CN102642346A - Method for modifying surface of metal die casting by using polymer coating method - Google Patents
Method for modifying surface of metal die casting by using polymer coating method Download PDFInfo
- Publication number
- CN102642346A CN102642346A CN2011100513174A CN201110051317A CN102642346A CN 102642346 A CN102642346 A CN 102642346A CN 2011100513174 A CN2011100513174 A CN 2011100513174A CN 201110051317 A CN201110051317 A CN 201110051317A CN 102642346 A CN102642346 A CN 102642346A
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- CN
- China
- Prior art keywords
- foundry goods
- metal
- metal crimp
- crimp foundry
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 109
- 239000002184 metal Substances 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 44
- 229920000642 polymer Polymers 0.000 title claims abstract description 31
- 238000004512 die casting Methods 0.000 title abstract description 17
- 238000000576 coating method Methods 0.000 title abstract description 3
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011241 protective layer Substances 0.000 claims abstract 3
- 239000000758 substrate Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 13
- 230000003647 oxidation Effects 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- 229910010037 TiAlN Inorganic materials 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical group [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 238000005275 alloying Methods 0.000 claims description 4
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011195 cermet Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 210000000981 epithelium Anatomy 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 claims 24
- 229920002635 polyurethane Polymers 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 239000002932 luster Substances 0.000 description 7
- 238000005266 casting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The invention discloses a method for modifying the surface of a metal die casting, which comprises the following steps: providing a metal die casting base material surface; coating a high molecular polymer on the surface of the metal die casting base material; depositing a metal film on the high molecular polymer in a vacuum coating mode; and covering a transparent protective layer on the metal film to finish the surface modification of the metal die casting, thereby improving the surface texture and the metal color of the metal die casting.
Description
Technical field
The present invention proposes a kind of method of metal crimp foundry goods surfaction, is meant the coating that the utilizes high molecular polymer method with the metal crimp foundry goods surfaction that increases metal crimp foundry goods surface adhesion force especially.
Background technology
Die casting is the part that a kind of compression casting forms, and is to use assembling casting die and die casting machine, with being heated to be the feeding mouth that liquid metal pours into die casting machine, through die casting machine die casting, casts out the metal parts of mould respective shapes and size.Because metal has good flowability and plasticity; And casting processing is in the die casting machine of pressure is arranged, to cast; Therefore the metal crimp foundry goods can be made various complicated shapes; Also can make higher precision and fineness, thereby reduce the machining amount of foundry goods significantly, and then improve metal crimp foundry goods application widely.
Along with being widely used of metal crimp foundry goods; The Surface Machining of metal crimp foundry goods also comes into one's own day by day; Wherein mechanicalness flattens handling procedure; Can handle the formed matsurface of process like processes such as surface grinding finishing, benefit soil and polishings, and give product better texture, therefore flattening handling procedure is indispensable procedure in the whole metal crimp foundry goods process.
But because of leveling handling procedure labor intensive, and relatively be fit to planar materials, for on-plane surface and the metal crimp foundry goods of tool complicated shape will improve the difficulty of processing, and the dead angle that can't polish arranged, texture and metallic luster that influence is surperficial.
Therefore; From the above; Exist restriction and other multinomial not tractable shortcoming on the process technology in the prior art, therefore, if the method that a kind of processing procedure is easy, safe and processed finished products is good can be provided; Can reduce the cost of mechanicalness leveling handling procedure, and further promote the usability of metal crimp foundry goods.
Summary of the invention
In view of this, the object of the invention is exactly in the method that a metal crimp foundry goods surfaction is provided, with texture and the metallic luster of improving existing machinery property leveling handling procedure and improving metal crimp foundry goods surface.
According to above-mentioned purpose, the present invention provides a kind of method of metal crimp foundry goods surfaction, comprises the following step: a die casting substrate surface is provided; On this die casting substrate surface, be covered with a high molecular polymer; With the mode of vacuum coating, depositing metal films on this high molecular polymer; And on this metallic film, be covered with the upgrading of protective clear layer, and then improve the texture and the metallic luster on metal crimp foundry goods surface with completion metal crimp foundry goods surface.
In sum; The method of metal crimp foundry goods surfaction of the present invention is to coat the mode on metal crimp foundry goods surface through high molecular polymer; Promote the flatness and the surface adhesion force on metal crimp foundry goods surface with the space of filling metal crimp foundry goods surface; The adhesive force on the metallic film of strengthening subsequent vacuum coating and metal crimp foundry goods surface more, and then improve the texture and the metallic luster on metal crimp foundry goods surface.
For let above and other objects of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and conjunction with figs., elaborates as follows.
Description of drawings
Figure 1A to Fig. 1 F is the processing procedure profile of first embodiment of the method for metal crimp foundry goods surfaction of the present invention.
Fig. 2 is the flow chart of second embodiment of the method for metal crimp foundry goods surfaction of the present invention.
Fig. 3 is the structure chart of the third embodiment of the present invention.
The primary clustering symbol description:
10,110: the metal crimp foundry goods
100: casing structure
20: substrate surface
30,120: high molecular polymer
40,130: metallic film
50,140: protective clear layer
S10～S40: step
The specific embodiment
Below will the method according to the metal crimp foundry goods surfaction of preferred embodiment of the present invention be described, and be convenient to understand that the same components among the following embodiment is to indicate with same-sign to explain for making with reference to relevant drawings.
See also Figure 1A to Fig. 1 F, the processing procedure profile of first embodiment of the method for metal crimp foundry goods surfaction of the present invention, shown in Figure 1A, metal crimp foundry goods 10 is through cold house or hot chamber die casting and die cast.Wherein, metal crimp foundry goods 10 is oxidable metal or light metal, for example is aluminium, magnesium, zinc, copper, aluminium, tin, iron or alloying metal etc.
Accept above-mentionedly, shown in Figure 1B, metal crimp foundry goods 10 is through the leveling handling procedures, for example grinds for mechanicalness or after mechanicalness polishes, has more smooth substrate surface 20.
Shown in Fig. 1 C, make the surface texture alligatoring of substrate surface 20 with the oxidation program, and utilize the surface adhesion force of the metal oxide of alligatoring with increase substrate surface 20.Wherein, aforesaid oxidation program for example is autoxidation program, chemical epithelium oxidation program and differential arc oxidation program.
Then, shown in Fig. 1 D, the mode with spraying, printing or immersion plating on substrate surface 20 is covered with high molecular polymer 30, and dry solidification high molecular polymer 30.Wherein, the composition of aforesaid high molecular polymer 30 for example is Polyurethane (PU), ultraviolet hardening resin (UV resin) or polyphenylene sulfide (PPS resin).
Shown in Fig. 1 E, having on the high molecular polymer 30, put into mode, physical vapor deposition (PVD) metallic film 40 with vacuum coating.Wherein, through the different structure or the composition of the aforementioned metallic film 40 that forms with the vacuum coating mode, with the metallic luster on control metal crimp foundry goods 10 surfaces.Metallic film 40 can be single-layer metal film, multiple layer metal film or metallic cermet films, for example is titanium nitride membrane, TiCN film, TiAlN film, chromium nitride film, DLC film and chromium nitride aluminium titanium film etc.
At last, shown in Fig. 1 F, on metallic film 40, be covered with protective clear layer 50 to accomplish the surfaction of metal crimp foundry goods 10.Wherein, the composition of protective clear layer 50 for example be Polyurethane (PU), ultraviolet hardening resin (UV resin) or other transparent resin, thereby protective clear layer 50 has scratch resistant, the anti-oxidation and anti-function that fades.So far, metal crimp foundry goods 10 has the structure of high molecular polymer 30, metallic film 40 and protective clear layer 50 at its substrate surface 20, and this structure can make metal crimp foundry goods 10 have preferable surperficial texture and metallic luster.
In addition, also the uncover a kind of method of metal crimp foundry goods surfaction of simplification of the present invention, Fig. 2 is the flow chart of second embodiment of the method for metal crimp foundry goods surfaction of the present invention; As shown in Figure 2; At first, step S 10 provides a metal crimp foundry goods substrate surface, wherein; The material of die casting substrate surface is oxidable metal or light metal, for example is aluminium, magnesium, zinc, copper, aluminium, tin, iron or alloying metal etc.Then, step S20 is covered with high molecular polymer with the mode of spraying, printing or immersion plating on the die casting substrate surface, and makes the high molecular polymer dry solidification.Wherein, the composition of aforesaid high molecular polymer for example is Polyurethane (PU), ultraviolet hardening resin (UV resin) or polyphenylene sulfide (PPS resin).Accept step S20, step S30 is with the mode of vacuum coating, depositing metal films on high molecular polymer.Wherein, metallic film can be single-layer metal film, multiple layer metal film or metallic cermet films, for example is titanium nitride membrane, TiCN film, TiAlN film, chromium nitride film, DLC film and chromium nitride aluminium titanium film etc.At last, step S40 is covered with protective clear layer on metallic film, for example is that Polyurethane (PU), ultraviolet hardening resin (UV resin) or other transparent resin are to accomplish the upgrading on metal crimp foundry goods surface.
The method for modifying on metal crimp foundry goods of the present invention surface can be widely used in hand set machine shell; Computer housing or other electronic installation; Fig. 3 is the structure chart of the third embodiment of the present invention, and is as shown in Figure 3, and the casing structure 100 of electronic product includes: metal crimp foundry goods 110; High molecular polymer 120, metallic film 130 and protective clear layer 140; Wherein, High molecular polymer 120 is overlying on the metal crimp foundry goods 110 with the mode of spraying, printing or immersion plating; Metallic film 130 is deposited on the high molecular polymer 120 by the mode of vacuum coating; And protective clear layer 140 is overlying on the metallic film 130, makes electronic product have surperficial texture and metallic luster.Because of metal crimp foundry goods 110, high molecular polymer 120, the material of metallic film 130 and protective clear layer 140 or composition all method first embodiment and second embodiment with the aforesaid metal crimp foundry goods of the present invention surfaction are identical, so repeat no more.
Though the present invention has disclosed preferred embodiment as above; Right its is not in order to limit the present invention; Any those of ordinary skill of being familiar with this technology; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and modification, so protection scope of the present invention when look claim scope defined is as the criterion.
Claims (19)
1. the method for a metal crimp foundry goods surfaction is characterized in that, this method comprises the following step:
Die cast one metal crimp foundry goods;
With this metal crimp foundry goods of leveling routine processes, make this metal crimp foundry goods have a more smooth substrate surface;
Mode with spraying, printing or immersion plating is covered with a high molecular polymer at this substrate surface, and this high molecular polymer of dry solidification;
Mode with vacuum coating deposits a metallic film on this high molecular polymer; And
Be covered with a protective clear layer on this metallic film.
2. the method for metal crimp foundry goods surfaction as claimed in claim 1 is characterized in that, this leveling handling procedure is that mechanicalness is ground or the mechanicalness polishing.
3. the method for metal crimp foundry goods surfaction as claimed in claim 1; It is characterized in that; Before being covered with this high molecular polymer, also comprise a pretreated oxidation program, this pretreated oxidation program is autoxidation program, chemical epithelium oxidation program or differential arc oxidation program.
4. the method for metal crimp foundry goods surfaction as claimed in claim 1 is characterized in that, the material of this metal crimp foundry goods is oxidable metal or light metal.
5. the method for metal crimp foundry goods surfaction as claimed in claim 4 is characterized in that, the material of this metal crimp foundry goods is aluminium, magnesium, zinc, copper, aluminium, tin, iron or alloying metal.
6. the method for metal crimp foundry goods surfaction as claimed in claim 1 is characterized in that, this high molecular polymer is to comprise Polyurethane, ultraviolet hardening resin or polyphenylene sulfide.
7. the method for metal crimp foundry goods surfaction as claimed in claim 1 is characterized in that, this metallic film is single-layer metal film, multiple layer metal film or metallic cermet films.
8. the method for metal crimp foundry goods surfaction as claimed in claim 7 is characterized in that, this metallic film is titanium nitride membrane, TiCN film, TiAlN film, chromium nitride film, type diamondlike thin film and chromium nitride aluminium titanium film.
9. the method for metal crimp foundry goods surfaction as claimed in claim 1 is characterized in that the composition of this protective clear layer comprises Polyurethane or ultraviolet hardening resin.
10. metal crimp foundry goods structure is characterized in that it comprises:
One metal crimp foundry goods comprises a substrate surface;
One high molecular polymer is attached on this substrate surface of this metal crimp foundry goods with the mode of spraying, printing or immersion plating;
The layer of metal film is attached on this high molecular polymer with the mode of vacuum coating; And
The layer of transparent protective layer is overlying on this metallic film.
11. metal crimp foundry goods structure as claimed in claim 10 is characterized in that, this substrate surface of this metal crimp foundry goods grinds or mechanicalness polishing program through a mechanicalness.
12. metal crimp foundry goods structure as claimed in claim 10 is characterized in that, this substrate surface of this metal crimp foundry goods is through an autoxidation program, chemical epithelium oxidation program or differential arc oxidation program.
13. metal crimp foundry goods structure as claimed in claim 10 is characterized in that the material of this metal crimp foundry goods is oxidable metal or light metal.
14. metal crimp foundry goods structure as claimed in claim 13 is characterized in that the material of this metal crimp foundry goods is aluminium, magnesium, zinc, copper, aluminium, iron or alloying metal.
15., it is characterized in that this high molecular polymer comprises Polyurethane, ultraviolet hardening resin or polyphenylene sulfide like the said metal crimp foundry goods of claim 10 structure.
16. metal crimp foundry goods structure as claimed in claim 10 is characterized in that, this metallic film is single-layer metal film, multiple layer metal film or metallic cermet films.
17., it is characterized in that this metallic film is titanium nitride membrane, TiCN film, TiAlN film, chromium nitride film, type diamondlike thin film and chromium nitride aluminium titanium film like the said metal crimp foundry goods of claim 16 structure.
18. metal crimp foundry goods structure as claimed in claim 10 is characterized in that the composition of this protective clear layer comprises Polyurethane or ultraviolet hardening resin.
19. a casing is characterized in that it comprises:
One metal crimp foundry goods has a more smooth substrate surface after grinding or polishing;
One high molecular polymer is attached on this substrate surface of this metal crimp foundry goods with the mode of spraying, printing or immersion plating;
The layer of metal film is attached on this high molecular polymer with the mode of vacuum coating; And
The layer of transparent protective layer is overlying on this metallic film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100105175 | 2011-02-16 | ||
| TW100105175A TW201235499A (en) | 2011-02-16 | 2011-02-16 | A polymer-based surface modification method for metal casting materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102642346A true CN102642346A (en) | 2012-08-22 |
Family
ID=46655535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100513174A Pending CN102642346A (en) | 2011-02-16 | 2011-03-03 | Method for modifying surface of metal die casting by using polymer coating method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102642346A (en) |
| TW (1) | TW201235499A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104928749A (en) * | 2014-03-17 | 2015-09-23 | 柯惠兰 | Method for forming protective coating layer on surface of magnesium alloy and protective coating layer thereof |
| CN109672764A (en) * | 2018-11-21 | 2019-04-23 | 惠州Tcl移动通信有限公司 | The production method of casting of electronic device |
-
2011
- 2011-02-16 TW TW100105175A patent/TW201235499A/en unknown
- 2011-03-03 CN CN2011100513174A patent/CN102642346A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104928749A (en) * | 2014-03-17 | 2015-09-23 | 柯惠兰 | Method for forming protective coating layer on surface of magnesium alloy and protective coating layer thereof |
| CN109672764A (en) * | 2018-11-21 | 2019-04-23 | 惠州Tcl移动通信有限公司 | The production method of casting of electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201235499A (en) | 2012-09-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120822 |