CN102663175A - System and method for constructing three-dimensional model of radio-frequency passive device - Google Patents
System and method for constructing three-dimensional model of radio-frequency passive device Download PDFInfo
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Abstract
The invention relates to a system and a method for constructing a three-dimensional model of a radio-frequency passive device and belongs to the technical field of radio-frequency integrated circuits. The system for constructing the three-dimensional model of the radio-frequency passive device comprises a two-dimensional model acquisition module, a lamination parameter setting module, an executing module, a database and a server. The method for constructing the three-dimensional model of the radio-frequency passive device includes: acquiring two-dimensional model information, perfecting a lamination parameter list, and adding electrical property to each lamination after extending and overlaying each lamination according to the lamination parameter list so as to obtain the three-dimensional model of the radio-frequency passive device. Design processes of the radio-frequency integrated circuits are simplified, and compatibility with the design processes of the radio-frequency integrated circuits is improved.
Description
Technical field
The present invention relates to a kind of constructing system and construction method of radio frequency passive device three-dimensional model, belong to the technical field of RF IC.
Background technology
RF IC is meant the radio circuit that uses the semiconductor integrated circuit technique fabrication techniques, and it is little, low in energy consumption to have a volume, characteristics such as reliability height.Common radio circuit has: low noise amplifier, power amplifier, oscillator; Frequency mixer etc.; Frequency of operation from hundreds of MHz to several GHz, tens GHz do not wait, and are the very important signal processing modules of Wireless Telecom Equipment, its performance quality directly influences product quality.
In recent years, the wireless communication technology development is rapid, and wireless product is widely used in the various aspects of people's life, and RF IC is also had higher requirement, and requires to have more excellent signal handling capacity and shorter product development cycle.
RF IC mainly is made up of passive devices such as transistor active device and inductance capacitances.At present; People can set up point-device transistor device model; And along with the further developing of CMOS technology, can make and had higher performance, the CMOS transistor of littler characteristic dimension (tens nanometers) and higher frequency of operation (more than the 100GHz).So the performance of passive device has just become the key factor of restriction RF IC performance on the sheet.
In order to obtain accurate radio frequency passive device model, just need the applying three-dimensional Theory of Electromagnetic Field that device is carried out simulation analysis.Carry out the analysis of three-dimensional all-wave electromagnetic-field simulation, need to make up earlier the three-dimensional model of radio frequency passive device.Existing three-dimensional model the build tool; Its method of application complicacy is loaded down with trivial details; Well the design cycle of compatibility and RF IC needs frequent must in Different software environment and design platform, the switching, makes the design cycle of existing RF IC become complicated; Increase deviser's work difficulty and workload, reduced design efficiency.
Summary of the invention
Technical matters to be solved by this invention is the deficiency to the above-mentioned background technology, and a kind of constructing system and construction method of radio frequency passive device three-dimensional model is provided.
The present invention adopts following technical scheme for realizing the foregoing invention purpose:
A kind of constructing system of radio frequency passive device three-dimensional model comprises: two dimensional surface model acquisition module, lamination parameter are provided with module, execution module, server, database; Wherein: the input end that said lamination parameter is provided with module is connected with the output terminal of two dimensional surface model acquisition module; The output terminal that the lamination parameter is provided with module is connected with the input end of execution module; Said lamination parameter is provided with the data-interface of module, the data-interface of execution module is connected with server respectively, and said two dimensional surface model acquisition module, that the lamination parameter is provided with module is all mutual with database;
The radio circuit layout extraction that said two dimensional surface model acquisition module is used for storing according to database makes up necessary each the two dimensional surface model of three-dimensional model, and obtains the information of each two dimensional surface model;
Said lamination parameter is provided with module and is used for constituting the lamination numbering of radio frequency passive device, the laminated thickness information of user's input, the corresponding electric parameter of each material that database is stored according to each two dimensional surface model and improves the lamination parameter list;
Said execution module is used for lamination numbering, the laminated thickness information according to the lamination parameter table stores, each two dimensional surface model is extended stack in the vertical obtain three-dimensional model, and the electric parameter that each lamination is corresponding adds in the three-dimensional model.
A kind of construction method of radio frequency passive device three-dimensional model comprises the steps:
Step 1 makes up the constructing system of radio frequency passive device three-dimensional model as claimed in claim 1;
Step 2, two dimensional surface model acquisition module constitutes necessary each the two dimensional surface model of radio frequency passive device according to the radio circuit layout extraction of storing in the database, obtains each two dimensional surface model information;
Step 3, lamination parameter are provided with each two dimensional surface model that module obtains according to step 2 and improve the lamination parameter list, and practical implementation is following:
Steps A is given each lamination numbering with each two dimensional surface model according to laminated layer sequence from bottom to the top;
Step B, the user is provided with each laminated thickness parameter through server;
Step C consults the electric parameter that database is confirmed each lamination according to the material information of each lamination;
Step 4; Execution module vertically prolongs the living three-dimensional submodel that obtains with each lamination according to the laminated thickness that is provided with; Each three-dimensional submodel superposeed according to the lamination label successively obtain the three-dimensional model of said radio frequency passive device; And the electric parameter of lamination added in the three-dimensional model, show the three-dimensional model that generates through server again.
In the construction method of said a kind of radio frequency passive device three-dimensional model, the practical implementation of step C is following:
If lamination is a conductive material, the lamination parameter is provided with module and consults the conductivity value that database obtains conductor;
If lamination is the insulator material, the lamination parameter is provided with module and consults relative dielectric constant value and the loss tangent that database obtains insulator;
If lamination is semiconductor material, the lamination parameter is provided with module and consults database and obtain conductivity value and relative dielectric constant value.
In the step 3 of the construction method of said a kind of radio frequency passive device three-dimensional model, the lamination parameter list also comprises: the error of stack surface roughness, lamination size.
The present invention adopts technique scheme, has following beneficial effect: simplified the design cycle of RF IC, improved the compatibility with the RF IC design cycle.
Description of drawings
Fig. 1 is the synoptic diagram of radio frequency passive device three-dimensional model constructing system.
Fig. 2 is the process flow diagram of radio frequency passive device 3 D model construction method.
Fig. 3 is for making up the two dimensional surface model synoptic diagram that simple spiral inductance obtains.
Fig. 4 is the cross sectional representation of simple spiral inductance lamination.
Fig. 5 is the synoptic diagram of the simple spiral inductance lamination xsect after the equivalence.
The simple spiral inductance three-dimensional model synoptic diagram of Fig. 6 for making up.
Embodiment
Be elaborated below in conjunction with the technical scheme of accompanying drawing to invention:
As shown in Figure 1, the constructing system of radio frequency passive device three-dimensional model comprises: two dimensional surface model acquisition module, lamination parameter are provided with module, execution module, server, database.The input end that the lamination parameter is provided with module is connected with the output terminal of two dimensional surface model acquisition module; The output terminal that the lamination parameter is provided with module is connected with the input end of execution module; The lamination parameter is provided with the data-interface of module, the data-interface of execution module is connected with server respectively, and it is all mutual with database that two dimensional surface model acquisition module, lamination parameter are provided with module.
The radio circuit layout extraction that two dimensional surface model acquisition module is used for storing according to database makes up necessary each the two dimensional surface model of three-dimensional model, and obtains the information of each two dimensional surface model.The two dimensional surface model information comprises: the coordinate in the shape information of two dimensional surface model, the two dimensional surface model place xOy two-dimensional coordinate system.
The lamination parameter is provided with module and is used for constituting the lamination numbering of radio frequency passive device, the laminated thickness information of user's input, the corresponding electric parameter of each material that database is stored according to each two dimensional surface model and improves the lamination parameter list.
Execution module is used for lamination numbering, the laminated thickness information according to the lamination parameter table stores, each two dimensional surface model is extended stack in the vertical obtain three-dimensional model, and the electric parameter that each lamination is corresponding adds in the three-dimensional model.
The method of setting up simple spiral inductance three-dimensional model in conjunction with Cadence Virtuoso IC design software and server is as shown in Figure 2, comprises the steps:
Step 1 utilizes Cadence Virtuoso IC design software to make up the constructing system of radio frequency passive device three-dimensional model as shown in Figure 1.
Step 2; Two dimensional surface model acquisition module constitutes necessary each the two dimensional surface model of radio frequency passive device according to the simple spiral inductance layout extraction of storing in the database: upper strata metal pattern (Metal2); Through hole model (Via1) and lower metal model (Metal1); Obtain each two dimensional surface model information, as shown in Figure 3.
Step 3, lamination parameter are provided with each two dimensional surface model that module obtains according to step 2 the lamination parameter are set, and it is following to improve lamination parameter list (as shown in table 1) practical implementation:
Steps A is given each lamination numbering with each two dimensional surface model according to laminated layer sequence from bottom to the top;
Step B, the user is provided with each laminated thickness parameter through server;
Step C consults the electric parameter that database is confirmed each lamination according to the material information of each lamination;
Table 1
As shown in table 1, laminated information comprises: layer definition and material definition two parts.In layer definition, the numbering of complete layer (showing layer order from top to bottom), layer name, laminated thickness (unit is a micron, greater than 0), (material of layer comprises the material of layer: conductor material and dielectric material two row, the name that need fill in material.When stack type is metal and through hole, then fill out the material name of associated metal at the conductor material row, represent the material of this metal and through hole, and fill out the packing material name of this layer at the dielectric material row; When stack type is a medium, then fill out the material name of this layer medium at the dielectric material row.), stack type (indicating the purposes of this layer).In the material definition, accomplish the name of material, type of material, the relative dielectric constant of material, conductivity and loss tangent.The physical attribute of lamination is according to the material name in the layer definition, retrieves material then and obtains.
The synoptic diagram of simple spiral inductance lamination xsect is as shown in Figure 4, and electrolyte (Dielectric), upper strata overwrite media (Pass), upper strata metal (Metal3), middle level metal (Metal2), lower metal (Metal1), substrate dielectric (Substrate) through hole 1 (Via1), through hole 2 (Vial2) are arranged.The size that the height of upper strata overwrite media (Pass), upper strata metal (Metal3), middle level metal (Metal2), lower metal (Metal1), each lamination of substrate dielectric (Substrate) extends on the z direction of principal axis for each two dimensional surface model.Through hole 1 (Via1), through hole 2 (Vial2) are respectively the space between space, middle level metal (Metal2) and the upper strata metal (Metal3) between lower metal (Metal1) and the middle level metal (Metal2).Be filled with electrolyte (Dielectric) between three metal levels.Upper metal layers that in the lamination parameter, is not used (Metal3) and through hole 2 (Via2) are then all substituted by its corresponding filling medium SiO2.The simple spiral inductance lamination cross sectional representation of equivalence is as shown in Figure 5, comprising: three dimensional inductor part, and the filling medium of three-dimensional inductance, substrate dielectric Substrate, the sandwich construction that upper strata overwrite media Pass constitutes.
Step 4; Execution module vertically prolongs living obtain three-dimensional submodel according to the laminated thickness that is provided with along the z axle with each lamination; Each three-dimensional submodel is obtained the three-dimensional model of simple spiral inductance according to lamination numbering stack successively; And the electric parameter of lamination added in the three-dimensional model, show the three-dimensional model (as shown in Figure 6) of simple spiral inductance again through server.
In sum, the present invention has simplified the design cycle of RF IC, has improved the compatibility with the RF IC design cycle.Above-mentioned example is merely one embodiment of the present of invention, but never is the unique embodiment of the present invention, other all meet embodiment that the present invention invents aim all within protection scope of the present invention.
Claims (4)
1. the constructing system of a radio frequency passive device three-dimensional model, it is characterized in that comprising: two dimensional surface model acquisition module, lamination parameter are provided with module, execution module, server, database; Wherein: the input end that said lamination parameter is provided with module is connected with the output terminal of two dimensional surface model acquisition module; The output terminal that the lamination parameter is provided with module is connected with the input end of execution module; Said lamination parameter is provided with the data-interface of module, the data-interface of execution module is connected with server respectively, and said two dimensional surface model acquisition module, that the lamination parameter is provided with module is all mutual with database;
The radio circuit layout extraction that said two dimensional surface model acquisition module is used for storing according to database makes up necessary each the two dimensional surface model of three-dimensional model, and obtains the information of each two dimensional surface model;
Said lamination parameter is provided with module and is used for constituting the lamination numbering of radio frequency passive device, the laminated thickness information of user's input, the corresponding electric parameter of each material that database is stored according to each two dimensional surface model and improves the lamination parameter list;
Said execution module is used for lamination numbering, the laminated thickness information according to the lamination parameter table stores, each two dimensional surface model is extended stack in the vertical obtain three-dimensional model, and the electric parameter that each lamination is corresponding adds in the three-dimensional model.
2. the construction method of a radio frequency passive device three-dimensional model is characterized in that comprising the steps:
Step 1 makes up the constructing system of radio frequency passive device three-dimensional model as claimed in claim 1;
Step 2, two dimensional surface model acquisition module constitutes necessary each the two dimensional surface model of radio frequency passive device according to the radio circuit layout extraction of storing in the database, obtains each two dimensional surface model information;
Step 3, lamination parameter are provided with each two dimensional surface model that module obtains according to step 2 and improve the lamination parameter list, and practical implementation is following:
Steps A is given each lamination numbering with each two dimensional surface model according to laminated layer sequence from bottom to the top;
Step B, the user is provided with each laminated thickness parameter through server;
Step C consults the electric parameter that database is confirmed each lamination according to the material information of each lamination;
Step 4; Execution module vertically prolongs the living three-dimensional submodel that obtains with each lamination according to the laminated thickness that is provided with; Each three-dimensional submodel superposeed according to the lamination label successively obtain the three-dimensional model of said radio frequency passive device; And the electric parameter of lamination added in the three-dimensional model, show the three-dimensional model that generates through server again.
3. the construction method of a kind of radio frequency passive device three-dimensional model according to claim 2 is characterized in that the practical implementation of said step C is following:
If lamination is a conductive material, the lamination parameter is provided with module and consults the conductivity value that database obtains conductor;
If lamination is the insulator material, the lamination parameter is provided with module and consults relative dielectric constant value and the loss tangent that database obtains insulator;
If lamination is semiconductor material, the lamination parameter is provided with module and consults database and obtain conductivity value and relative dielectric constant value.
4. the construction method of a kind of radio frequency passive device three-dimensional model according to claim 2 is characterized in that the lamination parameter list described in the step 3 also comprises: the error of stack surface roughness, lamination size.
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Cited By (3)
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| CN105824995A (en) * | 2016-03-10 | 2016-08-03 | 无锡飞谱电子信息技术有限公司 | Three-dimensional electromagnetic field model generation method based on physical layout |
| CN106446337A (en) * | 2016-08-26 | 2017-02-22 | 中国电子科技集团公司第十三研究所 | Method for calculating noise standard value of passive device |
| CN111739162A (en) * | 2020-08-10 | 2020-10-02 | 成都智明达电子股份有限公司 | Automatic PCBA accurate three-dimensional model generation method based on ECAD interface |
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| CN111739162A (en) * | 2020-08-10 | 2020-10-02 | 成都智明达电子股份有限公司 | Automatic PCBA accurate three-dimensional model generation method based on ECAD interface |
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