form solid or semisolid.In other embodiment, one or more first conductor 110 described may keep liquid or partially cured form and in being cured after a while.After deposition one or more first conductor 110 described, no matter be any solidification, partially cured or uncured, above one or more first conductor 110 described in the suspension be made up of multiple substrate particle 120 can be deposited in described recess, passage or groove 105, and (major part) can form nurse contact 265 difficult to understand with the first corresponding conductor 110.
In many one exemplary embodiment, described multiple substrate particle 120 is made up of semiconductor substrate, such as, and the siliceous or GaN substrate of p+, and thus can be called as multiple substrate particle 120.In other one exemplary embodiment, described multiple substrate particle 120 may comprise other organic material, inorganic material or polymeric material, such as, be applicable to the compound for creating organic or polymer LED or mixture, as discussion hereafter, and thus can be called as multiple light-emitting substrate particle 120 or photovoltaic substrate particle 120 equally.As the substrate of the suitable type of all kinds as substrate particle 120 hereafter can be discussed in more detail.Accordingly, any mention multiple substrate particle 120 herein, or multiple substrate (semiconductor) particle 120 is mentioned in equivalence, all should be understood to mean that and comprise be suitable for the known or following any kind that can develop at present luminescence application, photovoltaic application or any organic or inorganic substrate with the special shape of certain kind of other electronic application, these substrates any and all are all regarded as equivalence and drop on inside the category of the invention of advocating herein.
For example, the suspension that should be made up of multiple substrate particle 120 may be deposited via printing or coating process, such as, print by inside described multiple recesses 105 with described multiple first conductor 110, or print by the top of the first conductor 110 being deposited as one deck (Figure 34 to 40) or thin plate.As shown in Figure 37 to 40, before the described substrate particle 120 of deposition, conductive adhesive 110A is first deposited, as the another kind mechanism for cohering the nurse contact difficult to understand created between described substrate particle 120 and one or more first conductor 110 described.In addition, for example, the suspension that be made up of multiple substrate particle 120 should may be coated on the top of this substrate 100,100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H and multiple first conductor 110, as previously described, any unnecessary suspension can utilize medical scraper or other blade coating processing procedure removes.
For example, but not any restriction, described multiple substrate particle 120 may utilize any vapo(u)rability or volatile organic or inorganic compound (such as, water, alcohol, ether ... etc., it may also comprise tackness composition (such as, resin), and/or surfactant or other flowing adjuvant) be suspended among liquid, semiliquid or gel carrier.In one exemplary embodiment, for example, but not any limited significance, described multiple substrate particle 120 can be suspended in the deionized water as carrier, have can be water-soluble thickener (such as, methylcellulose, guar gum (guargum) or smoked silicon (fumedsilica, such as, Cabosil)), also may can use surfactant or flowing adjuvant (such as, octanol, methyl alcohol, isopropyl alcohol or deionized octanol or isopropyl alcohol), and also may can use adhesive, such as, containing essence very little or smaller (for example, 1 micron) the anisotropic conductive adhesive of nickel matter pearl body, (its can compression with solidification after conductivity (discussion as hereafter) is provided and, for example, can in order to improve or to strengthen the creation result of nurse contact 265 difficult to understand), or any other can solidify by uv, thermal curable or can the adhesive of air curing or polymer, it comprises hereafter adhesive discussed in detail or polymer, and (it also can coordinate dielectric compound, lens ... wait to use).Described volatility or vapo(u)rability become branch to be consumed, such as, via heating processing, uv curing process or any oven dry processing procedure, for example, to leave described substrate particle 120, it can contact in fact or at least partly and be adhered to one or more first conductor 110 described.This suspension material also may comprise reflectivity, diffusivity or scattering particle, for example, to contribute to printing opacity in luminescence application in the direction perpendicular to substrate 100,100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H.
Also may can apply to extra step or described multiple substrate particle 120 is deposited on above described multiple first conductor 110 and inside described recess, passage or groove 105 by several step process.In addition, for example, but not any restriction, adhesive (such as, methoxylation acrylic acid ether monomer (it also may comprise light initiator that can be water-soluble, such as, TPO (triphospheneoxide))) or anisotropic conduction adhesive can first be deposited, then, the described multiple substrate particles 120 be suspended in any carrier discussed above are deposited.
For example, when described multiple substrate particle 120 is deposited, described multiple first conductor 110 is only partly cured or is not cured, described multiple substrate particle 120 may become slight or be partially embedded in inside described multiple first conductor 110, contribute to forming nurse contact 265 difficult to understand, as shown in as graphic in each.Via applying pressure (discussion below with reference to Figure 13), heat treatment, uv solidification ... waiting may also can embedding or contact creation effect outside amount.
In one exemplary embodiment, the suspension medium of described multiple substrate particle 120 also comprises lytic agent or other reactant, and it has just started dissolve or soak one or more first conductor 110 described in some again.When the suspension of described multiple substrate particle 120 is deposited and the surface of one or more the first conductor 110 described is then partly solubilized or is not cured, described multiple substrate particle 120 just may become slight or be partially embedded in inside described multiple first conductor 110, it contributes to forming nurse contact 265 difficult to understand equally, and creates " chemical bonded refractory " or " chemical Coupling " between described multiple substrate particle 120 and one or more first conductor 110 described.When this lytic agent or reactant consume, such as, via evaporation, described multiple first conductor 110 can reharden (or solidifying) again, multiple substrate particle 120 described in substantial exposure.For example, but not any restriction, exemplary lytic agent or reactant are 1-Methoxy-2-propyl acetate (propyleneglycolmonomethyletheracetate) (C
6h
12o
3) (sold by Eastman, its brand name is " PMAcetate "), during use and the mole ratio of isopropyl alcohol (isopropylalcohol or isopropanol) be about 1: 8 (or, weight ratio is about 22: 78), to form the suspension medium of described multiple substrate particle 120.In addition, for example, but not any restriction, other exemplary lytic agent or reactant comprise dibasic ester miscellaneous and their mixture, such as, dimethyl succinate, dimethyl adipate and dimethyl glutarate (these can be obtain the various mixtures of DBE, DBE-2, DBE-3, DBE-4, DBE-5, DBE-6, DBE-9 and DBE-IB from the name of product from Invista).The mole ratio of the DBE-9 used in one exemplary embodiment and isopropyl alcohol is about 1: 10.
Described multiple substrate particle 120 may be made up of the semiconductor element of any type, material or compound, such as, silicon, GaAs (GaAs), gallium nitride (GaN) or any inorganic or organic semiconductive materials, and there is any form, for example, but not any restriction, it comprises: GaP, InAlGaP, InAlGaP, AlInGaAs, InGaNAs, AlInGaSb.For example, for forming semiconductor substrate particle 120, silicon may be used as monocrystalline silicon, polysilicon, amorphous silicon ... etc., and do not need building crystal to grow semiconductor integrated circuit and known diode, and GaAs, gallium nitride and other semiconductive compound also have identical crystalline texture miscellaneous and non-crystalline forms.Described multiple substrate particle 120 may be also be made up of the organic or inorganic compound of any type for luminous or energy absorption (photovoltaic spy learn) or polymer, such as, for light-emitting diode (LightEmittingDiode, OLED), phosphorescent OLED (PhosphorescentOLED, PHOLED), polymer LED (PolymerLightEmittingDiode, PLED), the various polymer of light emitting polymer (LightEmittingPolymer, LEP) and compound, for example, it comprises, but is not limited to: polyacetylene compound, polypyrrole compound, polyaniline compound, gather and stretch vinyl to stretching phenyl, polyfluorene (polyfluorene), conjugation dendrimer (conjugateddendrimer), organic metal chelate complex (for example, Alq3), and their corresponding derivatives any and all, replace side chain ... etc., it also may have the form be encapsulated, and such as, is encapsulated in micella body or other container.Mentioned by above, " substrate particle " may comprise any inorganic or organic semiconductive materials, energy emissive material, energy absorbing material, luminescent material, photovoltaic material or other electronic material, and these elements any and all, compound, mixture and/or suspension all drop on inside the category of the invention of advocating herein.
In Figure 11 to 24 and 32 to 40, it is spherical that described substrate particle 120 is illustrated as essence.In addition, although described substrate particle in one or more one exemplary embodiment 120 (and diode 155 and lens 150) for or " spherical " can be called as; But, will be appreciated that, " spherical " used herein mean that and comprise " essence is spherical ", namely, it drops on to preset or essence in other selected variation, tolerance or the scope of other specification is spherical or be mainly spherical, because have virtually no real-world object, to have the perfection of theory or textbook meaning spherical.For example, but not any restriction, described various spherical particle (the substrate particle used in described one exemplary embodiment, diode, lens) be usually short of some uniformity at least below: the uniformity in (1) each this kind of spheroid is (namely, some variation is had in its radius from the center to surperficial difference, and the slight non-spherical had to a certain degree), (2) spheroid is to the uniformity of spheroid, it has the variation of sphere size, (3) uniformity in each grain shape and size, its part or numerous meeting are that spherical (other is then for obvious non-spherical and/or deformity for essence, for example, look closely the tolerance of supplier and determine), and the uniformity of (4) surface characteristic, multiple substrate particle 120 has the surface of essence smoothly or through grinding, other substrate particle 120 then has larger surface variations or roughness.The spherical particle that described substrate particle 120 can be able to be known in known or this technology in shape cost technology, pearl body, or ball body, such as, in the United States Patent (USP) case the 6th that the people such as Hamakawa won on March 16th, 2004, 706, disclose for silicon (semiconductor) particle in No. 959, the title of this case is " photovoltaic devices and a large amount of process unitss (PhotovoltaicApparatusandMassProducingApparatusforMassPro ducingSphericalSemiconductingParticles) for producing spheric semiconductor particle in a large number ", by reference its complete content is incorporated to herein, the identical right completely of tool and effect.Other non-spherical or irregular substrate particle can be formed the spherical substrate particle of essence via any various types of Ginding process, such as, and ball-milling method (ballmill), but not any restriction.
In various one exemplary embodiment, described multiple substrate particle 120 then can be converted into corresponding diode 155, as hereafter discussed in more detail in place in situ.Accordingly, the size of described multiple substrate particle 120 can through design, to provide one or more selected size of described final multiple diode 155, such as, drop on the final diode 155 among about 10 to 40 microns of (μm) scopes, for example, this is much smaller than prior art light-emitting diode or photovoltaic diode (differing several order of magnitude).In another one exemplary embodiment, similarly, for example, but not any restriction, described diode 155 drops among about 25 to 40 microns of (μm) scopes.These small-sized substrates and diode size is likely used herein due to the relation of novel manufacture method, it comprises the suspension using described multiple substrate particle 120 to form and the deposition technique using printing and so on, it allows to carry out the described substrate particle of overall disposal in the mode of group, and does not need to put individually each particle 120.In addition, same as hereafter discussed in more detail, the super-small of described final diode 155 is advantageous particularly, it can provide more junction (pn) quantity in each baseplate material quantity, thus reaches higher light output efficiency (in LED application) or higher photovoltaic energy conversion efficiency (in photovoltaic application).
In various one exemplary embodiment, described multiple substrate particle 120 can through selecting or be designed to have the shape contributing to or can create optical resonance at one or more selected frequency place, such as, essence is spherical, essence toroid (or annular) shape, column or bar-shaped ... etc., and herein by those shapes respectively and be referred to as substantial optical " resonance " diode 155 and/or semiconductor or substrate particle 120.In addition, multiple substrate particle 120 also through selection or may can be designed to have the shape that can help to carry out Mode Coupling with described multiple lens 150, as hereafter discussed in more detail.
In other one exemplary embodiment, described multiple substrate particle 120 may have other shape or form, for example, but be not limited to: multiaspect shape, oblong (ellipse), essence rectangle, essence plane or essence is irregular or non-spherical, as shown in Figure 26 to 31.For example, multiaspect shape substrate particle 120 may be used for luminescence.Again, for example, the substrate particle 120 of essence rectangle or essence plane can also be used in selected one exemplary embodiment, such as, the shape of prior art, known diode and size.In addition, described multiple substrate particle 120 also may have size miscellaneous and shape, uses size miscellaneous, such as, to provide transmitting in multiple optical wavelength or other electromagnetic wave (EM) wavelength place, to absorb or optical resonance.For example, but not any restriction, in an one exemplary embodiment, described substrate particle 120 is essence spherical (dropping on inside default tolerance) and drops among the scope of about 10 to 40 microns, and, may drop among about 25 to 40 or the scope of 25 to 30 microns.In an one exemplary embodiment, can use and be doped GaAs or GaN that (for example, utilizing boron or other element) is p or p+ (equivalent saying is P or P+) semiconductor and help form corresponding nurse contact difficult to understand with one or more first conductor 110 described.In other one exemplary embodiment, n or n+ (equivalent saying is N or N+) alloy position can also be used accurate.
Interestedly especially be, it should be noted, except described multiple substrate particle 120 is suspended in except in carrier (or suspension medium), before above one or more first conductor 110 described in they being deposited in described multiple recess, passage or groove 105, they and without any need for process.For example, described multiple substrate particle 120 does not need to carry out any micro Process to change their shape or to expose interior section, and these are obviously different with prior art.
In addition, creating this time point place of process of device (200,300,400,500,600 and/or 700), described multiple substrate particle 120 to be essentially etc. to and also they are deposited on above (among described multiple recess, passage or groove 105) one or more first conductor 110 described during or before not and do not need to carry out any orientation operation.Exactly, same obviously different with prior art, when described multiple substrate particle 120, place can at this substrate (for example after being converted into diode in situ, semiconductor) produce orientation or difference in material, so that then in the manufacture of device (200,300,400,500,600 and/or 700) be fixed on pn (or equivalence) junction forming a correspondence in substrate (for example, the semiconductor) particle 120 of tram during creating.
Another selection practice is, under may creating the prerequisite of enough nurse contacts difficult to understand between described multiple substrate particle 120 and one or more first conductor 110 described, carrier or the suspension material of described multiple substrate particle 120 also may comprise insulation (or dielectric) adhesive or other polymer, it may be made up of any curable compound, this curable compound has rational high-k, and be enough to provides electric insulation between described multiple first conductor 110 and hereafter discussed described multiple second conductors 140.As hereafter discussed in more detail, dielectric compound of all kinds can be used, and these dielectric compounds any and all drop on inside category of the present invention, and for example, may be included in can air curing, thermal curable or can inside the adhesive of uv solidification or other polymer, to form a part or all for this suspension liquid, semiliquid or gel carrier.
The personage haveing the knack of this technology also can understand, and can also use the removable compound that maybe can etch miscellaneous.For example, once described multiple substrate particle 120 is embedded in inside described multiple first conductor 110 or and described multiple first conductor 110 fully after electrical contact, then just can be cured, all or part of of this suspension material or adhesive may be removed, such as, via acid etching or ion(ic) etching processing procedure.This etching or manufacturing process for cleaning may also contribute to providing extra electric terminal with described multiple semiconductor spherical particle 120, such as, and one or more second conductor 140 described continue formed multiple electric terminal.
In another change case, described substrate particle 120 can be suspended among carrier (such as, organic or inorganic solvent).Then, this carrier just can be evaporated, such as, evaporation is helped via applying heat, air or other method, and described multiple substrate particle 120 can be bonded to one or more first conductor 110 described, such as, via using lytic agent or reactant (discussion as above), pressure, radium-shine, uv or thermal annealing or alloying or applying the energy of certain form in addition.Accordingly, the electrical couplings between described multiple substrate particle 120 and one or more first conductor 110 described can any multiple several means occur, and these modes any and all drop on inside the category of the invention of advocating herein.For example, but not any restriction, this coupling can be undertaken by adjacent, pressure, radium-shine, uv or thermal annealing or alloying, by described multiple substrate particle 120 being partially embedded in inside one or more first conductor 110 (such as, when the electrically conductive ink or polymer that form one or more the first conductor 110 described be not cured before depositing described multiple substrate particle 120 or only by partially cured time, or when having used reaction suspending agent dissolved or soaked again during this substrate particle deposition processing procedure); Or by the anisotropic conducting polymer of use, for example, but not any restriction, they can produce and be electrically connected after compression with solidification.In one exemplary embodiment; one or more first conductor 110 based on aluminium can be utilized via thermal annealing to described substrate particle 120 of annealing; the temperature of this thermal annealing between 350 to 450 degree about Celsius or be enough to be formed wish or it (multiple) nurse difficult to understand contact of selected degree but can not cause any lower temperature of negative effect to the other parts of this assembly, look closely the composition of this substrate 100 and determine.
Shown in Figure 13 is the transverse views of the 5th exemplary substrates 100D, and described multiple substrate particle 120 can by pinch rolloer 195 in the optional step in the exemplary method for the formation of the device embodiment according to teachings of the present invention.In this one exemplary embodiment, described multiple first conductor 110 may keep liquid, colloid or partially cured form.After the described multiple substrate particle 120 of deposition, described multiple substrate particle 120 just can be compressed among uncured or partially cured multiple first conductors 110, such as, by the mobile substrate 100 with described multiple first conductor 110 and described multiple substrate particle 120, 100A, 100B, 100C, 100D, 100E, 100F, 100G and/or 100H is by these pinch rolloers 195, or by described multiple substrate particle 120 can be applied pressure to or described multiple substrate particle 120 can be arranged among described multiple first conductor 110 or allow them against other component any of described multiple first conductor 110, to help to form nurse contact (265) difficult to understand between substrate particle 120 and the first conductor 110.
Shown in Figure 14 is the cutaway view (running through 40-40 ' plane) with the 5th exemplary substrates 100D of multiple first conductor 110 and multiple substrate particle 120 (wherein can form junction 275 and thus can form diode 155) of a device embodiment according to teachings of the present invention.For example, but not any restriction, concerning semiconductor substrate particle 120, this junction 275 is pn (or PN) junction 275 normally; And concerning organic or polymeric substrates particle 120, this junction 275 can be regarded as the junction between the organic layer being used for creating OLED or PLED or polymeric layer.For example, formation is had to multiple substrate particles 120 of the semiconductor of first most carrier (for example, p+ or n+), can create and there is second most carrier (for example, corresponding n+ or p+) layer or region 255, in order to form junction 275.In a part for printing process, for the semiconductor-based board type of p or p+, can deposit in a carrier or adhesive at first or upper section of described multiple substrate particle 120 and there is liquid, semiliquid, colloid or form of film are (such as, ink or polymer) N-shaped alloy (such as, phosphorus or phosphorus and silicon), and heat, or accept radium-shine energy, or carry out the solidification of another kind of form, annealing or alloying, this upper section of described multiple substrate particle 120 or this upper section bond with described multiple substrate particle 120 can be diffused to fully in order to do making this N-shaped alloy or N-shaped material, thus form penetrated bed or region 255, in this example, this penetrated bed or region 255 are N-shaped penetrated bed or region 255, it can define corresponding junction 275 (in this example with p-type semiconductor substrate particle 120, it is pn junction 275).In one exemplary embodiment, this (N-shaped) penetrated bed or region 255 (and pn junction 275 of correspondence) are for essence is bending or shelly, such as, when described multiple substrate particle 120 be essence spherical time it is hemisphere shelly, this n-layer 255 (and pn junction 275 of correspondence) can extend in the below of outside coating 260 usually slightly, and it is obviously different with typical prior art diode, typical prior art diode has essence plane and smooth pn junction or have essence plane and smooth pn junction inside the well portion of semiconductor substrate.On the contrary, p-type penetrated bed or region 255 may be formed on inside N-shaped substrate particle 120, and can be regarded as equivalence and drop on equally inside category of the present invention.In addition, in one exemplary embodiment, N-shaped alloy (such as, phosphorus) can be suspended among more volatile carrier or adhesive, and when applying radium-shine energy, this carrier or adhesive just can consume.Described multiple substrate particle 120 this first or tip portion on can use fast laser pulse or heating (such as, tungsten matter heater or bar counter lamp or uv lamp is utilized to heat cycle a period of time at 800 to 1200 degree places Celsius, this period of time cycle may be that a few tenths of second is until 15 to 30 minutes), in order to do making any heat all can promptly dissipate, and can not have a negative impact to the other parts of this assembly.In one exemplary embodiment, also may using photoresistance, exposedly can not can not be adhered to those regions to this dopant material be deposited or this dopant material be deposited in order to do making the remainder of this device.In addition, various surface characteristics (such as, wetability) can also be adjusted, as discussion above.
In another one exemplary embodiment, various " spin coating (spin-on) " material may be deposited via rotation, sprinkling or printing, in order to provide this N-shaped doping effect.Concerning this embodiment, for example, but not any restriction, phosphorus plasma membrane, arsenic plasma membrane or the glass-film mixing antimony can be deposited over described multiple substrate particle 120 (such as, silicon grain) surface on, and can be heated, to form extra layer (and forming pn junction with described substrate particle 120 interface connect that is situated between) (as shown in Figure 15) above described substrate particle 120, or from then on film place is caused to diffuse to effect among described multiple semiconductor (silicon) particle 120.For example, but not any restriction, exemplary N-shaped alloy or spin-on material comprise the alloy can buied to the Emulsitone company being positioned at New Jersey Hui Pani city, such as, for EmulsitoneEmitterDiffusionSourceN-250, Arsenosilicafilm and Antimonysilicafilm of heeling-in layer, for the Phosphorosilicafilm5x10 of solar cell born of the same parents
20and Phosphorofilm.Those exemplary alloys or spin-on material can be deposited, and depend upon application pattern and alloy and determine, such as, in EmulsitoneEmitterDiffusionSourceN-250, first may can be heated to 150 to 200 degree Celsius at the beginning, keep 15 minutes, in order to this film that hardens, then, can 800 to 1200 degree places Celsius or can be formed have wish or selected feature (such as, desired penetration depth) junction 275 and/or layer or region 255 but can not manufacture time point place other parts to this assembly at this of this assembly and cause any lower temperature place of negative effect (such as, temperature lower than 200 to 300 degree Celsius) heat 15 to 30 minutes.
Shown in Figure 15 is have multiple first conductor 110 and multiple substrate particle 120 (after deposition one deck or region 255A according to the device embodiment of teachings of the present invention, it can form junction 275 equally, and thus form diode 155) the cutaway view of the 5th exemplary substrates 100D, this figure also diagram equally according to teachings of the present invention in order to locate another change case manufacturing diode 155 in situ.Concerning this one exemplary embodiment, diode 155 comprises the layer or region 255A that are coupled to substrate particle 120, in order to form junction 275.(Figure 15 also can be considered to be the change case of cutaway view (running through 40-40 ' plane) after one or more insulator 135 of deposition and one deck or region 255A of Figure 12, and it is separately diagram in the perspective not; Figure 15 also can be considered to be the change case of cutaway view (running through 50-50 ' plane) after deposition one deck or region 255A of Figure 16, and it is separately diagram in the perspective not)
Below with reference to more discussing in detail of Figure 16 and 17, one or more insulator (or insulating barrier) 135 may be deposited, in order to provide electrical isolation between one or more second conductor 140 and one or more the first conductor 110.Concerning this one exemplary embodiment, after the described multiple substrate particle 120 of deposition, just may deposit one or more insulator (or insulating barrier) 135 may be deposited, and then then can deposit one deck or region 255A.In other one exemplary embodiment, may just deposit described one or more insulator (or insulating barrier) 135 after situ creates diode 155, as discussion hereafter.
In addition, for example, there is first most carrier (for example for formation, p+ or n+) multiple substrate particles 120 of semiconductor, can create and there is second most carrier (for example, corresponding n+ or p+) layer or region 255A, it is form junction 275 equally.For example, but not any restriction, concerning semiconductor substrate particle 120, this junction 275 is pn (or PN) junction 275 normally; And concerning organic or polymeric substrates particle 120; This junction 275 can be regarded as the junction between the organic layer being used for creating OLED or PLED or polymeric layer.In a part for deposition manufacture process, such as, electricity consumption is made to starch deposition or sputter, for there is first most carrier (for example, p+ silicon) semiconductor-based board type, can above first or the upper section and one or more insulator 135 any of described multiple substrate particle 120 (top) deposition have second most carrier (for example, N-shaped alloy, such as, mix the silicon of phosphorus) semiconductive material.In addition, in various embodiment, this semiconductive material with second most carrier may be deposited over the top of this first surface (or side), covers first or upper section of described multiple substrate particle 120, one or more insulator 135 and spine or bizet) 115 (being shown as region 277 in figure).The most carrier of deposition second (N-shaped) semiconductive material of described correspondence can form continuous print semiconductor body with substrate particle 120 described in each, such as, forms continuous crystal or other bond with the upper section of substrate particle 120; Form with the first most carrier (p-type) semiconductor substrate particle 120 layer or region 255A that have deposited, in this example, it is n-layer or the region 255A that can define corresponding junction 275 (in this example, it is pn junction 275).In one exemplary embodiment, this (N-shaped) layer or region 255A (and junction 275 of correspondence) can be formed " cap portion " above this substrate particle 120, and be similarly essence to bend or shelly, such as, when described multiple substrate particle 120 be essence spherical time it is hemisphere shelly, and same and there is essence plane and smooth pn junction or inside the well portion of semiconductor substrate, there is essence plane and the typical prior art diode of smooth pn junction is obviously different.In another one exemplary embodiment, when this second most carrier (N-shaped) semiconductive material is deposited as the layer that can cover described insulator 135 and spine 115 equally, this junction 275 can be formed in " cap portion " with this substrate particle 120 interface connect that is situated between equally, and be similarly essence to bend or shelly, such as, when described multiple substrate particle 120 be essence spherical time it is hemisphere shelly.On the contrary, first most carrier (p-type) layer or region 255A may be formed on the top of the second most carrier (N-shaped) substrate particle 120, and can be regarded as equivalence and drop on equally inside category of the present invention.After depositing one or more insulator 135 described and form layer or region 255A, just mode (graphic) as discussed below can deposit one or more second conductor 140 and other Eigen Structure from Figure 18 and below.Carry out diagram hereinafter with reference to Figure 37 to 40 and exemplary device 700 embodiment utilizing the method to create is discussed.
In one exemplary embodiment, electricity slurry deposition manufacture process may be utilized to deposit one deck or region 255A, such as, utilize the vacuum reaction chamber with several Tao Er, for example, but not any restriction, it may be the process chamber as the module in whole printing process.After one or more insulator 135 of deposition (as hereafter more detailed description), just this first side or surface can be disposed, such as, utilize fluorine-containing gas to dispose, when described multiple substrate particle 120 be made up of semiconductor (such as having the silicon of doping) time, this fluorine-containing gas slightly may etch described multiple substrate particle 120 and may create the surface of described insulator 135 further, this surface can have poor sticks together feature (for example, class iron not dragon).Then, this electricity slurry deposition manufacture process can deposit this semiconductive material (such as, silicon), it can be adhered to described first most carrier substrate particle 120, but the fluorinated surface (and then may be removed) of described insulator 135 can not be adhered in fact, and this second most carrier (N-shaped) can be deposited, it to be merged among this semiconductive material deposited and may also can to diffuse to further among described substrate particle 120, thus forms layer or region 255A.The semiconductive material that this deposits, adulterate through second most carrier (N-shaped) then can contact the described substrate particle 120 with first most carrier closely, thus formation has junction 275 (such as, n+p junction) continuous semiconductor (for example, silicon) main body.
In another one exemplary embodiment, sputter process may be utilized to deposit one deck or region 255A.After one or more insulator 135 of deposition (as hereafter more detailed description), just can clean or dispose this first side or surface, such as, utilize back side sputter process.This sputter process then can deposit the semiconductive material of this second most carrier that adulterates (such as, adulterate in n+ silicon source the silicon of phosphorus), it can be adhered to described first most carrier substrate particle 120, described insulator 135 and spine 115, second most carrier (for example, N-shaped) can be merged among this semiconductive material deposited, thus form layer or region 255A.The semiconductive material that this deposits, adulterate through second most carrier (N-shaped) then can contact the described substrate particle 120 with first most carrier closely, thus formation has junction 275 (such as, n+p junction) continuous semiconductor (for example, silicon) main body.
In one exemplary embodiment, concerning described electricity slurry deposition and sputter two kinds of processing procedures, also photoresistance may be can used, exposedly those regions can not be can not be adhered to this dopant material be deposited or this dopant material be deposited in order to do making the remainder of this device.In addition, various surface characteristics (such as, wetability) can also be adjusted, as discussion above.
With reference to Figure 14 and 15, in various or selected one exemplary embodiment, be somebody's turn to do the different weight percentage that (pn) junction 275 may contain the housing district centered by described multiple substrate particle 120.For example, percentage based on the quantity of the surf zone using penetrated bed or region 255 by the corresponding junction 275 of formation to cover, when described multiple substrate particle 120 be essence spherical time, each essence hemisphere shelly (pn) junction 275 may contain 15 to 60 percent of substrate particle 120; In other one exemplary embodiment, shelly pn junction 275 may contain 15 to 55 percent of substrate particle 120; And in the various one exemplary embodiment of essence spherical substrate particle 120, then rough or approximately may contain 30 to 40 20 to 50 percent or percent (positive and negative specific small amount percentage (△)) of substrate particle 120.These are same obviously different with prior art, and in prior art, should (pn) junction just start to contain whole spheric semiconductor, then it must carry out micro Process, to expose the wherein one in described type of substrate.For example, in an one exemplary embodiment, penetrating or diffusion zone (255 of each Diode facets in the spherical diode of all in fact described multiple essence and correspondence, 255A) percent 15 to 55 has second most carrier (the second type dopant) (N-shaped or p-type) (namely, at first of each diode 155, a part for main overhead surface, most of or whole tops has this second type dopant, this second type dopant may additionally diffuse to second of this diode, underlying surfaces), remaining Diode facets and inside then have first most carrier (or first type dopant) (p-type or N-shaped) (namely, second of each diode, the major part of underlying surfaces, a part or all comprise do not deposited by this original substrate that the second type dopant and corresponding diffusion thereof cover), can corresponding formation pn junction in the inside of the spherical diode of each these essence.
Because this semiconductor substrate particle 120 should do not contained completely, so do not need process further to expose p-type area, these are equally different with prior art in (N-shaped) penetrated bed or region (255,255A).Accordingly, the nurse contact difficult to understand with p-type (or N-shaped) region can directly produce at this semiconductor substrate particle 120 without changing, not have on the outside of caving in, and do not need to carry out micro Process and expose the sunk part of inside.In addition, because final diode 155 locates in situ to produce, so, do not need to align this pn junction and the diode that need not put through orientation, because the proper position of this meeting inside exemplary device 200,300,400,500,600 and/or 700 manufactures the relation of the novel method of diode 155, it automatically can carry out correct alignment and put.Moreover because first createed the nurse contact difficult to understand between described substrate particle 120 and one or more first conductor 110 described before diode 155 is shaped, this same and typical semiconductor fabrication is obviously different.Accordingly, junction 275 can be created to be bent and among (and be in an exemplary embodiment essence hemisphere shelly or hat shape) diode 155 of shelly in essence, and synchronously or simultaneously have " exposed " semiconductor substrate further (for example, be bonded to or can in order to be bonded to the p-type area of conductor), and, in an exemplary embodiment, have exposed and be the hemispheric semiconductor substrate of essence, it has been coupled to one or more first conductor 110 at least partly.Change kind of a mode to describe, one to bend for essence and can be created at semiconductor substrate particle 120 for shelly or (pn) junction of hat shape 275 (it can cover the preset percentage of this semiconductor substrate particle 120 and neither can contain whole semiconductor substrate particle 120 whenever) (it is bonded to, be attached to or be coupled to conductor, such as, the first conductor 110) among.
After diode 155 is created, (there is region or layer 255 or 255A), may passivation layer be formed, such as, utilize electricity slurry deposition manufacture process, thus firmer and durable coating is created on described diode 155, in various embodiment, it also may be pliability.For example, electricity slurry deposition can be used.
In various one exemplary embodiment, mentioned by above, the size of described multiple substrate particle 120 can through design, to provide one or more selected size of described final multiple diode 155, such as, the final diode 155 among about 10 to 40 or 25 to 40 microns of (μm) scopes is dropped on.This super-small of described final diode 155 is advantageous particularly, it can provide the quantity of more (pn) junction 275 in each baseplate material quantity, in addition to other advantages, thus higher light output efficiency (in LED application) or higher photovoltaic energy conversion efficiency (in photovoltaic application) can be reached.
In addition, concerning photovoltaic application, when described multiple substrate particle 120 be essence spherical time, the junction 275 having formed pn can or will expose to the open air in (and in some situation perpendicular to) incident light equally very important substantially completely, and this incident light can from any correspondence direction on first or upper section of device 200,300,400,500,600,700.This extra feature can make the ambient light from various direction all may be used for energy generation, and does not need extra prior art necessary condition require mobile or locate photovoltaic panel to follow the trail of movement or position (the using the earth as benchmark framework) of the sun.
When described multiple substrate particle 120 be made up of organic or inorganic compound and polymer time (such as, the organic or inorganic compound that OLED or PLED uses and polymer), also have extra adoptable change case.Depend upon used type of compounds, this OLED is made up of simple layer (being this substrate particle 120 in this example), and if so talk about, just do not need formed layer 255.For other multilayer OLED; this selected OLED and/or the compound of oled layer and/or the mode of polymer can be used for by coating, printing or other interpolation and reach the object forming layer or region 255; then; this layer 255 just can form the oled layer of this correspondence; and corresponding interlayer junction (275) can be formed (for example; be equivalent to or be equivalent to pn junction) (and; for example and same as discussion hereafter, described organic substrate particle also can become corresponding (organic) diode 155).For multilayer OLED, this processing procedure may be repeated, thus on another top, create multiple region 255, the proper position of its same meeting in exemplary device 200,300,400,500,600,700 forms OLED and is after this substrate particle 120 is coupled to conductor (the first conductor 110).
Via the carrier (alloy) deposited used above multiple substrate particle 120 and/or coating, place forms pn or equivalent junction in situ, described multiple substrate particle 120 just can be converted into corresponding multiple diodes 155 now, and may be the diode of any type or kind, such as, for the diode (PV diode) of photovoltaic application, or for luminescence application diode (light-emitting diode or LED).Change kind of a mode to describe, when being deposited, described substrate particle 120 is not diode, is only the substrate particle not having junction, then just can form described junction 275 in correct place.
In addition, in one exemplary embodiment, for forming light-emitting diode (LED), the alloy of substrate particle 120 and correspondence and coating may be deposited in a different manner, such as, for example, but not any restriction, red LED, the green LED of the second first row/recess, the blue led of three first row/recess, the red LED of four first row/recess of printing first row/recess ... etc., thus creation can control the light-emitting device of colour temperature.Mentioned by above, many connecting lines or many coupling lines (such as electric wire or wire) may be connected to corresponding perforation 280,285, and there is no conducting back plane 290, these can be selected individually to arrange via the voltage or electric current applying correspondence.Being described in more detail below with reference to Figure 20, also may can use extra coating, such as, for the coating of one or more type phosphors of LED application.
Shown in Figure 16 be according to the device embodiment of teachings of the present invention have be deposited multiple first conductors 110, multiple diode 155 and the exemplary substrates 100 of multiple insulator 135, the perspective view of 100A, 100B, 100C, 100D.Shown in Figure 17 is the cutaway view (running through 50-50 ' plane) with the 5th exemplary substrates 100D of multiple first conductors 110, multiple diode 155 and the multiple insulator 135 be deposited of device embodiment according to teachings of the present invention.Wherein a kind of selectivity practice is, at multiple second conductor 140 of deposition or single the second conductor 140 (for example, second conductive layer) before, insulating material can be deposited over peripheral part of described first (top or top) part or the top of lateral part of described multiple diode 155, in order to form corresponding multiple insulators 135, such as, via printing or coating process, or, can be deposited as single, continuous print insulating barrier (below with reference to Figure 34,35 and 36 diagram and discussion).Described non-essential insulator 135 can be used for helping prevent has any contact between second or below (being p-type in this example) part of the second conductor 140 and diode 155.In addition, in one exemplary embodiment, insulator 135 may be deposited as one deck, prerequisite is, have enough part to keep exposed in described diode 155, so as to contact one or more second conductor 140 and can expose described diode 155 first, upper section is in order to carry out light transmitting or absorption.As above with reference to mentioned by figure 15, can also carry out first depositing one or more insulator 135 before diode 155 is created.
In addition, described multiple insulator 135 may be made up of any insulation be suspended among any various medium or dielectric compound, as discussion above and hereafter, for example, but not any restriction, is suspended in the inorganic dielectric particle among the polymerism medium with light initiator.In the embodiment shown in figure, by be suspended in there is light initiator polymerism medium (such as, can the polymerism adhesive of uv solidification) among one or more dielectric suspension of forming of inorganic dielectric particle can separate with described multiple substrate particle 120 and deposit, or, also can deposit in addition except depositing described multiple substrate particle 120 by be suspended in there is light initiator polymerism medium (such as, can the polymerism adhesive of uv solidification) among one or more dielectric suspension of forming of inorganic dielectric particle, in order to form one or more insulator 135.For example, but not any restriction, exemplary dielectric compound for the formation of insulation (or dielectric) suspension comprises: be suspended in organic or inorganic dielectric grain among solvent below or polymer (for example, powder or the barium titanate of other granular form, titanium dioxide ... etc.), such as, deionized water, diethylene glycol, isopropyl alcohol, n-butanol, ethanol, monomethyl ether propylene glycol acetate, dibasic ester (for example, InvistaDBE-9); Water-soluble resin, such as, polyvinyl alcohol (PolyVinylAlcohol, PVA), butyral (PolyVinylButyral, PVB), polyvinylpyrrolidone (polyvinylpyrrolidone), polyethylene glycol; And flow adjuvant or surfactant, such as, octanol and the Foamblast339 supplied by EmeraldPerformanceMaterials.In other one exemplary embodiment, one or more insulator 135 may be polymerism, such as, comprises PVA or PVB in deionized water, is usually less than percent 12.Other commercially available exemplary dielectric compound for the formation of insulation (or dielectric) suspension, polymer or carrier comprises, but is not limited to: the barium titanate dielectric medium that (1) ConductiveCompounds sells; (2) the transparent UV cured printing ink of 5018A sold of DuPont, the green UV cured printing ink of 5018G, 5018 blue UV cured printing inks, 7153 high-k dielectric insulator, and 8153 high-k dielectric insulator; (3) SunPoly, the Inc. dielectric ink of 305D UV-curable of selling and the dielectric ink of 308D UV-curable; (4) ink of titanium dioxide filling UV-curable sold of each supplier.
Shown in Figure 18 be according to the device embodiment of teachings of the present invention have be deposited multiple first conductors 110, multiple diode 155, multiple insulator 135 and multiple exemplary substrates 100 of the second conductor 140, the perspective view of 100A, 100B, 100C, 100D.Shown in Figure 19 is the cutaway view (running through 60-60 ' plane) with the 5th exemplary substrates 100D of multiple first conductors 110, multiple diode 155, multiple insulator 135 and multiple second conductor 140 be deposited of device embodiment according to teachings of the present invention.
With reference to Figure 18 and 19, after forming this pn junction or other junction 275 and/or depositing multiple insulator 135, or vice versa, one or more second conductor 140 just can be deposited (for example, via printing conductive inks, polymer or other conductor are (such as, metal)), it may be the conductor of any type discussed above, electrically conductive ink or polymer, or, it may be printing opacity (or transparent) conductor, in order to form nurse contact difficult to understand with first or top (being N-shaped in this example) penetrated bed of described diode 155 or the exposed or non-insulated portion of region (255).Although show multiple second conductor 140 in figure; But, the second conductor of printing opacity can also be deposited as single pantostrat (in order to form unitary electrode), such as, for luminescence application or photovoltaic application (below with reference to Figure 34,35 and 36 diagram and discussion).Second conductor 140 of one (or multiple) printing opacity may be made up of any compound with lower region feature: (1) has enough conductivity, in order to energy supply in the time cycle of giving tacit consent to or select to first or upper section of device 200,300,400,500,600,700 or first or upper portion office received energy from device 200,300,400,500,600,700; And (2) have the transparent position standard or transmittance at least presetting or select in selected electromagnetic radiation wavelength (in the visible spectrum such as, in a part).For example, when the present invention is used in luminous application or photovoltaic application, second conductor 140 of one (or multiple) printing opacity supplies energy to described multiple diode 155 or can be significantly less than other application from the conduction time of described multiple diode 155 received energy or speed.Therefore, in order to formed this (s) the selection of material of printing opacity or light tight second conductor 140 may not be identical, it can depend upon the selected application of this device 200,300,400,500,600,700 and depend upon the utilization of one or more the 3rd conductor 145 (hereafter can discuss) non-essential.To be somebody's turn to do (s) the top that one or more second conductor 140 can be deposited over the exposed and/or non-insulated portion of described multiple diode 155, and/or also can be deposited over the top of any described multiple insulator 135 and/or spine 115, such as, utilize the known printing that maybe may know or coating process in printing technology or coating technique, if desired or if necessary, can the correct any selected alignment of control or arrangement operation.Whether look closely selected embodiment and the second conductor 140 be that essence is transparent is determined, to be somebody's turn to do (s) one or more second conductor 140 and may to be deposited over whole part of the described exposed part of described multiple diode 155 or the top of only wherein a part and/or any multiple insulator 135, such as, with the side of the surrounding of described diode 155 or edge for benchmark, as shown in the figure.
In one exemplary embodiment; except conductor recited above; carbon nanotube (CNT), poly-ethylenedioxythiophene can also be used (for example; AGFAOrgacon), polyaniline or polypyrrole polymers, tin indium oxide (IndiumTinOxide; ITO) and/or antimony tin (AntimonyTinOxide, ATO) (this ITO or ATO can be suspended among any various adhesive previously discussed, polymer or carrier usually in the form of granules) form second conductor 140 of (multiple) printing opacity.In one exemplary embodiment, carbon nanotube can be suspended in polymerisable ionic liquid (such as, there is the aqueous hydrazine (aqueoushydrazine) of polymerizable acrylic ester or other polymerizable compound (and may comprise extra surfactant further)) among, final conductor (110,140,145) then comprises the carbon nanotube be suspended among (solidifying) acrylic acid, plastics or polymer.Although ITO and ATO provides the sufficient transparency in visible ray; But their impedance or resistance be higher (for example, 20k Ω), thus corresponding higher (namely, slowly) time constant can be produced in electrical communications.Other compound with less impedance can also be used, such as, poly-ethylenedioxythiophene.Therefore, in one exemplary embodiment described in some, one or more the 3rd conductor 145 (shown in Figure 22,24,26,27,33,41) with less impedance or resistance can be merged in or may be merged among corresponding (multiple) printing opacity second conductor 140, to reduce total impedance or the resistance of this layer, shorten conduction time, and the response speed of this device can be improved.As shown above, in the luminescence application with larger form factor or photovoltaic application, these one or more the 3rd conductor 145 can be used to provide throw light on faster, thus reach energy supply to wanting more middle body in illuminated region, otherwise, owing to being selected the relation of insufficient conduction of the many type compounds be used in (multiple) printing opacity second conductor 140, it just may keep not by energy supply and for black dull.For example, for forming one or more the 3rd conductor 145, may utilize be printed on this (s) electrically conductive ink above the correspondence band line of printing opacity second conductor 140 or electric wire or polymer (for example, silver ink, CNT or poly-ethylenedioxythiophene polymer) form one or more delicate wire, or, can utilize be printed in relatively large display larger, electrically conductive ink above single transparent second conductor 140 or polymer form one or more delicate wire (for example, there is grid pattern), to provide higher conduction speed in this second transparent conductor 140 whole, and can be described in a more detailed discussion in relevant application case.The usage of these the 3rd conductors 145 can be illustrated in each graphic in and can hereafter be discussed further.
Can equivalence other compound of being used for being formed (multiple) essence printing opacity second conductor 140 comprise above known or other printing opacity conductor that may know at present in mentioned tin indium oxide (ITO) and this technology, it comprises, one or more conducting polymer discussed above, such as, brand name is the poly-ethylenedioxythiophene of " Orgacon " and various transparent conductor based on carbon and/or carbon nanotube.For example, representational light transmitting electro-conductive material is can purchased from 7162 of DuPont and 7164ATO semi-transparent conductor.(multiple) printing opacity second conductor 140 can also in conjunction with various adhesive, polymer or carrier, and it comprises previously discussed, and such as, the adhesive that can solidify under various conditions, such as, is exposed to ultraviolet radiation (can uv solidification).
Refer again to Figure 18 and 19, when this (s) the first conductor (110) and the second conductor (140) caused supplying electrical power to described multiple diode 155 (such as by energy supply, LED) time, just can be luminous in the visible spectrum.So described final device 200,300,400,500,600 and/or 700 (correspondence is expressed as light-emitting device 200A, 300A, 400A, 500A, 600A, 700A) is specially adapted to luminous application and static state display application.Similarly, when described multiple diode 155, for photovoltaic diode, (it can form a photovoltaic devices, correspondence is expressed as device 200B, 300B, 400B, 500B, 600B and/or 700B) time, when exposing to the open air in light, described in just crossing over, one or more first conductor 110 and one or more second conductor 140 described produce voltage.When one or more first conductor 110 described is positioned between described diode 155 and this substrate (100 to 100H), can via this conducting back plane 290; Via described conductive through holes 280 or 285; Via with the exposed edges of the surrounding of this device 200,300,400,500,600 and/or 700 for one or more the first conductor 110 described in benchmark; Or provide via other connecting line any being coupled to described perforation 280,285 or conductor 110 or obtain the voltage of described correspondence.Access one or more second conductor 140 described to reach via the exposed edges being benchmark with the surrounding of this device 200,300,400,500,600 or from first or upper side of this device 200,300,400,500,600,700.
Shown in Figure 20 is the cutaway view with the 5th exemplary substrates 100D of multiple first conductor 110, multiple diode 155, multiple insulator 135, multiple second conductors 140 and one or more luminescent layer 295 (for example, it comprises one or more phosphor layer or coating) of device embodiment according to teachings of the present invention.In one exemplary embodiment, such as LED embodiment, one or more luminescent layer 295 may be deposited over the top (and also may can be deposited over the top on other selection area or whole surface) of (such as, via printing process or coating process) described diode 155.One or more luminescent layer 295 described may be by or can being adapted the light (or other electromagnetic radiation) and any material luminous in visible spectrum (or other electromagnetic radiation of any selected frequency) or compound that send in response to diode 155.For example, the luminescent layer 295 based on yellow phosphor can coordinate blue LED 155 to use, in order to produce the light being essentially white.These electroluminescent compounds comprise can any various forms and have the various phosphors that any various alloy provides, and such as, is mixed with copper, magnesium, strontium, caesium, rare earth ... the zinc sulphide waited or cadmium sulfide.Wherein this type of exemplary phosphors a kind of is zinc sulphide (having the ZnS of doping) phosphor, and its form that can be encapsulated (granular) provides, and with easy to use, such as, is derived from DuPont
tMluxprint
the micro-capsule envelope of electroluminescent polymer thick film materials has the ZnS phosphor of doping to be encapsulated powder.Although not in conjunction with a dielectric medium in described one exemplary embodiment; But, this phosphor can also in conjunction with a dielectric medium (such as, barium titanate or titanium dioxide), to adjust the dielectric constant of this layer.The polymer form that the EL compound of one or more luminescent layer 295 described in forming or particle can have various adhesive uses or suspends, and can separately in conjunction with various adhesive (such as, can purchased from the phosphor adhesive of DuPont or ConductiveCompounds), it has concurrently and helps to carry out this printing or other deposition manufacture process and allow this phosphor be adhered to underlying layer and overlying strata below.One or more luminescent layer 295 described can also uv cured form or thermal curable form provide.Equivalent electric electro luminescent compounds miscellaneous all can adopt and all drop on inside category of the present invention.
Equivalent electric electro luminescent compounds miscellaneous all can adopt and all drop on inside category of the present invention, it comprises, but be not limited to: the 7138J white emitting phosphor that (1) DuPont sells, 7151J blue-green phosphor, 7154J green-yellow phosphor, 8150 white emitting phosphors, 8152 turquoise phosphors, 8154 green-yellow phosphors, 8164 high brightness green-yellow phosphors, and the GlacierGlo series that (2) Osram sells, it comprises blue GGS60, GGL61, GGS62, GG65, turquois GGS20, GGL21, GGS22, GG23/24, GG25, green GGS40, GGL41, GGS42, GG43/44, GG45, the GGS10 of orange type, GGL11, GGS12, GG13/14, and the GGS70 of white, GGL71, GGS72, GG73/74.In addition, look closely in selected embodiment and determine, colouring agent, dyestuff and/or alloy can also be included into inside this type of luminescent layer 295 any.In addition, for the formation of the phosphor of luminescent layer 295 or phosphor capsule may also comprise can be luminous in peculiar spectrum (such as, green or blue) alloy.In those situations, this luminescent layer may be printed the pixel defining any given or selected color (such as, RGB or CMYK), to provide color monitor.
When these one or more luminescent layers 295 are used in luminous application, they can not separate display in Figure 21 to 40.The personage haveing the knack of this technology just can understand, and any device shown in Figure 21 to 40 also may comprise these one or more luminescent layers 295 be coupled to or be deposited above diode 155 shown in the figure.For example, but not any restriction, as discussion hereafter, multiple lens 150 (being suspended among polymer (resin or other adhesive) 165) also directly may be deposited over the top of one or more luminescent layer 295 described and other Eigen Structure, in order to create any described various light emitting device embodiment 200A, 300A, 400A, 500A, 600A and/or 700A.
Shown in Figure 21 be according to device 200 embodiment of teachings of the present invention have be deposited multiple first conductors 110, multiple diode 155, multiple insulator 135, multiple second conductor 140 and (being suspended among polymer (resin or other adhesive) 165) exemplary substrates 100 of multiple lens 150, the perspective view of 100A, 100B, 100C, 100D.Shown in Figure 22 be according to device 200 embodiment of teachings of the present invention have be deposited multiple first conductors 110, multiple diode 155, multiple insulator 135, multiple second conductor 140, multiple 3rd conductor 145 is (because covered by lens 150, so, cannot see in figure 21) and the cutaway view (running through 70-70 ' plane) of the 5th exemplary substrates of (being suspended among polymer (resin or other adhesive) 165) multiple lens 150.Although not separately display, but this device (200,300,400,500,600,700) also may comprise one or more luminescent layer 295; And/or may also comprise protective coating (such as; the plastics that essence is transparent or other polymer); various element can not be subject to (such as in order to provide protection; corrosive substance in weather, air ... etc.) destruction; or, this sealing and/or defencive function can also be provided by this polymer (resin or other adhesive) 165.(for convenience of explaining, Figure 21 makes the transparent mode of essence represented by dashed line carry out this polymer of diagram (resin or other adhesive) 165).
In one exemplary embodiment, described multiple lens 150 may be by borosilicate glass or other silicate glass or plastics (such as, polystyrene latex) formed; But, can also use any various types of material, it comprises, but is not limited to, the glass of other type, plastics, other polymer, crystal or polycrystalline silicon silicate glass and/or have the mixing of different kind of material of any shape or size.Although it is spherical to be shown as essence in figure; But, described multiple lens 150 also may have other shape and form, for example, but not any restriction, essence is hemispherical, multiaspect shape, ellipse (or oblong), irregular shape, cube or various prismatic shape (for example, trapezoidal, triangle, pyramid ... etc.), and also may have any variation and/or tolerance discussed with reference to described multiple substrate particle 120 above, such as, in shape, size ... etc. aspect.It is transparent that described multiple lens 150 (they have at least one first refractive rate) can be suspended in essence in the form of granules, the polymer (resin or other adhesive) 165 of printing opacity (for example, but not any restriction, various types of amido formate) among, again, for example, but not any restriction, this polymer (resin or other adhesive) 165 may be to solidify or drying by uv, thermal curable or drying, or can air curing or drying, and have further at least one second, different refractive indexes (being different from the first refractive rate of described multiple lens 150).
Described multiple lens 150 can have spatial relationship miscellaneous with described multiple diode 155, and can have size miscellaneous.Any special spatial relationship should not be reasoned out (for example from Figure 21 to 22 (or other Figure 23,24,30 to 33,35 and 36), rule or erratic interval, syntople ... etc.), in particular, those are graphic not according to scale.For example, mentioned by above, described lens 150 much larger than described diode 155, such as, in one exemplary embodiment, may have five times greatly.
In one exemplary embodiment, polymer (resin or other adhesive) 165 or its stickiness may be used other polymer of at least specific interval and can also to be provided between described multiple lens 150 between described multiple lens 150 and described diode 155, can not closely or directly contact with described multiple diode 155 in order to do making described multiple lens 150, adjacent contact, each lens 150 all to I haven't seen you for ages by by polymer (resin or other adhesive) 165 the film that forms or coating surround.In another one exemplary embodiment, the adhesive relatively not having stickiness can be used, and allow described multiple lens 150 and any one in described multiple diode 155, a part or be all in direct contact with one another, contact or directly contact with other device assembly, adjoin and contact (as shown in Figure 31).This polymer (resin or other adhesive) 165 in selected wavelengths of interest (such as, visible ray, infrared light and ultraviolet light) in can be regarded as printing opacity or transparent (having solidified or dry form at it), and may be regarded as light tight in other wavelength, vice versa.Except various types of amidocarbonic acid ester polymer, any and whole other polymer can also be used, (it comprises any solvent be incorporated to for resin or adhesive, flowing adjuvant, surfactant ... etc.), described any and whole other polymer, resin or adhesive solidifying or be essentially transparent at selected wavelength place in dried forms and there is suitable selected second refractive index in described selected wavelength at them, they comprise any and whole other polymer previously discussed, resin or adhesive, for example, but not any restriction: deionized water, diethylene glycol, isopropyl alcohol, n-butanol, ethanol, monomethyl ether propylene glycol acetate, methoxylation acrylic acid ether monomer (its may also comprise one can be water-soluble light initiator, such as, TPO (triphospheneoxide), dibasic ester (for example, InvistaDBE-9), water-soluble resin, such as, polyvinyl alcohol, butyral, polyvinylpyrrolidone, polyethylene glycol, and flow adjuvant or surfactant, such as, octanol and the Foamblast339 supplied by EmeraldPerformanceMaterials.
After deposition described one or more the second conductor 140 (and/or the 3rd conductor 145) (and/or one or more luminescent layer 295), in one exemplary embodiment, the described multiple lens 150 be suspended among a polymer (resin or other adhesive) 165 may be deposited (such as, via a printing process) in described diode 155 (and/or one or more luminescent layer 295), one or more the second conductor 140 (and/or the 3rd conductor 145), any bare substrate (100 to 100H) ... the top of waiting.In another one exemplary embodiment, described multiple lens 150 can with thin plate, panel or other form to be suspended among polymer (resin or other adhesive) 165 and can be cured, then, final thin plate or panel just can be attached to this device 200, 300, 400, 500, the remainder of 600 and/or 700 (namely, described diode 155 (and/or one or more luminescent layer 295), one or more second conductor 140 (and/or the 3rd conductor 145), any bare substrate (100 to 100H) ... the top of waiting), for example, but not any restriction, via stacking processing procedure, and these changes all drop on inside the category of the invention of advocating herein.
Accordingly, no matter whether the described multiple lens 150 be suspended among polymer (resin or other adhesive) 165 are directly deposited over described diode 155 (and/or one or more luminescent layer 295), the top of one or more second conductor 140 (and/or the 3rd conductor 145) and any bare substrate (100 to 100H), no matter or whether the described multiple lens 150 be suspended among polymer (resin or other adhesive) 165 are first formed the structure of separation and are then attached at described diode 155 (and/or one or more luminescent layer 295), the top of one or more second conductor 140 (and/or the 3rd conductor 145) and any bare substrate (100 to 100H), the combination being suspended in the described multiple lens 150 among polymer (resin or other adhesive) 165 all can define lens (lensing) structure 150 that has multiple refractive index, 165, in other words, it can define multiple lens 150 with at least one first refractive rate and the polymer with at least one the second refractive index (resin or other adhesive).These are same obviously different with prior art; in the prior art; lens or diffusion panel are made up of the single material (being generally plastics or another polymer) made in advance; it has single refractive index; and lens sizes usually can than the described multiple lens 150 used in various one exemplary embodiment of the present invention large several order of magnitude; as hereafter discussed (for example, average diameter is between about 40 to 400 microns) in more detail.
Described multiple lens 150, especially when being embodied as essence spherical lens, several functionalities below can be provided, it comprises aggregation capability, in order to collect light and this light to be gathered on multiple diode 155, there to be higher coupling efficiency in photovoltaic application, and the incidence angle (or accepting angle) of meeting width extender 200,300,400,500,600,700 and/or 200B, 300B, 400B, 500B, 600B, 700B, because the light of multi-angle place incidence of comforming still can be focused on described multiple diode 155.In addition, for example, described multiple lens 150 also can implement a divergent function at device 200,300,400,500,600,700 and/or 200A, 300A, 400A, 500A, 600A, 700A, when being formed on LED155, in order to scatter the light provided by described multiple spherical diode 155 (and/or one or more luminescent layer 295).Another advantage of described multiple lens 150 is without any need for special alignment or arrangement, and make not need to carry out any certain position relative to described spherical diode 155, light all can be gathered on several diode 155 or disperse the light from several diode 155 by any given lens 150.Or rather, in contrast diameter (or radius) ratio of the diameter (or radius) of the tolerance of size or the spherical lens 150 of index and spherical diode 155 by significant simulation into about 10: 1 to 2: 1, assemble in (or dispersion) in higher or more meaningful Mode Coupling or larger light, possible optimal proportion is then 5: 1.The average diameter of described multiple essence spherical lens is generally about 20 to 400 microns (diodes 155 corresponding to dropping in about 10 to 40 micrometer ranges), and more particularly, about 80 to 140 microns.Any space between the described spine (spike, protrusion or bizet) 115 of the typical case of described multiple diode 155 or average diameter and this exemplary substrates 100 (or, the saying of equivalence is the width of the described spine (spike, protrusion or bizet) 115 of this exemplary substrates 100 to 100G) may through selecting or determining in advance, in order to do making described multiple lens 150 may separate specific or default distance and/or in order to form the essence or relatively complete layer that are made up of multiple lens 150.
Described multiple lens 150 are used to carry out the incident angle of the ambient light of width extender 200,300,400,500,600,700 meaningful especially to photovoltaic application.In the prior art, when the angle of this photovoltaic (PhotoVoltaic, PV) assembly changes according to external sunlight, thus efficiency also can change, and described prior art PV element panels must move to meet the incidence angle changed always, otherwise just efficiency can be lost.According to described one exemplary embodiment, because have the relation of the building-up effect of described multiple lens 150 of obviously wider incidence angle (or accepting angle) when being embodied as spherical lens, so device 200B, 300B, 400B, 500B, 600B, 700B also move without any need for this type of.
Use spherical multiple substrate particles 120 (in order to form corresponding multiple diodes 155) although show in figure and be similarly spherical multiple lens 150; But, except spherical, other shape of these substrate particles 120 and/or lens 150 and form also drop on inside the category of the invention of advocating herein.For example, hereafter just carry out with reference to Figure 26 to 31 exemplary multiple substrate particles 120 that diagram and discussion have other shape (such as, multiaspect shape, ellipse or thin-and-long and irregular shape).Similarly, for example, spherical or other shape may through selecting, to provide optical resonance for any light of subsideing inside diode 155, it may improve the time number of this light inside diode 155 and thus improve the efficiency of photovoltaic diode 155.Other optical resonance form of diode 155 or shape can also adopt, and for example, it comprises, but is not limited to, column or bar-shaped, toroid or annular shape.Similarly, other lens 150 shape (similarly, for example, but not any restriction, such as, multiaspect shape, ellipse (or oblong) and/or irregularly shaped) also can drop on inside the category of the invention of advocating herein.
For example, corresponding in the long possible optical resonance of Different lightwave, described various multiple diode 155 also may be made up of the spherical diode 155 of different size, and similarly, described multiple lens 150 also may be made up of the lens 150 of the spherical of different size and other shape, to create multiple different focus, Mode Coupling and diffusivity.This may be used for the spectral concentration improving the light being absorbed or be issued.Described various lens 150 in described multiple lens 150 also may have different refractive indexes, to provide multiple different refractive index.
Concerning those various application any, such as, luminous application, except spherical, described substrate particle 120 also may have any shape or size.For example, diode 155 may be formed multiaspect shape or have other superficial makings and shape, can improve light output, as shown in Figure 26,27,30 and 31.In addition, for example, erose diode 155, as as shown in Figure 30 and 31, also can be used for creating multiple focus (based on multiple incidence angle) and for the contrast that improves junction 275 or relative size, all larger target area can be had in horizontal and vertical both direction.
Although not separately display in figure; But, plural layer diode 155 and/or lens 150 may also be had.For example, multiple diode 155 can by storehouse, and one of them is by the top of storehouse at another, or along the width storehouse side by side of a recess or channel 105; Or nido storehouse, larger diode 155 is arranged in the layer below less diode 155.Similarly, although not separately display in figure; But, any selected device 200,300,400,500,600,700 all may have any selected mixed structure be made up of the diode 155 of difformity and/or size and/or lens 150.In addition, the described multiple lens 150 be suspended among polymer (resin or other adhesive) 165 also may have any various position relative to the remainder of this device 200,300,400,500,600,700, its comprise regular to separate, erratic behavior is separated, adjoin, separate, storehouse ... etc., this change in a part be illustrated in Figure 31.
Shown in Figure 23 is the perspective view according to one of device 300 embodiment of teachings of the present invention with the exemplary 7th substrate 100E of multiple first conductors 110, multiple diode 155, multiple insulator 135, multiple second conductor 140 and (being suspended among polymer (resin or other adhesive) 165) multiple lens 150 of being deposited.Shown in Figure 24 is the cutaway view (running through 80-80 ' plane) with the 7th exemplary substrates 100E of multiple first conductors 110, multiple diode 155, multiple insulator 135, multiple second conductor 140, multiple 3rd conductor 145 and the multiple lens 150 be deposited of device 300 embodiment according to teachings of the present invention.Device 300 and be that the passage (recess or groove) 105 of substrate 100E has the form of off-axis parabola (or parabola) 105A in the difference of embodiment discussed above so far, and spine's (or bizet) 115 of substantial planar compared to substrate 100, described spine (or bizet) 115 has in fact angle (namely, substantial angle (for example, between about 15 to 60 degree) can be formed) with the plane of the first side or the second side that define or comprise substrate 100E.Figure 24 goes back the usage of diagram the 3rd conductor 145 as discussed above.The function of resulting device 300,300A and/or 300B in fact can be identical with other device embodiment any discussed in this article.
Mentioned by above, the possible size range of described multiple substrate particle 120 and final multiple diode 155 may in the scope of about 10 to 40 or 25 to 40 (or larger) micron, and it is much smaller than known, prior art diode.Therefore, according to described one exemplary embodiment, in a given area of device 200,300,400,500,600,700, usually have many diodes 155.The further result of this higher diode 155 density has huge restorative and robustness, even if because described diode 155 has the statistically fault of higher percent, still can produce available device 200,300,400,500,600,700.For example, the various assemblies with varying number nonfunctional diode 155 thus can by " clustering (binned) " together.Continue this example, having lessly has the device 200,300,400,500,600,700 of function diode 155 (when being embodied as LED) clustering simply can become be equivalent to have the lower output luminescence component of the light output of 60W lighting bulb, but not 100W lighting bulb.
Mentioned by above; after deposition is suspended in the described multiple lens 150 inside this polymer (resin or other adhesive) 165; just can deposit various protective coating, its equally as herein by reference as shown in the related application that is incorporated to.
Shown in Figure 25 is the perspective view of the exemplary 8th substrate 100F of device embodiment according to teachings of the present invention, and itself and be that the shape of described recess (channel, groove or space) 105 is designed to essence spherical (hemispherical) or the pothole of ellipse or the 105B that punchinges in the difference of embodiment discussed above so far, in order to form a substrate 100F (difference of itself and substrate 100 to 100E is only the shape of described recess 105).The function of one resulting device 200,300,400,500,600 and/or 700 in fact can be identical with other device embodiment any discussed in this article.
Shown in Figure 26 be according to one of a device embodiment of teachings of the present invention have be deposited multiple first conductors 110, in order to form the perspective view of the exemplary substrates (100,100A, 100B, 100C, 100D) of multiple essence multiaspect shape substrate particles 120 of corresponding multiaspect shape diode 155A, multiple insulator 135, multiple second conductor 140 and multiple 3rd conductor 145.Shown in Figure 27 be according to a device embodiment of teachings of the present invention have be deposited multiple first conductors 110, in order to form the cutaway view of the 5th exemplary substrates 100D of multiple essence multiaspect shape substrate particles 120 of corresponding multiaspect shape diode 155A, multiple insulator 135, multiple second conductor 140 and multiple 3rd conductor 145.Mentioned by above, Figure 26 and 27 is that it is the another kind of exemplary shapes of multiple diode 155 for diagram multiaspect shape diode 155A (multiaspect shape diode 155A described in each is same has that essence for the formation of a corresponding pn junction 275 is bending, shelly penetrated bed or region 255); And further diagram is in order on one or more second conductor 140 or the exemplary pattern of multiple 3rd conductor 145 of the inside deposition, for example, but not any restriction, it has the shape of the straight line of essence or has " ladder " shape (in figure not separately display).The function of resulting device in fact can be identical with other device embodiment any discussed in this article.
Shown in Figure 28 be according to one of another device embodiment of teachings of the present invention have be deposited multiple first conductors 110, in order to form the perspective view of the exemplary substrates (100,100A, 100B, 100C, 100D) of multiple essence ellipse (or oblong) substrate particles 120 of corresponding oval (or oblong) diode 155B, multiple insulator 135 and multiple second conductor 140.Shown in Figure 29 be according to the device embodiment of teachings of the present invention have be deposited multiple first conductors 110, in order to form the cutaway view of the 5th exemplary substrates 100D of multiple essence ellipse (or oblong) substrate particles 120 of corresponding oval (or oblong) diode 155B, multiple insulator 135 and multiple second conductor 140.Mentioned by above, Figure 28 and 29 is that it is the another kind of exemplary shapes of multiple diode 155 for diagram essence ellipse (or oblong) diode 155B (essence ellipse (or oblong) diode 155B described in each is same has that essence for the formation of corresponding pn junction 275 is bending, shelly penetrated bed or region 255).The function of resulting device in fact can be identical with other device embodiment any discussed in this article.
Shown in Figure 30 be according to device 500 embodiment of teachings of the present invention have be deposited multiple first conductors 110, in order to form the perspective view of the exemplary substrates (100E) of multiple essence irregular shape substrate particle 120 of corresponding irregular shape diode 155C, multiple insulator 135, multiple second conductors 140 and multiple lens 150 (being suspended among polymer (resin or other adhesive) 165).Shown in Figure 31 be according to device 500 embodiment of teachings of the present invention have be deposited multiple first conductors 110, in order to form multiple essence irregular shape substrate particle 120 of corresponding irregular shape diode 155C, multiple insulator 135, multiple second conductor 140 and to be suspended in the cutaway view of the 5th exemplary substrates 100E of the multiple lens 150 among polymer (resin or other adhesive) 165.Mentioned by above, Figure 30 and 31 is that it is the another kind of exemplary shapes of multiple diode 155 for diagram essence irregular shape diode 155C (irregular shape diode 155C described in each is same has that essence for the formation of corresponding pn junction 275 (or equivalent junction) is bending, irregular shelly penetrated bed or region 255).
Figure 30 and 31 further diagram is regarded as other equivalent exemplary variation example and drops on inside the category of the invention of advocating herein, it comprises in comparison with the described recess of diode 155, passage or the change case of the relative width of groove 105, and described recess, passage or the groove 105 shown in figure is obviously wider than described diode 155C.By described wider recess, passage or groove 105, as shown in the figure, thus the position of described various insulator 135 and the second conductor 140 also can change, and can be coupled to described diode 155C side or with the side of described diode 155 for benchmark, and top or top peripheral part of described diode 155 can not be coupled to further.Also show in figure is still the penetrated bed with variety of shapes or the region 255 of essence shelly, and described region 255 can define and do not have the complete corresponding pn junction 275 extended around described diode 155C, diode 155C can continue and make to have in its substrate significant part can be exposed and/or be coupled to one or more insulator 135 or (multiple) first conductor 110.Finally, Figure 30 and 31 also further diagram drops on the various example location of the lens 150 inside the category of the invention of advocating herein, and it comprises, but is not limited to: adjoin diode 155C, adjoin a part of this substrate 100E and separate.The function of resulting device 500,500A and/or 500B in fact can be identical with other device embodiment any discussed in this article.
Shown in Figure 32 is the perspective view with the 6th exemplary substrates (100G) of multiple first conductors 110, the spherical diode of multiple essence 155, multiple insulator 135, multiple second conductor 140, multiple 3rd conductors 145 and the multiple lens 150 (being suspended among polymer (resin or other adhesive) 165) be deposited of device 400 embodiment according to teachings of the present invention.Shown in Figure 33 is the cutaway view (running through 71-71 ' plane) with the 6th exemplary substrates 100G of multiple first conductors 110, the spherical diode of multiple essence 155, multiple insulator 135, multiple second conductor 140, multiple 3rd conductors 145 and the multiple lens 150 (being suspended among polymer (resin or other adhesive) 165) be deposited of device 400 embodiment according to teachings of the present invention.Mentioned by above, the difference of device 400 embodiment and so far other device is that the 6th exemplary substrates 100G comprises the multiple protuberances (or support portion) 245 being positioned at described path 10 5 (it may be integrally formed with this substrate 100G) the inside further, there are multiple first conductors 110 of the constant or consistent degree of depth of essence of the shape conforming to this path 10 5 and described protuberance 245, and comprise multiple integrally formed conductive through holes 285 further, in this example, described conductive through holes 285 can be randomly dispersed in inside this substrate 100G.In described first conductor 110, one of them does not contact perforation 285 in this selected or special cutaway view (running through 71-71 ' plane); but in its length, certain other location point place can contact a perforation 285 (in figure not separately display) usually, further illustrates this random distribution situation.Show although do not separate in Figure 32 and 33; But, this substrate 100G but also may comprise any extra coating discussed above or layer (250,260,270).Figure 33 also any described multiple diode 155 of diagram may have (variable) gap between the wall portion of the path 10 5 of its side and this substrate 100G, show in figure its insulated body 135 part insert, and between described lens 150 and among and between other device assembly and among have variable interval.The function of resulting device 400,400A and/or 400B in fact can be identical with other device embodiment any discussed in this article.
Shown in Figure 34 is have the first conductor 110 be deposited, the spherical diode 155 of multiple essence, insulator 135, second conductor 140 and the exemplary substrates 100 of the 3rd conductor 145 or the perspective view of 100F according to device 600 embodiment of teachings of the present invention.Shown in Figure 35 is have the first conductor 110 be deposited, the spherical diode of multiple essence 155, insulator 135, second conductor 140, the 3rd conductor 145 and (being suspended among a polymer (resin or other adhesive) 165) exemplary substrates 100 of multiple lens 150 or the perspective view of 100F according to device 600 embodiment of teachings of the present invention.Shown in Figure 36 is have the first conductor 110 be deposited, the spherical diode of multiple essence 155, insulator 135, second conductor 140, the 3rd conductor 145 and (being suspended among polymer (resin or other adhesive) 165) exemplary substrates 100 of multiple lens 150 or the cutaway view (running through 72-72 ' plane) of 100F according to device 600 embodiment of teachings of the present invention.Mentioned by above, the difference of device 600 embodiment and so far other device be in this first conductor 110, this insulator 135, this second conductor 140 (and the 3rd conductor 145) each all can be formed corresponding individual layer, and multiple discrete conductors of non-corresponding and insulator.Although not separately display in figure; But, this substrate also may for and/or comprise above for any further feature pattern that substrate 100 to 100G discusses, such as, conductive through holes 280,285, or conducting back plane, or various coating or layer 250,260,270.As as shown in this exemplary device 600, any one or more that voltage may be applied in (in luminescence application) crosses in this first conductor 110 and the second conductor 140 (and/or the 3rd conductor 145) is put or region, or, any one or more point or the areas accept voltage (in photovoltaic application) in this first conductor 110 and the second conductor 140 (and/or the 3rd conductor 145) may be crossed over, such as, be applied to and be received from the side (transverse direction) of this device 600, or, via above for other mechanism mentioned by other device embodiment any (such as, when device 600 comprises one or more conductive through holes 280 further, 285 and/or conducting back plane time).As shown in the figure, non-essential 3rd conductor 145 can be formed single conducting wire, such as, above this second conductor 140 or the inside there is grid pattern.As discussion above, those various layers any all can via any deposition, printing, coating, sputter, rotation die casting ... wait processing procedure to deposit.Although resulting device 600,600A and/or 600B do not provide other row addressability, row addressability or an address pixels ability; But, its function in fact can be identical with other device embodiment any discussed in this article.
Shown in Figure 37 is the perspective view with the 9th exemplary substrates 100H of the first conductor 110, first conductor (or conduction) adhesion layer 110A, multiple substrate particle 120 and one or more insulator 135 according to device 700 embodiment of teachings of the present invention.Shown in Figure 38 is the cutaway view (running through 73-73 ' plane) with the 9th exemplary substrates 100H of the first conductor 110, first conductor (or conduction) adhesion layer 110A, multiple substrate particle 120 and one or more insulator 135 according to device 700 embodiment of teachings of the present invention.Concerning this one exemplary embodiment, the monnolithic case factor and having that substrate 100H shown in figure has a substantial planar drops on the level and smooth first surface of essence inside pre-set tolerance or side and (and does not comprise any recess, passage or groove 105, for example, can not become netted) (essence level and smooth and the substrate 100H of substantial planar), and first conductor 110 can be formed single, unitary layer, such as, the aluminum plate made in advance.The support that looking closely is provided by this first conductor 110 is determined, and this substrate 100H can optionally be included into, and provides the electric insulation of this first conductor via other mechanism (such as, package shell (in figure not separately display)).In addition, in this one exemplary embodiment, can use the first conductor (or conduction) adhesion layer 110A that multiple substrate particle 120 is adhered to this first conductor 110 and in order to create nurse contact difficult to understand between described multiple substrate particle 120 and this first conductor 110, and for example, this first conductor (or conduction) adhesion layer 110A may comprise the conducting polymer of anisotropic conduction adhesive or polymer or other type discussed above, resin or adhesive.After any method discussed above of use deposits multiple substrate particle 120, the insulation of any type discussed above or dielectric material just can be used to carry out depositing insulating layer, in order to form insulator 135.
Shown in Figure 39 is have according to exemplary device 700 embodiment of teachings of the present invention the first conductor 110 be deposited, first conductor (or conduction) adhesion layer 110A, substrate (or semiconductor) layer that utilization has deposited or region 255A are formed on the multiple diodes 155 above multiple substrate particle 120, insulator 135, the perspective view of the 9th exemplary substrates 100H of the second conductor 140 and multiple lens 150 (being suspended among polymer (resin or other adhesive)).Shown in Figure 40 is have according to exemplary device 700 embodiment of teachings of the present invention the first conductor 110 be deposited, first conductor (or conduction) adhesion layer 110A, substrate (or semiconductor) layer that utilization has deposited or region 255A are formed on the multiple diodes 155 above multiple substrate particle 120, insulator 135, 9th exemplary substrates 100H of the second conductor 140 and multiple lens 150 (being suspended among polymer (resin or other adhesive)) the cutaway view of the 9th exemplary substrates.As above with reference to the discussion of figure 15, concerning this one exemplary embodiment, diode 155 comprises the layer or region 255A that are coupled to substrate particle 120, in order to form junction 275.
For example, in the multiple substrate particles 120 comprising the semiconductor with first most carrier (for example, p+ or n+), can create and there is second most carrier (for example, corresponding n+ or p+) layer or region 255A, also can form junction 275.For example, but not any restriction, concerning semiconductor substrate particle 120, this junction 275 is pn (or PN) junction 275 normally, and concerning organic or polymeric substrates particle 120, this junction 275 can be regarded as the junction between the organic layer being used for creating OLED or PLED or polymeric layer.In one exemplary embodiment 700 shown in the figure, in deposition manufacture process (such as, make electricity consumption starch deposition or sputter) a part in, for there is first most carrier (for example, p+ silicon) semiconductor-based board type, there is second most carrier (for example, N-shaped alloy, such as, the silicon of Doping Phosphorus) semiconductive material can be deposited over first or upper section of described multiple substrate particle 120 and the top (top) of one or more insulator 135 any, thus it is continuous to form essence, the glazed layer of class or region 255A, multiple junction 275 can be formed on the top of the part contacting described substrate particle 120 in this layer or region 255A.Being deposited the second most carrier (N-shaped) semiconductive material and can forming continuous print semiconductor body with substrate particle 120 described in each of this correspondence, such as, continuous crystal or other bond is formed with the upper section of substrate particle 120, thus form the layer or region 255A that are deposited, in this example, this layer or region 255A are that meeting defines n-layer or the region 255A of corresponding junction 275 (in this example, it is pn junction 275) with the first most carrier (p-type) semiconductor substrate particle 120.In the one exemplary embodiment shown in figure, the pn junction 275 of described correspondence also can form " cap portion " above this substrate particle 120, and be similarly the bending and shelly of essence, such as, when described multiple substrate particle 120 be essence spherical time it is hemisphere shelly, and same and there is essence plane and smooth pn junction or inside the well portion of semiconductor substrate, there is essence plane and the typical prior art diode of smooth pn junction is obviously different.On the contrary, first most carrier (p-type) layer or region 255A may be formed on the top of the second most carrier (N-shaped) substrate particle 120, and can be regarded as equivalence and drop on equally inside category of the present invention.After deposition one deck or region 255A, just mode one or more the second conductor 140 (and optionally depositing one or more the 3rd conductor 145) and multiple lens 150 (being suspended among polymer (resin or other adhesive) 165) can be deposited, in order to form exemplary device 700 embodiment as discussed above.
Mentioned by above, and duplicate in device 600 embodiment, the difference of this device 700 embodiment and so far other device be in this first conductor 110, first conductor (or conduction) adhesion layer 110A, this insulator 135, this layer or region 255A, this second conductor 140 (and non-essential 3rd conductor 145) each all can be formed corresponding individual layer, and multiple discrete conductors of non-corresponding and insulator.Although not separately display in figure; But, this substrate also may for and/or comprise above for any further feature pattern that substrate 100 to 100G discusses, such as, conductive through holes 280,285, or conducting back plane, or various coating or layer 250,260,270.As as shown in this exemplary device 700, any one or more that voltage may be applied in (in luminescence application) crosses in this first conductor 110 and the second conductor 140 (and/or the 3rd conductor 145) is put or region, or, any one or more point or the areas accept voltage (in photovoltaic application) in this first conductor 110 and the second conductor 140 (and/or the 3rd conductor 145) may be crossed over, such as, be applied to and be received from the side (transverse direction) of this device 700, or, via above for other mechanism mentioned by other device embodiment any (such as, when device 700 comprises one or more conductive through holes 280 further, 285 and/or conducting back plane time).Although not separately display in figure; But, non-essential 3rd conductor 145 can be formed single conducting wire, such as, above this second conductor 140 or the inside there is grid pattern, as discussion above and diagram.In addition, as discussion above, those various layers any all can via any deposition, printing, coating, sputter, rotation die casting ... wait processing procedure to deposit.Although resulting device 700,700A and/or 700B do not provide other row addressability, row addressability or an address pixels ability; But, its function in fact can be identical with other device embodiment any discussed in this article.
The personage haveing the knack of this technology just can understand, and can use any amount of first conductor 110, insulator 135, second conductor 140 and/or the 3rd conductor 145 inside the category of the invention of advocating herein.In addition, except the parallel orientation of the essence shown in Fig. 1 to 33, also may have the orientation of all kinds and configuration that are made up of described multiple first conductors 110 in any described device 200,300,400,500, multiple insulator 135 and described multiple second conductor 140 (and any correspondence of being merged in and one or more the 3rd conductor 145 non-essential).For example, described multiple first conductor 110 and to be somebody's turn to do (s) multiple second conductor 140 may (it can define multiple row and multirow) perpendicular to one another, definition pictorial element (pixel) can be used in order to do making their overlapping area and can separate and independent addressing.When described multiple first conductor 110 and in being somebody's turn to do (s) multiple second conductor 140 any one or both can be embodied as have predetermined width separate and essence parallel straight line time (both all define multiple row or both all define multirow), just can also by row and/or row come addressing they, for example, but not any restriction, sequentially addressing by column.In addition, mentioned by above, described multiple first conductor 110 and in being somebody's turn to do (s) multiple second conductor 140 any one or both also all can be embodied as one deck or thin plate.
As shown above, for example, but not any restriction, described multiple diode 155 (doping via Material selec-tion and correspondence) can be configured to photovoltaic (PV) diode 155 or LED155.Shown in Figure 41 is the calcspar of the first system embodiment 350 according to teachings of the present invention, and wherein, described multiple diode 155 is the LED being embodied as any type or color.This system 350 comprises: device 200A, 300A, 400A, 500A, 600A, 700A, and it has the multiple diodes 155 being embodied as LED; Power supply 340; And also may comprise non-essential controller 320.When one or more first conductor 110 and one (or multiple) second conductor 140 (and described one or more the 3rd conductor 145 non-essential) by energy supply time, such as, via applying corresponding voltage (for example, from power supply 340), energy will be provided in described multiple LED (155) one or more, when described conductor and insulator are embodied as individual layer separately, this energy can be provided to whole device 600A, or, at device 200A, 300A, 400A, in 500A this energy then can be provided to described by the first conductor 110 of energy supply and (multiple) second conductor 140 corresponding intersection point (overlapping area) place (for example, it can define pixel, thin plate or column/row), this can depend upon their orientation and configuration.Accordingly, give described first conductor 110 by optionally energy supply and to be somebody's turn to do (s) the second conductor 140 (and/or the 3rd conductor 145), device 200A, 300A, 400A, 500A (and/or system 350) just can provide a kind of can the dynamic display of address pixels or luminescence component or signboard ... etc.For example, described multiple first conductor 110 may comprise corresponding several column, it is capable that the second conductor 140 (and described one or more the 3rd conductor 145 non-essential) being somebody's turn to do (s) multiple printing opacity then comprises corresponding plural number, and each pixel is all defined by the intersection point of respective column and corresponding row or overlap.When described multiple first conductor 110 and to be somebody's turn to do (s) multiple printing opacity the second conductor 140 (and/or described 3rd conductor 145) in any one or both all can be embodied as unitary formula thin plate time, such as, in device 600A, similarly, for example, conductor 110,140 (and/or 145) described in energy supply will supply electrical power to essence all (or major part) described multiple LED (155), such as, in order to allow luminescence component or static display (such as, signboard) luminescence.
Continue with reference to Figure 41, device 200A, 300A, 400A, 500A, 600A, 700A can via many circuits or connector 310 (for example, it may be the connector of two or multiple correspondence or may be similarly the form of bus) be coupled to control bus 315, in order to be coupled to controller (or, the saying of equivalence is control logic square) 320, and/or in order to be coupled to power supply 340, this power supply 340 may be DC power supply (such as, battery or photovoltaic cell born of the same parents) or AC power supplies (such as, domestic power supply or building power supply).When this controller 320 is implemented, such as, in addressable active display system 350 embodiment and/or in dynamic light-emitting display system 350 embodiment, maybe can know as known in electronic technology, this controller 320 can be used to control energy supply to described LED (155) (through described various multiple first conductor 110 and the second conductor 140 (and described one or more the 3rd conductor 145 non-essential) being somebody's turn to do (s) multiple printing opacity), and generally includes processor 325, memory 330 and I/O (I/O) interface 335.When this controller 320 is not implemented; such as; in various luminescent system 350 embodiment (these normally unaddressable and/or non-dynamic active display system 350 embodiments); this system 350 usually can be coupled to electrically or electronic switch (in figure not separately display); this switch may comprise the handover configurations of any suitable type; such as, for starting luminescent system, closing the brightness of luminescent system and/or adjustment luminescent system.
" processor " 325 may be controller or the processor of any type, and can is now one or more processor 325 by tool, in order to implement function discussed in this article.Processor one word as used herein, processor 325 may comprise use single IC for both (IntegratedCircuit, IC), or, use may be comprised be joined together, be arranged on together or by group's multiple integrated circuit together or other assembly, such as, controller, microprocessor, digital signal processor (DigitalSignalProcessor, DSP), parallel processor, multi-core processor, customized IC, ASIC(Application Specific Integrated Circuit) (ApplicationSpecificIntegratedCircuit, ASIC), can field programmable gate array (FieldProgrammableGateArray, FPGA), adaptive computation IC, the memory be associated (such as, RAM, DRAM and ROM) and other IC and assembly.Therefore, processor one word used herein should be understood to that equivalence means and comprises single IC, or multiple customized IC, multiple ASIC, multiple processor, multi-microprocessor, multiple controller, multiple FPGA, multiple adaptive computation IC or the arrangement of other group specific of integrated circuit of the function hereafter discussed can be implemented, it has the memory be associated, such as, microprocessor memory or extra RAM, DRAM, SDRAM, SRAM, MRAM, ROM, FLASH, EPROM or E
2pROM.One processor (such as, processor 325), and its memory be associated, (through sequencing, FPGA interconnection or hard coiling) can be adapted or be configured to use to implement the method, such as, selectivity address pixels in dynamic display embodiment, or column/row addressing (such as, for signboard embodiment).For example, the method can be used as batch processing instruction or other coding (or the configuration of equivalence or other program) and be programmed and be stored in one and have among the processor 325 of its associated memory (and/or memory 330) and other equivalent elements, (namely, start and when playing function) reaches the object of follow-up execution so that when this processor operates.Equivalence speech, when this processor 325 all or part ofly can be implemented as FPGA, customized IC and/or ASIC, described FPGA, customized IC or ASIC can also be designed, configure and/or coiling firmly, in order to implement method of the present invention.For example, this processor 325 can be embodied as the arrangement of multiple processor, multiple controller, multi-microprocessor, multiple DSP and/or ASIC, be referred to as " controller " or " processor ", they can be programmed individually, design, adjust or be configured to coordinate memory 330 to implement method of the present invention.
There is the processor of its associated memory (such as, processor 325) (through sequencing, FPGA interconnection or hard coiling) may be configured in order to control energy supply to (apply voltage to) described various multiple first conductor 110 and the second conductor 140 (and/or described one or more the 3rd conductor 145 non-essential) being somebody's turn to do (s) multiple printing opacity, to conform to the control will carried out the information be shown.For example, static or time become monitor information can be used as batch processing instruction (or the configuration of equivalence or other program) be programmed and store, configure and/or hard coiling among the processor 325 with its associated memory (and/or memory 330) and other equivalent elements, to reach the object of follow-up execution when this processor operates.
Memory 330 may comprise data storing body (or database), it is existing that this memory 330 can carry out tool in any number of forms, it comprises tool now known or following obtainable any computer or other machine-readable data Storage Media at present, memory assembly or in order to store or exchange message other store or communication part inside, it comprises, but be not limited to, memory integrated circuit (IC), or the memory portion in integrated circuit (such as, residence memory inside processor 325), no matter be evaporation type or non-volatile formula, no matter be extraction-type or non-extraction-type, it comprises, but be not limited to, RAM, FLASH, DRAM, SDRAM, SRAM, MRAM, FeRAM, ROM, EPROM or E
2the memory assembly of PROM or other form any, such as, the memory of magnetic hard-disk machine, CD-ROM drive, disk or magnetic tape station, Winchester disk drive, other machine-readable or memory medium, such as, floppy disk, CDROM, CD-RW, digital multi disc (DigitalVersatileDisk, DVD) or other optical memory or the memory of known or following obtainable other type any, Storage Media or data memory devices or circuit at present, look closely this selected embodiment and determine.In addition, this computer fetch medium comprise with data signals or through modulation signal (such as, electromagnetic type or optical carrier or other transmission mechanism) come the existing computer-readable instruction fetch of tool, data structure, program module or any form communication medium of other data, it comprises any information delivery media, data or out of Memory can be coded among a signal by a wired or wireless manner, and this signal comprises electromagnetic riveting machine signal, optical signal, sound signal, RF signal or infrared light signal ... etc.This memory 330 may be adapted to store the various form (such as, database table) looking into value table, parameter, coefficient, out of Memory and data, (software of the present invention) program or instruction and other type.
As shown above, for example, software of the present invention and data structure can be used to carry out this processor 325 of sequencing, to implement method of the present invention.Therefore, System and method for of the present invention can by the existing software for providing these sequencing or other instruction of tool, such as.By one group of instruction inside the present computer fetch medium of tool and/or metadata, it was discussed hereinbefore.In addition, metadata can also be used to define the various data structures looked in value table or database.For example, but not any restriction, this software may have the form of source code or object code.Source code can be compiled into instruction or the object code (it comprises assembler language, instruction or configuration info) of certain form further.Software of the present invention, source code or metadata can be now all the coding of any type by tool, such as, C, C++, SystemC, LISA, XML, Java, Brew, SQL and version thereof or other type program language any in order to implement function discussed in this article, it comprises various hardware definition or simulation hardware language (for example, Verilog, VHDL, RTL) and the Data Base Pile (for example, GDSII) that generates.Therefore, equivalence uses herein " structure ", " program structure ", " software construction " or " software " all means and represents any procedural language of any kind with any grammer or stamped signature, its can provide or can be translated into provide specified functions associated or method (for example, when it is cited or be loaded on one to comprise among the processor of this processor 325 or computer and to be performed time).
Software of the present invention, position archives (the object code of metadata or other source code and any generation, database, or look into value table) all can be become the instruction of embodied on computer readable by (such as the data storage medium of any computer or other machine-readable) inside the present any tangible Storage Media of tool, data structure, program module, or other data, such as, discuss for memory 330 above, for example, floppy disk, CDROM, CD-RW, DVD, magnetic hard-disk machine, the data memory device of CD-ROM drive or other type any or media, mentioned by above.
I/O interface 335 can be embodied as interface that is known in this technology or that may know, and may comprise: impedance matching capability; For the voltage transition of low voltage processors, for example, high voltage control bus 315 is connect in order to be situated between; Various handover mechanism (for example, transistor), to start in response to the signaling from this processor 325 or to close each bar circuit or connector 310; And/or physical couplings mechanism.In addition, this I/O interface 335 can also be adapted in order to system 300 external reception and/or transmit signal, such as, via hard coiling or RF signaling, for example, in order to real-time reception information to control a dynamic display.
For example, exemplary the first system embodiment 350 comprises device 200A, 300A, 400A, 500A, 600A, 700A, and wherein, described multiple diode 155 is light-emitting diode, and I/O interface 335, in order to connect any various standard Edison slots of lighting bulb.Continue this example and without any restriction, the size and shape of this I/O interface 335 can be designed to conform to standardized spiral configuration described in one or more, such as, E12, E14, E26 and/or E27 spiral base standard, such as, medium-sized spiral base (E26) or candleholder-type spiral base (E12), and/or, for example, other various standard that American National Standards Institute (ANSI) (AmericanNationalStandardsInstitute, ANSI) and/or German Illuminating Engineeering Society (IlluminatingEngineeringSociety) announce.In other one exemplary embodiment, the size and shape of this I/O interface 335 can be designed to the fluorescent lamp bulb slot of the standard that conforms to or two slotting base, similarly, for example, but does not have any restriction, such as GU-10 base.This exemplary the first system embodiment 350 can also be considered as the device of another kind of type by equivalence, for example, but not any restriction, especially when having the form factor that can be used for and be inserted in Edison or fluorescence slot.
Except the controller 320 shown in Figure 41, the personage haveing the knack of this technology just can understand, and in this technology, known control circuit system configuration, layout, kind and the type knowing countless versions equivalence, all drops on inside category of the present invention.
As shown above, described multiple diode 155 (doping via Material selec-tion and correspondence) can also be configured to photovoltaic (PV) diode 155.Shown in Figure 42 is the calcspar of second system embodiment 375 according to teachings of the present invention, and wherein, described multiple diode 155 is embodied as photovoltaic (PV) diode 155.This system 375 comprises: device 200B, 300B, 400B, 500B, 600B, 700B, and it has the multiple diodes 155 being embodied as photovoltaic (PV) diode 155; And one energy storage component 380 (such as, battery) or in order to transmit electric power to energy operative installations or system or Energy distribution device or system (for example, such as, electric assembly or electric installation) interface circuit 385 in any one or both.(in other one exemplary embodiment not comprising interface circuit 385, other Circnit Layout may be used directly to provide energy or electric power to this energy operative installations or system or Energy distribution device or system).Inside this system 375, device 200B, 300B, 400B, 500B, 600B, one or more first conductor 110 described of 700B can be coupled to form first terminal (such as, negative terminal or positive terminal), and this device 200B, 300B, 400B, 500B, 600B, 700B's to be somebody's turn to do (s) one or more second conductor 140 (and/or the 3rd conductor 145) and then can be coupled to form the second terminal (such as, corresponding positive terminal or negative terminal), then, they just can be coupled to circuit or connector 310, so that any one or both that are connected in energy storage component 380 or interface circuit 385.When light (such as, sunlight) be incident on device 200B, 300B, 400B, 500B, 600B, (as discussion above time in described multiple spherical lens 150 of 700B, angle from various scope), this light just can be collected on one or more photovoltaic (PV) diode 155, then, described photovoltaic (PV) diode 155 can convert incident photon to electronics-electric hole pair, thus make output voltage can cross over described first terminal and the second terminal is produced, and any one or both that can be output in energy storage component 380 or interface circuit 385.
Shown in Figure 43 is the flow chart of embodiment of the method according to teachings of the present invention, its be for the formation of or manufacturing installation 200,300,400,500,600,700, and provide practical explanatory memorandum.The method starts from and starts step 702, it can deposit multiple first conductor (110), usually in the multiple channel of correspondence (recess, channel or the groove 105) the inside of a substrate (100 to 100G), such as, by printing conductive inks or polymer or utilize one or more metal to carry out sputter or be coated with this substrate (100 to 100G), then, solidification or this electrically conductive ink partially cured or polymer, or may remove from each spine or bizet 115 metal deposited, look closely modus operandi and determine, step 705.Again, look closely modus operandi and determine, extra step can be used to form substrate 100, such as, make this substrate and/or recess, passage or groove 105, newly-increased reflectivity or refractiveness coating 270, or there is the reflector of coating (260), refractor or face mirror 250 (for example, optics grid, Bragg reflector), or newly-increased conducting back plane (290) and multiple perforation (280,285).Then, normally to be suspended among adhesive or other compound or mixture (for example, be suspended among volatile solvent or reactive solvents) multiple substrate particles 120 can be deposited over above described multiple first conductor, normally in the path 10 5 of correspondence, step 710, and it is usually same via printing or coating, to form nurse contact difficult to understand (for example between described multiple substrate particle 120 and one or more first conductor described, but not any restriction, it may also relate to various chemical reaction, compression and/or heating).
Above multiple substrate particle 120 as described in being deposited over for one or more alloy (also equivalence is called dopant compound) in OLED modus operandi (discussion as above) or extra organic luminous layer, usually same via printing or coating, then, can heat them where necessary, energy supply or solidification (such as, via radium-shine or thermal annealing or alloying), to form corresponding multiple diodes 155, step 715, such as, photovoltaic (PV) diode, LED or OLED.Above the corresponding Part I that insulating material (being such as suspended in the granular dielectric compound among polymer or adhesive) then can be deposited over described multiple diode 155 (and being then cured or being heated), such as, with the surrounding of described diode 155 for benchmark, step 720, to form one or more insulator 135.Then, one or more second conductor (they may or may can not printing opacity) can be deposited to the corresponding Part II of described multiple diode 155, such as, be deposited over described insulator 135 top and with the surrounding of described diode 155 for benchmark, and then can be cured (or being heated), step 725, similarly, to form the nurse contact difficult to understand between one or more second conductor (140) described and described multiple diode 155.In one exemplary embodiment, such as, in addressable display, described multiple (printing opacity) second conductor 140 in fact can by orientation become perpendicular to described multiple first conductor 110.Optionally, then, the top of one or more (printing opacity) second conductor of described correspondence that one or more the 3rd conductor (145) can be deposited over (and solidify or be heated), step 730.
The another kind of selectivity practice is, in step 735, can embodiment testing examination, there is no function or defective diode 155 can be removed or forbidden energy.For example, in PV diode, radium-shine or other light source can be utilized to scan this surface (the first side) of device of completing of part, and, when region (or individual diode 155) does not provide the electrical response of expection, just can use high strength radium-shine or other remove technology to remove this region (or individual diode 155).In addition, for example, in the light-emitting diode that power supply has been opened, optical sensor can be utilized to scan this surface (the first side), and, when region (or individual diode 155) do not provide the light output of expection and/or absorption exceed the quata electric current (namely, electric current exceedes default number) time, just can use equally high strength radium-shine or other remove technology to remove this region (or individual diode 155).Look closely modus operandi and determine, such as, looking closely does not have function or how defective diode 155 is removed and determines, and testing procedure 735 just can also be implemented after the step 740 hereafter discussed or 745.Then, multiple lens (150) (their same suspension polymers of meeting usually, among adhesive or other compound or mixture, in order to be formed with lensing or lens particle ink or suspension) just can be placed or be deposited on the top of described multiple spherical diode 155, step 740, it is equally normally via printing, or, the lens panel comprising the prior formation of the multiple lens 150 be suspended among polymer can be attached to the first side of the device that this partly completes (such as, via a stacking processing procedure), then can deposit (such as, via printing) any non-essential protective coating (and/or selected color), step 745, and can the method be terminated, return step 750.
Although the present invention was described with reference to specific embodiment herein; But, those embodiments only have explanatory and do not limit the present invention.In explanation herein, provide many clear and definite details, such as, the example of electronic building brick, electronics and structural connectivity, material and structural variation, so that complete understanding embodiments of the invention.But, the personage haveing the knack of this technology just can understand, and does not have clear and definite details described in one or more, or, utilize other device, system, assembly parts, assembly, material, part ... wait and also can carry out embodiments of the invention.Can not clearly show or describe in detail the structure known by crowd, material or operation in other example, in order to avoid obscure the viewpoint of embodiments of the invention.The personage haveing the knack of this technology also can understand further, extra or equivalent method step can be used, or can in combination with other steps, or order that can be different is implemented, among them any one and all drop on the invention of advocating herein category inside.In addition, described various graphic not according to scale and should not be regarded as that there is limited significance.
Mention " wherein an embodiment " in whole part specification, " embodiment ", or one specific " embodiment " mean that and coordinate a special characteristic, structure or feature described in this embodiment to be included among at least one embodiment of the present invention, and may not be included among all embodiments, and further it, and identical embodiment may not be referred to.Moreover, described special characteristic, the structure of any specific embodiment of the present invention or feature all any suitable mode can combine or can carry out any suitable combination with one or more other embodiment, it comprises the feature using and select, and correspondingly need not use other feature.In addition, many corrections can also be carried out, to allow a certain special applications, situation or material be adapted to basic categories of the present invention and spirit.Will be appreciated that and can carry out other with graphic embodiments of the invention change with correction and the part that can be regarded as spirit of the present invention and category illustrated herein according to teachings herein.
Also it is clear that one or more in described graphic middle drawn component also can be implemented in mode that is more discrete or that integrate, or even can be removed in particular case or cannot operate, this may be quite practical in special application.The multiple assembly of integrally formed combination drops on inside category of the present invention equally, especially multiple discrete component separation or combine ambiguous or cannot in the embodiment of identification.In addition, " being coupled " used herein one word (comprise its various forms, such as, " coupling " or " can be coupled ") mean that and comprise any directly or indirectly electric, structural or magnetic couplings, connection or attachment, or this type of directly or indirectly electric, structural or magnetic couplings, the adjusting or function of connection or attachment, its comprise integrally formed assembly and through or the assembly that is coupled via another assembly.
For reaching object of the present invention, " LED " used herein one word and plural form " multiple LED " thereof should be understood to comprise any electroluminescent diode or the system on basis or system by junction based on can be emitted as to other type producing radiation by carrier in response to electrical signal, it comprises, but be not limited to, in response to curtage luminescence, (it comprises visible spectrum or has any bandwidth in meeting, other spectrum of any color or colour temperature, such as, ultraviolet light or infrared light) various structure based on semiconductor or the structure based on carbon, light emitting polymer, organic LED ... etc.For reaching object of the present invention, " photovoltaic diode (or PV) " word also used herein and plural form " multiple PV " thereof should be understood to comprise any photovoltaic diode or can in response to projectile energy (such as, light or other electromagnetic wave) produce electrical signal (such as, voltage) other type be emitted as system or the system based on junction on basis by carrier, it comprises, but be not limited to, can in response to light (its other spectrum comprising visible spectrum or there is any bandwidth or spectrum, such as, ultraviolet light or infrared light) produce or various structure based on semiconductor that electrical signal is provided or the structure based on carbon.
Moreover unless explicitly stated otherwise, any signal arrow in described figure/graphic all should be understood to be only exemplary, and does not have limited significance.The combination of the composition of step can be regarded as dropping on inside category of the present invention equally, especially in the ambiguous place maybe cannot predicted of ability be separated or combine.Unless indicated otherwise, otherwise disjunctive "or" used in whole claim herein and below has substantially " and/or " meaning, it has the meaning (and not being confined to the meaning of " mutual exclusion or (exclusiveor) ") of conjunction and disjunctive concurrently.Unless the clear regulation of interior literary composition, otherwise herein in specification and whole claim below used " one ", " one " and the meaning of " being somebody's turn to do " comprise plural references.Similarly, unless the clear regulation of interior literary composition, otherwise herein used in specification and whole claim below " ... among " meaning comprise " ... among " and " ... on " meaning.
The present invention illustrate that (comprising described in summary of the invention or abstract of invention) is not exhausted or limit the present invention to the intention of cutting blocks for printing in form disclosed herein before the embodiment explained.Can notice from above, the invention is intended to contain many change case, fixed case and replace example, and they can be implemented and can not depart from spirit and the category of novel concept of the present invention.It should also be understood that, purpose of the present invention or should infer, the ad hoc approach explained herein and device are without any restriction.Certainly, the present invention wishes to be contained by the claim of enclosing, and these fixed cases all drop on inside the category of described claim.
Claims (86)
1. a device, it comprises:
Substrate, it comprises the passage of multiple separation;
Multiple first conductor, they are coupled to described substrate, and each first conductor is all arranged among the passage of the correspondence of the passage of described multiple separation;
Multiple diode, they are coupled to described multiple first conductor, wherein in all described multiple diodes each diode surface in 10 five to percent five ten five have penetrated bed or region, described penetrated bed or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy;
Multiple second conductor, they are coupled to described multiple diode; And
Multiple lens, they at least have first refractive rate, and described multiple lenses suspended at least has among the second different refractive index first polymer.
2. device according to claim 1, wherein, described multiple diode is selected from following group: spherical diode, toroid diode, column diode, multiaspect shape diode, rectangle diode, planar diode, oval diode and above-mentioned mixing.
3. device according to claim 1, wherein, described multiple lens are spherical and comprise borosilicate glass or polystyrene latex.
4. device according to claim 1, wherein, described multiple diode is spherical, and described multiple lens are spherical, and the ratio of the average diameter of the average diameter of wherein said multiple lens and described multiple diode is five to one.
5. device according to claim 1, wherein, described multiple diode is spherical, and described multiple lens are spherical, and the ratio of the average diameter of the average diameter of wherein said multiple lens and described multiple diode between ten to one and two-to-one between.
6. device according to claim 5, wherein, the contrast size of described multiple lens or interval supply a pattern and are coupled to described multiple diode.
7. device according to claim 1, wherein, the average diameter of described multiple diode or length are greater than 20 microns and are less than 40 microns.
8. device according to claim 1, wherein, described multiple diode is selected from following group: semiconductor light-emitting-diode, Organic Light Emitting Diode, polymer LED, photovoltaic diode and above-mentioned mixing.
9. device according to claim 1, wherein, described multiple diode comprises the semiconductor that one or more is selected from following group: gallium nitride, GaAs, silicon and above-mentioned mixing.
10. device according to claim 1, it comprises further:
Multiple 3rd conductor, they are coupled to described multiple second conductor.
11. devices according to claim 1, wherein, described substrate comprises reflector or refractor further.
12. devices according to claim 1, wherein, described substrate comprises Bragg reflector or reflectivity plastics or polyester coating further.
13. devices according to claim 1, it comprises multiple conductive through holes further, and they to extend between the first side of described substrate and the second side and are coupled to described multiple first conductor in described first side place.
14. devices according to claim 13, wherein, described substrate comprises conducting back plane further, and it is coupled to described multiple conductive through holes and is coupled to or is integrated into described second side of described substrate.
15. devices according to claim 13, wherein, described multiple conductive through holes comprises multiple random distribution, spherical conductor.
16. devices according to claim 1, it comprises further:
Multiple insulator, they are coupled to each in described multiple diode by correspondence and comprise multiple inorganic dielectric particle, and described multiple inorganic dielectric particle is suspended among the second polymer or resin together with light initiator compound.
17. devices according to claim 1, it comprises further:
Multiple insulator, they are coupled to each in described multiple diode by correspondence and comprise light initiator compound and the second polymer or resin.
18. devices according to claim 1, wherein, described substrate has the smooth monnolithic case factor, and it has or does not have surface characteristics pattern, and thickness is less than two millimeters.
19. devices according to claim 1, wherein, described substrate comprises one of them material below: paper, have the paper of coating, the paper that plastic material has coating, card-cut paper, fibre paper, hardboard, placard paper, placard cardboard, timber, plastics, rubber, fabric, glass, pottery and above-mentioned mixing.
20. devices according to claim 1, wherein, the passage of described multiple separation is parallel.
21. devices according to claim 1, wherein, the passage of described multiple separation is hemispherical at least partly and can be arranged in array.
22. devices according to claim 1, wherein, the passage of described multiple separation is parabolical at least partly.
23. devices according to claim 22, wherein, described substrate comprises multiple angled spine further.
24. devices according to claim 1, wherein, the passage of described multiple separation comprises multiple integrally formed protuberance or support portion further.
25. devices according to claim 24, wherein, described multiple first conductor is coupled to described multiple integrally formed protuberance inside the passage of described multiple separation or support portion, and described multiple diode by alloying or be annealed or by chemical Coupling to described multiple first conductor.
26. devices stated according to claim 1, wherein, described multiple first conductor comprises the electrically conductive ink solidified or the conducting polymer solidified.
27. devices according to claim 1, wherein, described multiple first conductor comprises one of them person in the types of conductors of cured form below: silver conductive ink, copper electrically conductive ink, golden electrically conductive ink, aluminium matter electrically conductive ink, tin matter electrically conductive ink, carbonaceous electrically conductive ink, carbon nanotube polymer, conducting polymer and above-mentioned mixing.
28. devices according to claim 1, wherein, described multiple first conductor includes sputter, have coating, have vapour deposition or have the metal of plating, metal alloy or the combination of various metals.
29. devices according to claim 28, wherein, the combination of described metal, metal alloy or various metals comprises at least one metal be selected from following group: aluminium, copper, silver, nickel, gold and above-mentioned mixing.
30. devices according to claim 1, wherein, described multiple second conductor comprises and is suspended in printing opacity conductor among polymer, resin or medium or conductive compound.
31. devices according to claim 30, wherein, described multiple second conductor comprises and is suspended at least one material among polymer, resin or medium or compound, and described material or compound are selected from following group: carbon nanotube, antimony tin, tin indium oxide, poly-ethylenedioxythiophene and above-mentioned mixing.
32. devices according to claim 1, wherein, described multiple diode is coupled to described multiple first conductor by adjacent or be positioned at inside described multiple first conductor.
33. devices according to claim 1, wherein, described multiple diode by adjacent be annealed or alloying to described multiple first conductor or be positioned at inside described multiple first conductor.
34. devices according to claim 1, wherein, described multiple diode by chemical Coupling to described multiple first conductor or be positioned at inside described multiple first conductor.
35. devices according to claim 1, it comprises further:
For being inserted into the interface among standard luminescent slot.
36. devices according to claim 1, it comprises further:
With the interface of E12, E14, E26, E27 or GU-10 emission standards compatibility.
37. devices according to claim 1, it comprises further:
For being inserted into the interface among the luminous slot of standard Edison-type.
38. devices according to claim 1, it comprises further:
For being inserted into the interface among the luminous slot of standard fluorescence type.
39. 1 kinds of devices, it comprises:
Substrate;
At least one first conductor, is coupled to described substrate;
Multiple diode, be coupled at least one first conductor described, wherein in all described multiple diodes each diode surface in 10 five to percent five ten five have penetrated bed or region, described penetrated bed or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy;
At least one second conductor, is coupled to described multiple diode; And
Multiple lens, to be suspended among the first polymer and to be coupled to described multiple diode.
40. as the device of claim the 39th, and wherein, described multiple lens at least have a first refractive rate and described first polymer at least has one second, different refractive indexes.
41. according to device according to claim 39, wherein, described multiple diode is spherical, and described multiple lens are spherical, and the ratio of the average diameter of the average diameter of wherein said multiple lens and described multiple diode between ten to one and two-to-one between.
42. according to device according to claim 39, and wherein, the average diameter of described multiple diode or length are greater than 20 microns and are less than 40 microns.
43. according to device according to claim 39, and wherein, described multiple diode is selected from following group: semiconductor light-emitting-diode, Organic Light Emitting Diode, polymer LED, photovoltaic diode and above-mentioned mixing.
44. according to device according to claim 39, and wherein, described multiple diode comprises the semiconductor that one or more is selected from following group: gallium nitride, GaAs, silicon and above-mentioned mixing.
45. according to device according to claim 39, and it comprises further:
At least one the 3rd conductor, is coupled at least one second conductor described.
46. according to device according to claim 39, and wherein, described substrate comprises reflector or refractor further.
47. according to device according to claim 39, and it comprises at least one conductive through holes further, extends between the first side of described substrate and the second side and in described first side place and is coupled at least one first conductor described.
48. devices according to claim 47, wherein, described substrate comprises conducting back plane further, and it is coupled at least one conductive through holes described and is coupled to or is integrated into described second side of described substrate.
49. according to device according to claim 39, and it comprises further:
At least one insulator, is coupled to described multiple diode and comprises multiple inorganic dielectric particle, and described multiple inorganic dielectric particle is suspended among the second polymer or resin together with light initiator compound.
50. according to device according to claim 39, and wherein, described substrate has the smooth monnolithic case factor, and it has or does not have surface characteristics pattern, and thickness is less than two millimeters.
51. according to device according to claim 39, wherein, described substrate comprises one of them material below: paper, have the paper of coating, the paper that plastic material has coating, card-cut paper, fibre paper, hardboard, placard paper, placard cardboard, timber, plastics, rubber, fabric, glass, pottery and above-mentioned mixing.
52. devices stated according to claim 39, wherein, at least one first conductor described comprises the electrically conductive ink solidified or the conducting polymer solidified.
53. according to device according to claim 39, and wherein, at least one first conductor described includes sputter, have coating, have vapour deposition or have the metal of plating, metal alloy or the combination of various metals.
54. according to device according to claim 39, and wherein, at least one second conductor described comprises light penetrating copolymer.
55. according to device according to claim 39, and wherein, described multiple diode is annealed, alloying or chemical Coupling are at least one first conductor described or be positioned at inside at least one first conductor described.
56. according to device according to claim 39, and it comprises further:
For being inserted into the interface among standard luminescent slot.
57. according to device according to claim 39, and it comprises further:
With the interface of E12, E14, E26, E27 or GU-10 emission standards compatibility.
58. according to device according to claim 39, and it comprises further:
For being inserted into the interface among the luminous slot of standard Edison-type.
59. according to device according to claim 39, and it comprises further:
For being inserted into the interface among the luminous slot of standard fluorescence type.
60. 1 kinds of systems, it comprises:
Electrically or the interface of electronics;
Substrate, has the smooth monnolithic case factor, and it has or does not have surface characteristics pattern, and thickness is less than two millimeters;
At least one first conductor, is coupled to described substrate;
Multiple diode, they are coupled at least one first conductor described, wherein in all described multiple diodes each diode surface in 10 five to percent five ten five have penetrated bed or region, described penetrated bed or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy;
At least one second conductor, is coupled to described multiple diode; And
Multiple lens.
61. systems according to claim 60, wherein, described multiple diode is selected from following group: spherical diode, toroid diode, column diode, multiaspect shape diode, rectangle diode, planar diode, oval diode and above-mentioned mixing.
62. as the system of claim the 60th, and wherein, described multiple lenses suspended is among the first polymer, and described multiple lens at least have a first refractive rate and described first polymer at least has one second, different refractive indexes.
63. systems according to claim 30, wherein, the contrast size of described multiple lens or interval supply a pattern and are coupled to described multiple diode.
64. systems according to claim 60, wherein, described multiple lens are selected from following group: spherical, hemispherical, multiaspect shape, ellipse, oblong, cube, prismatic, trapezoidal, triangle, pyramid and above-mentioned mixing.
65. systems according to claim 60, wherein, the average diameter of described multiple diode or length are greater than 20 microns and are less than 40 microns.
66. systems according to claim 60, wherein, described multiple diode is selected from following group: semiconductor light-emitting-diode, Organic Light Emitting Diode, polymer LED, Organic Light Emitting Diode through being encapsulated, photovoltaic diode and above-mentioned mixing.
67. systems according to claim 60, wherein, described multiple diode comprises the semiconductor that one or more is selected from following group: gallium nitride, GaAs, silicon and above-mentioned mixing.
68. systems according to claim 60, it comprises at least one conductive through holes further, extends between the first side of described substrate and the second side and in described first side place and is coupled at least one first conductor described.
69. systems according to claim 68, wherein, described substrate comprises conducting back plane further, and it is coupled at least one conductive through holes described and is coupled to or is integrated into described second side of described substrate.
70. systems according to claim 60, it comprises further:
At least one insulator, is coupled to described multiple diode and comprises multiple inorganic dielectric particle, and described multiple inorganic dielectric particle is suspended among the second polymer or resin together with light initiator compound.
71. systems according to claim 60, wherein, described substrate comprises at least one material below: paper, have the paper of coating, the paper that plastic material has coating, card-cut paper, fibre paper, hardboard, placard paper, placard cardboard, timber, plastics, rubber, fabric, glass, pottery and above-mentioned mixing.
72. systems according to claim 60, wherein, at least one first conductor described comprises at least one conductor below: the combination of the electrically conductive ink solidified, the conducting polymer solidified, carbon nanotube, metal, metal alloy, various metals and above-mentioned mixing.
73. systems according to claim 60, wherein, at least one second conductor described comprises and is suspended in printing opacity conductor among polymer, resin or medium or conductive compound.
74. systems according to claim 60, wherein, described multiple diode be annealed or by alloying or by chemical Coupling at least one first conductor described or be positioned at inside at least one first conductor described.
75. systems according to claim 60, wherein, described multiple lens comprise borosilicate glass or polystyrene latex.
76. systems according to claim 60, wherein, described interface and E12, E14, E26, E27 or GU-10 emission standards compatibility.
77. systems according to claim 60, wherein, described interface is for being inserted among the luminous slot of standard Edison-type.
78. systems according to claim 60, wherein, described interface is for being inserted among the luminous slot of standard fluorescence type.
79. 1 kinds of devices, it comprises:
Substrate, has the smooth monnolithic case factor, and it has or does not have surface characteristics pattern, and thickness is less than two millimeters;
At least one first conductor, is coupled to described substrate;
Multiple diode, be coupled at least one first conductor described, in all described multiple diodes each diode surface in 10 five to percent five ten five have one deck or region, described layer or region have the first most carrier or alloy, and remaining diode base plate then has the second most carrier or alloy;
At least one second conductor, is coupled to described multiple diode; And
Multiple lens or lens arrangement, be coupled to described multiple diode.
80. according to the device described in claim 79, wherein, the average diameter of described multiple lens or length and the described average diameter of multiple diode or the ratio of length between ten to one and two-to-one between.
81. according to the device described in claim 79, and wherein, the average diameter of described multiple diode or length are greater than 20 microns and are less than 40 microns.
82. according to the device described in claim 79, wherein, described multiple diode is selected from following group: spherical diode, toroid diode, column diode, multiaspect shape diode, rectangle diode, planar diode, oval diode, irregular shape diode and above-mentioned mixing.
83. according to the device described in claim 79, and wherein, described multiple diode comprises the one or more semiconductors be selected from following group: gallium nitride, GaAs, silicon and above-mentioned mixing.
84. according to the device described in claim 79, and it comprises further:
At least one conductive through holes, extends between the first side of described substrate and the second side and in described first side place and is coupled at least one first conductor described;
Conducting back plane, it is coupled at least one conductive through holes described and is coupled to or is integrated into described second side of described substrate; And
At least one insulator, is coupled to described multiple diode and comprises multiple inorganic dielectric particle, and described multiple inorganic dielectric particle is suspended among the second polymer or resin together with light initiator compound.
85. according to the device described in claim 79, and wherein, described multiple lens comprise borosilicate glass or polystyrene latex.
86. according to the device described in claim 79, and it comprises further:
Electrically or the interface of electronics.
Applications Claiming Priority (11)
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| US12/560,364 US8456393B2 (en) | 2007-05-31 | 2009-09-15 | Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system |
| US12/560,371 | 2009-09-15 | ||
| US12/560,364 | 2009-09-15 | ||
| US12/560,355 US8456392B2 (en) | 2007-05-31 | 2009-09-15 | Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system |
| US12/560,371 US8133768B2 (en) | 2007-05-31 | 2009-09-15 | Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system |
| US12/560,340 US8384630B2 (en) | 2007-05-31 | 2009-09-15 | Light emitting, photovoltaic or other electronic apparatus and system |
| US12/560,340 | 2009-09-15 | ||
| US12/560,334 US8395568B2 (en) | 2007-05-31 | 2009-09-15 | Light emitting, photovoltaic or other electronic apparatus and system |
| US12/560,355 | 2009-09-15 | ||
| US12/560,334 | 2009-09-15 | ||
| PCT/US2010/048918 WO2011034908A1 (en) | 2009-09-15 | 2010-09-15 | Light emitting, photovoltaic or other electronic apparatus and system and method of making same |
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