CN102604248A - Non-migration-type macromolecule conductive masterbatch applied to IC (integrated circuit) carrier tape material and preparation method of conductive masterbatch - Google Patents
Non-migration-type macromolecule conductive masterbatch applied to IC (integrated circuit) carrier tape material and preparation method of conductive masterbatch Download PDFInfo
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- CN102604248A CN102604248A CN2012100559577A CN201210055957A CN102604248A CN 102604248 A CN102604248 A CN 102604248A CN 2012100559577 A CN2012100559577 A CN 2012100559577A CN 201210055957 A CN201210055957 A CN 201210055957A CN 102604248 A CN102604248 A CN 102604248A
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Abstract
The invention relates to non-migration-type macromolecule conductive masterbatch and particularly relates to non-migration-type macromolecule conductive masterbatch applied to an IC (integrated circuit) carrier tape material and a preparation method of the conductive masterbatch. The conductive masterbatch is prepared by mixing the following components in percentage by weight: 35.0%-85.0% of HIPS (High Impact Polystyrene), 5.0%-35.5% of conductive black, 3.0%-35.0% of polyethylene, 0.1%-8.0% of antioxidant, 4.0%-35.5% of SBS (thermoplastic elastomer), 1.0%-5.0% of coupling agents, and 0.5%-2.0% of other additives. The non-migration-type macromolecule conductive masterbatch has the important characteristics of being uniform in carbon black dispersion, firm in interlayer cohesion, stable in sealing performance, and the like, and meets the requirements on performance of the IC carrier tape material.
Description
Technical field
The present invention relates to a kind of non-migrating type conductive polymer master batch, relate in particular to non-migrating type conductive polymer master batch of a kind of IC of being applied to carrier band material and preparation method thereof.
Background technology
The high-density of electronic product assembling, highly reliable, miniaturized, low cost and the robotization of producing expedite the emergence of the formation of SMT (surface installation technique) process method.IC carrier band material is the antistatic packaging material that is used for high-grade microelectronics part; Being intended to prevent receive static damage, physical damage or contamination by dust in Electronic Components Manufacturing and the transportation, is to realize one of critical material indispensable in the automatic production of SMT electronic devices and components, packing and the transportation.IC carrier band material is owing to will supportingly use on robotization SMT production technique flow line; Performance requriements to material is very high; This material must possess simultaneously antistatic performance, surperficial carbon black dispersion evenly, characteristics such as interlayer firm binding force; Should guarantee certain involution power simultaneously and between the multiple cover tape (base material is matrix materials such as PE, PET), guarantee again in the automatic production line stripping process, to peel off easily.Therefore, the exploitation meet high performance requirements like this preparation IC carrier band material core material---the top layer conductive agglomerate becomes important research project instantly.
Mainly there is following technical barrier in domestic existing conducting masterbatch at present:
A difficult problem one, three-decker are insecure.IC carrier band material adopts three-decker, extrudes compound processing.Upper layer adopts conductive agglomerate, and insulating material is adopted in the middle layer, reduces cost with this.But three-decker is insecure to be caused surface layer part easily or comes off fully; Cause moulding bad, pollute electronic devices and components when packing with the cover tape involution easily, three-decker is insecure when cover tape is peeled off possibly cause upper layer and cover tape adhesion; Upper layer and middle layer meeting direct separation when serious; Make electronic devices and components come off, cause electronic devices and components to be scrapped, can't automatic production.
A difficult problem two, surface impurity particle point are many.Conductive agglomerate all adopts the graphitized carbon black preparation, in the thermoplastic extrusion process, is easy to generate the carbonization impurity particle.IC carrier band material has strict international standard to surperficial particle size, quantity, and can directly influence involution power value standard deviation, and according to the EIA-481 standard code, involution power value standard deviation is no more than 10.If standard deviation is greater than 10 in the cover tape stripping process, can cause involution unstable, electronic devices and components are jumped out IC carrier band material, can't cooperate the rhythm of production of mechanical manipulator extracting part on the automatic production line, and the production automation is obstructed.
A difficult problem three, involution adaptive surface are narrow.Domestic existing conductive agglomerate have can with heat-sealing type cover tape coupling, but can't with cold enclosed cover tape involution; What have can cold envelope, but can't seal; Have can with the cover tape involution that with PE is base material, be the cover tape of base material but can not mate with PET, can not be satisfied with the involution of multiple cover tape under different modes such as heat-sealing, cold envelope simultaneously.
Chinese invention patent application (application number: 200910095623.0 applyings date: 2009-01-13) disclose the antistatic plastic that is used for the SMT carrier band; This is used for the antistatic plastic of SMT carrier band, forms by the composition of following weight percent is mixing: conductive carbon black 5%～45%, PS 30%～90%; Styrene-butadiene-copolymer elasticity SBS5%～45%; Toughner 1%～13%, oxidation inhibitor 0.1%～2.8%, coupling agent 0.3%～3.8%.
Summary of the invention
In order to solve above-mentioned technical problem; An object of the present invention is to provide the non-migrating type conductive polymer master batch of IC carrier band material; Prepared non-migrating type conductive polymer master batch possesses indispensable characteristics such as carbon black dispersion is even, interlayer firm binding force, involution stable performance, meets the requirement of IC carrier band material property.Second purpose of the present invention provides a kind of preparation method of non-migrating type conductive polymer master batch of above-mentioned IC carrier band material.The 3rd purpose of the present invention provides a kind of IC carrier band material.
In order to realize first above-mentioned purpose, the technical scheme below the present invention has adopted:
The non-migrating type conductive polymer master batch of IC carrier band material, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 35.0%～85.0%; Graphitized carbon black 5.0%～35.0%;
Vilaterm 3.0%～35.0%; Inhibitor 0.1%～8.0%;
SBS 4.0% ~ 35.0%; Coupling agent 1.0% ~ 5.0%;
Other auxiliary agents 0.5% ~ 2.0%.
As preferably, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 45.0%～75.0%; Graphitized carbon black 8.0%～20.0%;
Vilaterm 5.0%～20.0%; Inhibitor 0.2%～1.0%;
SBS 8.0% ~ 20.0%; Coupling agent 1.0% ~ 2.5%;
Other auxiliary agents 0.5% ~ 2.0%.
Preferred as again, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 60.0%～70.0%; Graphitized carbon black 10.0%～15.0%;
Vilaterm 5.0%～10.0%; Inhibitor 0.2%～0.5%;
SBS 8.0% ~ 15.0%; Coupling agent 1.0% ~ 2.5%;
Other auxiliary agents 0.5% ~ 2.0%.
As most preferably, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 65.0%; Graphitized carbon black 13.0%;
Vilaterm 8.0%; Inhibitor 0.5%;
SBS 10.0%; Coupling agent 2.0%;
Other auxiliary agents 1.5%.
As most preferably, above-mentioned coupling agent is selected silane coupling agent KH-570 for use.
As preferably, above-mentioned Vilaterm adopts HDPE or LDPE.
As preferably, other above-mentioned auxiliary agents comprise one or more in inhibitor, toughener and the toughner.
Preferred as again, above-mentioned inhibitor 0.3% ~ 1.6%, toughener 0.2% ~ 1.5% and toughner 0.2% ~ 1.5%.
As preferably, above-mentioned inhibitor is antioxidant 1010 or inhibitor 168.
For guaranteeing the interlayer bonding force of three-decker matrix material; Possesses simultaneously excellent involution performance again; Adopt the similar compatibility principle, the present invention adds the Vilaterm solid particulate of an amount of ratio in non-migrating type conductive polymer formula of master batch, and Vilaterm adopts HDPE or LDPE; Utilize the consistency between the same material under the high temperature fused state and in the middle layer, make material in that to extrude the compound tense bonded more firm.And make non-migrating type conductive polymer master batch demonstrate certain polymer property; To being that the cover tape of base material has affinity with polymkeric substance such as PE, PET; Thereby make itself and cover tape (base material is composite polyethylene materials such as PE, PET) the involution stable performance of widespread use in the market, be applicable to that the cover tape of multiple different model carries out involution.
In order to realize second above-mentioned purpose, the technical scheme below the present invention has adopted:
A kind of method for preparing the non-migrating type conductive polymer master batch of above-mentioned IC carrier band material, this method comprises the steps:
1) by prescription take by weighing PS 40% ~ 60% amount, graphitized carbon black all, inhibitor 40% ~ 60% amount, Vilaterm is whole and SBS is whole;
2) above-mentioned PS, graphitized carbon black, inhibitor, Vilaterm, SBS is mixing in a stage, mediate and be prepared into the high work in-process of electric conductivity;
3) with above-mentioned mixing; Kneading is prepared into the high work in-process of electric conductivity and mixes with remaining PS, coupling agent, remaining inhibitor and other auxiliary agents, and under 55～190 ℃ condition mixing 30～50 minutes, feeding was extruded to forcing machine; The rotating speed of feeder is 450～550 rev/mins; The temperature of extruding is 180 ℃～210 ℃, and the rotating speed of forcing machine is 550～650 rev/mins, makes non-migrating type conductive polymer master batch through cooling, drying again.
The present invention adopts two rank blend dispersion methods to realize that graphitized carbon black disperses more equably, makes surface layer material particle point Control of Impurities within standard-required in resin.The method of two rank blend is parts of component that consumption in two kinds of blend components is more, carries out the fs blend earlier with another part whole.In the fs blend, two phase melt viscosities are equated, and two component material consumptions are also equated substantially, under such condition, prepare the two continuous mutually intermediate products of " Hai-Hai structure ".Subordinate phase in two rank blend; The remainder of the material that component content is more; Join in the intermediate product of " Hai-Hai structure ", " Hai-Hai structure " disperseed, can be made into and have less disperse phase particle diameter; And the disperse phase size distribution is " sea-island structure " two-phase system comparatively uniformly, like Fig. 1.
In order to realize the 3rd above-mentioned purpose, the technical scheme below the present invention has adopted:
IC carrier band material, this IC carrier band material adopts three-decker, and upper layer adopts conductive agglomerate, and insulating material is adopted in the middle layer, and described conductive agglomerate adopts the non-migrating type conductive polymer master batch of above-mentioned IC carrier band material.
Description of drawings
Fig. 1 is that two rank blend disperse the course synoptic diagram.
Embodiment
Embodiment 1
The non-migrating type conductive polymer master batch of IC carrier band material, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 65.0%; Graphitized carbon black 13.0%;
Vilaterm 8.0%; Inhibitor 0.5%;
SBS 10.0%; Coupling agent 2.0%;
Inhibitor 0.6%; Toughener 0.9%.
Above-mentioned HIPS PS 50% amount, graphitized carbon black, inhibitor 50% amount, Vilaterm, SBS is mixing in a stage, mediate and be prepared into the high work in-process of electric conductivity.
With above-mentioned mixing; Kneading is prepared into the high work in-process of electric conductivity and mixes with HIPS PS residual content, silane coupling agent KH-570, inhibitor residual content, inhibitor, toughener, and under 60 ℃ condition mixing 43 minutes, feeding was extruded to forcing machine; The rotating speed of feeder is 520 rev/mins; The temperature of extruding is 180 ℃～210 ℃, and the rotating speed of forcing machine is 600 rev/mins, makes a kind of non-migrating type conductive polymer master batch through cooling, pelletizing, drying again.
Embodiment 2
The non-migrating type conductive polymer master batch of IC carrier band material, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 45.0%; Graphitized carbon black 12.2%;
Vilaterm 18.4%; Inhibitor 0.8%;
SBS 20.0%; Coupling agent 1.5%;
Inhibitor 0.5%; Toughener 0.8%;
Toughner 0.8%.
Above-mentioned HIPS PS 50% amount, graphitized carbon black, inhibitor 50% amount, Vilaterm, SBS is mixing in a stage, mediate and be prepared into the high work in-process of electric conductivity.
With above-mentioned mixing; Kneading is prepared into the high work in-process of electric conductivity and mixes with HIPS PS residual content, silane coupling agent KH-570, inhibitor residual content, inhibitor, toughener, and under 60 ℃ condition mixing 43 minutes, feeding was extruded to forcing machine; The rotating speed of feeder is 520 rev/mins; The temperature of extruding is 180 ℃～210 ℃, and the rotating speed of forcing machine is 600 rev/mins, makes a kind of non-migrating type conductive polymer master batch through cooling, pelletizing, drying again.
Embodiment 3
The non-migrating type conductive polymer master batch of IC carrier band material, this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 70.0%; Graphitized carbon black 8.5%;
Vilaterm 8.0%; Inhibitor 0.8%;
SBS 10.0%; Coupling agent 0.6%;
Inhibitor 0.5%; Toughener 0.8%;
Toughner 0.8%.
Above-mentioned HIPS PS 50% amount, graphitized carbon black, inhibitor 50% amount, Vilaterm, SBS is mixing in a stage, mediate and be prepared into the high work in-process of electric conductivity.
With above-mentioned mixing; Kneading is prepared into the high work in-process of electric conductivity and mixes with HIPS PS residual content, silane coupling agent KH-570, inhibitor residual content, inhibitor, toughener, and under 60 ℃ condition mixing 43 minutes, feeding was extruded to forcing machine; The rotating speed of feeder is 520 rev/mins; The temperature of extruding is 180 ℃～210 ℃, and the rotating speed of forcing machine is 600 rev/mins, makes a kind of non-migrating type conductive polymer master batch through cooling, pelletizing, drying again.
Test Example
The product of getting present embodiment 1 carries out following characteristic measurement, and data are following:
Claims (10)
1.IC the non-migrating type conductive polymer master batch of carrier band material, it is characterized in that: this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 35.0%～85.0%; Graphitized carbon black 5.0%～35.0%;
Vilaterm 3.0%～35.0%; Inhibitor 0.1%～8.0%;
SBS 4.0% ~ 35.0%; Coupling agent 1.0% ~ 5.0%;
Other auxiliary agents 0.5% ~ 2.0%.
2. the non-migrating type conductive polymer master batch of IC carrier band material according to claim 1, it is characterized in that: this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 45.0%～75.0%; Graphitized carbon black 8.0%～20.0%;
Vilaterm 5.0%～20.0%; Inhibitor 0.2%～1.0%;
SBS 8.0% ~ 20.0%; Coupling agent 1.0% ~ 2.5%;
Other auxiliary agents 0.5% ~ 2.0%.
3. the non-migrating type conductive polymer master batch of IC carrier band material according to claim 1, it is characterized in that: this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 60.0%～70.0%; Graphitized carbon black 10.0%～15.0%;
Vilaterm 5.0%～10.0%; Inhibitor 0.2%～0.5%;
SBS 8.0% ~ 15.0%; Coupling agent 1.0% ~ 2.5%;
Other auxiliary agents 0.5% ~ 2.0%.
4. the non-migrating type conductive polymer master batch of IC carrier band material according to claim 1, it is characterized in that: this conductive agglomerate makes by the component of following prescription is mixing by weight percentage:
HIPS PS 65.0%; Graphitized carbon black 13.0%;
Vilaterm 8.0%; Inhibitor 0.5%;
SBS 10.0%; Coupling agent 2.0%;
Other auxiliary agents 1.5%.
5. according to the non-migrating type conductive polymer master batch of claim 1 or 2 or 3 or 4 described IC carrier band materials, it is characterized in that: coupling agent is selected silane coupling agent KH-570 for use.
6. according to the non-migrating type conductive polymer master batch of claim 1 or 2 or 3 or 4 described IC carrier band materials, it is characterized in that: Vilaterm adopts HDPE or LDPE.
7. according to the non-migrating type conductive polymer master batch of claim 1 or 2 or 3 or 4 described IC carrier band materials, it is characterized in that: other auxiliary agents comprise one or more in inhibitor, toughener and the toughner; Described inhibitor 0.3% ~ 1.6%, toughener 0.2% ~ 1.5%, toughner 0.2% ~ 1.5%.
8. according to the non-migrating type conductive polymer master batch of claim 1 or 2 or 3 or 4 described IC carrier band materials, it is characterized in that: inhibitor is antioxidant 1010 or inhibitor 168.
9. a method for preparing the non-migrating type conductive polymer master batch of claim 1 or 2 or 3 or 4 described IC carrier band materials is characterized in that this method comprises the steps:
1) by prescription take by weighing PS 40% ~ 60% amount, graphitized carbon black all, inhibitor 40% ~ 60% amount, Vilaterm is whole and SBS is whole;
2) above-mentioned PS, graphitized carbon black, inhibitor, Vilaterm, SBS is mixing in a stage, mediate and be prepared into the high work in-process of electric conductivity;
3) with above-mentioned mixing; Kneading is prepared into the high work in-process of electric conductivity and mixes with remaining PS, coupling agent, remaining inhibitor and other auxiliary agents, and under 55～190 ℃ condition mixing 30～50 minutes, feeding was extruded to forcing machine; The rotating speed of feeder is 450～550 rev/mins; The temperature of extruding is 180 ℃～210 ℃, and the rotating speed of forcing machine is 550～650 rev/mins, makes non-migrating type conductive polymer master batch through cooling, drying again.
10.IC carrier band material; This IC carrier band material adopts three-decker; Upper layer adopts conductive agglomerate, and the middle layer adopts insulating material it is characterized in that: described conductive agglomerate adopts the non-migrating type conductive polymer master batch of claim 1 or 2 or 3 or 4 described IC carrier band materials.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104861405A (en) * | 2015-05-11 | 2015-08-26 | 昆山恒光塑料制品有限公司 | Composite conductive master batch and production process thereof |
| CN108047624A (en) * | 2017-12-28 | 2018-05-18 | 深圳金大全科技有限公司 | A kind of HIPS carrier band new materials and its processing method |
| CN112111122A (en) * | 2020-09-17 | 2020-12-22 | 浙江三和塑料有限公司 | Decomposition-resistant PS conductive master batch |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104861405A (en) * | 2015-05-11 | 2015-08-26 | 昆山恒光塑料制品有限公司 | Composite conductive master batch and production process thereof |
| CN108047624A (en) * | 2017-12-28 | 2018-05-18 | 深圳金大全科技有限公司 | A kind of HIPS carrier band new materials and its processing method |
| CN112111122A (en) * | 2020-09-17 | 2020-12-22 | 浙江三和塑料有限公司 | Decomposition-resistant PS conductive master batch |
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Application publication date: 20120725 |