CN102686032A - Method for improving exposure vacuumizing of circuit board - Google Patents

Method for improving exposure vacuumizing of circuit board Download PDF

Info

Publication number
CN102686032A
CN102686032A CN201210188963XA CN201210188963A CN102686032A CN 102686032 A CN102686032 A CN 102686032A CN 201210188963X A CN201210188963X A CN 201210188963XA CN 201210188963 A CN201210188963 A CN 201210188963A CN 102686032 A CN102686032 A CN 102686032A
Authority
CN
China
Prior art keywords
film
circuit board
wiring board
vacuum
vacuumizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210188963XA
Other languages
Chinese (zh)
Inventor
赵建梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd
Original Assignee
ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd filed Critical ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd
Priority to CN201210188963XA priority Critical patent/CN102686032A/en
Publication of CN102686032A publication Critical patent/CN102686032A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a method for improving exposure vacuumizing of a circuit board. A printer is supplied; a planless blank region is determined on a film; a plurality of air guide holes are drilled in the blank region by the printer; and the film is attached to the board body of the circuit board and vacuumized. A plurality of air guide holes are formed in the film, so that the circuit board is wrapped by the film completely when the film is attached to the board body of the circuit board; during vacuuming, air can be sucked out from the air guide holes, so that better vacuumizing effect is achieved, and the exposure vacuumizng operation of the circuit board is improved.

Description

A kind of method of improving wiring board exposure suction vacuum
Technical field
The present invention relates to wiring board and make the field, especially a kind of method of improving wiring board exposure suction vacuum.
Background technology
Along with wiring board constantly to frivolous, set type to strengthen and the high-density line direction develops, wherein circuit board pattern conductor width and spacing are more and more littler.Equally, this has also proposed new requirement to figure transfer.
When producing, find; Open the oversize wiring board of material and when figure transfer, be prone to take place the ill-exposed phenomenon in product centre position, its reason is, fits with plate body around the film; Making can't be with the air sucking-off in the film and the plate body when inhaling vacuum; The film and plate body are fitted tightly, thereby the place that causes need not making public receives the light influence, and cause bad.Through various checkings, find to reduce out can make this bad improving after the material size, just equal reducing speed of production and strengthening workload but reduce out the material size, same problem can not get the solution of essence.
Therefore, need a kind of new technical scheme to address the above problem.
Summary of the invention
To above-mentioned existing in prior technology problem and shortage, the purpose of this invention is to provide a kind of method that vacuum is inhaled in the wiring board exposure of improving.
For realizing above-mentioned purpose, the method that the present invention improves wiring board exposure suction vacuum can adopt following technical scheme:
A kind of method of improving wiring board exposure suction vacuum provides puncher, on the film, determines planless white space, and uses puncher to get out some gas ports at this white space, again with the film and applying of wiring board plate body and suction vacuum.
The present invention is compared with prior art: owing to had more some gas ports on the film; Even like this film with wiring board plate body applying process in wrapped wiring board around the film; Air also can be from said gas port sucking-off when inhaling vacuum; Make that the suction vacuum is more complete, thereby improved the operation of wiring board exposure suction vacuum.
Embodiment
Below in conjunction with embodiment; Further illustrate the present invention; Should understand following embodiment only be used to the present invention is described and be not used in the restriction scope of the present invention; After having read the present invention, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the present invention.
The present invention discloses a kind of method that vacuum is inhaled in the wiring board exposure of improving; Film puncher is provided; On the film, determine planless white space, and use film puncher to get out some diameters to be the 3mm gas port, again the film and wiring board plate body are fitted and inhale vacuum at this white space.Owing to had more some gas ports on the film; Even like this film with wiring board plate body applying process in wrapped wiring board around the film; Air also can make that the suction vacuum is more complete from said gas port sucking-off when inhaling vacuum, thereby has improved the operation of wiring board exposure suction vacuum.

Claims (3)

1. one kind is improved the method that vacuum is inhaled in the wiring board exposure; It is characterized in that: puncher is provided; On the film, determine planless white space, and use puncher to get out some gas ports, again with the film and applying of wiring board plate body and suction vacuum at this white space.
2. a use improves the method that vacuum is inhaled in the wiring board exposure according to claim 1, and it is characterized in that: the diameter of said gas port is 3mm.
3. a use improves the method that vacuum is inhaled in the wiring board exposure according to claim 1 or claim 2, and it is characterized in that: said puncher is a film puncher.
CN201210188963XA 2012-06-08 2012-06-08 Method for improving exposure vacuumizing of circuit board Pending CN102686032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210188963XA CN102686032A (en) 2012-06-08 2012-06-08 Method for improving exposure vacuumizing of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210188963XA CN102686032A (en) 2012-06-08 2012-06-08 Method for improving exposure vacuumizing of circuit board

Publications (1)

Publication Number Publication Date
CN102686032A true CN102686032A (en) 2012-09-19

Family

ID=46817190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210188963XA Pending CN102686032A (en) 2012-06-08 2012-06-08 Method for improving exposure vacuumizing of circuit board

Country Status (1)

Country Link
CN (1) CN102686032A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103802444A (en) * 2014-01-25 2014-05-21 东莞南玻工程玻璃有限公司 Manufacturing method for enameled glass screen printing plate and enameled glass

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600298A (en) * 2009-07-09 2009-12-09 皆利士多层线路版(中山)有限公司 A kind of manufacture method of circuit board
CN101598901A (en) * 2009-07-14 2009-12-09 昆山鼎鑫电子有限公司 A kind of operational method of manual exposure machine
CN201418201Y (en) * 2009-04-14 2010-03-03 常州海弘电子有限公司 PCB board with positioning holes
CN101772268A (en) * 2009-12-22 2010-07-07 深圳市集锦线路板科技有限公司 Technology for aligning circuit board by PIN nail
CN202071122U (en) * 2011-04-27 2011-12-14 深圳市崇达电路技术股份有限公司 Film punching machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201418201Y (en) * 2009-04-14 2010-03-03 常州海弘电子有限公司 PCB board with positioning holes
CN101600298A (en) * 2009-07-09 2009-12-09 皆利士多层线路版(中山)有限公司 A kind of manufacture method of circuit board
CN101598901A (en) * 2009-07-14 2009-12-09 昆山鼎鑫电子有限公司 A kind of operational method of manual exposure machine
CN101772268A (en) * 2009-12-22 2010-07-07 深圳市集锦线路板科技有限公司 Technology for aligning circuit board by PIN nail
CN202071122U (en) * 2011-04-27 2011-12-14 深圳市崇达电路技术股份有限公司 Film punching machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103802444A (en) * 2014-01-25 2014-05-21 东莞南玻工程玻璃有限公司 Manufacturing method for enameled glass screen printing plate and enameled glass
CN103802444B (en) * 2014-01-25 2016-08-17 东莞南玻工程玻璃有限公司 A kind of colored glazed glass half tone and the manufacture method of colored glazed glass

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120919