CN102624617B - Data exchange system and data exchange method - Google Patents
Data exchange system and data exchange method Download PDFInfo
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- CN102624617B CN102624617B CN201210056381.6A CN201210056381A CN102624617B CN 102624617 B CN102624617 B CN 102624617B CN 201210056381 A CN201210056381 A CN 201210056381A CN 102624617 B CN102624617 B CN 102624617B
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Abstract
The invention provides a data exchange system and a data exchange method. The system comprises a server, an access switch and a core switch, wherein at least one physical layer processing chip arranged in the access switch and at least one message exchange chip arranged in the core switch are directly connected through at least one data link layer processing chip, the physical layer processing chip is connected with the server, the physical layer processing chip is used for transforming formats of messages sent by the server on the basis of a physical layer-data link layer conversion protocol, the data link layer processing chip is used for performing corresponding process for the received messages according to message processing strategies, and the message exchange chip is used for exchanging the received messages. According to the data exchange system and the data exchange method, the optimization for message exchange processing procedures by a data center is achieved, the delay of message forwarding is reduced, and the communication capacity of the data center is improved.
Description
Technical field
The embodiment of the present invention relates to communication technical field, relates in particular to a kind of data exchange system and method.
Background technology
Data center, for holding department of computer science's relevant assembly of unifying, as communication and storage system, is the important infrastructure of IT application in enterprises.Data center moves the communication network based on IP agreement, mainly comprises: access switch, and for accessing different servers, such as application server, database server, Web server etc.; Convergence switch, for will being also linked to above core switch between multiple access switch; Core switch, for providing exchange at a high speed key circuit.
Carry out in recent years the flattening of data center network framework, the convergence switch in the middle of having removed, thus the switching system of whole data center forms two-tier system by access switch and core switch.Based on existing switching system, although access switch and core switch all have user side interface, but in order to meet the high speed exchange of bandwidth demand and message simultaneously, the message that need to send by the user side interface reception server in access switch, and by interconnected the physical layer Phy chip interface of the physical layer Phy chip interface of access switch and core switch, thereby make message can realize exchange at a high speed by the Fabric chip of core switch after the repeatedly processing of the physical layer Phy chip in access switch and core switch and data link layer Switch chip.
But, pass through the interconnected switching system of physical layer Phy chip interface based on access switch and core switch, make message in the process that realizes message switching need to pass through the processing of multiple physical layer and data link layer, greatly increase the delay of message repeating, reduced the communication capacity of data center.
Summary of the invention
For the above-mentioned defect of prior art, the embodiment of the present invention provides a kind of data exchange system and method.
The embodiment of the present invention provides a kind of data exchange system on the one hand, comprising:
Server, access switch and core switch, wherein, described access switch comprises that at least one physical layer process chip, described core switch comprise at least one message switching chip, wherein, physical layer process chip and being directly connected by a data link layer deals chip between message switching chip described at least one described at least one, described physical layer process chip is connected with described server;
Described physical layer process chip, carries out the conversion from physical layer protocol to data link layer protocol for the form of the message to described server transmission according to physical layer-data link layer translation-protocol;
Described data link layer deals chip, for carrying out corresponding processing according to message processing policy to the message receiving;
Described message switching chip, for exchanging the message receiving.
The embodiment of the present invention provides a kind of method for interchanging data on the other hand, comprising:
The form of the message that described physical layer process chip sends server according to physical layer-data link layer translation-protocol carries out the conversion process from physical layer protocol to data link layer protocol, and send to described data link layer deals chip, the message receiving is carried out after corresponding processing according to message processing policy for described data link layer deals chip, directly by described message switching chip, the message receiving is exchanged;
Or, the message that described data link layer deals chip sends described message switching chip according to message processing policy carries out sending to described physical layer process chip after corresponding processing, the form of the message according to physical layer-data link layer translation-protocol, described data link layer deals chip being sent for described physical layer process chip carries out the conversion process from data link layer protocol to physical layer protocol, and sends to described server.
Data exchange system provided by the invention and method, by the physical layer process chip in access switch is connected with server, and be directly connected by a data link layer deals chip between at least one the physical layer process chip in access switch and at least one message switching chip in core switch, the form of the message that the physical layer process chip that makes access switch sends server carries out after the conversion process from physical layer protocol to data link layer protocol, according to message processing policy, message being carried out to corresponding processing by data link layer deals chip more directly exchanges by message switching chip afterwards.
And pass through the interconnected switching system of physical layer process chip interface based on access switch and core switch in prior art, server is sent after message to access switch, after first sending to physical layer process chip-data link layer deals chip in core switch process after the processing of the physical layer process chip in access switch (Phy chip)-data link layer deals chip (Switch chip)-physical layer process chip, could realize message exchange at a high speed by the message switching chip of core switch (Fabric chip), therefore, compared with prior art, the message switching procedure that the data exchange system providing based on the embodiment of the present invention is carried out only carries out passing through after single treatment the single treatment of data link layer deals chip again by the physical layer process chip in access switch, directly exchange by message switching chip, thereby realize the optimization of data center to message switching handling process, reduce the delay of message repeating, improve the communication capacity of data center.
Brief description of the drawings
Fig. 1 is the structural representation of an embodiment of data exchange system of the present invention;
The flow chart of message forward processing in the method for interchanging data that Fig. 2 carries out for the data exchange system shown in application drawing 1;
The flow chart of message reverse process in the method for interchanging data that Fig. 3 carries out for the data exchange system shown in application drawing 1;
Fig. 4 is data exchange system of the prior art;
Fig. 5 is the structural representation of another embodiment of data exchange system of the present invention;
The flow chart of message forward processing in the method for interchanging data that Fig. 6 carries out for the data exchange system shown in application drawing 5;
The flow chart of message reverse process in the method for interchanging data that Fig. 7 carries out for the data exchange system shown in application drawing 5;
Fig. 8 is the data exchange system that data link layer deals chip is placed in to access switch provided by the invention;
Fig. 9 is the data exchange system that data link layer deals chip is placed in to core switch provided by the invention;
Figure 10 is the structural representation of the data exchange system shown in Fig. 9 under low capacity application scenarios;
Figure 11 is the structural representation of the data exchange system shown in Fig. 8 under large capacity applications scene.
Embodiment
Fig. 1 is the structural representation of an embodiment of data exchange system of the present invention, and as shown in Figure 1, this system comprises:
Server 1, access switch 2 and core switch 3, access switch 2 comprises that at least one physical layer process chip 21, core switch 3 comprise at least one message switching chip 31, wherein, between at least one physical layer process chip 21 and at least one message switching chip 31, be directly connected by least one data link layer deals chip 41, the physical layer process chip 21 in access switch 2 is connected with server 1.Wherein, physical layer process chip 21 carries out the conversion from source protocol to target protocol for the form of the message that server 1 sent according to physical layer-data link layer translation-protocol; Data link layer deals chip 41 is for carrying out corresponding processing according to message processing policy to the message receiving; Message switching chip 31 is for exchanging the message receiving.
The method for interchanging data carrying out for the data exchange system shown in Fig. 1 comprises forward processing procedure and the inverse process from message switching chip to server from server to message switching chip to message, and Fig. 2 and Fig. 3 are described in detail forward processing procedure and the inverse process of message respectively;
The flow chart of message forward processing in the method for interchanging data that Fig. 2 carries out for the data exchange system shown in application drawing 1, specifically comprises:
Step 100, the form of the message that physical layer process chip sends server carries out conversion process, and sends to data link layer deals chip;
The form of the message that physical layer process chip sends server according to physical layer-data link layer translation-protocol carries out the conversion process from physical layer protocol to data link layer protocol, and sends to data link layer deals chip.
Step 101, data link layer deals chip carries out after corresponding processing the message receiving according to message processing policy, directly by message switching chip, the message receiving is exchanged.
Data link layer deals chip carries out corresponding processing according to message processing policy to the message receiving, it should be noted that, one of ordinary skill in the art will appreciate that be in data link layer according to concrete application demand the concrete processing procedure difference to message, such as buffer memory, the classification etc. of message, for packet-based message switching, also need message to be divided into grouping one by one, and grouping is sent into switching matrix forward.After data link layer deals chip is finished dealing with, directly message after treatment is sent to the message switching chip in core switch, thereby message switching chip exchanges to the message receiving.
The flow chart of message reverse process in the method for interchanging data that Fig. 3 carries out for the data exchange system shown in application drawing 1, specifically comprises:
Step 200, the message that data link layer deals chip sends message switching chip according to message processing policy carries out sending to physical layer process chip after corresponding processing;
The message that message switching chip sends all the other network element devices that receive sends in data link layer deals chip, thereby the message that data link layer deals chip sends message switching chip according to message processing policy carries out corresponding processing, such as buffer memory, the classification etc. of message, for packet-based message switching, need to be reassembled into message to the grouping receiving, data link layer deals chip sends to the physical layer process chip in access switch after finishing dealing with.
Step 201, the form of the message that physical layer process chip sends data link layer deals chip carries out sending to server after conversion process.
The form of the message that physical layer process chip sends data link layer deals chip according to physical layer-data link layer translation-protocol carries out the conversion process from data link layer protocol to physical layer protocol, and sends to server.
Fig. 4 is data exchange system of the prior art, as shown in Figure 4, data exchange system of the prior art is in order to meet the high speed exchange of bandwidth demand and message simultaneously, thereby physical chip (Phy chip) interface of the physical chip of access switch (Phy chip) interface and core switch is passed through to CoaXPress (CXP) interface inter-link, wherein, CXP interface is a kind of point-to-point standard for serial communication of asymmetrical high speed for transmission of video and image transmitting foundation, can expand single or multiple coaxial cables.It has a high-speed downstream can reach every 6.25gbps video, image, data channel, communicates by letter, control channel with a up 20mbps.Hence one can see that, the message that server sends to access switch, first after the processing of the physical layer process chip in access switch (Phy chip)-data link layer deals chip (Switch chip)-physical layer process chip (Phy chip), arrive core switch by CXP interface, after the physical layer process chip in core switch (Phy chip)-data link layer deals chip (Switch chip) is processed, could realize message exchange at a high speed by the message switching chip in core switch (Fabric chip) again.Thereby make needs the processing through multiple physical layer and data link layer to message, the time that has greatly increased message switching in the process that realizes the exchange of message high speed.
In sum, compared with existing data exchange system shown in Fig. 4, the data exchange system that the present embodiment provides, by being directly connected by least one data link layer deals chip between at least one the message switching chip at least one the physical layer process chip in access switch and core switch, the message that server is sent to access switch, only carry out passing through again after single treatment the single treatment of data link layer deals chip by the physical layer process chip in access switch, directly carry out high speed exchange by the message switching chip in core switch, thereby realize the optimization of data center to message switching handling process, reduce the delay of message repeating, improve the communication capacity of data center.
Fig. 5 is the structural representation of another embodiment of data exchange system of the present invention, as shown in Figure 5, based on embodiment illustrated in fig. 1, core switch 3 also comprises: N level message switching chipset, wherein, N level message switching chipset comprises at least two N level message switching chips, wherein, at least one message switching chip is connected with the first order message switching chip in N level message switching chipset by backplane interface, between the message switching chips at different levels in N level message switching chipset, is connected by backplane interface.Wherein, message switching chip 31 is also for forwarding to the first order message switching chip of N level message switching chipset the message receiving; Front N-1 level message switching chip in N level message switching chipset is for the message receiving is forwarded, and N level message switching chip is for exchanging the message receiving.It should be noted that, the concrete number of N can need to arrange according to the application of system, the present embodiment is not limited this, embodiment illustrated in fig. 5 is to be specifically described as an example of N=1 example, at least comprise two first order message switching chips 32, wherein, message switching chip 31 is also for forwarding to first order message switching chip 32 message receiving; First order message switching chip 32 is for exchanging the message receiving.
The method for interchanging data carrying out for the data exchange system shown in Fig. 5 comprise to message from server the forward processing procedure to first order message switching chip and the inverse process from first order message switching chip to server, Fig. 6 and Fig. 7 are described in detail forward processing procedure and the inverse process of message respectively;
The flow chart of message forward processing in the method for interchanging data that Fig. 6 carries out for the data exchange system shown in application drawing 5, specifically comprises:
Step 300, the form of the message that physical layer process chip sends server carries out conversion process, and sends to data link layer deals chip;
The form of the message that physical layer process chip sends server according to physical layer-data link layer translation-protocol carries out the conversion process from physical layer protocol to data link layer protocol, and sends to data link layer deals chip.
Step 301, data link layer deals chip carries out, after corresponding processing, directly sending to message switching chip to the message receiving according to message processing policy;
Data link layer deals chip carries out corresponding processing according to message processing policy to the message receiving, such as buffer memory, the classification etc. of message, for packet-based message switching, also need message to be divided into grouping one by one, and grouping is sent into switching matrix forward.After data link layer deals chip is finished dealing with, directly message after treatment is sent to the message switching chip in core switch.
Step 302, message switching chip sends to the first order message switching chip message that data link layer deals chip sends, to carry out the high speed exchange of message by first order message switching chip.
Message switching chip forwards to the first order message switching chip message that received data link layer deals chip sends by backplane interface, because a message switching chip can E-Packet at least two first order message switching chips, thereby can realize the high speed exchange of more messages by more first order message switching chip.Therefore, compared with embodiment illustrated in fig. 4, the message switching chip in the present embodiment is used for E-Packeting, and first order message switching chip is realized the high speed exchange of message, be different from the high speed that directly realizes message by message switching chip in embodiment illustrated in fig. 4 and exchange, improve the processing capacity of system.
The flow chart of message reverse process in the method for interchanging data that Fig. 7 carries out for the data exchange system shown in application drawing 5, specifically comprises:
Step 400, the message that first order message switching chip receives all the other network element devices transmissions sends to message switching chip, to be transmitted to data link layer deals chip by message switching chip;
Because a message switching chip connects at least two first order message switching chips, thereby can receive by the first order message switching chip message that more all the other network element devices send, first order message switching chip is transmitted to data link layer deals chip by the message receiving by message switching chip.
Step 401, the message that data link layer deals chip sends message switching chip according to message processing policy carries out sending to physical layer process chip after corresponding processing;
Data link layer deals chip receives after the message of message switching chip transmission, according to message processing policy, message is carried out to corresponding processing, such as buffer memory, the classification etc. of message, for packet-based message switching, need to be reassembled into message to the grouping receiving, data link layer deals chip sends to the physical layer process chip in access switch after finishing dealing with.
Step 402, the form of the message that physical layer process chip sends data link layer deals chip carries out sending to server after conversion process.
The form of the message that physical layer process chip sends data link layer deals chip according to physical layer-data link layer translation-protocol carries out the conversion process from data link layer protocol to physical layer protocol, and sends to server.
The data exchange system that the present embodiment provides, by being directly connected by least one data link layer deals chip between at least one the message switching chip at least one the physical layer process chip in access switch and core switch, and at least one message switching chip is connected with at least two first order message switching chips in core switch, the message that server is sent to access switch, only carry out passing through again after single treatment the single treatment of data link layer deals chip by the physical layer process chip in access switch, directly be transmitted to first order message switching chip by the message switching chip in core switch, and by first order message switching chip, more message is carried out to high speed exchange, thereby realize the optimization of data center to message switching handling process, when having reduced the delay of message repeating, also increase power system capacity, and can be according to the adjustment System configuration flexibly of the capacity of system, improve further the communication capacity of data center.
For Fig. 1, data link layer deals chip in data exchange system embodiment shown in Fig. 5 shown in dotted portion, can data link layer deals chip need to be placed in to access switch or be placed in core switch according to actual application, need difference according to application, connection between each chip can be applied different interfaces, illustrates as follows:
Mode one: data link layer deals chip 41 is placed in to access switch 2, makes access switch 2 at least comprise a data link layer deals chip 41;
Particularly, at least one physical layer process chip 21 in access switch 2 is connected with server 1 by SFP+ interface, and physical layer process chip 21 is connected with at least one the data link layer deals chip 41 in access switch 2 by XAUI interface and/or RXAUI interface; Data link layer deals chip 41 is connected with at least one the message switching chip 31 in core switch 3 by CXP interface or high-speed interface.
Mode two: data link layer deals chip 41 is placed in to core switch 3, makes core switch 3 at least comprise a data link layer deals chip 41;
Particularly, at least one physical layer process chip 21 in access switch 2 is connected with server 1 by SFP+ interface, and physical layer process chip 21 is connected with at least one the data link layer deals chip 41 in core switch 3 by XAUI interface and/or RXAUI interface; Data link layer deals chip 41 is connected with at least one the message switching chip 31 in core switch 3 by backplane interface or CXP interface or high-speed interface.
In sum, the method for interchanging data that the data exchange system providing for the clearer explanation application embodiment of the present invention is carried out, is that example is described in detail below by the concrete application scenarios shown in Fig. 8 and Fig. 9.
Fig. 8 is the data exchange system that data link layer deals chip is placed in to access switch provided by the invention, the message switching processing procedure that data exchange system shown in application drawing 8 is carried out is specific as follows: particularly, the user side interface of the access switch in the data exchange system shown in Fig. 8 is that SFP+ interface is used for connection server, the message that the multiple 10G Phy chips (being equivalent to the physical layer process chip in above-described embodiment) in access switch send by SFP+ interface reception server.Access switch comprises multiple Swtich chips (being equivalent to the data link layer deals chip in above-described embodiment), Swtich chip receives by XAUI and/or RXAUI interface the message that 10G Phy chip sends, be used for realizing processing to message, such as the buffer memory of message, classification, processing etc.Every Swtich chip has 8 CXP interfaces, it should be noted that CXP interface and SFP+ interface, not at same, can be placed on the back side of access switch, convenient wiring.Process every Swtich chip after message and have on 32 road differential signal Serdes and Jiang Gai 32 road differential signal mean allocation to a 8 CXP interface, make on each CXP interface, to there are 4 road Serdes.On Fabric chip (being equivalent to the message switching chip in above-described embodiment) during every Swtich chip exchanges to core by CXP interface cochain.
Each Fabric chip in core switch has 10 CXP interfaces, each Fabric chip You128 road Serdes (such as the BCM88750 of Broadcom company), wherein 64 tunnels are for front panel interface, 64 tunnels connect for backboard, because 64 can not be divided exactly by 10, therefore only used wherein 60 road, thereby every Fabric chip is to the Serdes that has 6 tunnels on each CXP interface, can adopt N level Fabric chipset (in the present embodiment, to describe as an example of N=1 example at the power board of cabinet aft section, be equivalent to the first order message switching chip in the N level message switching chipset in above-described embodiment), Fabric chip is connected with first order Fabric chip by back panel connector, every first order Fabric chip has 128 road Serdes and 8 back panel connectors, Gai128 road Serdes mean allocation is to these 8 back panel connectors, each back panel connector Wei16 road Serdes.
In sum, the data exchange system providing by the present embodiment, the message that server sends by the 10G Phy chip in access switch and Swtich chip to the processing of message after, directly send to the Fabric chip in core switch by CXP interface, and arrive first order Fabric chip by back panel connector, realize the high speed exchange to message by Fabric chip and first order Fabric chip.Thereby realize the optimization of data center to message switching handling process, when having reduced the delay of message repeating, also increased power system capacity, improved to greatest extent the communication capacity of data center.
Fig. 9 is the data exchange system that data link layer deals chip is placed in to core switch provided by the invention, the message switching processing procedure that data exchange system shown in application drawing 9 is carried out is specific as follows: particularly, the user side interface of the access switch in the data exchange system shown in Fig. 9 is that SFP+ interface is used for connection server, the message that the multiple 10G Phy chips (being equivalent to the physical layer process chip in above-described embodiment) in access switch send by SFP+ interface reception server.Core switch comprises multiple Swtich chips (being equivalent to the data link layer deals chip in above-described embodiment), Swtich chip receives by XAUI and/or RXAUI interface the message that 10G Phy chip sends, be used for realizing processing to message, such as the buffer memory of message, classification, processing etc.Every Swtich chip has 8 CXP interfaces, it should be noted that CXP interface and SFP+ interface, not at same, can be placed on the back side of access switch, convenient wiring.Process every Swtich chip after message and have on 32 road differential signal Serdes and Jiang Gai 32 road differential signal mean allocation to a 8 CXP interface, make on each CXP interface, to there are 4 road Serdes.On Fabric chip (being equivalent to the message switching chip in above-described embodiment) during every Swtich chip exchanges to core by CXP interface cochain.
Each Fabric chip in core switch has 10 CXP interfaces, each Fabric chip You128 road Serdes (such as the BCM88750 of Broadcom company), wherein 64 tunnels are for front panel interface, 64 tunnels connect for backboard, because 64 can not be divided exactly by 10, therefore only used wherein 60 road, thereby every Fabric chip is to the Serdes that has 6 tunnels on each CXP interface.Can adopt N level Fabric chipset (in the present embodiment, to describe as an example of N=2 example at the power board of cabinet aft section, be equivalent to the first order message switching chip in the N level message switching chipset in above-described embodiment), Fabric chip is connected with first order Fabric chip by back panel connector, every first order Fabric chip has 128 road Serdes and 8 back panel connectors, Gai128 road Serdes mean allocation to these 8 back panel connectors, each back panel connector Wei16 road Serdes.
In sum, the data exchange system providing by the present embodiment, the message that server sends by the 10G Phy chip in access switch to the processing of message after, directly send to the Swtich chip in core switch by XAUI and/or RXAUI interface, Swtich chip is connected to the Fabric chip of core switch by CXP interface, Fabric chip connects first order Fabric chip by back panel connector, thereby realizes the high speed exchange to message by first order Fabric chip.Thereby realize the optimization of data center to message switching handling process, when having reduced the delay of message repeating, also increased power system capacity, improved to greatest extent the communication capacity of data center.
For the embodiment shown in Fig. 8 and Fig. 9, it should be noted that, for different power system capacities, the switching system being made up of access switch and core switch can need to carry out system configuration and corresponding connected mode according to concrete application, illustrates as follows:
Figure 10 is the structural representation of the data exchange system shown in Fig. 9 under low capacity application scenarios, as shown in figure 10, for the smaller system of capacity relative, can adopt following connected mode: every line in core switch represents a cable that connects CXP interface, data inserting link layer process chip and message switching chip on core switch, because power system capacity is less, so do not insert N level message switching chipset, all message switching chip configuration are become directly to exchange at a high speed, and obstructed level later forwards.On each data link layer deals chip, there is the CXP interface connecting on 8, be connected respectively on the CXP interface of 8 message switching chips, will directly carry out high speed exchange by message switching chip through data link layer deals chip message after treatment.
Figure 11 is the structural representation of the data exchange system shown in Fig. 8 under large capacity applications scene, as shown in figure 11, for the larger system of capacity relative, can adopt following connected mode: on core switch, stick with all message switching chips, because the power system capacity of processing is larger, so insert N level message switching chipset, such as the situation of N=1, be that N level message switching chipset comprises first order message switching chip, all message switching chip configuration are become to forward by first order message switching chip, whole system is maximum supports that the access switch of 80 is interconnected.On each data link layer deals chip, there is the CXP interface connecting on 8, be connected respectively on the CXP interface of 8 core switch, because the panel of each core switch is supported at most 10*8=80 CXP interface, so whole system can be supported at most the access switch of 80, if every access switch has 48 SFP+ interfaces, whole system can be supported the surface speed forwarding of 48*80=3840 SFP+ interface so.
Further, if the capacity of system is between Figure 10 and the power system capacity of mentioning embodiment illustrated in fig. 11, can reduce so the quantity of core switch, or, if the capacity of system is larger, by the quantity of N in N level message switching chipset in increase core switch, the capacity that whole system can be supported can also be larger, thereby Figure 10, the embodiment of Figure 11 can, according to the adjustment System configuration flexibly of the capacity of system, meet its different application needs.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can complete by the relevant hardware of program command, aforesaid program can be stored in a computer read/write memory medium, this program, in the time carrying out, is carried out the step that comprises said method embodiment; And aforesaid storage medium comprises: various media that can be program code stored such as ROM, RAM, magnetic disc or CDs.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a data exchange system, is characterized in that, comprising:
Server, access switch and core switch, wherein, described access switch comprises that at least one physical layer process chip, described core switch comprise at least one message switching chip, wherein, physical layer process chip and being directly connected by a data link layer deals chip between message switching chip described at least one described at least one, described physical layer process chip is connected with described server;
Described physical layer process chip, carries out the conversion from physical layer protocol to data link layer protocol for the form of the message to described server transmission according to physical layer-data link layer translation-protocol;
Described data link layer deals chip, for carrying out corresponding processing according to message processing policy to the message receiving;
Described message switching chip, for exchanging the message receiving.
2. data exchange system according to claim 1, is characterized in that, described data link layer deals chip is arranged in described access switch;
Described physical layer process chip and be directly connected and comprise by a data link layer deals chip between message switching chip described at least one described at least one:
Described at least one, physical layer process chip is connected with a data link layer deals chip by XAUI interface or RXAUI interface;
A described data link layer deals chip is connected with message switching chip described at least one by high-speed interface.
3. data exchange system according to claim 1, is characterized in that, described data link layer deals chip is arranged in described core switch;
Described physical layer process chip and be directly connected and comprise by a data link layer deals chip between message switching chip described at least one described at least one:
Described at least one, physical layer process chip is connected with a described data link layer deals chip by XAUI interface or RXAUI interface;
A described data link layer deals chip is connected with message switching chip described at least one by backplane interface.
4. data exchange system according to claim 1, is characterized in that, described physical layer process chip is connected and comprises with described server:
Described physical layer process chip is connected with described server by SFP+ interface.
5. according to the data exchange system described in claim 1-4 any one, it is characterized in that, described core switch also comprises: N level message switching chipset, wherein, described N level message switching chipset comprises at least two N level message switching chips, wherein, described at least one, message switching chip is connected with the first order message switching chip in described N level message switching chipset by backplane interface, between the message switching chips at different levels in described N level message switching chipset, is connected by described backplane interface;
Described message switching chip, also for forwarding to the first order message switching chip of described N level message switching chipset the message receiving;
Front N-1 level message switching chip in described N level message switching chipset is for the message receiving is forwarded, and N level message switching chip is for exchanging the message receiving.
6. the method for interchanging data that application data exchange system as claimed in claim 1 is carried out, is characterized in that, comprising:
The form of the message that described physical layer process chip sends server according to physical layer-data link layer translation-protocol carries out the conversion process from physical layer protocol to data link layer protocol, and send to described data link layer deals chip, the message receiving is carried out after corresponding processing according to message processing policy for described data link layer deals chip, directly by described message switching chip, the message receiving is exchanged;
Or, the message that described data link layer deals chip sends described message switching chip according to message processing policy carries out sending to described physical layer process chip after corresponding processing, the form of the message according to physical layer-data link layer translation-protocol, described data link layer deals chip being sent for described physical layer process chip carries out the conversion process from data link layer protocol to physical layer protocol, and sends to described server.
7. method for interchanging data according to claim 6, is characterized in that, described data link layer deals chip is arranged in described access switch,
Described data link layer deals chip carries out message interaction by high-speed interface and described message switching chip.
8. method for interchanging data according to claim 6, is characterized in that, described data link layer deals chip is arranged in described core switch,
Described data link layer deals chip carries out message interaction by backplane interface and described message switching chip.
9. according to the method for interchanging data described in claim 6-8 any one, it is characterized in that,
Described physical layer process chip carries out message interaction by XAUI interface or RXAUI interface and described data link layer deals chip.
10. according to the method for interchanging data described in claim 6-8 any one, it is characterized in that, described core switch also comprises: N level message switching chipset, wherein, described N level message switching chipset comprises at least two N level message switching chips, and described method also comprises:
Described message switching chip sends to the first order message switching chip in described N level message switching chipset by the message receiving by backplane interface, to forwarded the packet to the N level message switching chip in described N level message switching chipset and carried out message switching by the front N-1 level message switching chip in N level message switching chipset;
Or, N level message switching chip in described N level message switching chipset sends to described message switching chip by the message receiving by backplane interface, carries out message processing to described message is sent to described data link layer deals chip by described message switching chip.
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| CN201210056381.6A CN102624617B (en) | 2012-03-06 | 2012-03-06 | Data exchange system and data exchange method |
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