CN102625634A - 散热装置及组合 - Google Patents
散热装置及组合 Download PDFInfo
- Publication number
- CN102625634A CN102625634A CN2011100286471A CN201110028647A CN102625634A CN 102625634 A CN102625634 A CN 102625634A CN 2011100286471 A CN2011100286471 A CN 2011100286471A CN 201110028647 A CN201110028647 A CN 201110028647A CN 102625634 A CN102625634 A CN 102625634A
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- CN
- China
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- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000011900 installation process Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110028647.1A CN102625634B (zh) | 2011-01-26 | 散热装置及组合 | |
US13/180,836 US8593814B2 (en) | 2011-01-26 | 2011-07-12 | Heat sink assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110028647.1A CN102625634B (zh) | 2011-01-26 | 散热装置及组合 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102625634A true CN102625634A (zh) | 2012-08-01 |
CN102625634B CN102625634B (zh) | 2016-12-14 |
Family
ID=
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030079861A1 (en) * | 2001-03-03 | 2003-05-01 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
CN1659700A (zh) * | 2001-09-10 | 2005-08-24 | 英特尔公司 | 带高容量散热器的电子组件及其制作方法 |
CN1752892A (zh) * | 2004-09-20 | 2006-03-29 | 扎尔曼技术株式会社 | 散热器 |
CN101056523A (zh) * | 2006-04-14 | 2007-10-17 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP2008166465A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Densan Corp | ヒートシンクファン |
CN101472443A (zh) * | 2007-12-27 | 2009-07-01 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030079861A1 (en) * | 2001-03-03 | 2003-05-01 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
CN1659700A (zh) * | 2001-09-10 | 2005-08-24 | 英特尔公司 | 带高容量散热器的电子组件及其制作方法 |
CN1752892A (zh) * | 2004-09-20 | 2006-03-29 | 扎尔曼技术株式会社 | 散热器 |
CN101056523A (zh) * | 2006-04-14 | 2007-10-17 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP2008166465A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Densan Corp | ヒートシンクファン |
CN101472443A (zh) * | 2007-12-27 | 2009-07-01 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US20120188722A1 (en) | 2012-07-26 |
US8593814B2 (en) | 2013-11-26 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160401 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160601 Address after: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608 Applicant after: Jinyang Shenzhen sea Network Intelligent Technology Co., Ltd. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: He Bo Inventor after: Zhang Jinjun Inventor after: Lei Yong Inventor after: Sun Jianfei Inventor after: Wang Aihua Inventor after: Diao Xiaoxiang Inventor after: Yu Zhigang Inventor after: Qian Bin Inventor before: Ji Jinbiao Inventor before: Yao Zhijiang Inventor before: Xu Lifu |
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COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160918 Address after: 225300 No. 36 Jiangzhou North Road, Taizhou, Jiangsu Applicant after: Zhonghai asphalt (Taizhou) Co., Ltd. Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608 Applicant before: Jinyang Shenzhen sea Network Intelligent Technology Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180503 Address after: No. 1, Hai oil road, Taizhou, Jiangsu Province Patentee after: CNOOC TAIZHOU PETROCHEMICAL CO., LTD. Address before: 225300 Jiangzhou North Road, Taizhou, Taizhou, Jiangsu Patentee before: Zhonghai asphalt (Taizhou) Co., Ltd. |
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TR01 | Transfer of patent right |