Background technology
Virtual switch unit(Virtual Switching Unit, VSU)Technology is a kind of network system Intel Virtualization Technology,
Support for multiple devices to be combined into single virtual unit, in the network architecture as shown in Figure 1, Access Layer, convergence-level, core layer
Equipment can form VSU, form whole net VSU networking plan end to end.Compared with traditional networking mode, this networking
Network topology can be simplified, reduce the management service cost of network, shorten application recovery time and service outage duration, improve net
The utilization rate of network resource.
For three-layer network model, core layer is the high speed backbone of network, needs the data volume forwarding very huge,
So the switching equipment of core layer generally adopts rack framework, as shown in Fig. 2 the switching equipment of core layer includes engine, industry
Business card and backboard, engine and service card may be connected on backboard, realize connection by the data channel on backboard.Engine holds
The functions such as the control carrying on a shoulder pole switching equipment state, the management routeing, the management of user's access, device upgrade;Service card includes line
Card and switching matrix, line card is used for realizing specific business, carries the functions such as data forwarding, data fragmentation, and switching matrix is used
In carrying out data exchange between each line card, the structure of line card is as shown in figure 3, include central processing unit(Central
Processing Unit, CPU), Media access contorl(Medium Access Control, MAC)Chip, physical layer
(Physical Layer, PHY)Chip and ethernet port, a width of 10G or 40G of band of ethernet port.
At present, it is to rely on the ethernet port on line card to realize VSU interconnection, as shown in Figure 4 between switching equipment.Work as friendship
When between exchange device, the data volume of forwarding is little, 10G the or 40G ethernet port using minority line card carries out VSU interconnection, can expire
The demand of sufficient data forwarding, but when the data volume that needs forward is very big, using 10G the or 40G Ethernet of a lot of line cards
Port carries out VSU interconnection, and this will directly increase interconnection cost and power consumption.For example, 480G to be realized forward, need MAC chip
Cochain backboard reaches the bandwidth of 480G, and lower chain panel reaches the bandwidth of 480G, altogether needs the bandwidth of 960G, a MAC chip
Will consume energy in more than 100W;And, when the ethernet port realizing line card is interconnected, need using optical module and ether
Net port carries out inserting, and the cost of optical module is very high, and a pair of 40G short distance optical module market purchasing valency is 5000 yuan,
If the bandwidth of 480G to be realized, optical mode block cost just has 60000 yuan about.
It can be seen that, the structure of current line card leads to interconnect cost and power consumption is all very high.
Content of the invention
The embodiment of the present invention provides a kind of high density line card, switching equipment, group system and electrical signal types collocation method,
Structure in order to solve the problems, such as existing line card leads to interconnect cost and power consumption is all very high.
Therefore, the embodiment of the present invention provides a kind of high density line card, is applied in switching equipment, described high density line card bag
Include control unit, electric signal converting unit, photoelectric conversion unit and connection unit, wherein:
Described control unit, for obtaining after the electrical signal types that described photoelectric conversion unit is supported, notifies described telecommunications
Number converting unit;
Described electric signal converting unit, for being converted into described photoelectricity by the electric signal of the backboard from described switching equipment
It is sent to described photoelectric conversion unit after the electrical signal types that converting unit is supported, or by from described photoelectric conversion unit
Electric signal is sent to described backboard after being converted into the electrical signal types that described backboard is supported;
Described photoelectric conversion unit, sends for the electric signal from described electric signal converting unit is converted into optical signal
To described connection unit, or the optical signal from described connection unit is converted into electric signal it is sent to the conversion of described electric signal
Unit;
Described connection unit, for connecting other switching equipment by CA cable assembly;Will be from other switching equipment described
Optical signal be sent to described photoelectric conversion unit, or by the optical signal from described photoelectric conversion unit be sent to described its
His switching equipment.
Specifically, described control unit is connected with described electric signal converting unit by serial management interface SMI bus, institute
State control unit to be connected with described photoelectric conversion unit by I2C bus;
Described control unit, specifically for reading, by described I2C bus, the electric signal that described photoelectric conversion unit is supported
After type, the electrical signal types reading are configured in described electric signal converting unit by described SMI bus.
Specifically, described photoelectric conversion unit includes parallel optical sending device and parallel optical receiving device, wherein:
Described parallel optical sending device, for being converted into optical signal by the electric signal from described electric signal converting unit
Afterwards, it is sent to described connection unit;
Described parallel optical receiving device, for being converted into the optical signal from described connection unit after electric signal, sends out
Give described electric signal converting unit.
Specifically, many optical fiber that described connection unit includes the first ribbon fiber and is located at described first ribbon fiber one end
Wire jumper MPO male, wherein:
Described first ribbon fiber is connected with described photoelectric conversion unit.
Specifically, many optical fiber that described CA cable assembly includes the second ribbon fiber and is located at described second ribbon fiber two ends
Wire jumper MPO female;
Described connection unit also includes adapter, and described adapter is used for described MPO male and a described MPO female
Locking connects.
Also provide a kind of switching equipment, including above-specified high density line card, engine, backboard and switching matrix, wherein, described height
Density line card is connected with described engine, described backboard and described switching matrix respectively.
Specifically, described high-density lines card is connected with described backboard by gigabit management interface.
Also include a kind of group system, including at least two above-mentioned switching equipment, pass through between described switching equipment two-by-two
CA cable assembly connects.
Specifically, many optical fiber that described CA cable assembly includes the second ribbon fiber and is located at described second ribbon fiber two ends
Wire jumper MPO female.
A kind of electrical signal types collocation method based on high density line card is also provided, is applied to above-specified high density line card, institute
The method of stating includes:
Described control unit determines whether described photoelectric conversion unit is in place;
If in place, after obtaining the electrical signal types that described photoelectric conversion unit is supported, notify described electric signal converting unit,
And indicate that the electric signal of the backboard of described electric signal converting unit selfing in future exchange device is converted into described photoelectric conversion unit and props up
It is sent to described photoelectric conversion unit after the electrical signal types held.
High density line card provided in an embodiment of the present invention, switching equipment, group system and electrical signal types collocation method, should
Do not use MAC chip in high density line card, but use photoelectric conversion unit, due to photoelectric conversion unit power consumption very
Low, thus the power consumption of whole high density line card just can be substantially reduced;And the connection unit in this high density line card passes through electricity
Cable assembly connects other switching equipment, does not use optical module, thus can substantially reduce interconnection cost.
Specific embodiment
Structure for existing line card leads to interconnect cost and all very high problem of power consumption, and the embodiment of the present invention provides one
Plant high density line card, this high density line card is applied in switching equipment, and structure includes control unit 50, electric signal as shown in Figure 5
Converting unit 51, photoelectric conversion unit 52 and connection unit 53, wherein:
Control unit 50, for obtaining after the electrical signal types that photoelectric conversion unit 52 is supported, notifies electric signal conversion single
Unit 51.
Electric signal converting unit 51, the electric signal for the backboard of selfing in future exchange device is converted into photoelectric conversion unit 52
It is sent to photoelectric conversion unit 52 after the electrical signal types supported, or the electric signal from 52 yuan of opto-electronic conversion list is converted into
It is sent to backboard after the electrical signal types that backboard is supported.
Photoelectric conversion unit 52, is sent to even for the electric signal from electric signal converting unit 51 is converted into optical signal
Order unit 53, or the optical signal from connection unit 53 is converted into electric signal is sent to electric signal converting unit 51.
Connection unit 53, for connecting other switching equipment by CA cable assembly;By the light letter from other switching equipment
Number it is sent to photoelectric conversion unit 52, or the optical signal from photoelectric conversion unit 52 is sent to other switching equipment.
Do not use MAC chip in this high density line card, but use photoelectric conversion unit, due to photoelectric conversion unit
Power consumption is very low, thus the power consumption of whole high density line card just can be substantially reduced;And the connection list in this high density line card
Unit connects other switching equipment by CA cable assembly, does not use optical module, thus can substantially reduce interconnection cost.
Specifically, control unit passes through serial management interface(Serial Management Interface, SMI)Bus
It is connected with electric signal converting unit, control unit is connected with photoelectric conversion unit by I2C bus;
Control unit, specifically for being read after the electrical signal types that photoelectric conversion unit is supported by I2C bus, is passed through
The electrical signal types that SMI bus reads in the configuration of electric signal converting unit.
Control unit is passed through to configure the electrical signal types of photoelectric conversion unit support it is achieved that carrying on the back in electric signal converting unit
Electric signal on plate can be sent to photoelectric conversion unit by electric signal converting unit, and then is sent to other switching equipment.
Specifically, photoelectric conversion unit includes parallel optical sending device and parallel optical receiving device, wherein:
Parallel optical sending device, for being converted into the electric signal from electric signal converting unit after optical signal, sends
To connection unit;
Parallel optical receiving device, for being converted into, after electric signal, being sent to telecommunications the optical signal from connection unit
Number converting unit.
Specifically, as shown in fig. 6, connection unit 53 includes the first ribbon fiber 530 and is located at first ribbon fiber one end
Many optical patchcords(Multi-fiber Push On, MPO)Male 531, wherein:First ribbon fiber 530 and opto-electronic conversion list
Unit 52 connection.
Specifically, as shown in fig. 7, CA cable assembly 7 includes the second ribbon fiber 70 and is located at the second ribbon fiber two ends
MPO female 71;
Connection unit also includes adapter, and adapter is used for being connected MPO male with a MPO female locking.
CA cable assembly and connection unit can be securely attached together it is ensured that the exchange of VSU interconnection by adapter
Proper communication between equipment.
Based on same inventive concept, the embodiment of the present invention also provides a kind of switching equipment, structure such as Fig. 8 of this switching equipment
Shown, including high density line card 80 as shown in Figure 5, engine 81, backboard 82, switching matrix 83 and line card 84, wherein, high density
Line card 80 is connected with engine 81, backboard 82 and switching matrix 83 respectively, engine 81, switching matrix 83 and line card 84 can be to
Few one, only illustrate one in fig. 8.
Specifically, high density line card 80 is connected with backboard 82 by gigabit management interface.
Based on same inventive concept, the embodiment of the present invention also provides a kind of group system, as shown in Figure 8 including at least two
Switching equipment, is connected by CA cable assembly between switching equipment two-by-two, can be using CA cable assembly as shown in Figure 7.
Realize the present invention is carried out specifically as a example the interconnection of 480G bandwidth VSU by two rack switching equipment below
Bright.
Fig. 9 show the Organization Chart of the switching equipment in the present embodiment, wherein in engine, line card and switching matrix and Fig. 2
Unanimously, increased a high density line card in fig .9, realize high bandwidth clustered system interconnection between frame for the switching equipment
's.
The structure of high density line card as shown in Figure 10, contrasts common line card, uses " PHY chip+parallel optical device+company
Order unit " substitutes original " MAC chip+PHY chip ", and the hardware cost of the two is substantially suitable, but the work(of high density line card
Consumption will be far below common line card, and parallel optical device is analogous to the device of optical module, and power consumption is much smaller than MAC chip, and 1 to parallel
The power consumption of optics is less than 4W, but, the power consumption of a high bandwidth MAC chip generally reaches 100W.
The function of in high density line card each device is described in detail below, CPU corresponds to and the control unit 50, PHY in Fig. 5
Chip corresponds to and the electric signal converting unit 51 in Fig. 5, and parallel optical device corresponds to and the photoelectric conversion unit 52,24 in Fig. 5
Core high density ribbon cable assembly and front-panel connector correspond to and the connection unit 53 in Fig. 5.
CPU:For receiving the management information of engine, and by SMI, PHY chip is configured, by I2C bus to simultaneously
Row optics is managed and configures.Because the type of electric signal is very abundant, there is KR(Backboard interconnection defined in 802.3
Interface, have two kinds of interfaces of 40GBASE-KR4 and 10GBASE-KR)、SFI(10G attachment defined in IEEE802.3 standard
Reason media add(Physical Medium Attachment, PMA)Layer is related with physical medium(Physical Medium
Dependent, PMD)The interface of layer)Etc. a variety of it is impossible to every kind of electric signal can converge to parallel optical device realizes
Opto-electronic conversion, CPU will obtain, by I2C bus, the electrical signal protocol that parallel optical device is supported, then by configuring PHY core
Piece, the electric signal realizing backboard is converted into being suitable for the electric signal of parallel optical device.
PHY chip:For electrical signal protocol conversion, because KR4 signal is defined as the letter for backboard transmission in a standard
Number, be not suitable for walking front panel port, be used for Institute of Electrical and Electronics Engineers in this example(Institute of
Electrical and Electronics Engineers, IEEE)40GBASE-KR4 in 802.3ap standard(802.3ap
The interface for the interconnection of 40G signal backplane of definition)Signal is converted to the XLPPI in IEEE802.3ba standard
(The interface connecting PMA layer and pmd layer for 40G defined in IEEE802.3ba standard)Signal.
Parallel optical device:Including parallel optical sending device and parallel optical receiving device, it is a kind of high pass track density
Module, has multiple module appearance and size, and each module can support the Ethernet of the 10.3125Gbps speed of 10 to 12 paths
Link, such as, for 12 passages embedded MiniPOD parallel optical device, highest can support the speed of 120Gbps.
24 core high density ribbon cable assemblies and front-panel connector:For carrying out inserting, cable with parallel optical device
Assembly has the joint of 2 pluggable parallel optical devices, is connected to MPO male by the flat type optical fiber of 2 12 cores respectively.2
The flat type optical fiber of root 12 core connects parallel optical sending device and parallel optical receiving device respectively, realizes the speed of 120Gbps.
The present invention uses the flat type optical fiber cooperation 4 of 4 12 cores to embedded parallel optical device, totally realizes the transmission speed of 480Gbps
Rate;Front-panel connector has 4 adapters, and the size of whole connector only has the size of 3 40G optical modules, but can be real
The bandwidth of existing 480G.
The structure of VSU interconnection is realized as shown in figure 11, front-panel connector is by 24 core high density between two switching equipment
MPO male locking in MPO female in CA cable assembly and front-panel connector, by 4 24 core high-density cable assemblies, just
The VSU interconnection of 480G bandwidth between 2 switching equipment can be realized.
In this application scenarios, the power consumption of high density line card is less than 1/3 of line card in prior art;As long as 4 24 core ribbon
Shape optical fiber can achieve the interconnection of 480G bandwidth, needs 12 copper to look at or optical fiber cable compared to prior art, present invention reduces
Wiring difficulty;Without using optical module, greatly reduce interconnection cost;Interconnection transmission is optical signal, and transmission range is permissible
Reach 100m, look at much larger than copper, substantially meet the demand of VSU interconnection;Without using optical module, bandwidth will not be subject to optical module thing
The restriction of reason size, the interconnection of equipment room is to be realized using the pairing interconnection of MPO male and female head, realizes 480G bandwidth, size is less than 12
The 1/4 of individual 40G port.
Based on same inventive concept, the embodiment of the present invention also provides a kind of configuration of the electrical signal types based on high density line card
Method, as shown in figure 12, executive agent is control unit to the flow process of the method, and step is as follows:
S120:After the completion of electricity on high density line card, initialized.
S121:Determine whether photoelectric conversion unit is in place, if in place, execute S122;Otherwise, continue executing with S121.
S122:After obtaining the electrical signal types that photoelectric conversion unit is supported, notify electric signal converting unit, and indicate telecommunications
The electric signal of the backboard of number converting unit selfing in future exchange device is sent out after being converted into the electrical signal types of photoelectric conversion unit support
Give photoelectric conversion unit.
The present invention is with reference to method according to embodiments of the present invention, equipment(System), and computer program flow process
Figure and/or block diagram are describing.It should be understood that can be by each stream in computer program instructions flowchart and/or block diagram
Flow process in journey and/or square frame and flow chart and/or block diagram and/or the combination of square frame.These computer programs can be provided
The processor instructing all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing device is to produce
A raw machine is so that produced for reality by the instruction of computer or the computing device of other programmable data processing device
The device of the function of specifying in present one flow process of flow chart or multiple flow process and/or one square frame of block diagram or multiple square frame.
These computer program instructions may be alternatively stored in and can guide computer or other programmable data processing device with spy
Determine in the computer-readable memory that mode works so that the instruction generation inclusion being stored in this computer-readable memory refers to
Make the manufacture of device, this command device realize in one flow process of flow chart or multiple flow process and/or one square frame of block diagram or
The function of specifying in multiple square frames.
These computer program instructions also can be loaded in computer or other programmable data processing device so that counting
On calculation machine or other programmable devices, execution series of operation steps to be to produce computer implemented process, thus in computer or
On other programmable devices, the instruction of execution is provided for realizing in one flow process of flow chart or multiple flow process and/or block diagram one
The step of the function of specifying in individual square frame or multiple square frame.
Although having been described for the alternative embodiment of the present invention, those skilled in the art once know basic creation
Property concept, then can make other change and modification to these embodiments.So, claims are intended to be construed to including can
Select embodiment and fall into being had altered and changing of the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this to the embodiment of the present invention
The spirit and scope of bright embodiment.So, if these modifications of the embodiment of the present invention and modification belong to the claims in the present invention
And its within the scope of equivalent technologies, then the present invention is also intended to comprise these changes and modification.