CN102637487A - Lapping production technology of copper conductor - Google Patents
Lapping production technology of copper conductor Download PDFInfo
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- CN102637487A CN102637487A CN2012101002838A CN201210100283A CN102637487A CN 102637487 A CN102637487 A CN 102637487A CN 2012101002838 A CN2012101002838 A CN 2012101002838A CN 201210100283 A CN201210100283 A CN 201210100283A CN 102637487 A CN102637487 A CN 102637487A
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Abstract
The invention discloses a lapping production technology of a copper conductor, comprising the following steps: paying off, straightening and decontamination, thin film mica lapping, primary paint dipping, primary glass silk lapping, secondary paint dipping, secondary glass silk lapping, third paint dipping, primary baking, fourth paint dipping, secondary baking, self-adhesive addition, third baking and taking up. In the manner, the process of the lapping production technology of the copper conductor is simplified and detailed, the equipment amount is decreased, the production process is continuous, the energy-saving effect is strengthened, the labor intensity of the operation personnel is decreased and the favorable insulating property and mechanical property of the copper conductor are ensured.
Description
Technical field
The present invention relates to the wrapped production field of copper cash, particularly relate to a kind of wrapped production technology of copper conductor.
Background technology
Along with the continuing to increase and dropping into of Chinese large-sized industry and main equipment,, new requirement has also been proposed like the production performance of electromagnetic wire to electrician's auxiliary material.
The employed copper conductors of large-scale mobile transformer station such as present big electromechanics, DC generator, generator, dry-type transformer often require to have higher mechanical properties and overload capacity and moisture-proof thermal characteristics.And the production equipment quantity of copper conductor is various, and production process is very complicated, has had a strong impact on end product quality and the output produced.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of wrapped production technology of copper conductor; The simple refinement of process has reduced number of devices, can reduce labor intensity of operating personnel; Strengthen energy-saving effect, guarantee that copper conductor has good insulation performance performance and mechanical performance.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of wrapped production technology of copper conductor is provided, comprises the steps:
Self-adhesive-bake and bank up with earth for the third time-take-up the-the 4th dipping lacquer-second time is baked and banked up with earth-add to the wrapped glass fiber of the wrapped glass fiber of the unwrapping wire-aligning decontamination-wrapped film mica-first time dipping lacquer-first time-second time dipping lacquer-second time-bake and bank up with earth dipping lacquer-first time for the third time.
In preferred embodiment of the present invention, said unwrapping wire process comprises: self check copper conductor-unwrapping wire-do leader.
In preferred embodiment of the present invention, said aligning decontamination process comprises: make copper cash head-the end of a thread in order and pass straightener-accent straightener pinch roller-installation or change felt.
In preferred embodiment of the present invention; Said wrapped film mica process comprises: selection film mica specification-wrapped rotating speed of setting-control wrapped width, thickness and the wrapped number of plies-detection insulation thickness-adjusting to wrap the film reconciliation statement; Overlapping wrapped between said film band and the mica tape, wrapped width is more than or equal to 40% of bandwidth.
In preferred embodiment of the present invention, said wrapped glass fiber process comprises: doubling-adjusting silk hook, leading screw and stage clip-confirm lay of lapping and size-adjusting speed changer reconciliation statement, said glass fiber are two-layer wrapped and lapping direction is opposite inside and outside being.
In preferred embodiment of the present invention, said dipping lacquer process comprises: add insulating varnish-design temperature-preheating-impregnated insulating paint, temperature resistant grade is 180 ℃ of 130 ℃ of B levels, 155 ℃ of F levels or H levels in the said dipping lacquer process.
In preferred embodiment of the present invention, the said process of baking and banking up with earth comprises: setting oven temperature-confirm to bake and bank up with earth number-detection to bake and bank up with earth the quality of copper conductor afterwards.
In preferred embodiment of the present invention, the said self-adhesive process that adds comprises: select self-adhesive model-design temperature-preheating-be coated with self-adhesive, temperature resistant grade is 180 ℃ of 130 ℃ of B levels, 155 ℃ of F levels or H levels in the said gluing process.
In preferred embodiment of the present invention, said take-up process comprises: inspection pressing plate and straightener-adjustment takeup tension-control take-up-record reel number and line segment-filling in circulation blocks.
The invention has the beneficial effects as follows: the simple refinement of its process of wrapped production technology of copper conductor of the present invention; Reduced number of devices, production process is continuous, has strengthened energy-saving effect; Reduced labor intensity of operating personnel; Adopt film mica envelope curve and double fibre glass-covered wire, and impregnated insulating paint repeatedly, guaranteed that copper conductor has good insulation performance performance and mechanical performance.
Embodiment
Set forth in detail in the face of preferred embodiment of the present invention down, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
The embodiment of the invention comprises:
A kind of wrapped production technology of copper conductor comprises the steps:
Self-adhesive-bake and bank up with earth for the third time-take-up the-the 4th dipping lacquer-second time is baked and banked up with earth-add to the wrapped glass fiber of the wrapped glass fiber of the unwrapping wire-aligning decontamination-wrapped film mica-first time dipping lacquer-first time-second time dipping lacquer-second time-bake and bank up with earth dipping lacquer-first time for the third time.
Wherein, the unwrapping wire process comprises: self check copper conductor-unwrapping wire-do leader.Particularly, copper conductor adopts the bare copper wire that presentation quality is smooth, burr, no greasy dirt oxide layer or metal particle are damaged, do not had to nothing.Require doubling two to flush before the unwrapping wire, must not a size or twine is arranged, to observe unwrapping wire at any time in the unwrapping wire process in case copper cash rolls silk or diminishing line, connect with iron wire with pistol jewel hole on copper cash then that doing takes the lead puts straightener.
Said aligning decontamination process comprises: make copper cash head-the end of a thread in order and pass straightener-accent straightener pinch roller-installation or change felt.Particularly, that the roller on the straightener should keep is smooth, cleaning, no scratch, and the degree of tightness of pinch roller is moderate, tight can diminishing line, loose not straight with regard to the school.
Said wrapped film mica process comprises: selection film mica specification-wrapped rotating speed of setting-control wrapped width, thickness and the wrapped number of plies-detection insulation thickness-adjusting to wrap the film reconciliation statement.
Particularly, overlapping wrapped between said film band and the mica tape, wrapped width is more than or equal to 40% of bandwidth, and lap seam should stagger, and film band and mica tape should be closely smooth wrapped equably on bare copper wire.Wherein, insulation thickness is regulated through controlling packet film reconciliation statement: when insulation thickness is bigger than normal, transfer big reconciliation statement index a little; When insulation thickness is less than normal, turn the reconciliation statement index a little down.
After wrapped film mica, carry out the dipping lacquer first time; Its process comprises: select the lacquer model, in the lacquer cylinder, add insulating varnish, the lacquer amount is no less than 1/3rd in the maintenance lacquer cylinder; The first road dipping lacquer amount will be amplified a bit; Guarantee to see tangible four sides lacquer amount after the back first road glass fiber is wrapped dipping, can't see the glass point of white simultaneously, and will have a spot of lacquer to be exposed at outside the glass fiber.
For the first time carry out wrapped glass fiber first time behind the dipping lacquer, a bag silk process comprises: doubling-adjusting hook, leading screw and stage clip-confirm lay of lapping and size-adjusting speed changer reconciliation statement.Wherein, the doubling process will be selected silk group's number of share of stock and glass fiber radical, controlling packet yarn quality by wire gauge; Operating personnel check feeding head stage clip degree of tightness then, and the silk hook, whether leading screw fluffs and in time repair; Secondly inspection bag silk changes, and observes lay of lapping; Control insulation thickness through regulating the speed changer reconciliation statement at last: when insulation thickness is bigger than normal, transfer big reconciliation statement index a little; When insulation thickness is less than normal, turn the reconciliation statement index a little down.
Carrying out the dipping lacquer second time behind the wrapped glass fiber for the first time, its process comprises: select the lacquer model, in the lacquer cylinder, add insulating varnish, the lacquer amount is no less than 1/3rd in the maintenance lacquer cylinder, and the second road dipping lacquer will flood fully, just looks at the glass point less than white.
Carry out the wrapped glass fiber second time behind the dipping lacquer for the second time, bag silk process is with wrapped glass fiber process is identical for the first time.In twice wrapped glass fiber process, doubling wants two to flush, and glass fiber is closely evenly wrapped on copper conductor, and wrapped mode is two-layer wrapped and lapping direction is opposite inside and outside being.
Carry out dipping lacquer for the third time behind the wrapped glass fiber for the second time, its process comprises: select the lacquer model, in the lacquer cylinder, add insulating varnish, the lacquer amount is no less than 1/3rd in the maintenance lacquer cylinder, and the 3rd road japanning amount can be a little less, guarantees that japanning is even.
The baking oven of lead behind dipping lacquer entering is is for the third time baked and banked up with earth, and the process of baking and banking up with earth comprises: setting oven temperature-confirm to bake and bank up with earth number-detection to bake and bank up with earth the quality of copper conductor afterwards.
Among the present invention, as only flooding three roads lacquers, then lead is according to the number of baking and banking up with earth of technological requirement, several circles of circulation cabling between last baking oven and following baking oven; Flood the 4th road lacquer like need, then lead passes through baking oven once again after baking oven on the process and following baking oven one enclose, and gets into baking oven down again, accomplishes the number of baking and banking up with earth of technological requirement.
The 4th time the dipping lacquer process comprises: select the lacquer model, in the lacquer cylinder, add insulating varnish, the lacquer amount is no less than 1/3rd in the maintenance lacquer cylinder, and the 4th road japanning amount also can be a little less, guarantees that japanning is even.Among the present invention, temperature resistant grade is 180 ℃ of 130 ℃ of B levels, 155 ℃ of F levels or H levels in four dipping lacquer processes.
Among the present invention, if do not add self-adhesive, then directly take-up after number is baked and banked up with earth in completion; Add self-adhesive like need, then put into the glue cylinder to lead.Particularly, add the self-adhesive process and comprise: select self-adhesive model-design temperature-preheating-be coated with self-adhesive, wherein temperature resistant grade is 180 ℃ of 130 ℃ of B levels, 155 ℃ of F levels or H levels in the gluing process, and gluing is wanted evenly.
Through the baking and banking up with earth and detect and can get into take-up after baking and banking up with earth quality of small bake oven, said take-up process comprises lead behind the gluing again: the inspection pressing plate is with straightener-adjustment takeup tension-control take-up-record reel number and line segment-filling in circulates blocks.Particularly, product line should be smooth around twisting on the drum, adjusts takeup tension in case diminishing line, the product line on each drum should be closely, evenly, neat, the lower wall finished product should fill label, name of product, model, specification and date of manufacture.
The beneficial effect of the wrapped production technology of copper conductor of the present invention is:
The simple refinement of technical process has reduced number of devices, and production process is continuous; Strengthen energy-saving effect, reduced labor intensity of operating personnel, adopted film mica envelope curve and double fibre glass-covered wire; And impregnated insulating paint repeatedly, guaranteed that copper conductor has good insulation performance performance and mechanical performance.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (9)
1. the wrapped production technology of a copper conductor is characterized in that, comprises the steps:
Self-adhesive-bake and bank up with earth for the third time-take-up the-the 4th dipping lacquer-second time is baked and banked up with earth-add to the wrapped glass fiber of the wrapped glass fiber of the unwrapping wire-aligning decontamination-wrapped film mica-first time dipping lacquer-first time-second time dipping lacquer-second time-bake and bank up with earth dipping lacquer-first time for the third time.
2. the wrapped production technology of copper conductor according to claim 1 is characterized in that, said unwrapping wire process comprises: self check copper conductor-unwrapping wire-do leader.
3. the wrapped production technology of copper conductor according to claim 1 is characterized in that, said aligning decontamination process comprises: make copper cash head-the end of a thread in order and pass straightener-accent straightener pinch roller-installation or change felt.
4. the wrapped production technology of copper conductor according to claim 1; It is characterized in that; Said wrapped film mica process comprises: selection film mica specification-wrapped rotating speed of setting-control wrapped width, thickness and the wrapped number of plies-detection insulation thickness-adjusting to wrap the film reconciliation statement; Overlapping wrapped between said film band and the mica tape, wrapped width is more than or equal to 40% of bandwidth.
5. the wrapped production technology of copper conductor according to claim 1; It is characterized in that; Said wrapped glass fiber process comprises: doubling-adjusting silk hook, leading screw and stage clip-confirm lay of lapping and size-adjusting speed changer reconciliation statement, said glass fiber are two-layer wrapped and lapping direction is opposite inside and outside being.
6. the wrapped production technology of copper conductor according to claim 1; It is characterized in that; Said dipping lacquer process comprises: add insulating varnish-design temperature-preheating-impregnated insulating paint, temperature resistant grade is 180 ℃ of 130 ℃ of B levels, 155 ℃ of F levels or H levels in the said dipping lacquer process.
7. the wrapped production technology of copper conductor according to claim 1 is characterized in that, the said process of baking and banking up with earth comprises: setting oven temperature-confirm to bake and bank up with earth number-detection to bake and bank up with earth the quality of copper conductor afterwards.
8. the wrapped production technology of copper conductor according to claim 1; It is characterized in that; The said self-adhesive process that adds comprises: select self-adhesive model-design temperature-preheating-be coated with self-adhesive, temperature resistant grade is 180 ℃ of 130 ℃ of B levels, 155 ℃ of F levels or H levels in the said gluing process.
9. the wrapped production technology of copper conductor according to claim 1 is characterized in that, said take-up process comprises: inspection pressing plate and straightener-adjustment takeup tension-control take-up-record reel number and line segment-filling in circulation blocks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101002838A CN102637487A (en) | 2012-04-09 | 2012-04-09 | Lapping production technology of copper conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101002838A CN102637487A (en) | 2012-04-09 | 2012-04-09 | Lapping production technology of copper conductor |
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| Publication Number | Publication Date |
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| CN102637487A true CN102637487A (en) | 2012-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012101002838A Pending CN102637487A (en) | 2012-04-09 | 2012-04-09 | Lapping production technology of copper conductor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509750A (en) * | 2020-11-19 | 2021-03-16 | 上海申茂电磁线有限公司 | Automatic impregnating varnish device of preventing deposiing for mica glass fiber covered electromagnetic wire |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87102209A (en) * | 1987-03-20 | 1987-09-09 | 上海电磁线一厂 | The electromagnetic wires with glass fibre covered and thin film sheathing manufacturing equipment |
| CN2365749Y (en) * | 1998-11-20 | 2000-02-23 | 王和兴 | Multi-function double head thin film glass fibre covering machine |
| CN101615451A (en) * | 2009-04-03 | 2009-12-30 | 湘潭市霞城电工有限公司 | Production process of freon resistant, double glass fiber covered enamelled wire |
| CN101640084A (en) * | 2009-08-07 | 2010-02-03 | 常熟市豪威富机械制造有限公司 | Film yarn covering and wrapping machine |
-
2012
- 2012-04-09 CN CN2012101002838A patent/CN102637487A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87102209A (en) * | 1987-03-20 | 1987-09-09 | 上海电磁线一厂 | The electromagnetic wires with glass fibre covered and thin film sheathing manufacturing equipment |
| CN2365749Y (en) * | 1998-11-20 | 2000-02-23 | 王和兴 | Multi-function double head thin film glass fibre covering machine |
| CN101615451A (en) * | 2009-04-03 | 2009-12-30 | 湘潭市霞城电工有限公司 | Production process of freon resistant, double glass fiber covered enamelled wire |
| CN101640084A (en) * | 2009-08-07 | 2010-02-03 | 常熟市豪威富机械制造有限公司 | Film yarn covering and wrapping machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509750A (en) * | 2020-11-19 | 2021-03-16 | 上海申茂电磁线有限公司 | Automatic impregnating varnish device of preventing deposiing for mica glass fiber covered electromagnetic wire |
| CN112509750B (en) * | 2020-11-19 | 2024-05-31 | 上海申茂电磁线有限公司 | Automatic precipitation-preventing impregnating varnish device for mica glass fiber covered electromagnetic wire |
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Application publication date: 20120815 |