CN102625638A - Ethernet multilayer switch system and heat-radiating device thereof - Google Patents
Ethernet multilayer switch system and heat-radiating device thereof Download PDFInfo
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- CN102625638A CN102625638A CN2011102307646A CN201110230764A CN102625638A CN 102625638 A CN102625638 A CN 102625638A CN 2011102307646 A CN2011102307646 A CN 2011102307646A CN 201110230764 A CN201110230764 A CN 201110230764A CN 102625638 A CN102625638 A CN 102625638A
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- heat
- multilayer switch
- ethernet
- radiating
- ethernet multilayer
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Abstract
The invention discloses a heat-radiating device for an Ethernet multilayer switch system. The heat-radiating device comprises a heat sink, a heat-radiating base and a heat-radiating film, wherein the heat sink comprises a plurality of groups of square heat-radiating fins and a baseboard, and the baseboard of the heat sink is bonded with one end face of the heat-radiating base via heat-radiating glue. The invention further provides an Ethernet multilayer switch system, which comprises an Ethernet multilayer switch and the heat-radiating device for the Ethernet multilayer switch, wherein the Ethernet multilayer switch comprises a circuit board and a chip, the heat-radiating base of the heat-radiating device is fixed on the circuit board through double-screw bolts, and the bottom end face of the heat-radiating device is directly contacted with the chip through the heat-radiating film. The Ethernet multilayer switch system and the heat-radiating device thereof have the advantages of capability of meeting the heat radiating requirement of the Ethernet multilayer switch system, large heat conduction coefficient and high heat-radiating speed.
Description
Technical field
The present invention relates to the EPA communication technique field, particularly relate to a kind of Ethernet multilayer switch system and heat abstractor thereof.
Background technology
EPA is the industrial automation Control Network; Because industrial environment is to the superelevation requirement of industrial control network unfailing performance; To consider that to the aspects such as influence, simple communication function and telecommunication management function, electricity mouth or light mouth of heat radiation these all are the most basic selection factors that when product design, need understand from ethernet communication agreement, power supply, traffic rate, industrial environment authentication, mounting means, shell.
At present; Ethernet switch fin commonly used is long flat list fin type fin; Fin directly contacts with chip on the circuit board through heat-conducting glue; When chip produced heat, heat can be delivered in the fin through heat-conducting glue, utilizes the big characteristics of long flat list fin type fin and air contact area rapidly heat to be dispersed in the air and goes.But the power consumption of Ethernet three-tier switch is bigger; The caloric value of its master chip is also very big; When the switch long-term work, can produce very big heat, and long flat list fin type fin heat sinking function this moment can not meet the demands, radiating effect is not clearly; Can not solve its heat dissipation problem fully, influence the performance of switch.
In sum, to the bigger problem of EPA three-tier switch caloric value, it is more powerful to work out heat sinking function, and radiating rate is heat abstractor faster, can satisfy the demand of multilayer switch heat radiation.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of Ethernet multilayer switch system and heat abstractor thereof, can satisfy the demand of Ethernet multilayer switch heat radiation, and the coefficient of heat conduction is big, and radiating rate is faster.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of heat abstractor that is used for Ethernet multilayer switch system is provided; Comprise fin, heat dissipation base and heat radiation film; Said fin comprises many prescriptions shape fin type radiator and base plate, and the base plate of said fin is bonding through thermal paste and heat dissipation base one end face.
In preferred embodiment of the present invention, said fin is an aluminum alloy material, and said many prescriptions shape fin type radiator and base plate are structure as a whole.
In preferred embodiment of the present invention, said square fin type radiator is that matrix form is arranged in base plate one end face in length and breadth, and radiator distance each other equates.
In preferred embodiment of the present invention, said heat dissipation base is a copper material, and heat dissipation base comprises keeps away a square hole and location hole.
The present invention also provides a kind of Ethernet multilayer switch system; The heat abstractor that comprises Ethernet multilayer switch and Ethernet multilayer switch system; Said Ethernet multilayer switch comprises circuit board and chip; The heat dissipation base of said heat abstractor is fixed in circuit board through double-screw bolt, and the bottom end face of said heat abstractor directly contacts with chip through the heat radiation film.The heat abstractor of said Ethernet multilayer switch system comprises fin, heat dissipation base and heat radiation film, and said fin comprises many prescriptions shape fin type radiator and base plate, and the base plate of said fin is bonding through thermal paste and heat dissipation base one end face.
The invention has the beneficial effects as follows: the many prescriptions shape fin type radiator that is provided with in Ethernet multilayer switch system of the present invention and the heat abstractor thereof; Help the transmission of heat dissipation base heat; Bigger with the air contact area, heat is accelerated to the conduction of velocity of air, has improved heat conductivility.
Description of drawings
Fig. 1 is the perspective view of Ethernet multilayer switch of the present invention system one preferred embodiment;
Fig. 2 be Ethernet multilayer switch shown in Figure 1 system partly cut open perspective view;
The mark of each parts is following in the accompanying drawing: 1, fin; 2, heat dissipation base; 3, heat radiation film; 4, circuit board; 5, chip; 6, double-screw bolt; 11, radiator; 12, base plate; 21, keep away a square hole; 22, location hole.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1 and Fig. 2; The embodiment of the invention comprises: a kind of heat abstractor that is used for Ethernet multilayer switch system; Comprise fin 1, heat dissipation base 2 and heat radiation film 3; Fin 1 comprises many prescriptions shape fin type radiator 11 and base plate 12, and the base plate 12 of fin 1 is bonding through thermal paste and heat dissipation base 2 one end faces.
Further, said fin 1 is an aluminum alloy material, and the many prescriptions shape fin type radiator 11 and the base plate 12 of fin 1 are structure as a whole, and adopts the one-shot forming technique manufacturing to form.Square fin type radiator 11 adopts matrix form to be arranged in base plate 12 1 end faces in length and breadth, and radiator 11 distance each other equates.Heat dissipation base 2 is a copper material, and heat dissipation base 2 comprises keeps away a square hole 21 and location hole 22, keeps away other installation parts that a square hole 21 is avoided multilayer switch, keeps away a square hole 21 and can be open type or enclosed.
See also Fig. 1 again, the present invention also provides a kind of Ethernet multilayer switch system, and said Ethernet multilayer switch system comprises the heat abstractor of Ethernet multilayer switch and above-mentioned Ethernet multilayer switch system.
The Ethernet multilayer switch comprises circuit board 4 and chip 5, and the heat dissipation base 2 of heat abstractor is fixed in circuit board 4 through double-screw bolt 6, and the bottom end face of heat abstractor directly contacts with chip 5 through heat radiation film 3.The shape of heat dissipation base 2 is according to the installation situation customization of element on the side circuit plate 4; Keep away a square hole 21 and be used for avoiding other element on the circuit board 4; Make the entire heat dissipation Unit Installation tightr, according to the big I of area of heat dissipation base 2 a plurality of location holes 22 are set and are fixed on the circuit board 4.
See also Fig. 2; The mounting structure of Ethernet multilayer switch system of the present invention and heat abstractor thereof: on the chip 5 of circuit board 4, paste heat radiation film 3 earlier; Paste with the heat radiation film 3 that is fixed on chip 5 tops mutually at the center of heat dissipation base 2 then; Then four double-screw bolts 6 of heat dissipation base 2 usefulness are fixed on the circuit board 4 through four location holes 22, the last fin 1 of above heat dissipation base 2, placing, and fin 1 bonds together through thermal paste and heat dissipation base 2.When switch worked long hours, the chip 5 on the circuit board 4 can produce very big heat, and this moment, heat can be diffused in the heat dissipation base 2 through heat radiation film 3 rapidly, uniformly; The fin 1 that heat dissipation base 2 tops are bonding; Its heat dissipation base 2 is big with base plate 12 contacts area of fin 1, can disjunctor behind the conduction heat of the base plate 12 of fin 1 be delivered in a plurality of radiators 11, four surfaces of radiator 11 and the contact area of air increase; Heat can be dispersed in the air faster and go; And the conductive coefficient of aluminium alloy is very big, and good heat conductivity makes the entire heat dissipation device can play good heat-radiation effect for a large amount of heats that chip 5 produces.
Ethernet multilayer switch system of the present invention and heat abstractor thereof are different from prior art: with the heat dissipation base that chip directly contacts is copper material, and heat dissipation base is directed against the composition structure of circuit board component and designs, and area of dissipation is big.Fin is an aluminum alloy material, and its coefficient of heat conduction is big, adopts square fin type radiator on the structure, and is big with the air contact area, helps heat and in air, spreads.Heat dissipation base and chip contacts through the heat radiation film, can be in time heat to the heat dissipation base transmission, employing thermal paste adhesion between heat dissipation base and the fin; Firmly and help heat radiation; It is fairly obvious that heat transmits its radiating effect through twice, and simple in structure, and cost performance is high.
In Ethernet multilayer switch system of the present invention and heat abstractor thereof, square fin type radiator 11 also can be circle or polygon, increases the efficiently radiates heat area that contacts with air according to the heat that element distributed.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (7)
1. heat abstractor that is used for Ethernet multilayer switch system; It is characterized in that; Comprise fin, heat dissipation base and heat radiation film, said fin comprises many prescriptions shape fin type radiator and base plate, and the base plate of said fin is bonding through thermal paste and heat dissipation base one end face.
2. the heat abstractor that is used for Ethernet multilayer switch system according to claim 1 is characterized in that, said fin is an aluminum alloy material, and said many prescriptions shape fin type radiator and base plate are structure as a whole.
3. the heat abstractor that is used for Ethernet multilayer switch system according to claim 1 is characterized in that, said square fin type radiator is that matrix form is arranged in base plate one end face in length and breadth, and radiator distance each other equates.
4. the heat abstractor that is used for Ethernet multilayer switch system according to claim 1 is characterized in that, said heat dissipation base is a copper material, and heat dissipation base comprises keeps away a square hole and location hole.
5. an Ethernet multilayer switch system is characterized in that, comprises the arbitrary described heat abstractor that is used for Ethernet multilayer switch system of claim 1 to 4.
6. Ethernet multilayer switch according to claim 5 system is characterized in that said Ethernet multilayer switch comprises circuit board, and the heat dissipation base of said heat abstractor is fixed in circuit board through double-screw bolt.
7. Ethernet multilayer switch according to claim 5 system is characterized in that said Ethernet multilayer switch comprises chip, and the bottom end face of said heat abstractor directly contacts with chip through the heat radiation film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102307646A CN102625638A (en) | 2011-08-12 | 2011-08-12 | Ethernet multilayer switch system and heat-radiating device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102307646A CN102625638A (en) | 2011-08-12 | 2011-08-12 | Ethernet multilayer switch system and heat-radiating device thereof |
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| CN102625638A true CN102625638A (en) | 2012-08-01 |
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| CN2011102307646A Pending CN102625638A (en) | 2011-08-12 | 2011-08-12 | Ethernet multilayer switch system and heat-radiating device thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016123950A1 (en) * | 2015-02-05 | 2016-08-11 | 中兴通讯股份有限公司 | Bottom plate, bottom plate component and bottom plate installation system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2583600Y (en) * | 2002-12-05 | 2003-10-29 | 廖炎福 | Radiator |
| CN101398601A (en) * | 2007-09-28 | 2009-04-01 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN201237194Y (en) * | 2008-06-04 | 2009-05-13 | 东莞市友美电源设备有限公司 | High-power high-efficiency LED road lamp radiator |
| CN201547576U (en) * | 2009-11-13 | 2010-08-11 | 珠海华博科技工业有限公司 | LED lamp with radiating structure |
| CN101873786A (en) * | 2009-04-23 | 2010-10-27 | 富准精密工业(深圳)有限公司 | Heat sink |
| CN202197484U (en) * | 2011-08-12 | 2012-04-18 | 苏州恒启自动化工程有限公司 | Ethernet multilayer switch system and heat radiation apparatus thereof |
-
2011
- 2011-08-12 CN CN2011102307646A patent/CN102625638A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2583600Y (en) * | 2002-12-05 | 2003-10-29 | 廖炎福 | Radiator |
| CN101398601A (en) * | 2007-09-28 | 2009-04-01 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN201237194Y (en) * | 2008-06-04 | 2009-05-13 | 东莞市友美电源设备有限公司 | High-power high-efficiency LED road lamp radiator |
| CN101873786A (en) * | 2009-04-23 | 2010-10-27 | 富准精密工业(深圳)有限公司 | Heat sink |
| CN201547576U (en) * | 2009-11-13 | 2010-08-11 | 珠海华博科技工业有限公司 | LED lamp with radiating structure |
| CN202197484U (en) * | 2011-08-12 | 2012-04-18 | 苏州恒启自动化工程有限公司 | Ethernet multilayer switch system and heat radiation apparatus thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016123950A1 (en) * | 2015-02-05 | 2016-08-11 | 中兴通讯股份有限公司 | Bottom plate, bottom plate component and bottom plate installation system |
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Application publication date: 20120801 |