CN102620813A - 导电粘接装置及其系统 - Google Patents

导电粘接装置及其系统 Download PDF

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CN102620813A
CN102620813A CN201110424595XA CN201110424595A CN102620813A CN 102620813 A CN102620813 A CN 102620813A CN 201110424595X A CN201110424595X A CN 201110424595XA CN 201110424595 A CN201110424595 A CN 201110424595A CN 102620813 A CN102620813 A CN 102620813A
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J·雅各布
H·格吕勒
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Vega Grieshaber KG
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Abstract

本发明涉及一种由通过至少一个粘合连接(5)连接的压电传动器(1)和电路板(3)构成的装置,在电路板(3)上的第一连接触点(13)与压电传动器(1)上的第二连接触点(15)之间具有至少一个由导电的粘合材料构成的电连接,其中连接触点(13,15)指向相同的方向,并且粘合连接(5)通过这些部件之一中的开口来实现。

Description

导电粘接装置及其系统
技术领域
本发明涉及一种根据权利要求1前序部分的由压电传动器(Piezoaktor)和电路板构成的装置以及一种根据权利要求9前序部分的该装置的制造方法。
背景技术
这样的由压电传动器和电路板构成的装置在现有技术中是已知的,并且例如被用在所谓的振动极限状态测量器(Vibrations-
Figure BDA0000120976030000011
)中。
在图1中给出了这样的振动极限状态测量器的示意结构。
图1中的示意结构既不是按比例的也不是完整的,而应当仅仅按照原理图的方式示出了振动极限状态测量器的功能。
所示的振动极限状态测量器包括设置在膜9上的振动叉(Schwinggabel)11作为传感器。膜9是振动叉11的一部分,其中振动叉的齿(Zinke)11a、11b直接连接到膜9,并且由于膜9的弯曲而相互相向或相背移动。
膜9通常由不锈钢(Edelstahl)制成,并且能通过压电传动器1而置于振动中。压电传动器1经由设置在压电传动器1和膜9之间的陶瓷薄片
Figure BDA0000120976030000012
7而与该膜连接。设置陶瓷薄片7以便使膜9和压电传动器1不同的热膨胀系数相互适配。
通过经由电路板3在压电传动器1的上表面上施加的电压来激励压电传动器1。压电传动器1的下表面被连贯地(durchgehend)敷以金属(metallisieren),从而施加在上表面上的电压由于上表面上电极划分(Segmentierung)以及这些压电段(Piezosegment)的不同极化而导致压电传动器1的振动。电路板3在这个例子中构造为所谓的柔性线路(Flexleitung),即构造为其上设置有印制导线的柔韧构造的电路板。
柔性线路3在压电传动器1的要与导电粘合剂接触的点处与导电粘合剂连接,从而电压只有在由该粘合剂连接的点才被导入到压电传动器1中。压电传动器1以及陶瓷薄片7和膜9也相互粘接。
为了利用压电传动器1生成振动叉11的振动并且同时检测振动叉11的频率变化(Frequenzverschiebung)或衰减
Figure BDA0000120976030000021
压电传动器1被划分为四个段。其中压电传动器1通常在俯视图中构造为是圆形的,并且被划分为四个四分之一圆,这四个四分之一圆可以通过施加电压而分别单独地被控制。为了生成振动,对两个对角相对的四分之一圆施加以电压,而其他两个四分之一圆被用于检测所产生的振动。以该方式可以同时生成和检测振动。
在图2中示出了现有技术中常见的由压电传动器1和电路板3构成的结构。电路板3或柔性线路为了施加电压到压电传动器1而具有第一连接触点13。对应于第一连接触点13,在压电传动器1上设置有第二连接触点15。为了在柔性线路3和压电传动器1之间不仅建立电气连接而且还建立机械连接,根据现有技术通常是在第一连接触点13和第二连接触点15之间建立导电的粘合连接(Klebeverbindung)5。在现有技术中目前通常是为此将导电的粘合剂涂敷到压电传动器1的连接触点15上,然后将柔性线路3适当对齐地设置在该粘合剂上并且与压电传动器1粘接。
由于很小的粘接面以及随后的按压,粘合剂的量必须非常少并且必须非常准确地分配。对非常少量的高粘性介质的能准确再现的配量由于在小体积(Volumina)的情况下占主导地位的表面张力而非常难以实现,从而使得生产成本提高。
在该方式中有问题的是:在第一次尝试(Anlauf)中柔性线路3的错误对齐不再能被纠正,  因为否则导电的粘合剂被乱涂(verschmieren)在连接触点13、15之间并且因此会导致各个触点之间的短接。此外不利的还在于:柔性线路3和压电传动器1由于位于它们之间的粘合连接5而不能彼此直接重叠地设置。而且不利的还在于:通过按压柔性线路3和压电传动器1,位于它们之间的粘合连接5被压平(flachdrücken)并且因此在可能的情况下多余的粘合剂从连接触点13、15的侧面被挤出。这增大了短接的风险。
由于柔性线路3和压电传动器1之间的连接完全由材料决定(stoffschlüssig),所以粘合连接5以后的每个负荷都由粘附力或附着力来承受。
在涂敷粘合剂之后,柔型线路必须面平行地并且相对于压电传动器1准确地被放置。由于上述原因,事后位置修正是不可能的。
发明内容
本发明的任务在于克服上述缺点并且简化上述装置生产中的过程控制。
该任务通过具有权利要求1特征的装置以及具有权利要求9特征的方法来实现。
根据本发明的由通过至少一个粘合连接来连接的压电传动器和电路板构成的装置在电路板上的第一连接触点和压电传动器上的第二连接触点之间具有至少一个由导电粘合材料产生的电连接,其中连接触点指向相同方向,并且通过其中一个部件中的开口来进行粘接。
通过相应的装置实现了负荷能力非常强的形状配合的(formschlüssig)铆合形式的粘合连接。通过在粘合之前能够使压电传动器和电路板相互准确地对齐,不需要在涂敷粘合剂之后执行位置校正。因为以该方式可以避免粘合材料的乱涂,所以很大程度上避免了各个连接触点之间的短接。此外,所使用的用于粘合连接的粘合材料量可以被提高,并且还能够精确度更低地被配量
一种特别有利的结构是电路板设置在压电传动器上。此外有利的是:电路板被构造为柔性的电路板。
通过柔性电路板(所谓的柔性导体)实现了:压电传动器一方面可以平面地与电路板粘合,但是另一方面使得能够实现灵活的信号馈入馈出。
用于生成电接触的一种有利的可能性是第一连接触点被构造为是环状的。如果第二连接触点被构造为是圆形,则该装置是特别有利的。
如果用于粘合的开口设置在环状构造的连接触点的内部,则由此可以实现:除了机械方面负荷能力非常强的连接之外还在柔性线路上的第一连接触点和压电传动器上的第二连接触点之间生成良好的电连接。
通过以下方式实现机械方面特别有利的构造:压电传动器和电路板相互直接重叠地设置。
以该方式实现柔性线路和压电传动器的平面设置,其中在这两个部件之间没有空隙。这样的设置是有利的,因为对于直接重叠设置的部件在粘合边缘处不会有杠杆力(Hebelkraft),从而这样构成的连接是高度机械稳定的。
如果粘合材料拱形地覆盖连接面,则实现粘合连接的一种特别稳定的构造。
这样的粘合连接是有利的,因为因此在压电传动器上提供了圆形面,在柔性线路上提供了环状面,这些面分别被粘合材料覆盖。
对于当前应用,特别有利的是压电传动器被分成四个部分,并且各自设置有粘合连接。
通过被分成四个部分且每个部分能单独控制的圆形构造压电传动器实现了:可以同时通过触发压电传动器的两个对角相对的部分产生振动,并且同时以其余两个部分进行检测。但是也可以考虑将根据本发明的粘合连接也应用在其中柔性西那路应被设置在位于其下的元件上的其他应用领域。
对于根据本发明的用于在具有第一连接触点的电路板和具有第二连接触点的压电传动器之间建立导电粘合连接的方法(其中电路板在连接触点区域中具有开口),在第一步骤中将电路板和压电传动器相互对齐地设置,在第二步骤中将适当量的导电粘合材料涂敷到连接触点上,使得在它们之间建立连接,并且在第三步骤中使粘合连接硬化。
与现有技术相比,根据本发明的方法具有以下优点:电路板和压电传动器在涂敷粘合材料之前可以相互对齐,并且因此可以避免可能有错误的对齐的事后校正。此外该方法还具有以下优点:不必在中间设置有粘合材料的情况下按压各个粘合部件,从而避免了粘合材料分布到实际要粘合的面积之外。以该方式避免了在按压时可能流出的导电粘合材料导致的短接。根据本发明的方法的另一优点还在于:用于粘合的导电粘合材料的量可以确定为更大并且可以精度更低地测定。以该方式显著简化了装配过程。
对于所实现的粘合连接的质量而言有利的是:电路板和压电传动器在涂敷粘合材料之前相互挤压(aufeinanderpressen)。
以该方式避免了在涂敷粘合材料时粘合材料毛细现象地渗透到压电传动器和电路板之间的间隔中并且因此在可能的情况下还产生短接。
有利地,涂敷的粘合材料的量使得粘合材料拱形地覆盖连接触点。以该方式实现了特别稳定的粘合连接,此外该粘合连接能非常容易生成。
为了在连接触点之间生成特别有利的电连接,有利的是:第一连接触点被构造为围绕开口的环状的,和/或第二连接触点被构造为圆形的。以该方式实现了:导电粘合连接在任何方向上都产生电接触,并且因此使得能够实现将电压可靠且低损耗地耦入到压电传动器。
附图说明
以下参考附图详细地介绍本发明。
在附图中:
图1示出了振动极限状态测量器的示意构造(已经介绍过了);
图2示出了按照现有技术的导电粘合连接(已经介绍过了);
图3示出了按照本发明的粘合连接。
具体实施方式
图3示出了压电传动器1和电路板3之间按照本发明的粘合连接5。电路板3在本例中被构造为柔性线路,即被构造为其上设置有印制导线的柔性构造的电路板。柔性线路3直接设置在压电传动器1上,并且具有设置在柔性线路3的背离(wegweisend)压电传动器的一侧上的环状的第一连接触点13。
在第一连接触点13内部,柔性线路3具有开口,设置在压电传动器1上的第二连接触点15被定位在该开口内。压电传动器1和柔性线路3经由粘合连接5相互连接。粘合连接5由导电的粘合材料生成,使得粘合连接覆盖连接触点13、15并且因此构成在横截面上铆合形式构造的粘合连接5。
以该方式构成的由压电传动器1和柔性线路3构成的装置优选应用于振动极限状态测量器中,如现有技术中已知的那样。
柔性线路3和压电传动器1上的连接触点例如可以由涂敷的金涂层构成。用于粘合连接5的粘合材料例如可以掺杂(versetzen)以银微粒(Silberpartikel),从而确保导电性。
附图标记列表
1   压电传动器
2   电路板/柔性线路
5   粘合连接
7   陶瓷薄片
9   膜
11  振动叉
11a,b  齿
13  第一连接触点
15  第二连接触点

Claims (13)

1.一种由通过至少一个粘合连接(5)连接的压电传动器(1)和电路板(3)构成的装置,在电路板(3)上的第一连接触点(13)与压电传动器(1)上的第二连接触点(15)之间具有至少一个由导电的粘合材料构成的电连接,其特征在于:
连接触点(13,15)指向相同的方向,并且粘合连接(5)通过这些部件之一中的开口来实现。
2.根据权利要求1所述的装置,其特征在于,电路板(3)设置在压电传动器(1)上。
3.根据前述权利要求之一所述的装置,其特征在于,电路板(3)被构造为柔性的电路板。
4.根据前述权利要求之一所述的装置,其特征在于,第一连接触点(13)被构造为是环状的。
5.根据前述权利要求之一所述的装置,其特征在于,第二连接触点(15)被构造为是圆形的。
6.根据前述权利要求之一所述的装置,其特征在于,压电传动器(1)和电路板(3)相互直接重叠设置。
7.根据前述权利要求之一所述的装置,其特征在于,粘合材料拱形地覆盖连接面(13,15)。
8.根据前述权利要求之一所述的装置,其特征在于,压电传动器(1)被分成四个部分,并且对于每个部分分别设置有粘合连接(5)。
9.一种用于在具有第一连接触点(13)的电路板(3)和具有第二连接触点(15)的压电传动器(1)之间生成导电的粘合连接(5)的方法,其中电路板(3)在第一连接触点(13)的区域中具有开口,所述方法具有以下步骤:
将电路板(3)和压电传动器(1)相互对齐地设置,
将适当量的导电的粘合材料涂敷到连接触点(13,15)上,使得在这些连接触点之间形成连接,以及
使粘合材料硬化。
10.根据权利要求9所述的方法,其特征在于,电路板(3)和压电传动器(1)在涂敷粘合材料之前相互挤压。
11.根据权利要求9或10所述的方法,其特征在于,涂敷的粘合材料的量使得粘合材料拱形地覆盖连接触点(13,15)。
12.根据权利要求9至11之一所述的方法,其特征在于,第一连接触点(13)被构造为是环状的。
13.根据权利要求9至12之一所述的方法,其特征在于,开口设置在环状的第一连接触点(13)内部。
CN201110424595.XA 2011-02-01 2011-12-16 导电粘接装置及其系统 Active CN102620813B (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110351960A (zh) * 2018-04-03 2019-10-18 赛米控电子股份有限公司 开关装置和制造开关装置的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054486A (ja) * 1983-09-05 1985-03-28 Toshiba Corp 高分子素子のリ−ド線接続部
US6472610B1 (en) * 1997-04-15 2002-10-29 Murata Manufacturing Co., Ltd. Support structure for electronic component
CN1505844A (zh) * 2001-06-01 2004-06-16 ������˹�ͺ�ɪ�����Ϲ�˾ 具有至少一个压电元件的机电式传感器
CN1650680A (zh) * 2001-06-01 2005-08-03 恩德莱斯和豪瑟尔两合公司 带有至少一个电子元件的印刷电路板
CN1729387A (zh) * 2002-12-19 2006-02-01 恩德莱斯和豪瑟尔两合公司 用于确定和/或监控至少一个物理量并且具有用于振荡激励及检测的压电驱动装置的设备
US20100165515A1 (en) * 2008-12-25 2010-07-01 Nhk Spring Co., Ltd. Wiring connecting structure for piezoelectric element, wiring connecting method, piezoelectric actuator, and head suspension

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054486A (ja) * 1983-09-05 1985-03-28 Toshiba Corp 高分子素子のリ−ド線接続部
US6472610B1 (en) * 1997-04-15 2002-10-29 Murata Manufacturing Co., Ltd. Support structure for electronic component
CN1505844A (zh) * 2001-06-01 2004-06-16 ������˹�ͺ�ɪ�����Ϲ�˾ 具有至少一个压电元件的机电式传感器
CN1650680A (zh) * 2001-06-01 2005-08-03 恩德莱斯和豪瑟尔两合公司 带有至少一个电子元件的印刷电路板
CN1729387A (zh) * 2002-12-19 2006-02-01 恩德莱斯和豪瑟尔两合公司 用于确定和/或监控至少一个物理量并且具有用于振荡激励及检测的压电驱动装置的设备
US20100165515A1 (en) * 2008-12-25 2010-07-01 Nhk Spring Co., Ltd. Wiring connecting structure for piezoelectric element, wiring connecting method, piezoelectric actuator, and head suspension

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110351960A (zh) * 2018-04-03 2019-10-18 赛米控电子股份有限公司 开关装置和制造开关装置的方法

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