CN102645177B - Pre-detection method of wafer breakage - Google Patents
Pre-detection method of wafer breakage Download PDFInfo
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- CN102645177B CN102645177B CN201110039631.0A CN201110039631A CN102645177B CN 102645177 B CN102645177 B CN 102645177B CN 201110039631 A CN201110039631 A CN 201110039631A CN 102645177 B CN102645177 B CN 102645177B
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- wafer
- splitting
- fragmentation
- tangent line
- detection method
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a pre-detection method of wafer breakage. The method comprises the following steps of: performing image pickup for reading the contour of the broken wafer; positioning the broken wafer on a rotation platform; determining the moving path of a second image pickup unit by use of a reference point on the broken wafer in combination with the contour data; obtaining the coordinate data of the endpoint of the pre-cut line by the second image pickup unit, and transferring the coordinate data to an operation unit to calculate the length of each pre-cut line; and finding the corresponding breakage depth from a database, and assisting a wafer breaker in providing a proper breakage depth to the pre-cut lines with different depths in the broken wafer. Through the invention, the pre-cut line is effectively broken, and the breakage damage rate of the wafer is reduced.
Description
Technical field
The present invention is a kind of preposition detection method of wafer splitting, particularly a kind of preposition detection method of wafer splitting of assisting splitting fragmentation wafer.
Background technology
Wafer is to be divided into most crystal grain by wafer splitting machine, crystal grain is further installed on carrier and executive circuit is laid, then carry out packaging operation and make semiconductor element, wherein, wafer can produce fragmentation situation because of collision in transporting on the way, expensive because of wafer again, so the wafer of fragmentation still needs to enter wafer splitting machine and cuts apart operation, material and cost avoid waste, wherein, wafer is before carrying out splitting, need on wafer, cut go out laterally, longitudinal pre-tangent line, then after carrying out conservation treatment, be placed on the worktable of wafer splitting machine processing wafer later again, and read the contour image of wafer with single image reading unit, and send data to an arithmetic element, and then location wafer, and the chopper on wafer splitting machine is driven and the pre-tangent line place of wafer is carried out to splitting operation.
But, the border of fragmentation wafer is irregular, and pre-length of tangent degree also not necessarily, wafer splitting machine is to all applying the identical splitting degree of depth at the pre-tangent line of different length, and at the shorter pre-tangent line of splitting wafer length, batch resistance to spalling applying exceedes its load and fragile, at the long pre-tangent line of splitting wafer length, may cause the situation that cannot once split disconnected pre-tangent line, therefore wafer splitting machine need to repeat splitting to same pre-tangent line, causes the time-consuming problem of work consuming.
Summary of the invention
The technical problem to be solved in the present invention is: a kind of preposition detection method of wafer splitting is provided, and improving existing wafer splitting method cannot provide for fragmentation wafer the problem of the suitable splitting degree of depth.
Technical solution of the present invention is: a kind of preposition detection method of wafer splitting is provided, and wherein, the preposition detection method of described wafer splitting includes:
One shooting step, reads the profile of fragmentation wafer, and data is sent to an arithmetic element with one first image unit;
One positioning step, is positioned at fragmentation wafer on one universal stage;
One determines length step, take out a reference point, determine the mobile route of one second image unit with the outline data of fragmentation wafer, obtained the coordinate data of pre-tangent line and junction contour by the second image unit, and be sent to arithmetic element to calculate each pre-length of tangent degree; And
One determines splitting depth step, according to each pre-length of tangent degree, and can be by finding out the corresponding splitting degree of depth in the database of arithmetic element.
Advantage of the present invention is: the preposition detection method of described wafer splitting utilizes the first image unit to obtain the profile of fragmentation wafer, outline data determines the mobile route of the second image unit according to this, allow the second image unit can obtain the coordinate data of pre-tangent line and fragmentation wafer junction contour, further calculate each pre-length of tangent degree on fragmentation wafer, again by finding out the corresponding splitting degree of depth in database, the data of the splitting degree of depth can be sent to a control module, the chopper of the controlled combinations circle of described control module splitting machine, with pre-tangent line corresponding on suitable splitting degree of depth splitting fragmentation wafer, so fragmentation wafer is before splitting, by the preposition detection method of wafer splitting, can learn the pre-needed suitable splitting degree of depth of tangent line on fragmentation wafer, can assist the pre-tangent line of the smooth splitting fragmentation of the chopper wafer of wafer splitting machine, avoid the splitting degree of depth excessive and damage the situation of wafer, and avoid the splitting degree of depth too small and need the time-consuming problem of work consuming that repeatedly splitting causes.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of a specific embodiment of the preposition detection method of wafer splitting of the present invention.
Embodiment
Below coordinate preferred embodiment graphic and of the present invention, further set forth the technological means that the present invention takes for reaching predetermined goal of the invention.
Referring to Fig. 1, is a preferred embodiment of the preposition detection method of wafer splitting of the present invention, and it includes a shooting step, a positioning step, determines that length step and determines splitting depth step.
In described shooting step, read the profile of fragmentation wafer with one first image unit, and data are sent to an arithmetic element.
In described positioning step, fragmentation wafer is positioned on a universal stage, and wherein, described positioning step is the angle of inclination of first adjusting fragmentation wafer, adjust again the position of longitudinally pre-tangent line, laterally pre-tangent line on fragmentation wafer, make the pairs of bit line contraposition of longitudinally pre-tangent line, laterally pre-tangent line and universal stage.
In described decision length step, first in the fragmentation wafer on universal stage, take out a reference point, can get the end points of fragmentation wafer as reference point, as most significant end point or minimum end points, determine again the mobile route of one second image unit according to the outline data of fragmentation wafer, obtained the coordinate data of pre-tangent line and junction contour by the second image unit, coordinate data is sent to arithmetic element to calculate each pre-length of tangent degree on fragmentation wafer.
In described decision splitting depth step, according to each pre-length of tangent degree that calculates in described decision length step, length/degree of depth table of comparisons default in the database via arithmetic element is compared, and can find out the applicable splitting degree of depth of each pre-tangent line.
In sum, wafer splitting machine is before splitting fragmentation wafer, can be by the preposition detection method of wafer splitting of the present invention, obtain smoothly the needed splitting degree of depth of pre-tangent line of different length, just split efficiently the pre-tangent line on disconnected fragmentation wafer at the chopper of wafer splitting machine, and then it is excessive and damage the situation of wafer to improve the splitting degree of depth, and it is too small and need the time-consuming problem of work consuming that repeatedly splitting causes to improve the splitting degree of depth, and the utilization factor that promotes fragmentation wafer also improves the efficiency of splitting operation.
The above is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, not departing from the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (2)
1. a preposition detection method for wafer splitting, is characterized in that, the preposition detection method of described wafer splitting comprises:
One shooting step, reads the profile of fragmentation wafer, and data is sent to an arithmetic element with one first image unit;
One positioning step, is positioned at fragmentation wafer on one universal stage, first adjusts the angle of inclination of fragmentation wafer, then adjusts the position of longitudinally pre-tangent line, laterally pre-tangent line on fragmentation wafer, makes the pairs of bit line contraposition of longitudinally pre-tangent line, laterally pre-tangent line and universal stage;
One determines length step, take out a reference point, determine the mobile route of one second image unit with the outline data of fragmentation wafer, obtained the coordinate data of pre-tangent line and junction contour by the second image unit, and be sent to arithmetic element to calculate each pre-length of tangent degree; And
One determines splitting depth step, according to each pre-length of tangent degree, finds out the corresponding splitting degree of depth in the database by arithmetic element.
2. the preposition detection method of wafer splitting according to claim 1, is characterized in that, in described decision length step, described reference point is got the end points of fragmentation wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110039631.0A CN102645177B (en) | 2011-02-17 | 2011-02-17 | Pre-detection method of wafer breakage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110039631.0A CN102645177B (en) | 2011-02-17 | 2011-02-17 | Pre-detection method of wafer breakage |
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| Publication Number | Publication Date |
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| CN102645177A CN102645177A (en) | 2012-08-22 |
| CN102645177B true CN102645177B (en) | 2014-08-20 |
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| CN201110039631.0A Expired - Fee Related CN102645177B (en) | 2011-02-17 | 2011-02-17 | Pre-detection method of wafer breakage |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200949240A (en) * | 2008-05-17 | 2009-12-01 | Wecon Automation Co Ltd | Method and device for inspecting and identifying burst of back of grains |
| CN101622525A (en) * | 2007-02-28 | 2010-01-06 | 株式会社尼康 | Observation device, inspection device and inspection method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH112510A (en) * | 1997-06-11 | 1999-01-06 | Disco Abrasive Syst Ltd | Device for detecting depth of cut groove |
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2011
- 2011-02-17 CN CN201110039631.0A patent/CN102645177B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101622525A (en) * | 2007-02-28 | 2010-01-06 | 株式会社尼康 | Observation device, inspection device and inspection method |
| TW200949240A (en) * | 2008-05-17 | 2009-12-01 | Wecon Automation Co Ltd | Method and device for inspecting and identifying burst of back of grains |
Non-Patent Citations (5)
| Title |
|---|
| JP特开平11-2510A 1999.01.06 |
| 任明灿等.基于线阵CCD的晶圆缺口检测装置.《电子测量技术》.2007,第30卷(第8期),第133-136页. |
| 基于线阵CCD的晶圆缺口检测装置;任明灿等;《电子测量技术》;20070831;第30卷(第8期);第133-136页 * |
| 基于高精度测微仪的晶圆预对准方法;曲东升等;《纳米技术与精密工程》;20090531;第7卷(第3期);第249-253页 * |
| 曲东升等.基于高精度测微仪的晶圆预对准方法.《纳米技术与精密工程》.2009,第7卷(第3期),第249-253页. |
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| CN102645177A (en) | 2012-08-22 |
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