CN102683227A - Cooling fan and packaging method of electronic assembly of cooling fan - Google Patents
Cooling fan and packaging method of electronic assembly of cooling fan Download PDFInfo
- Publication number
- CN102683227A CN102683227A CN201210117468XA CN201210117468A CN102683227A CN 102683227 A CN102683227 A CN 102683227A CN 201210117468X A CN201210117468X A CN 201210117468XA CN 201210117468 A CN201210117468 A CN 201210117468A CN 102683227 A CN102683227 A CN 102683227A
- Authority
- CN
- China
- Prior art keywords
- fan
- electronic building
- building brick
- packing
- sizing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
Disclosed are a cooling fan and a packaging method of an electronic assembly of a cooling fan. The cooling fan comprises a fan rotor, a fan casing, a fan base, and the fan electronic assembly, wherein the fan casing is installed on the fan base, the fan rotor is arranged inside an accommodating space defined by the fan casing and the fan base, and the electronic assembly is arranged outside the fan casing of the cooling fan and connected with the fan rotor of the cooling fan electrically. The packaging method of the electronic assembly comprises the steps of preprocessing, preparing a glue material and performing packaging and molding, wherein checking and cleaning the surface of the electronic assembly to be packaged so as to remove stains on the surface of the electronic assembly and improve the binding force of packaging; preparing a glue material for packaging and removing water in the glue material; and placing the electronic assembly into a packaging mold and injecting the environment-friendly glue material into the mold and performing rapid curling and molding, so that electronic parts are packaged.
Description
Technical field
The present invention relates to a kind of radiator fan, the method for packing of particularly a kind of radiator fan and electronic building brick thereof.
Background technology
Referring to Figure 1A, 1B, Figure 1A, Figure 1B are provided with position view for the radiator fan electronic building brick of prior art.The radiator fan common structural is that the electronic component design is below inner rotator (referring to Figure 1A), to play the effect of protection at present.And electronic component itself has height, and radiator fan is had restriction toward the slimming development.Be the protection electronic component, general outer only drawing can so not only can influence the blast amount of fan Element Design (layout) to runner inner (referring to Figure 1B), also can influence the flabellum natural frequency (BPF) of fan.
Summary of the invention
Technical problem to be solved by this invention provides the method for packing of a kind of radiator fan and electronic building brick thereof, is beneficial to the thin typeization of cooling fan structure and effectively protects electronic building brick.
To achieve these goals, the invention provides a kind of method for packing of electronic building brick of radiator fan, the fan drum that said electronic building brick is arranged on said radiator fan is electrically connected outward and with the fan propeller of said radiator fan, wherein, comprising:
Electronic building brick surface to be packaged is checked and cleaned to pre-treatment step, to remove the spot on electronic building brick surface, improves the adhesion of encapsulation;
The sizing material preparation process is prepared the encapsulation sizing material and is removed the moisture in the sizing material;
The encapsulated moulding step is put into encapsulating mould with this electronic building brick, and the environmental protection sizing material is injected mould and fast curing-formed so that this electronic component group is encapsulated.
The method for packing of above-mentioned electronic building brick, wherein, said pre-treatment step comprises:
Preliminary examination step, the outer surface of checking this electronic building brick have or not damage, cut and spot;
Cleaning cleans the surface of this electronic building brick;
Full inspection step checks whether the surface blot of this electronic building brick is cleaned out.
The method for packing of above-mentioned electronic building brick, wherein, said cleaning adopts the plasma gas cleaning procedure.
The method for packing of above-mentioned electronic building brick, wherein, the vacuum degree of this plasma gas cleaning procedure is 10～50pa, and the processing time is 3～8min, and argon gas oxygen is than being Ar/O
2=100～500/100～500.
The method for packing of above-mentioned electronic building brick, wherein, said sizing material preparation process comprises:
Baking step, bake out temperature are 50～100 ℃, and drying time is 0.5～2 hour, to remove the moisture in the sizing material, keep this sizing material dry;
Heating melt step is prepared against use with this sizing material heating and melting.
The method for packing of above-mentioned electronic building brick wherein, also comprises the step to the inboard plating Teflon of said encapsulating mould in the said encapsulated moulding step.
The method for packing of above-mentioned electronic building brick, wherein, the encapsulated moulding temperature in the said encapsulated moulding step is 190～250 ℃, encapsulated moulding pressure is 0.4～2Mpa.
The method for packing of above-mentioned electronic building brick wherein, also comprises after the encapsulated moulding step detecting the goods step entirely.
In order to realize above-mentioned purpose better; The present invention also provides a kind of radiator fan; Comprise fan propeller, fan drum, fan base and fan electronic building brick; Said fan drum is installed on the said fan base, and said fan propeller is arranged in the accommodation space that said fan drum and said fan base surround, and it is outer and be electrically connected with the fan propeller of said radiator fan that said fan electronic building brick is arranged on the fan drum of said radiator fan; Wherein, said fan electronic building brick is for adopting the packaging part of above-mentioned method for packing processing.
Technique effect of the present invention is:
The present invention adopts the mode of low head injection; The serial special environmental protection sizing material of Henkel LPIM (Macromelt) is injected mould and fast curing-formed; Encapsulate the electronic component group; Utilize the characteristic of the serial special environmental protection glue of Henkel LPIM (Macromelt), protect the electronic component group; Has good adhesive property after the serial special environmental protection sizing material fusing of Henkel LPIM (Macromelt); Can play the effect of sealing, protection against the tide, waterproof and dustproof, resistance to chemical attack effectively to packaged components and parts, and have heatproof, anti-vibration, anti-stress protective value and with performance such as electric insulation; Simultaneously, adopt the mode of mould medial surface plating Teflon (Teflon), conveniently stripped, and can guarantee appearance requirement; Adopt plasma (Plasma) technology cleaning workpiece surface, can increase the encapsulation adhesion.The present invention can effectively protect electronic building brick, for radiator fan provides powerful guarantee toward the slimming development.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is provided with position view for the radiator fan electronic building brick of prior art;
Fig. 2 is a cooling fan structure sketch map of the present invention;
Fig. 3 is the rearview of Fig. 2;
Fig. 4 A is the electronic building brick encapsulating structure sketch map of one embodiment of the invention;
Fig. 4 B is the left view of Fig. 4 A;
Fig. 5 A is the electronic building brick encapsulating structure sketch map of another embodiment of the present invention;
Fig. 5 B is the left view of Fig. 5 A;
Fig. 6 is the method for packing flow chart of electronic building brick of the present invention.
Wherein, Reference numeral
1 fan propeller
2 fan drums
3 fan bases
31 go out line trenches
4 fan electronic building bricks
41 assembly base plates
42 component package housings
S1～S4 step
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
Referring to Fig. 2 and Fig. 3, Fig. 2 is a cooling fan structure sketch map of the present invention, and Fig. 3 is the rearview of Fig. 2.Radiator fan of the present invention; Comprise fan propeller 1, fan drum 2, fan base 3 and fan electronic building brick 4; Said fan drum 2 is installed on the said fan base 3; Said fan propeller 1 is arranged in the accommodation space that said fan drum 2 and said fan base 3 surround, and it is outer and be electrically connected with the fan propeller 1 of said radiator fan that said fan electronic building brick 4 is arranged on the fan drum 2 of said radiator fan.Referring to Fig. 4 A-Fig. 5 B, Fig. 4 A is the electronic building brick encapsulating structure sketch map of one embodiment of the invention, and Fig. 4 B is the left view of Fig. 4 A, and Fig. 5 A is the electronic building brick encapsulating structure sketch map of another embodiment of the present invention, and Fig. 5 B is the left view of Fig. 5 A.Fan electronic building brick of the present invention because saving fan inner space, help the thinning of fan, it is arranged on the outside of the fan drum 2 of radiator fan, the line trenches 31 that goes out through fan base 3 is electrically connected with fan propeller 1.This fan electronic building brick 4 comprises assembly base plate 41, component package housing 42 and electronic devices and components (figure does not show); These electronic devices and components are installed on the assembly base plate 41; These component package housing 42 covers overlay on these electronic devices and components 43; And with the synthetic confined space of these assembly base plate 41 one common peripheral, effectively packaged electronic devices and components are played the effect of sealing, protection against the tide, waterproof and dustproof, resistance to chemical attack, and have the protective value of heatproof, anti-vibration, anti-stress to reach and performance such as electric insulation.Because of other part-structures of this radiator fan and function are ripe prior art, do not give unnecessary details at this, only the method for packing of said fan electronic building brick 4 is specified below.
Referring to Fig. 6, Fig. 6 is the method for packing flow chart of electronic building brick of the present invention.The method for packing of fan electronic building brick of the present invention comprises:
Pre-treatment step S1 checks and cleans electronic building brick surface to be packaged, to remove the spot on electronic building brick surface, improves the adhesion of encapsulation;
Sizing material preparation process S2 prepares the encapsulation sizing material and removes the moisture in the sizing material;
Encapsulated moulding step S3 keeps flat this fan electronic building brick 4 in the encapsulating mould, the environmental protection sizing material is injected mould and fast curing-formed encapsulate with the electronic devices and components with this fan electronic building brick 4.The preferred serial special environmental protection sizing material of Henkel LPIM (Macromelt).Encapsulated moulding temperature among the said encapsulated moulding step c is preferably 190～250 ℃, and encapsulated moulding pressure is preferably 0.4～2Mpa.Do not put earlier assembly base plate 41 (soft board), empty to beat several moulds inferior, confirm up to specification after, encapsulate again.
Also can comprise after the encapsulated moulding step S3 detecting goods step S4 entirely, inspection has or not encapsulation shrink, overlap etc., and notices that the inspection outward appearance can not weigh wounded.
In the present embodiment, said pre-treatment step S1 comprises:
Preliminary examination step, the outer surface of checking this electronic building brick have or not damage, cut and spot, and do corresponding sign;
Cleaning cleans the surface of this fan electronic building brick 4;
Full inspection step is checked this fan electronic building brick 4, and particularly whether the surface blot of the electronic devices and components of this fan electronic building brick 4 is cleaned out.
Wherein, said cleaning adopts plasma gas (Plasma) cleaning procedure.The vacuum degree of this plasma gas cleaner is preferably 10-50pa, and the processing time is preferably 3-8min, and argon gas oxygen volume ratio is preferably Ar/O
2=100-500/100-500.To remove the spot on fan electronic building brick 4 surfaces, improve the adhesion of encapsulation.
Wherein, said sizing material preparation process S2 comprises:
Baking step is dried sizing material, and bake out temperature is preferably 50-100 ℃, and drying time is preferably 0.5-2 hour, to remove the moisture in the sizing material, keeps this sizing material dry;
Heating melt step is prepared against use with this sizing material heating and melting.
Wherein, also comprise the step of the inboard of said encapsulating mould being plated Teflon (Teflon) among the said encapsulated moulding step S3.
The present invention adopts the mode of low head injection; The serial special environmental protection sizing material of Henkel LPIM (Macromelt) is injected mould and fast curing-formed; Encapsulate the electronic component group; Utilize the characteristic of the serial special environmental protection glue of Henkel LPIM (Macromelt), protect the electronic component group; Has good adhesive property after the serial special environmental protection sizing material fusing of Henkel LPIM (Macromelt); Can play the effect of sealing, protection against the tide, waterproof and dustproof, resistance to chemical attack effectively to packaged components and parts, and have heatproof, anti-vibration, anti-stress protective value and with performance such as electric insulation; Simultaneously, adopt the mode of mould medial surface plating Teflon (Teflon), conveniently stripped, and can guarantee appearance requirement; Adopt plasma (Plasma) technology cleaning workpiece surface, can increase the encapsulation adhesion.The present invention can effectively protect electronic building brick, for radiator fan provides powerful guarantee toward the slimming development.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. it is outer and be electrically connected with the fan propeller of said radiator fan that the method for packing of the electronic building brick of a radiator fan, said electronic building brick are arranged on the fan drum of said radiator fan, it is characterized in that, comprising:
Electronic building brick surface to be packaged is checked and cleaned to pre-treatment step, to remove the spot on electronic building brick surface, improves the adhesion of encapsulation;
The sizing material preparation process is prepared the encapsulation sizing material and is removed the moisture in the sizing material;
The encapsulated moulding step is put into encapsulating mould with this electronic building brick, and the environmental protection sizing material is injected mould and fast curing-formed so that this electronic component group is encapsulated.
2. the method for packing of electronic building brick as claimed in claim 1 is characterized in that, said pre-treatment step comprises:
Preliminary examination step, the outer surface of checking this electronic building brick have or not damage, cut and spot;
Cleaning cleans the surface of this electronic building brick;
Full inspection step checks whether the surface blot of this electronic building brick is cleaned out.
3. the method for packing of electronic building brick as claimed in claim 2 is characterized in that, said cleaning adopts the plasma gas cleaning procedure.
4. the method for packing of electronic building brick as claimed in claim 3 is characterized in that, the vacuum degree of this plasma gas cleaning procedure is 10～50pa, and the processing time is 3～8min, and argon gas oxygen is than being Ar/O
2=100～500/100～500.
5. like the method for packing of claim 1,2,3 or 4 described electronic building bricks, it is characterized in that said sizing material preparation process comprises:
Baking step, bake out temperature are 50～100 ℃, and drying time is 0.5～2 hour, to remove the moisture in the sizing material, keep this sizing material dry;
Heating melt step is prepared against use with this sizing material heating and melting.
6. the method for packing of electronic building brick as claimed in claim 1 is characterized in that, also comprises the step to the inboard plating Teflon of said encapsulating mould in the said encapsulated moulding step.
7. the method for packing of electronic building brick as claimed in claim 1 is characterized in that, the encapsulated moulding temperature in the said encapsulated moulding step is 190～250 ℃, and encapsulated moulding pressure is 0.4～2Mpa.
8. the method for packing of electronic building brick as claimed in claim 7 is characterized in that, also comprises after the encapsulated moulding step detecting the goods step entirely.
9. radiator fan; Comprise fan propeller, fan drum, fan base and fan electronic building brick; Said fan drum is installed on the said fan base; Said fan propeller is arranged in the accommodation space that said fan drum and said fan base surround; It is outer and is electrically connected with the fan propeller of said radiator fan that said fan electronic building brick is arranged on the fan drum of said radiator fan, it is characterized in that the packaging part of said fan electronic building brick for adopting aforesaid right to require 1,2,3,4,6,7 or 8 described method for packing to process.
10. radiator fan; Comprise fan propeller, fan drum, fan base and fan electronic building brick; Said fan drum is installed on the said fan base; Said fan propeller is arranged in the accommodation space that said fan drum and said fan base surround; The fan drum that said fan electronic building brick is arranged on said radiator fan is electrically connected outward and with the fan propeller of said radiator fan, it is characterized in that, said fan electronic building brick requires the packaging part of 5 described method for packing processing for adopting aforesaid right.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117468XA CN102683227A (en) | 2012-04-19 | 2012-04-19 | Cooling fan and packaging method of electronic assembly of cooling fan |
| TW101120404A TW201344064A (en) | 2012-04-19 | 2012-06-07 | Heat dissipating fan and packaging method of electronic component thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117468XA CN102683227A (en) | 2012-04-19 | 2012-04-19 | Cooling fan and packaging method of electronic assembly of cooling fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102683227A true CN102683227A (en) | 2012-09-19 |
Family
ID=46814957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210117468XA Pending CN102683227A (en) | 2012-04-19 | 2012-04-19 | Cooling fan and packaging method of electronic assembly of cooling fan |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102683227A (en) |
| TW (1) | TW201344064A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101047136A (en) * | 2006-03-27 | 2007-10-03 | 深圳市易方数码科技有限公司 | Manufacturing method of mobile storage equipment |
| CN101123834A (en) * | 2007-07-20 | 2008-02-13 | 鹤山丽得电子实业有限公司 | A LED manufacturing method |
| CN201053404Y (en) * | 2007-04-28 | 2008-04-30 | 中山市电机电器有限公司 | Blower |
| CN101175922A (en) * | 2005-05-19 | 2008-05-07 | 惠普开发有限公司 | Cooling fan with external circuit board |
-
2012
- 2012-04-19 CN CN201210117468XA patent/CN102683227A/en active Pending
- 2012-06-07 TW TW101120404A patent/TW201344064A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101175922A (en) * | 2005-05-19 | 2008-05-07 | 惠普开发有限公司 | Cooling fan with external circuit board |
| CN101047136A (en) * | 2006-03-27 | 2007-10-03 | 深圳市易方数码科技有限公司 | Manufacturing method of mobile storage equipment |
| CN201053404Y (en) * | 2007-04-28 | 2008-04-30 | 中山市电机电器有限公司 | Blower |
| CN101123834A (en) * | 2007-07-20 | 2008-02-13 | 鹤山丽得电子实业有限公司 | A LED manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201344064A (en) | 2013-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103545945B (en) | Motor stator | |
| CN104868667B (en) | Glue-pouring mold for motor stator winding | |
| CN105844325A (en) | Washable RFID tag and preparation method thereof | |
| WO2017004957A1 (en) | Insulating bush made of thermoplastic material and production method therefor | |
| US8987958B2 (en) | Waterproof motor stator structure | |
| CN102474035A (en) | Connecting component for electrical conductors and method for sheathing such connecting component | |
| CN102163510B (en) | Production process of solid-packaged polar pole | |
| CN102683227A (en) | Cooling fan and packaging method of electronic assembly of cooling fan | |
| JP6709264B2 (en) | Method of manufacturing waterproof motor stator and waterproof motor stator | |
| CN106450067B (en) | It is a kind of for storeing the high pressure resistant insulation sealing structure and method of formula battery | |
| CN106968005B (en) | Terminal enclosure and preparation method thereof | |
| CN205670301U (en) | Water-fastness electronic tag | |
| CN113916068B (en) | Overload-resistant encapsulating process for missile-borne products | |
| JP2020121457A (en) | Apparatus and method for manufacturing injection molding, and insert molding | |
| CN112384025B (en) | Protective device of electronic device and packaging method thereof | |
| CN204130728U (en) | Wire and cable connector | |
| CN104092339A (en) | Method for motor vacuum injection molding operation | |
| CN204013154U (en) | A kind of permagnetic synchronous motor and iron core thereof | |
| CN209893933U (en) | Neodymium iron boron magnet is with high-efficient smelting furnace that prevents heat loss | |
| CN207782512U (en) | A kind of fixed structure for disk type electric machine stator | |
| US4914547A (en) | Process for making capacitors | |
| CN205255320U (en) | Gu vacuum interrupter's recovery unit in utmost point post | |
| CN1953301B (en) | Stator structure and its manufacture method | |
| CN106129618B (en) | Seal wave transparent antenna house sleeve part and forming method | |
| US20100156589A1 (en) | Resistor and method for making a resistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120919 |