CN102628119B - Low-nickel and high-iron copper alloy glass mould and manufacturing method thereof - Google Patents
Low-nickel and high-iron copper alloy glass mould and manufacturing method thereof Download PDFInfo
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- CN102628119B CN102628119B CN 201210128169 CN201210128169A CN102628119B CN 102628119 B CN102628119 B CN 102628119B CN 201210128169 CN201210128169 CN 201210128169 CN 201210128169 A CN201210128169 A CN 201210128169A CN 102628119 B CN102628119 B CN 102628119B
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Abstract
The invention relates to a low-nickel and high-iron copper alloy glass mould and a manufacturing method thereof. The mould has better oxidization resistance, heat fatigue resistance, heat conductivity, enhanced toughness, good heat cracking resistance, and has the advantages of easiness of machining, reduced cost and long service life. The low-nickel and high-iron copper alloy glass mould comprises the following components in weight percentage: 0.05-0.2% of Si, 8.0-10.0% of Al, 4.0-6.0% of Ni, 0.05-0.25% of Zn, 4.0-6.0% of Fe and 0.8-1.5% of Mn; after the components are smelted, the smelted components are cast at 1250-1280 DEG C; the heat-preservation time of heat treatment is 6 hours and the temperature is controlled at 680 DEG C; and the mixture is reduced to 150 DEG C along the furnacetemperature, the furnace temperature is raised to the room temperature and then the product is taken out to obtain the glass mould which has the properties that the tensile strength is 400-450 N/mm<2>, the Brinell hardness is 175-200, the bending strength is 350 N/mm<2>, the thermal conductivity is 0.12-0.15 k/M*S*DEG C, the thermal expansion coefficient is 17*10<-6> m/k and the service life is 1.3-1.5 million times.
Description
Technical field
The present invention relates to a kind of glass mold, particularly a kind of low nickel high ferro copper alloy glass mould.The invention still further relates to the manufacture method of above-mentioned glass mold.
Background technology
Because Cu alloy material has good thermal conductivity, good Castability, the advantages such as long service life, domestic and international high-end Glass Containers product is generally used copper alloy to do moulding stock.
Glass mold is the instrument that glasswork is made moulding, and in the process of glasswork moulding, the thermal conductivity that material is good makes the inside and outside thermograde of mould be down to minimum, can make extend the work-ing life of mould.Cu alloy material has possessed good thermal conductivity, can not only extend die life, also the glasswork molding effect is played to very large effect, can effectively prevent that the frit temperature from not falling, be difficult to solidify, frit is affected by gravity, and the bad glasswork caused.Moreover, Cu alloy material also is suitable for the making of light weight glasswork, can reach effective saving frit, reduces the carbon emission amount.
Generally the tantnickel copper alloy of application can have work-ing life and higher hardness preferably, because the content of nickel element is high, causes its cost high, difficult processing, especially under the fast radiating state of high temperature, because of the hardness of material own higher, thermal deformation coefficient is large, and poor toughness very easily causes crack of die.The surface hardening of mould is processed and used has more defective products to occur, has therefore improved the mould use cost, has reduced the production efficiency of product.
In order not change the self character of Cu alloy material, by adjusting Si, Al, Ni, Zn, Fe, Mn constituent content, wish to obtain thering is thermal crack resistant, anti-oxidant, heat conduction is excellent, easy processing, copper alloy glass mould that cost is light.
For example, the composition of tantnickel copper alloy (wt%) is: Si0.8～1.2%, Al8.5～10.5%, Ni7.5～9.5%, Zn7.5～9.5%, Fe0.8～1.0%, Mn0.08～0.1%, Cu residue; The alloyed copper material of this research, although hardness is high, anti-oxidant, difficult processing, more easy to crack, cost is high.Under the condition of high temperature, as larger as the temperature drop gradient, to greatly reducing the work-ing life of mould.
Summary of the invention
The purpose of this invention is to provide a kind of low nickel high ferro copper alloy glass mould, this glass mold makes it have excellent performance by the optimization proportioning of element.The present invention also provides above-mentioned low nickel high ferro copper alloy glass mould manufacturing method.
In order to reach above-mentioned technical purpose, a kind of low nickel high ferro copper alloy glass mould of the present invention comprises following weight percent component:
Si0.05～0.2%
Al8.0～10.0%
Ni4.0～6.0%
Zn0.05～0.25%
Fe4.0～6.0%
Mn0.8～1.5%
All the other are Cu and common impurity.
Si, Ni content are can hardened material high temperature resistant, anti-oxidant.Fe, Al content improve can strengthen toughness, and splitting resistance is good.
The content that the crucial part of the present invention is to reduce Ni adds the content that promotes Fe simultaneously, and its hardness is slightly fallen; Strongthener toughness, good to reach hot-cracking resistance, easily processing, cost alleviates, the characteristics of long service life.
The tensile strength of described glass mold is 400-450N/mm
2, Brinell hardness is 175-200, bending strength is 350N/mm
2, thermal conductivity is 0.12-0.15k/M.S. ℃, thermal expansion factor is 17*10
-6m/K, be 130-150 ten thousand times work-ing life.
The manufacture method of above-mentioned low nickel high ferro copper alloy glass mould comprises the following steps:
1) following weight percent component is carried out to melting:
Si0.05～0.2%
Al8.0～10.0%
Ni4.0～6.0%
Zn0.05～0.25%
Fe4.0～6.0%
Mn0.8～1.5%
All the other are Cu and common impurity;
2) under 1250-1280 ℃, poured into a mould;
3) soaking time during thermal treatment is 6 hours, and temperature is controlled 680 ℃;
4) being down to 150 ℃ of kindling to room temperatures with furnace temperature takes out.
The teeming temperature of product of the present invention when casting is 1250-1280 ℃, adopts unique pouring technology casting.When this temperature casting, the elements such as ferronickel reach the optimum activity state, are beneficial to the element distribution and merge.
The soaking time of product of the present invention when thermal treatment is 6 hours, long than tantnickel copper alloy (4 hours), and temperature is controlled 680 ℃, than tantnickel copper alloy (600 ℃) height, is down to 150 ℃ of kindling to room temperatures with furnace temperature and takes out.Not in conventional thermal treatment process, its unique distinction is fully to eliminate Cu alloy material quenching and the thermal stresses that causes makes its thermal expansion factor keep stable when cast, in the situation that frequent, touches hotly, is difficult for hot tearing.
Glass mold of the present invention has oxidation-resistance, thermal fatigue resistance, thermal conductivity preferably, strengthens toughness simultaneously, makes it have good hot-cracking resistance, and easily processing, and cost alleviates, long service life.
Embodiment
Embodiment 1
1) following weight percent component is carried out to melting:
Si0.05%
Al10.0%
Ni5.0%
Zn0.15%
Fe5.0%
Mn1.5%
All the other are Cu and common impurity;
2) under 1280 ℃, poured into a mould;
3) soaking time during thermal treatment is 6 hours, and temperature is controlled 680 ℃;
4) being down to 150 ℃ of kindling to room temperatures with furnace temperature takes out.
The tensile strength of the glass mold obtained is 410N/mm
2, Brinell hardness is 200, bending strength is 350N/mm
2, thermal conductivity is 0.12k/M.S. ℃, thermal expansion factor is 17*10
-6m/K is 1,300,000 times through testing work-ing life.
Embodiment 2
1) following weight percent component is carried out to melting:
Si0.2%
Al9.0%
Ni6.0%
Zn0.05%
Fe6.0%
Mn1.2%
All the other are Cu and common impurity;
2) under 1250 ℃, poured into a mould;
3) soaking time during thermal treatment is 6 hours, and temperature is controlled 680 ℃;
4) being down to 150 ℃ of kindling to room temperatures with furnace temperature takes out.
The tensile strength of the glass mold obtained is 400N/mm
2, Brinell hardness is 185, bending strength is 350N/mm
2, thermal conductivity is 0.15k/M.S. ℃, thermal expansion factor is 17*10
-6m/K is 1,450,000 times through testing work-ing life.
Embodiment 3
1) following weight percent component is carried out to melting:
Si0.1%
Al8.0%
Ni4.0%
Zn0.25%
Fe4.0%
Mn0.8%
All the other are Cu and common impurity;
2) under 1250 ℃, poured into a mould;
3) soaking time during thermal treatment is 6 hours, and temperature is controlled 680 ℃;
4) being down to 150 ℃ of kindling to room temperatures with furnace temperature takes out.
The tensile strength of the glass mold obtained is 450N/mm
2, Brinell hardness is 175, bending strength is 350N/mm
2, thermal conductivity is 0.13k/M.S. ℃, thermal expansion factor is 17*10
-6m/K is 1,500,000 times through testing work-ing life.
Above-described embodiment does not limit the present invention in any way, and every employing is equal to replaces or technical scheme that the mode of equivalent transformation obtains all drops in protection scope of the present invention.
Claims (2)
1. one kind low nickel high ferro copper alloy glass mould is characterized in that comprising following weight percent component:
Si0.05～0.2%
Al8.0～10.0%
Ni4.0～6.0%
Zn0.05～0.25%
Fe4.0～6.0%
Mn0.8～1.5%
All the other are Cu and common impurity;
The tensile strength of described glass mold is 400-450N/mm
2, Brinell hardness is 175-200, bending strength is 350N/mm
2, thermal conductivity is 0.12-0.15k/M.S. ℃, thermal expansion factor is 17*10
-6m/K, be 130-150 ten thousand times work-ing life.
2. the manufacture method of one kind low nickel high ferro copper alloy glass mould is characterized in that comprising the following steps:
1) following weight percent component is carried out to melting:
Si0.05～0.2%
Al8.0～10.0%
Ni4.0～6.0%
Zn0.05～0.25%
Fe4.0～6.0%
Mn0.8～1.5%
All the other are Cu and common impurity;
2) under 1250-1280 ℃, poured into a mould;
3) soaking time during thermal treatment is 6 hours, and temperature is controlled 680 ℃;
4) being down to 150 ℃ of kindling to room temperatures with furnace temperature takes out.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201210128169 CN102628119B (en) | 2012-04-27 | 2012-04-27 | Low-nickel and high-iron copper alloy glass mould and manufacturing method thereof |
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| CN 201210128169 CN102628119B (en) | 2012-04-27 | 2012-04-27 | Low-nickel and high-iron copper alloy glass mould and manufacturing method thereof |
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| CN102628119B true CN102628119B (en) | 2013-06-19 |
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Families Citing this family (3)
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| CN103924120A (en) * | 2014-04-29 | 2014-07-16 | 常熟市红洲模具有限公司 | Wear-resistant copper alloy glass mould material with high iron content |
| CN107475561A (en) * | 2017-07-17 | 2017-12-15 | 常熟市金诺精工模具有限公司 | High ferro acid bronze alloy glass mold material and preparation method thereof |
| CN111334684B (en) * | 2020-03-20 | 2021-04-20 | 苏州东方模具科技股份有限公司 | Solid solution state high-toughness high-heat-conductivity copper alloy glass mold and preparation method thereof |
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| JP4068626B2 (en) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
| CN101671109B (en) * | 2009-08-28 | 2012-05-02 | 苏州东方模具科技股份有限公司 | Bimetallic glass mould of copper and stainless steel and preparation method thereof |
| CN102418003B (en) * | 2011-11-24 | 2013-05-08 | 中铝洛阳铜业有限公司 | Processing method of nickel-chromium-silicon-bronze alloy |
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