CN102665375A - System and method for welding flexible printed circuit made of polyester material at low temperature - Google Patents
System and method for welding flexible printed circuit made of polyester material at low temperature Download PDFInfo
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- CN102665375A CN102665375A CN2012101771356A CN201210177135A CN102665375A CN 102665375 A CN102665375 A CN 102665375A CN 2012101771356 A CN2012101771356 A CN 2012101771356A CN 201210177135 A CN201210177135 A CN 201210177135A CN 102665375 A CN102665375 A CN 102665375A
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- electric circuit
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Abstract
The invention discloses a system and a method for welding a flexible printed circuit made of a polyester material at a low temperature. The low-temperature welding system comprises a reflow soldering device and soldering tin, particularly the soldering tin is lead-free low-temperature solder paste of which the welding temperature of lower than or equal to 110 DEG C; and the low-temperature welding system also comprises a surface mount carrier, and an insulation board which is used for covering a polyester material flexible printed circuit to insulate heat, wherein the insulation board has an avoiding space for avoiding surface mount components, so that the welding parts of the surface mount components are exposed so as to perform reflow soldering. According to the low-temperature welding system for the polyester material flexible printed circuit, the polyester material can be directly subjected to surface mount components and reflow soldering, and the overall expansion and deformation of the welded polyester material flexible printed circuit are in a completely controllable range which meets the requirement. In addition, the system is easy to operate, reliable in surface mount welding, energy-saving and highly efficient and can be applied to the wide application field, and the cost of a manufacturing enterprise and a using enterprise is reduced.
Description
Technical field
the present invention relates to a kind of polyester material flexible electric circuit board soldered system and welding method.
Background technology
In
prior art; The flexible circuit board industry to the product that needs Surface Mount Component, (SMT) when the design; All select for use resistant to elevated temperatures polyimides (PI) material to carry out production of products; Follow-up when mounting behind the components and parts through the high temperature Reflow Soldering to guarantee, processed product can Yin Gaowen and is produced serious harmomegathus and distortion.Because the maximum temperature that the theory of polyester (PET) material own is born is 105 ℃, the flexible circuit panel products that is processed into, if carry out operation for 250 ℃ according to the high temperature reflux weldering of polyimides (PI) material, polyester (PET) material definitely can't stand; And polyimides (PI) material polyester (PET) material price on year-on-year basis is doubled at least.Therefore; The existence of objective condition problem; Troubling the manufacturer and use producer of flexible circuit for a long time always; And manufacturing firm and use producer are also being explored always hardy, hope to seek the method that can directly carry out Surface Mount Component, (SMT) and Reflow Soldering to polyester (PET) material, the use cost of finally coming to reduce better product.
Summary of the invention
technical problem to be solved by this invention is the deficiency that overcomes prior art, and a kind of polyester material flexible electric circuit board soldered system that can directly carry out Surface Mount Component, and Reflow Soldering to polyester material is provided.
the present invention also will provide a kind of polyester material flexible electric circuit board low-temperature welding method that can directly carry out Surface Mount Component, and Reflow Soldering to polyester material simultaneously.
For solving above technical problem, a kind of technical scheme that the present invention takes is:
a kind of polyester material flexible electric circuit board soldered system; It comprises reflow soldering apparatus and is arranged on the polyester material flexible electric circuit board and is mounted on the scolding tin between the components and parts that mounts on the polyester material flexible electric circuit board; Particularly; Described scolding tin is welding temperature smaller or equal to 110 ℃ lead-free low-temperature tin cream; The soldered system also comprises and is used for fixing mounting support plate, being used to cover the thermal insulation board that plays heat-blocking action on the polyester material flexible electric circuit board of polyester material flexible electric circuit board, and this thermal insulation board has dodges the space of dodging that mounts components and parts, makes the welding position that mounts components and parts expose and is convenient to carry out Reflow Soldering.
according to an aspect of the present invention, described scolding tin is that welding temperature is 100 ℃ ~ 110 ℃ a lead-free low-temperature tin cream.Field village TLF-204-NH lead-free low-temperature tin cream for example.
according to the present invention, the material of described thermal insulation board is heat stable resin, preferred epoxy or modified epoxy.
The another technical scheme that the present invention takes is:
A kind of method that adopts above-mentioned polyester material flexible electric circuit board soldered system to weld, it comprises the steps:
(1), the polyester material flexible electric circuit board be fixed on mount above the support plate, and accomplish and mount components and parts mounting on the polyester material flexible electric circuit board;
(2), thermal insulation board is fixed on the polyester material flexible electric circuit board, guarantee in the time of fixedly that the welding position that mounts components and parts exposes, and obtains assembly to be welded;
(3), above-mentioned assembly to be welded is placed in the reflow soldering apparatus that configures temperature parameter, carry out Reflow Soldering by reflow soldering apparatus to mounting components and parts above the polyester material flexible electric circuit board;
(4), Reflow Soldering after accomplishing are laid down thermal insulation board, above mounting support plate, take off the polyester material flexible electric circuit board again, and so far all weld job is accomplished.
preferably, in the step (3), the temperature of Reflow Soldering is 100 ~ 110 ℃.
Because the enforcement of above technical scheme, the present invention compared with prior art has following advantage:
the present invention proposes polyester material flexible electric circuit board soldered system first; Utilize this system directly to carry out Surface Mount Component, and Reflow Soldering to polyester material, whole harmomegathus of welding back polyester material flexible circuit panel products and distortion are fully within satisfactory controlled range.In addition, the Reflow Soldering temperature of soldered of the present invention system is lower, compared with present technology, and Reflow Soldering equipment power consumption decline to a great extent (nearly 35%).
Description of drawings
are done further detailed explanation below in conjunction with accompanying drawing and concrete execution mode to the present invention.
Fig. 1 is the structural representation (reflow soldering apparatus does not show) of polyester material flexible electric circuit board soldered of the present invention system;
wherein: 1, mount components and parts; 2, low-temperature lead-free solder; 3, thermal insulation board; 4, polyester material flexible electric circuit board; 5, mount support plate.
Embodiment
are as shown in Figure 1, comprise reflow soldering apparatus (not shown), low-temperature lead-free solder 2 (field village TLF-204-NH lead-free low-temperature tin cream), thermal insulation board 3 (material is an epoxy resin), polyester material flexible electric circuit board 4 and mount support plate 5 according to the polyester material flexible electric circuit board soldered system of present embodiment.
It is following to utilize the soldered system of present embodiment to carry out the step of Reflow Soldering:
(1), polyester material flexible electric circuit board 4 be fixed on mount above the support plate 5, and accomplish and mount components and parts 1 mounting on polyester material flexible electric circuit board 4;
(2), will have the thermal insulation board 3 of dodging the space and be fixed on the polyester material flexible electric circuit board 4, guarantee in the time of fixedly that the welding position that mounts components and parts 1 that is soldered exposes, and obtains assembly to be welded;
(3), assembly to be welded be placed into configure in the isoparametric reflow soldering apparatus of all temperature; Accomplished mounting the soldered process of components and parts 1 above the polyester material flexible electric circuit board 4 by reflow soldering apparatus, the Reflow Soldering temperature is 100 ~ 110 ℃.
After
(4), Reflow Soldering are accomplished; Thermal insulation board 3 is laid down; Above mounting support plate 5, take off polyester material flexible electric circuit board 4 again, accomplished the soldered operation process of the Surface Mount Component, of whole polyester material flexible circuit panel products thus.
the present invention and traditional polyimides product mount the high-temperature soldering compared with techniques of components and parts; Simple to operate, mount reliable welding; Mount the components and parts that welding is accomplished; All more than one kilogram, its components and parts welding quality meets all specification requirements fully through the actual thrust strength test; Improve original product and directly got into the technology that Reflow Soldering is processed; Re-designed polyester (PET) material product surface thermal insulation board; Guaranteed that polyester (PET) material product accomplishes Surface Mount Component,, pass through low temperature (110 ℃) Reflow Soldering processing again after, the whole harmomegathus of polyester (PET) material product and distortion are fully within satisfactory controlled range; The reprocessing of subsequent handling there are not any adverse effect and hidden danger of quality; Thoroughly realize polyester material flexible circuit panel products, can have been carried out the soldered technology of Surface Mount Component, in enormous quantities, do not changed any technology that original polyester material flexible electric circuit board is produced; And because the processing temperature of soldered tin cream is low, compare original high temperature tin cream operation, it is nearly 35% that the Reflow Soldering equipment power consumption of soldered has also reduced, basic neutralisation the price difference of two kinds of tin creams.Therefore; Meeting under the situation of equal serviceability; Can be under the situation that does not increase any cost expenditure; Really accomplished simple and reliable and efficient energy-saving,, made that also the application of polyester material flexible circuit panel products is more wide simultaneously for enterprise opens up a market better and is that the client reduces cost better advantage is provided.
are to sum up, and are simple according to polyester material flexible electric circuit board soldered of the present invention system operation, mount reliable welding, efficient energy-saving, for manufacturing enterprise with use enterprise to reduce cost, have more wide application.
are above has done detailed description to the present invention, but the invention is not restricted to the embodiments described.All equivalences of doing according to spirit of the present invention change or modify, and all should be encompassed in protection scope of the present invention
Claims (5)
1. polyester material flexible electric circuit board soldered system; Comprise reflow soldering apparatus and be arranged on said polyester material flexible electric circuit board (4) and be mounted on the scolding tin (2) between the components and parts (1) that mounts on the said polyester material flexible electric circuit board (4); It is characterized in that: described scolding tin (2) is the lead-free low-temperature tin cream of welding temperature smaller or equal to 110 ℃; Described soldered system also comprises and is used for fixing mounting support plate (5), being used to cover the thermal insulation board (3) that said polyester material flexible electric circuit board (4) has been gone up heat-blocking action of said polyester material flexible electric circuit board (4); Said thermal insulation board (3) has dodges the described space of dodging that mounts components and parts (1), makes the welding position mount components and parts (1) expose and is convenient to carry out Reflow Soldering.
2. polyester material flexible electric circuit board soldered according to claim 1 system, it is characterized in that: described scolding tin (2) is 100 ℃ ~ 110 ℃ lead-free low-temperature tin cream for welding temperature.
3. polyester material flexible electric circuit board soldered according to claim 1 system, it is characterized in that: the material of described thermal insulation board (3) is an epoxy resin.
4. one kind is adopted the method that the described polyester material flexible electric circuit board of each claim soldered system welds in the claim 1 to 3, it is characterized in that: comprise the steps:
(1), the polyester material flexible electric circuit board be fixed on mount above the support plate, and accomplish and mount components and parts mounting on the polyester material flexible electric circuit board;
(2), thermal insulation board is fixed on the polyester material flexible electric circuit board, guarantee in the time of fixedly that the welding position that mounts components and parts exposes, and obtains assembly to be welded;
(3), above-mentioned assembly to be welded is placed in the reflow soldering apparatus that configures temperature parameter, carry out Reflow Soldering by reflow soldering apparatus to mounting components and parts above the polyester material flexible electric circuit board;
(4), after Reflow Soldering accomplishes, thermal insulation board is laid down, above mounting support plate, take off the polyester material flexible electric circuit board, so far all weld jobs are accomplished again.
5. method according to claim 4 is characterized in that: in the step (3), the temperature of Reflow Soldering is 100 ℃ ~ 110 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177135.6A CN102665375B (en) | 2012-05-31 | 2012-05-31 | System and method for welding flexible printed circuit made of polyester material at low temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177135.6A CN102665375B (en) | 2012-05-31 | 2012-05-31 | System and method for welding flexible printed circuit made of polyester material at low temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102665375A true CN102665375A (en) | 2012-09-12 |
| CN102665375B CN102665375B (en) | 2014-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210177135.6A Active CN102665375B (en) | 2012-05-31 | 2012-05-31 | System and method for welding flexible printed circuit made of polyester material at low temperature |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922070A (en) * | 2012-11-05 | 2013-02-13 | 上海航嘉电子有限公司 | Lead-free surface mounting technology (SMT) welding process for FR-1 paper printed circuit board (PCB) and special heat insulation fixture |
Citations (8)
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|---|---|---|---|---|
| CN1171718A (en) * | 1996-07-23 | 1998-01-28 | 日本电气株式会社 | Multi-layered interconnection board capable of reducing cross-talk noise |
| JP2000357869A (en) * | 1999-06-17 | 2000-12-26 | Sony Corp | Method of mounting components |
| CN1402606A (en) * | 2001-08-20 | 2003-03-12 | 日本电气株式会社 | Printed circuit board with protruding end on electroplated conductive layer and mfg. method thereof |
| CN101080441A (en) * | 2004-12-16 | 2007-11-28 | 伊斯曼化学公司 | Biaxially oriented copolyester film and laminates thereof with copper |
| JP2008091957A (en) * | 2002-01-11 | 2008-04-17 | Nec Infrontia Corp | Soldering method |
| CN101350464A (en) * | 2007-07-20 | 2009-01-21 | 深圳富泰宏精密工业有限公司 | Conductive pole and electronic device containing the same |
| CN101521994A (en) * | 2009-04-03 | 2009-09-02 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN202634899U (en) * | 2012-05-31 | 2012-12-26 | 昆山市线路板厂 | Low-temperature welding system for flexible polyester circuit board |
-
2012
- 2012-05-31 CN CN201210177135.6A patent/CN102665375B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171718A (en) * | 1996-07-23 | 1998-01-28 | 日本电气株式会社 | Multi-layered interconnection board capable of reducing cross-talk noise |
| JP2000357869A (en) * | 1999-06-17 | 2000-12-26 | Sony Corp | Method of mounting components |
| CN1402606A (en) * | 2001-08-20 | 2003-03-12 | 日本电气株式会社 | Printed circuit board with protruding end on electroplated conductive layer and mfg. method thereof |
| JP2008091957A (en) * | 2002-01-11 | 2008-04-17 | Nec Infrontia Corp | Soldering method |
| CN101080441A (en) * | 2004-12-16 | 2007-11-28 | 伊斯曼化学公司 | Biaxially oriented copolyester film and laminates thereof with copper |
| CN101350464A (en) * | 2007-07-20 | 2009-01-21 | 深圳富泰宏精密工业有限公司 | Conductive pole and electronic device containing the same |
| CN101521994A (en) * | 2009-04-03 | 2009-09-02 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN202634899U (en) * | 2012-05-31 | 2012-12-26 | 昆山市线路板厂 | Low-temperature welding system for flexible polyester circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922070A (en) * | 2012-11-05 | 2013-02-13 | 上海航嘉电子有限公司 | Lead-free surface mounting technology (SMT) welding process for FR-1 paper printed circuit board (PCB) and special heat insulation fixture |
| CN102922070B (en) * | 2012-11-05 | 2015-07-15 | 上海航嘉电子科技股份有限公司 | Lead-free surface mounting technology (SMT) welding process for FR-1 paper printed circuit board (PCB) and special heat insulation fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102665375B (en) | 2014-12-17 |
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