CN102686034B - Film coating method for electronic circuit board - Google Patents
Film coating method for electronic circuit board Download PDFInfo
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- CN102686034B CN102686034B CN201210128002.XA CN201210128002A CN102686034B CN 102686034 B CN102686034 B CN 102686034B CN 201210128002 A CN201210128002 A CN 201210128002A CN 102686034 B CN102686034 B CN 102686034B
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- circuit board
- electronic circuit
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- coating
- vacuum
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Abstract
The invention relates to a film coating method for an electronic circuit board. The film coating method comprises the steps of plating a film on the electronic circuit board under vacuum conditions and performing post-treatment, and specifically comprises the following steps: introducing a film-plating material which is vaporized and cracked by heating into a vacuum chamber placing the electronic circuit board, cooling the vacuum chamber, performing vacuum film plating operation on the surface of the electronic circuit board at normal temperature till the thickness of the plated film achieves the requirements, then taking out the electronic circuit board; then performing the post-treatment, that is, removing a film-plated layer at the part of the electronic circuit board, which is required to be exposed outside. Through the vacuum film-plating way, the film-plated layer is uniform and complete, the relatively complete waterproof, moisture-proof and anti-oxidation effects can be ensured, and even for all the small gaps and other dead points in the prior art, the effects are also good; and simultaneously, the processing cost is low, and the film coating method is suitable for mass production. The post-treatment process step can better treat the part to be exposed, and the follow-up processing and the use of the electronic circuit board can not be affected.
Description
Technical field
The present invention relates to electronic circuit plate technique, particularly relate to a kind of film covering method of electronic circuit board.
Background technology
Current electronic product, mostly relies on mould structure to reach waterproof and dampproof effect, but there is following problem:
1. product appearance is limited to waterproof construction, causes product design clumsy, not easily accomplishes compact.
2. the design difficulty of outward appearance and mould improves.
3. must increase extra waterproof material cost.
4. production assembling difficulty is high, and the consistency of processing is poor.
5. water resistance when product just fills after after-sales service, cannot be reached.
Another method is that direct coating material does water-proofing treatment, the coating material of current use adopts Epoxy(epoxy mostly), Urethane(carbamate), Silicone(has base silicon) etc., realize with the technique of spraying, immersion or brushing etc., although also waterproof and dampproof effect can be reached, there is following problem:
1. when producing in enormous quantities, be difficult to the consistency of controlled working.
2. production process easily causes damage to components and parts, increases material cost.
3. carry out after-sales service difficulty large, increase human cost.
4. spray, soak or the coating process of brushing, coating is uneven and cannot go deep into the small finedraw of part, affects waterproof moisture-proof effect.
5. coating material is adding the escaping gas in man-hour, there is certain infringement to the health of operating personnel.
6. easily mould growth destroys coating, affects waterproof moisture-proof effect.
Particularly electronic circuit board is done waterproof, protection against the tide and anti-oxidant treatment time, coating is difficult to accomplish even, complete, and effectively cannot retain the position that needs expose.
Summary of the invention
The invention provides the film covering method of electronic circuit board, prior art coating inequality, incomplete deficiency can be overcome, and the position needing to expose can be processed preferably.
Technical scheme of the present invention is: a kind of film covering method of electronic circuit board, comprise electric wire plate plated film and post-processing step under vacuum, first the heat vaporized and Coating Materials of cracking is passed in the vacuum chamber being placed with electric wire plate, and vacuum chamber is cooled, at normal temperatures vacuum coating operation is carried out to electronic circuit board surface, until take out electronic circuit board when coating film thickness reaches requirement; Then, do reprocessing, namely remove the film plating layer that electronic circuit board needs exsertion part.
The invention has the beneficial effects as follows: by the mode of vacuum coating, make film plating layer more complete, fairly perfect waterproof, protection against the tide and antioxidant effect can be ensured, even if the dead point of the prior aries such as all tiny gaps is no exception, processing cost is low simultaneously, is suitable for producing in enormous quantities.Postprocessing working procedures then can process preferably needs the position of exposing, the processing making electronic circuit board follow-up and use unaffected.
In addition:
Need exsertion part to apply welding resistance glue at described electronic circuit board, then can facilitate postprocessing working procedures.Because welding resistance glue ratio is easier to peel off from electronic circuit board, so the removal plated film of exsertion part can will be needed very easily.
To the step of the space coating welding resistance glue around movable part, can prevent plated film from entering inside, space, avoid causing obstruction.
To the step of movable part surface and the coating of space around welding resistance glue thereof, not only can prevent plated film from entering inside, space, avoid causing obstruction, and can to forming complete covering glue layer outside movable part, the useful life more grown.
Described electronic circuit board is done to the step of aridity process, plated film can be made to be attached to the surface of electronic circuit board more reliably.
Xylylene po1ymer is selected in Coating Materials choosing, the surface of various shape can be coated to after its cracking, comprise in sharp-pointed seamed edge and small crack and inner surface, room temperature deposition can prepare the film coating of 0.1-100 micron under vacuum conditions, thickness even, fine and close free of pinholes, not disfiguring workpiece, there are excellent electrical insulating property and protective, can effective waterproof, anticorrosion.
Accompanying drawing explanation
Fig. 1 is coating process system for use in carrying figure of the present invention.
Fig. 2 be plated film after the schematic diagram of electronic circuit board.
Fig. 3 is the button of an embodiment.
The golden finger connector of Fig. 4 embodiment.
The connector body of Fig. 5 embodiment.
The connector plug of Fig. 6 embodiment.
Fig. 7 is the schematic diagram (partial enlargement) of electronic circuit board and button.
Fig. 8 is the button schematic diagram (partial enlargement) after coating welding resistance glue.
Embodiment
Contrast accompanying drawing below in conjunction with specific embodiment the present invention is described in further details.
As shown in Figure 1, be coating process system for use in carrying figure of the present invention, it comprises the storing containers 1 of the Coating Materials xylylene po1ymer connected successively, vaporizer 2, cracking room 3, condensing plant 4 and vacuum film coating chamber 5.
As shown in Figure 2, be the schematic diagram of the electronic circuit board in the present embodiment after plated film, it comprises pcb board 6, is arranged on the components and parts 7 on pcb board 6 and the plated film 8 on surface.
Preposition processing:
For part electronic circuit board not needing plated film (namely need to expose, be connected with contact, signal transmission etc. with other parts in the future), must first be coated with welding resistance glue.The electronic circuit board of the present embodiment exists this position needing to expose or device, as golden finger connector, connector body and connector plug etc., enlarged drawing respectively as Figure 4-Figure 6.These component surface must brushing welding resistance glue, finally can divest Coating Materials, thus can normally use.Generally speaking, welding resistance glue brushing thickness about 0.2 ~ 0.3mm.
As for button 10 as shown in Figure 6, then different from the processing mode of connector, the connection of itself and electronic circuit board 6 and position relationship are as shown in Figure 7 (close-up schematic view), all there is certain gap with pcb board 6 in around this button 10 and bottom, to ensure that button 10 can be pressed smoothly and upspring.If directly carry out coating operation, then plated film will enter in the gap 11 around button 10, and covered by the distributing point 61 bottom button 10 corresponding on pcb board 6, so, button 10 just cannot normally play a role, such as can not conducting.Even, when bottom gap enter Coating Materials more, also bottom gap 12 can be taken, thus button 10 cannot be pressed.So, just need before plated film, welding resistance glue need be avoided to enter space, bottom when the space 11 around button 10 being applied one deck welding resistance glue 13(and applying), when avoiding vacuum coating, Coating Materials enters bottom gap 12, after coating welding resistance glue as shown in Figure 8 (close-up schematic view).Because welding resistance glue 13 has certain elasticity, after its solidification, do not affect the action of pressing and upspring of button 10.
In addition, preferably button 10 surrounding space all being applied welding resistance glue together with the outer surface above it, form form as shown in Figure 8, having worn individual cap as giving button 10.The benefit done so had both facilitated coating welding resistance glue, can form complete glue-line again, be not easy to tear glue-line, thus can increase the service life in button 10 operating process.
The present embodiment welding resistance used glue is a kind of high temperature resistant, and tearability anti-welding material, also possesses certain elasticity after solidification.Welding resistance glue is used herein to insulating electron wiring board and Coating Materials.The advantage done like this is that construction is simple and easy, and not injuring part, resistance to water is good, and subsequent technique easily divests plated film electronic circuit board needing exsertion part, and does not stay cull after divesting.
Vacuum coating:
First, electronic circuit board is placed in baking box, under 45 degree Celsius, toasts operation 60 minutes.Baking object is that the aridity on electronic circuit board is improved, and increases plated film and covers intensity, and welding resistance glue is solidified completely.
Secondly, about 50 ~ 100 grams, Coating Materials powder xylylene po1ymer end (Coating Materials can add at any time in operation) is delivered to vapourizing unit 2 from material storing containers 1.
Then, start gasification and cracking operation, vaporizer 21 is warmed to 150 ~ 200 degree Celsius gradually, cracking room 22 is warmed to 650 ~ 700 degree Celsius gradually, Coating Materials powder is vaporized rear gas and is extruded to cracking room 22 and carries out molecular cleavage, and the molecule monomer after cracking enters normal-temperature vacuum coating chamber 4 li.Now condensing plant 3 starts, and is normal temperature to keep in vacuum film coating chamber 4.
Then, at normal temperatures vacuum coating operation is carried out to electronic circuit board.Vacuum coating thickness 3um needs about three hours consuming time, and sustainable plated film operation, until required coating film thickness.
Finally, take out electronic circuit board and do reprocessing.Namely to place's blades such as connector, USB jack, golden finger or laser cutting machine along object edge slit plated film, then divest plated film and the welding resistance glue of incision gently with tweezers.Afterwards, also can be coated with anti-corrosive grease at the metallic member of object, prevent the oxidative phenomena that wet wet environment produces.
As for welding resistance glue 13 and the plated film of button 10 part, then need to retain, as waterproof and oxidation resistant coating.
Above content is further description made for the present invention in conjunction with specific embodiments, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (4)
1. the film covering method of an electronic circuit board, comprise electric wire plate plated film and post-processing step under vacuum, first the heat vaporized and Coating Materials of cracking is passed in the vacuum chamber being placed with electric wire plate, and vacuum chamber is cooled, at normal temperatures vacuum coating operation is carried out to electronic circuit board surface, until take out electronic circuit board when coating film thickness reaches requirement; Then, do reprocessing, namely remove the film plating layer that electronic circuit board needs exsertion part, but the welding resistance glue of key part and plated film retain; Also pre-treatment step is comprised before plating steps, described pre-treatment step comprises, exsertion part is needed to apply welding resistance glue at described electronic circuit board, also comprise to the space coating of keytop and surrounding for the step of the welding resistance glue of insulating electron wiring board and Coating Materials or to the step of the space coating around button for the welding resistance glue of insulating electron wiring board and Coating Materials, during to avoid vacuum coating, Coating Materials enters bottom gap.
2. the film covering method of electronic circuit board as claimed in claim 1, is characterized in that: described pre-treatment step also comprises the step described electronic circuit board being done to aridity process.
3. the film covering method of electronic circuit board as claimed in claim 1, is characterized in that: described Coating Materials choosing is xylylene po1ymer.
4. the film covering method of electronic circuit board as claimed in claim 1, is characterized in that: described post-processing step is also included in the step that the position after removing welding resistance glue is coated with anti-corrosive grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210128002.XA CN102686034B (en) | 2012-04-27 | 2012-04-27 | Film coating method for electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210128002.XA CN102686034B (en) | 2012-04-27 | 2012-04-27 | Film coating method for electronic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102686034A CN102686034A (en) | 2012-09-19 |
| CN102686034B true CN102686034B (en) | 2015-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210128002.XA Expired - Fee Related CN102686034B (en) | 2012-04-27 | 2012-04-27 | Film coating method for electronic circuit board |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106480414A (en) * | 2016-09-15 | 2017-03-08 | 广东思泉新材料股份有限公司 | A kind of manufacture method of waterproof electronic product |
| CN111050486A (en) * | 2019-11-29 | 2020-04-21 | 苏州市迪飞特电子有限公司 | Processing technology for improving moisture resistance of electronic circuit board |
| CN111132466A (en) * | 2019-12-27 | 2020-05-08 | 苏州晶台光电有限公司 | Method for preventing metal ion migration on surface of PCB |
| CN111520624A (en) * | 2020-03-17 | 2020-08-11 | 亚鹰建筑科技集团有限公司 | Forming process of multicolor luminous glass |
| CN112235956A (en) * | 2020-11-06 | 2021-01-15 | 惠州市盈帆实业有限公司 | Production and manufacturing process of copper-embedded circuit board based on PVC material |
| CN112739049A (en) * | 2020-12-18 | 2021-04-30 | 绵阳正能新能源技术有限公司 | Circuit board coating process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6517895B1 (en) * | 1998-06-24 | 2003-02-11 | Vantico Inc. | Method of coating both sides of printed circuit boards having holes |
| CN101603678A (en) * | 2009-07-15 | 2009-12-16 | 中国科学院上海有机化学研究所 | The waterproof sealing structure of LED module and preparation technology thereof |
| CN101772276A (en) * | 2009-12-31 | 2010-07-07 | 深圳和而泰智能控制股份有限公司 | Method for installing press key in printed circuit board |
-
2012
- 2012-04-27 CN CN201210128002.XA patent/CN102686034B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6517895B1 (en) * | 1998-06-24 | 2003-02-11 | Vantico Inc. | Method of coating both sides of printed circuit boards having holes |
| CN101603678A (en) * | 2009-07-15 | 2009-12-16 | 中国科学院上海有机化学研究所 | The waterproof sealing structure of LED module and preparation technology thereof |
| CN101772276A (en) * | 2009-12-31 | 2010-07-07 | 深圳和而泰智能控制股份有限公司 | Method for installing press key in printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN102686034A (en) | 2012-09-19 |
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Granted publication date: 20150114 Termination date: 20180427 |