CN102623380A - Sheet-like component holding device and method thereof - Google Patents
Sheet-like component holding device and method thereof Download PDFInfo
- Publication number
- CN102623380A CN102623380A CN2012100831839A CN201210083183A CN102623380A CN 102623380 A CN102623380 A CN 102623380A CN 2012100831839 A CN2012100831839 A CN 2012100831839A CN 201210083183 A CN201210083183 A CN 201210083183A CN 102623380 A CN102623380 A CN 102623380A
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- those
- rotatably connected
- chip component
- supporting rods
- clamping device
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Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000012856 packing Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims description 2
- 230000001458 anti-acid effect Effects 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 230000008676 import Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a sheet element clamping device and a method thereof. The support frame is provided with a first support arm and a second support arm which are arranged oppositely, and simultaneously provides support force for the first clamping part and the second clamping part when rotating. The first clamping part comprises a first rotating connecting part and a first clamping rod which are arranged in pair; and two fixing blocks are respectively arranged at two ends of the first rotating connecting part and are arranged between the support frame and the first rotating connecting part. The second clamping part comprises a second rotary connecting part and a second clamping rod which are arranged in pair; two sliding blocks are respectively arranged at two ends of the second rotary connecting part and are arranged between the supporting frame and the second rotary connecting part. The first rotation connecting part can rotate in parallel with the first clamping rod, and the second rotation connecting part can rotate in parallel with the second clamping rod, and the rotation direction is opposite to that of the first clamping part. The sheet-like element clamping device has the function of etching two surfaces simultaneously.
Description
Technical field
The present invention is about a kind of chip component clamping device and method thereof; Particularly, the present invention is about a kind of chip component clamping device and method thereof, and the sheet clamping device has the two-sided etched function of carrying out simultaneously.
Background technology
The thin plate etching is widely used in fields such as semiconductor, demonstration electronics.Along with the home appliance size maximizes, and etching makes granular, and how promoting etched precision becomes a main problem.Lifting etching precision mainly contains the selection of chemical solution, the modes such as improvement of making anchor clamps.
Fig. 1 is traditional device for clamping sheet sketch map.As shown in Figure 1, the conventional thin plate holder is held mode palpus collocation one conveyer belt 12 and magnet 20, with sheet metal 14 clampings.When the fabrication and processing operation was carried out, for cooperating wet making demand, conveyer belt 12 and magnet 20 were arranged at the one side of sheet metal 14, and another side carries out chemical etching simultaneously.Sheet metal 14 surfaces have barrier layer 16 and opening 18 to form required etched figure.
Yet; Use traditional device for clamping sheet as shown in Figure 1 can't two-sidedly carry out chemical etching simultaneously; In addition; Only utilize the mode of magnet 20 absorption can't provide sheet metal 14 uniform tension force, than fine etching the time, just can influence the product yields, so the surface smoothness of sheet metal 14 also is one of problem that need overcome.
Summary of the invention
A purpose of the present invention is to provide a kind of chip component clamping device, has the two-sided etched function of carrying out simultaneously.
Another object of the present invention is to provide a kind of chip component clamping device, have the function of tension-adjustable.
The chip component clamping device mainly comprises bracing frame, first clamping part and second clamping part.Bracing frame has first support arm and second support arm that is oppositely arranged, the support force the when rotation of first clamping part and second clamping part is provided simultaneously.First clamping part comprises first of paired setting the be rotatably connected portion and first supporting rod.First be rotatably connected portion two ends respectively have a fixed block to be arranged at bracing frame to be rotatably connected between the portion with first.Second clamping part comprises second of paired setting the be rotatably connected portion and second supporting rod.Second be rotatably connected portion two ends respectively have a sliding shoe to be arranged at bracing frame to be rotatably connected between the portion with second.First portion of being rotatably connected can with the parallel rotation of first supporting rod, simultaneously second portion of being rotatably connected can with the parallel rotation of second supporting rod, and direction of rotation is opposite with first clamping part.
Beneficial functional of the present invention is: by chip component clamping device of the present invention; Give chip component adjustable tension force; Make chip component keep smooth and chip component around can not stop chemical solution, can get rid of chemical solution smoothly, reach the wet simultaneously purpose of making of chip component upper and lower surface simultaneously; Thereby improve wet drainage of making, and improve process quality.
Description of drawings
Fig. 1 is traditional device for clamping sheet sketch map;
Fig. 2 A to Fig. 2 D is the embodiment sketch map of chip component clamping device of the present invention;
Fig. 3 is the vertical view of carriage of the present invention;
Fig. 4 A and Fig. 4 B are the end view of packing of the present invention unit;
Fig. 5 is the embodiment profile of chip component clamping device;
Fig. 6 is the embodiment flow chart of chip component clamp method;
Fig. 7 is another embodiment profile of chip component clamping device;
Fig. 8 is another embodiment profile of chip component clamping device.
Wherein, Reference numeral
100 chip component clamping devices
102 bracing frames
104 first support arms
106 second support arms
210 first clamping parts
211 first clamping faces
212 first portions that are rotatably connected
213 first supporting rods
214 fixed blocks
220 second clamping parts
221 second clamping faces
222 second portions that are rotatably connected
223 second supporting rods
224 sliding shoes
225 back-up blocks
226 adjustment units
2261 springs
2262 axis bodies
2263 screws
240 packing unit
250 chutes
260 turning handles
270 chip components lock the unit
280 chamferings
300 chip components
Embodiment
Below in conjunction with accompanying drawing and specific embodiment technical scheme of the present invention being carried out detailed description, further understanding the object of the invention, scheme and effect, but is not the restriction as accompanying claims protection range of the present invention.
The present invention provides a kind of chip component clamping device, and the etching that generally can be used for fields such as semiconductor, demonstration electronics is made, and chip component can be metal material, also can be plastic cement or other different materials.Fig. 2 A to Fig. 2 D is the embodiment sketch map of chip component clamping device of the present invention.Shown in Fig. 2 A and Fig. 2 B, chip component clamping device 100 mainly comprises bracing frame 102, first clamping part 210 and second clamping part 220.Bracing frame 102 has first support arm 104 and second support arm 106 that is oppositely arranged, the support force when first clamping part 210 and 220 rotations of second clamping part are provided simultaneously.The two ends of first clamping part 210 comprise first of paired setting the be rotatably connected portion 212 and first supporting rod 213.First be rotatably connected portion 212 two ends respectively have a fixed block 214 to be arranged at bracing frame 102 to be rotatably connected between the portion 212 with first; That is; Fixed block 214 is arranged on first support arm 104 and second support arm 106, and first portion 212 that is rotatably connected is connected with fixed block 214 again.See also the partial enlarged drawing shown in Fig. 2 A and Fig. 2 B, an end of fixed block 214 is connected with first support arm 104 (or second support arm 106), and be rotatably connected with first rotating shaft of portion 212 of the other end articulates.Fixed block 214 by this; Paired first portion 212 that is rotatably connected can more firmly connect first support arm 104 and second support arm 106; Simultaneously can be with respect to bracing frame 102 coaxial rotations; In other words, first the be rotatably connected surfaces of revolution of portion 212 is parallel with the surfaces of revolution of first supporting rod 213, make win the portion of being rotatably connected 212 can with the 213 parallel rotations of first supporting rod.
On the other hand, second clamping part, 220 relative first clamping parts 210 are arranged at intervals at the other end of bracing frame 102.Second clamping part 220 and the connected mode of first clamping part 210 be preferable to have different designs, and the two ends of second clamping part 220 comprise second of paired setting the be rotatably connected portion 222 and second supporting rod 223.Second be rotatably connected portion 222 two ends respectively have a sliding shoe 224 to be arranged at bracing frame 102 to be rotatably connected between the portion 222 with second, to connect first support arm 104 and second support arm 106 respectively.That is sliding shoe 224 is arranged on first support arm 104 and second support arm 106, and second portion 222 that is rotatably connected links to each other with sliding shoe 224 again.See also the partial enlarged drawing shown in Fig. 2 A and Fig. 2 B part; One end of sliding shoe 224 can move and is connected with first support arm 104 (or second support arm 106) along first support arm 104 (or second support arm 106), and be rotatably connected with the second rotating shaft pivot joint of portion 222 of the other end.Sliding shoe 224 by this; Paired second portion 222 that is rotatably connected can more firmly connect first support arm 104 and second support arm 106; Simultaneously can be with respect to bracing frame 102 coaxial rotations; In other words, second the be rotatably connected surfaces of revolution of portion 222 is parallel with the surfaces of revolution of second supporting rod 223, make second be rotatably connected portion 222 can with the 223 parallel rotations of second supporting rod.Please be simultaneously with reference to figure 2C and Fig. 2 D; Be rotatably connected portion 222 when driving second supporting rod 223 and being the clockwise direction rotation when second; First the be rotatably connected portion 212 drives first supporting rod 213 and is rotation counterclockwise, and promptly the direction of rotation of second clamping part 220 is opposite with first clamping part 210.
In the embodiment shown in Fig. 2 C and Fig. 2 D; Turning handle 260 can drive first the be rotatably connected portion 222 of portion 212 and second that is rotatably connected and rotate 90 degree, and first portion 222 that is rotatably connected of portion 212 and second that is rotatably connected is turned to perpendicular to first support arm, 104 second places from the primary importance that is parallel to first support arm 104.Please be simultaneously with reference to figure 5, Fig. 5 is the embodiment profile of chip component clamping device.As shown in Figure 5, the both sides of first supporting rod 213 and second supporting rod, 223 clamp clip linear elements 300, and 213 of first supporting rods have first clamping face 211, and 223 of second supporting rods have second clamping face 221.In this embodiment, the section shape of first supporting rod 213 and second supporting rod 223 is circular, and first clamping face 211 and 221 of second clamping faces are the tangent plane between two circles.When chip component 300 is positioned at primary importance, has first clamping face 211 and second clamping face 221 is parallel with chip component 300; When chip component 300 was positioned at the second place, first clamping face 211 and second clamping face 221 were vertical with chip component 300.Yet in other embodiments, the primary importance and the second place are not limited to orthogonal relation, that is to say, first portion 212 and second angle that portion 222 rotates between the primary importance and the second place that is rotatably connected that is rotatably connected can be greater than or less than 90 degree.By chip component clamping device 100 of the present invention, give chip component 300 adjustable tension force, make chip component 300 keep smooth and chip component 300 around can not stop chemical solution, thereby improve wet drainage of making, and improve process quality.In addition, the surperficial visual making demand of first supporting rod 213 or second supporting rod 223 plates manufacturing materials, for example antiacid material, alkali resistant material, anti-etching material and silica gel etc.
Fig. 6 is the embodiment flow chart of chip component clamp method.As shown in Figure 6, step S1010 comprises between input chip linear element to the first supporting rod and second supporting rod.Please be simultaneously with reference to figure 2A and Fig. 2 B, chip component 300 is cut in advance makes required size, is arranged between first supporting rod 213 and second supporting rod 223 again.Step S1020 comprises adjustment packing unit, makes the packing unit be fixed into first right supporting rod 213 and the second paired supporting rod 223 respectively.Shown in Fig. 2 A and Fig. 2 B; When chip component 300 is put into to first supporting rod 213 and second supporting rod 223; Packing unit 240 stretches into from an end of chute 250; With first supporting rod 213 arranged side by side of conflicting, adjust the gap of first supporting rod 213, make a side of first supporting rod, 213 clamp clip linear elements 300.Likewise, 223 opposite sides of second supporting rod by packing unit 240 clamp clip linear elements 300.Step S1030 comprises outside rotation first portion that is rotatably connected of portion and second that is rotatably connected, and makes the coaxial rotation respectively of first supporting rod and second supporting rod.Shown in Fig. 2 C and Fig. 2 D; First portion 222 that is rotatably connected of portion 212 and second that is rotatably connected turns to perpendicular to first support arm, 104 second places from the primary importance that is parallel to first support arm 104, drives first supporting rod 213 and second supporting rod 223 simultaneously and makes the both sides of chip component 300 produce bending respectively.As previously mentioned; When chip component 300 is positioned at the second place; First clamping face 211 and second clamping face 221 are vertical with chip component 300, this moment chip component 300 all without hindrance block material of horizontal plane upper edge dual-side, therefore; Can get rid of chemical solution smoothly, reach the purpose that chip component 300 upper and lower surfaces wet simultaneously and make simultaneously.Step S1040 comprises mobile second clamping part, makes between first clamping part and second clamping part to have a tension force.After chip component 300 rotated to the second place from primary importance, chip component 300 can by spring 2261 and screw 2263 increases or the tension force of minimizing chip component 300, simultaneously its surface smoothness is improved.
Fig. 7 is another embodiment profile of chip component clamping device.As shown in Figure 7, first supporting rod 213 and second supporting rod 223 are prism.Comprise chip component between prism and lock unit 270, chip component locks unit 270 and can a side of chip component 300 be fixed in first supporting rod 213 by this, and the opposite side of chip component 300 is fixed in second supporting rod 223.As shown in Figure 7, chip component lock unit 270 by vertical first clamping face 211 and second clamping face 221 fixing first supporting rod 213 of direction and second supporting rod 223.Wherein prism forms chamfering 280 along a side of chip component 300, and is as shown in Figure 7, and the position of chamfering 280 is that chip component 300 bendings and prism clamp part.Folding takes place in the time of can avoiding chip component 300 to rotate with first supporting rod 213 and second supporting rod 223 and hinders in the setting of chamfering 280 by this.
Fig. 8 is another embodiment profile of chip component clamping device.As shown in Figure 8, first supporting rod 213 and second supporting rod 223 are prism.Has the magnetic force of inhaling mutually between prism.Magnetic force can be fixed in a side of chip component 300 first supporting rod 213 by this, and the opposite side of chip component 300 is fixed in second supporting rod 223.Wherein prism forms chamfering 280 along a side of chip component 300, and is as shown in Figure 8, and the position of chamfering 280 is that chip component 300 bendings and rectangular cylinder clamp part.Folding takes place in the time of can avoiding chip component 300 to rotate with first supporting rod 213 and second supporting rod 223 and hinders in the setting of chamfering 280 by this.On the other hand, chip component clamping device 100 of the present invention has less slit, can avoid chemical solution to remain in the surface and the edge of chip component 300, and then improve yields.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (16)
1. a chip component clamping device is characterized in that, comprises:
One bracing frame has one first support arm and one second support arm that are oppositely arranged;
One first clamping part comprises a plurality of first be rotatably connected portion and a plurality of first supporting rod, and a plurality of first portions of being rotatably connected connect this first support arm and this second support arm respectively, and is provided with in pairs; Wherein paired this first portion of being rotatably connected can be with respect to the coaxial rotation of this bracing frame; A plurality of first supporting rod adjustable gaps are set up in parallel wholely, and two ends connect into right this first portion that is rotatably connected respectively; Wherein, paired this first portion of being rotatably connected can with the parallel rotation of those first supporting rods; And
One second clamping part, this first clamping part is provided with at interval relatively, comprises a plurality of second be rotatably connected portion and a plurality of second supporting rod, and a plurality of second portions of being rotatably connected connect this first support arm and this second support arm respectively, and are provided with in pairs; Wherein paired this second portion of being rotatably connected can be with respect to the coaxial rotation of this bracing frame; A plurality of second supporting rod adjustable gaps are set up in parallel wholely, and two ends connect into right this second portion that is rotatably connected respectively; Wherein, paired this second portion of being rotatably connected can with the parallel rotation of those second supporting rods, and direction of rotation is opposite with those first clamping parts.
2. chip component clamping device as claimed in claim 1; It is characterized in that; This first clamping part more comprises a fixed block and is arranged at this bracing frame and first is rotatably connected between the portion with this; One end of this fixed block is connected with this bracing frame, the other end of this fixed block with those first be rotatably connected portion rotating shaft articulate.
3. chip component clamping device as claimed in claim 1; It is characterized in that; This second clamping part more comprises a sliding shoe and is arranged at this bracing frame and second is rotatably connected between the portion with this; One end of this sliding shoe can connect this bracing frame movably along this bracing frame, and the other end of this sliding shoe articulates with those second portions of being rotatably connected.
4. chip component clamping device as claimed in claim 3 is characterized in that, more comprises the side that at least one back-up block is arranged at this sliding shoe, and is connected with this bracing frame; More comprise an adjustment unit between one side of this sliding shoe and this back-up block, this adjustment unit limits the relative displacement of this second clamping part and this first clamping part.
5. chip component clamping device as claimed in claim 4; It is characterized in that; This adjustment unit is a spring and an axis body, and this spring is arranged on this axis body, and this axis body wears this sliding shoe and parallel this bracing frame; This axis body one end is connected with this back-up block, but and this spring of this second clamping part mat move towards direction away from this first clamping part.
6. chip component clamping device as claimed in claim 4 is characterized in that, this adjustment unit is a screw, and this screw is arranged on this back-up block, and rotatablely stretches out or withdraw towards this sliding shoe.
7. chip component clamping device as claimed in claim 1; It is characterized in that; Those first portion and those second that are rotatably connected are rotatably connected in the portion at least that one of which more comprises a packing unit, and this packing unit is from a side those first supporting rods of adjustment of those first supporting rods and those second supporting rods and the gap of those second supporting rods.
8. chip component clamping device as claimed in claim 7; It is characterized in that; Those first be rotatably connected portion and those second portions of being rotatably connected more comprise a chute; Those first supporting rods and those second supporting rods can be placed in this chute respectively and this packing unit stretches into this first supporting rod of conflicting from an end of this chute.
9. chip component clamping device as claimed in claim 1 is characterized in that, when this first portion of being rotatably connected is positioned at a primary importance, has one first clamping face and is parallel to this first support arm; When this first portion of being rotatably connected was positioned at a second place, this first clamping face was perpendicular to this first support arm, and this first portion that is rotatably connected rotates between this primary importance and this second place.
10. chip component clamping device as claimed in claim 1 is characterized in that, those first portion and those second that are rotatably connected are rotatably connected in the portion at least that one of which comprises the radially extension setting of a turning handle along rotating shaft.
11. chip component clamping device as claimed in claim 1 is characterized in that, those first supporting rods or those second supporting rods more comprise a chip component and lock the unit, and this chip component locks the unit can fix those first supporting rods or those second supporting rods.
12. chip component clamping device as claimed in claim 11 is characterized in that, those first supporting rods or those second supporting rods form a rectangular cylinder, and this rectangular cylinder forms chamfering along a side of a chip component.
13. chip component clamping device as claimed in claim 1 is characterized in that, arranged side by side those first supporting rod or those second supporting rods have the magnetic force of inhaling mutually.
14. chip component clamping device as claimed in claim 1; It is characterized in that; The surface of those first supporting rods or this second supporting rod is coated with a process materials, and this process materials is selected from one of group that antiacid material, alkali resistant material, anti-etching material and silica gel forms.
15. a chip component clamp method uses chip component clamping device as claimed in claim 1, comprises the following step:
Import between a chip component to those first supporting rods arranged side by side and those second supporting rods arranged side by side;
Adjust a packing unit, make fixing those first supporting rods arranged side by side in this packing unit and those second supporting rods arranged side by side;
Rotate those first portion and those second portions that is rotatably connected that is rotatably connected, make those first supporting rods and the coaxial rotation of those second supporting rods.
16. use chip component clamp method as claimed in claim 15, it is characterized in that, further comprise and move this second clamping part, make between this first clamping part and this second clamping part to have a tension force.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100146040A TWI439628B (en) | 2011-12-13 | 2011-12-13 | Sheet unit clamping device and the method thereof |
| TW100146040 | 2011-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102623380A true CN102623380A (en) | 2012-08-01 |
| CN102623380B CN102623380B (en) | 2014-05-21 |
Family
ID=46563215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210083183.9A Expired - Fee Related CN102623380B (en) | 2011-12-13 | 2012-03-21 | Sheet-like component holding device and method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102623380B (en) |
| TW (1) | TWI439628B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107297692A (en) * | 2016-03-28 | 2017-10-27 | 合肥龙精灵信息技术有限公司 | A kind of electronic clamping device of sheet-like workpiece for accelerating to radiate and its application method |
| CN109029335A (en) * | 2018-09-12 | 2018-12-18 | 江苏英锐半导体有限公司 | A kind of wafer flow surface smoothness detection device |
| CN111211068A (en) * | 2018-11-21 | 2020-05-29 | 株式会社荏原制作所 | Method for making substrate holder hold substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2401570Y (en) * | 1999-10-27 | 2000-10-18 | 吴海铭 | Sehet component holder for continuous electroplating |
| US6171437B1 (en) * | 1997-11-20 | 2001-01-09 | Seiko Instruments Inc. | Semiconductor manufacturing device |
| CN1347558A (en) * | 1999-04-22 | 2002-05-01 | 乌尔苏拉·卢科 | Device for holding disk-shaped storage elements |
| US20070138601A1 (en) * | 2005-12-21 | 2007-06-21 | General Electric Company | Etch resistant wafer processing apparatus and method for producing the same |
| CN101728299A (en) * | 2008-10-16 | 2010-06-09 | 家登精密工业股份有限公司 | Device for clamping sheet |
-
2011
- 2011-12-13 TW TW100146040A patent/TWI439628B/en active
-
2012
- 2012-03-21 CN CN201210083183.9A patent/CN102623380B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6171437B1 (en) * | 1997-11-20 | 2001-01-09 | Seiko Instruments Inc. | Semiconductor manufacturing device |
| CN1347558A (en) * | 1999-04-22 | 2002-05-01 | 乌尔苏拉·卢科 | Device for holding disk-shaped storage elements |
| CN2401570Y (en) * | 1999-10-27 | 2000-10-18 | 吴海铭 | Sehet component holder for continuous electroplating |
| US20070138601A1 (en) * | 2005-12-21 | 2007-06-21 | General Electric Company | Etch resistant wafer processing apparatus and method for producing the same |
| CN101728299A (en) * | 2008-10-16 | 2010-06-09 | 家登精密工业股份有限公司 | Device for clamping sheet |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107297692A (en) * | 2016-03-28 | 2017-10-27 | 合肥龙精灵信息技术有限公司 | A kind of electronic clamping device of sheet-like workpiece for accelerating to radiate and its application method |
| CN109029335A (en) * | 2018-09-12 | 2018-12-18 | 江苏英锐半导体有限公司 | A kind of wafer flow surface smoothness detection device |
| CN111211068A (en) * | 2018-11-21 | 2020-05-29 | 株式会社荏原制作所 | Method for making substrate holder hold substrate |
| CN111211068B (en) * | 2018-11-21 | 2024-05-03 | 株式会社荏原制作所 | Method for holding substrate by substrate holder |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201323763A (en) | 2013-06-16 |
| TWI439628B (en) | 2014-06-01 |
| CN102623380B (en) | 2014-05-21 |
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Owner name: FUXIANG INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: JINGZHI ELECTRONICS CO., LTD. Effective date: 20150128 |
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Effective date of registration: 20150128 Address after: Taiwan District, Taichung City Chinese Minsheng Road 3 Lane 313 No. 45 Patentee after: Fuxiang Industrial Co., Ltd. Address before: Longtan County, Taoyuan County, Taiwan, China, 185, 4, 4 Patentee before: Jingzhi Electronics Co., Ltd. |
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Owner name: YUNDA PRECISION INDUSTRY CO., LTD. Free format text: FORMER NAME: FUXIANG INDUSTRIAL CO., LTD. |
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Address after: Taiwan District, Taichung City Chinese Minsheng Road 3 Lane 313 No. 45 Patentee after: Transport precision industries Limited by Share Ltd Address before: Taiwan District, Taichung City Chinese Minsheng Road 3 Lane 313 No. 45 Patentee before: Fuxiang Industrial Co., Ltd. |
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