CN102675881B - High temperature resistant rubber base composite material used for chip packaging and application thereof - Google Patents
High temperature resistant rubber base composite material used for chip packaging and application thereof Download PDFInfo
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- CN102675881B CN102675881B CN201210151699.2A CN201210151699A CN102675881B CN 102675881 B CN102675881 B CN 102675881B CN 201210151699 A CN201210151699 A CN 201210151699A CN 102675881 B CN102675881 B CN 102675881B
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Abstract
The invention discloses a high temperature resistant rubber base composite material used for chip packaging and an application thereof, and belongs to the technical field of the high temperature resistant chip packaging material. The invention aims to provide a high temperature resistant, moisture-proof and damp-proof chip packaging composite material. The high temperature resistant rubber base composite material used for the chip packaging adopts the technical scheme that the high temperature resistant rubber base composite material used for the chip packaging comprises the following raw materials in parts by weight: 100 parts of silicon rubber, 0.1-2 parts of plasticizer, 1-10 parts of reinforcing agent, 50-100 parts of heat insulation microsphere and 1-15 parts of vulcanizing agent. The plastic rubber base composite material related by the invention has a high temperature resistant characteristic, a radio frequency identification device (RFID) chip can be comprehensively protected to normally work in the high temperature environment, the chip is free from being damaged due to overheat at the temperature of 300DEG C, and the packaged chip has an excellent moisture-proof and damp-proof performance.
Description
Technical field
A kind of Chip Packaging of the present invention belongs to Anti-high temperature chip packaged material technical field with high-temperature resistant rubber based composites and application thereof.
Background technology
The RFID term is radio-frequency apparatus, is commonly called as electronic tag, RF tag, transponder, data carrier.Common RFID packaged material comprises: the encapsulation of papery cassette, PVC encapsulation, use is confined to the Air drying environment, use temperature is the highest can not surpass 85 ℃, also prevents the anti-adverse environment characteristics such as the wet anti-salt fog of tidal rip, makes the RFID technology be very restricted when application.
Summary of the invention
The present invention is in order to overcome the deficiencies in the prior art, provide a kind of high temperature resistant, every wet moistureproof packaged chip matrix material.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is: a kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts, silicon rubber, softening agent 0.1-2 part, strengthening agent 1-10 part, adiabatic microballon 50-100 part, vulcanizing agent 1-15 part.
The preferred weight part proportioning of each component is:
100 parts, silicon rubber, softening agent 0.5-1.2 part, strengthening agent 3-8 part, adiabatic microballon 70-85 part, vulcanizing agent 6-10 part.
Described silicon rubber is methyl vinyl silicone rubber or methyl ethylene phenyl siloxane rubber.
Described strengthening agent is superfine silicon dioxide, superfine carbon black or fibrous silicate.
Described softening agent is hydroxy silicon oil.
Described adiabatic microballon is hollow glass micropearl.
Described vulcanizing agent is dicumyl peroxide, two 25 or two 24.
According to following steps, carry out: with mixing roll, silicon rubber, softening agent, strengthening agent, adiabatic microballon and vulcanizing agent are mixed according to described weight part proportioning, be squeezed into sheet material, then cut into small pieces by chip size, with after the sheet material packaged chip cut out, opening again fairlead, finally at 150 ℃ of-168 ℃ of sintering 12min-20min of temperature, obtain the finished product packaged chip.
The beneficial effect that the present invention compared with prior art has is: the plasticity-rubber-base composite material the present invention relates to has high-temperature stability; can in hot environment, work by omnibearing protection RFID chip; can not only guarantee that chip can be because of overheated not impaired in 300 ℃ of environment, the chip after encapsulation also has good in wet humidity resistance.Guarantee that chip technology can not be stolen simultaneously, can provide new idea in management in false proof, the industries such as the turnover depositary management is made an inventory, logistics transportation widely.
RFID through matrix material encapsulation of the present invention can work in severe environment, and can be widely used in aspect.
1, false proof, the inbound/outbound process management of high-end article are made an inventory, for large supermarket's logistics transportation, goods deposit provide new management thought.
2, to rareness species as the rare animals and plants of the rare species of marine existence, field survivorship are identified, tracking and information acquisition.
3, goods and materials and the equipment to working in special environment or storing, as the device identification of working in hot environment, the food sign stored in low temperature environment etc. provides new management mode and management method.
4, the electronic tag that carries out the secondary plastic packaging under 300 ℃ of hot environments is carried out to high temperature packaging protection in advance.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
A kind of Chip Packaging of the present invention utilizes mixing roll that each component is mixed according to described weight part proportioning by the preparation method of high-temperature resistant rubber based composites, extrusion molding.Also can adopt other existing extrusion forming technology preparation.
In the present invention, the granularity of superfine silicon dioxide, superfine carbon black and fibrous silicate is limited to the micro/nano level granularity.
Embodiment 1
A kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts of methyl vinyl silicone rubbers, 0.5 part of hydroxy silicon oil, 5 parts of superfine silicon dioxides, 50 parts of hollow glass micropearls, two 245 parts.
The application of high-temperature resistant rubber based composites for a kind of Chip Packaging, according to following steps, carry out: with mixing roll, methyl vinyl silicone rubber, hydroxy silicon oil, superfine silicon dioxide, hollow glass micropearl and two 24 are mixed according to above-mentioned weight part proportioning, be squeezed into the sheet material of even thickness, then cut into small pieces by chip size, with the sheet material packaged chip cut out, packaged chip profile is standard evenly, open again fairlead, finally at 160 ℃ of sintering 15min of temperature, obtain the finished product packaged chip.
Embodiment 2
A kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts of methyl ethylene phenyl siloxane rubbers, 1.2 parts of hydroxy silicon oils, 8 parts of superfine carbon blacks, 100 parts of hollow glass micropearls, two 256 parts.
The application of high-temperature resistant rubber based composites for a kind of Chip Packaging, according to following steps, carry out: with mixing roll, methyl ethylene phenyl siloxane rubber, hydroxy silicon oil, superfine carbon black, hollow glass micropearl and two 25 are mixed according to above-mentioned weight part proportioning, be squeezed into the sheet material of even thickness, then cut into small pieces by chip size, with the sheet material packaged chip cut out, packaged chip profile is standard evenly, open again fairlead, finally at 168 ℃ of sintering 12min of temperature, obtain the finished product packaged chip.
Embodiment 3
A kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts of methyl ethylene phenyl siloxane rubbers, 2 parts of hydroxy silicon oils, 10 parts of fibrous silicates, 70 parts of hollow glass micropearls, 10 parts of dicumyl peroxides.
The application of high-temperature resistant rubber based composites for a kind of Chip Packaging, according to following steps, carry out: with mixing roll, methyl ethylene phenyl siloxane rubber, hydroxy silicon oil, fibrous silicate, hollow glass micropearl and dicumyl peroxide are mixed according to above-mentioned weight part proportioning, be squeezed into the sheet material of even thickness, then cut into small pieces by chip size, with the sheet material packaged chip cut out, packaged chip profile is standard evenly, open again fairlead, finally at 150 ℃ of sintering 20min of temperature, obtain the finished product packaged chip.
Embodiment 4
A kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts of methyl vinyl silicone rubbers, 0.1 part of hydroxy silicon oil, 3 parts of fibrous silicates, 85 parts of hollow glass micropearls, two 24 15 parts.
The application of high-temperature resistant rubber based composites for a kind of Chip Packaging, according to following steps, carry out: with mixing roll, methyl vinyl silicone rubber, hydroxy silicon oil, fibrous silicate, hollow glass micropearl and two 24 are mixed according to above-mentioned weight part proportioning, be squeezed into the sheet material of even thickness, then cut into small pieces by chip size, with the sheet material packaged chip cut out, packaged chip profile is standard evenly, open again fairlead, finally at 155 ℃ of sintering 18min of temperature, obtain the finished product packaged chip.
Embodiment 5
A kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts of methyl ethylene phenyl siloxane rubbers, 0.5 part of hydroxy silicon oil, 1 part of superfine silicon dioxide, 50 parts of hollow glass micropearls, 1 part of dicumyl peroxide.
The application of high-temperature resistant rubber based composites for a kind of Chip Packaging, according to following steps, carry out: with mixing roll, methyl ethylene phenyl siloxane rubber, hydroxy silicon oil, superfine silicon dioxide, hollow glass micropearl and dicumyl peroxide are mixed according to above-mentioned weight part proportioning, be squeezed into the sheet material of even thickness, then cut into small pieces by chip size, with the sheet material packaged chip cut out, packaged chip profile is standard evenly, open again fairlead, finally at 165 ℃ of sintering 16min of temperature, obtain the finished product packaged chip.
Embodiment 6
A kind of Chip Packaging high-temperature resistant rubber based composites is comprised of the following component according to the weight part proportioning:
100 parts of methyl vinyl silicone rubbers, 1 part of hydroxy silicon oil, 6 parts of fibrous silicates, 80 parts of hollow glass micropearls, two 257 parts.
The application of high-temperature resistant rubber based composites for a kind of Chip Packaging, according to following steps, carry out: with mixing roll, methyl vinyl silicone rubber, hydroxy silicon oil, fibrous silicate, hollow glass micropearl and two 25 are mixed according to above-mentioned weight part proportioning, be squeezed into the sheet material of even thickness, then cut into small pieces by chip size, with the sheet material packaged chip cut out, packaged chip profile is standard evenly, open again fairlead, finally at 162 ℃ of sintering 13min of temperature, obtain the finished product packaged chip.
The present invention can summarize with other the specific form without prejudice to spirit of the present invention or principal character.Therefore, no matter from that, above-mentioned embodiment of the present invention all can only be thought can not limit invention to explanation of the present invention, claims have been pointed out scope of the present invention, and scope of the present invention is not pointed out in above-mentioned explanation, therefore, in the implication suitable with claims of the present invention and any variation in scope, all should think to be included in the scope of claims.
Claims (6)
1. a Chip Packaging high-temperature resistant rubber based composites is characterized in that being comprised of the following component according to the weight part proportioning:
100 parts, silicon rubber, softening agent 0.1-2 part, strengthening agent 1-10 part, adiabatic microballon 50-100 part, vulcanizing agent 1-15 part;
Described silicon rubber is methyl vinyl silicone rubber or methyl ethylene phenyl siloxane rubber;
Described adiabatic microballon is hollow glass micropearl.
2. a kind of Chip Packaging high-temperature resistant rubber based composites according to claim 1 is characterized in that being comprised of the following component according to the weight part proportioning:
100 parts, silicon rubber, softening agent 0.5-1.2 part, strengthening agent 3-8 part, adiabatic microballon 70-85 part, vulcanizing agent 6-10 part.
3. a kind of Chip Packaging high-temperature resistant rubber based composites according to claim 1, is characterized in that described strengthening agent is superfine silicon dioxide, superfine carbon black or fibrous silicate.
4. a kind of Chip Packaging high-temperature resistant rubber based composites according to claim 1, is characterized in that described softening agent is hydroxy silicon oil.
5. a kind of Chip Packaging high-temperature resistant rubber based composites according to claim 1, is characterized in that described vulcanizing agent is dicumyl peroxide, two 25 or two 24.
6. the application of high-temperature resistant rubber based composites for a kind of Chip Packaging claimed in claim 1, it is characterized in that carrying out according to following steps: with mixing roll, silicon rubber, softening agent, strengthening agent, adiabatic microballon and vulcanizing agent are mixed according to described weight part proportioning, be squeezed into sheet material, then cut into small pieces by chip size, with after the sheet material packaged chip cut out, opening again fairlead, finally at 150 ℃ of-168 ℃ of sintering 12min-20min of temperature, obtain the finished product packaged chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210151699.2A CN102675881B (en) | 2012-05-16 | 2012-05-16 | High temperature resistant rubber base composite material used for chip packaging and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210151699.2A CN102675881B (en) | 2012-05-16 | 2012-05-16 | High temperature resistant rubber base composite material used for chip packaging and application thereof |
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| CN102675881A CN102675881A (en) | 2012-09-19 |
| CN102675881B true CN102675881B (en) | 2014-01-01 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103820072B (en) * | 2012-11-19 | 2015-07-01 | 郑州中原应用技术研究开发有限公司 | Double-component silicone structural sealant for heat mirror hollow glass and preparation method thereof |
| CN103351621A (en) * | 2013-05-31 | 2013-10-16 | 镇江天信电器有限公司 | Insulation rubber tube for heater, and making method thereof |
| CN104403329A (en) * | 2014-11-18 | 2015-03-11 | 滁州君越高分子新材料有限公司 | Heat-conducting silicone rubber |
| CN104371331A (en) * | 2014-11-18 | 2015-02-25 | 滁州君越高分子新材料有限公司 | Silicone rubber for sealing two ends of heater |
| CN104725876A (en) * | 2014-12-17 | 2015-06-24 | 苏州锦腾电子科技有限公司 | Oil-resistant and high-temperature-resistant room temperature vulcanized silicone rubber and preparation method thereof |
| CN106328739B (en) * | 2016-08-19 | 2018-02-09 | 中国建筑材料科学研究总院 | Solar cell flexible cover plate and preparation method thereof |
| CN106419442B (en) * | 2016-08-30 | 2019-01-22 | 软控股份有限公司 | Plane warehouse compartment management system based on RFID ground cushion |
| CN107541069A (en) * | 2017-10-12 | 2018-01-05 | 西北橡胶塑料研究设计院有限公司 | A kind of silicone rubber seal section bar |
| CN108467592A (en) * | 2018-04-09 | 2018-08-31 | 武汉理工大学 | A kind of heat-insulated solar heat protection room temperature curing organosilicon film and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950692A (en) * | 2010-09-28 | 2011-01-19 | 彩虹集团公司 | Packaging material and packaging method for dye sensitized solar cell |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950692A (en) * | 2010-09-28 | 2011-01-19 | 彩虹集团公司 | Packaging material and packaging method for dye sensitized solar cell |
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