CN102592021A - Failure modes and injection simulation (FMIS) method for power module of aerial parameter processing device - Google Patents
Failure modes and injection simulation (FMIS) method for power module of aerial parameter processing device Download PDFInfo
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Abstract
Disclosed is an FMIS method for a power module of an aerial parameter processing device. The FMIS method includes steps of determining critical components of a power module of an aerial parameter processing device; determining failure modes of the critical components; performing transient circuit simulation of the power module under a normal condition; and performing transient circuit simulation of the power module under a failure condition. By means of the FMIS method for the power module of the aerial parameter processing device, the failure modes of the power module of the aerial parameter processing device are determined based on a stress simulation method and failure mode injection technology, circuit output is obtained quantitatively in the failure modes, evidence is provided for design engineers to evaluate the influence and determine the harmfulness of the failure modes, and simultaneously for the design improvement of the power module. The FMIS method for the power module of the aerial parameter processing device has good practical value and wide application prospect in the simulation technical field of product reliability.
Description
Technical field
The present invention provides a kind of FMIS method of aviation parameter treatment facility power module; Particularly relate to a kind of based on stress emulation and failure mode implantttion technique aviation parameter treatment facility power module fault and influence emulation mode, belong to product reliability emulation field.
Background technology
Along with high-speed development of science and technology, the complexity of aeronautical product improves constantly, and is also increasingly high to the requirement of reliability simultaneously.Therefore, in the product development process, fault analysis, reliability design are had higher requirement.Aviation parameter treatment facility is that the aviation flight parameter of gathering is write down, handles, measures, reports to the police, with the electronic equipment of monitoring aircraft running status.The function of power module is that extraneous supply voltage is converted into other module required voltages in the equipment, for entire equipment provides the power supply input.Power module is through draw-in groove, connector, locking strip fixed equipment cabinet both sides; In the process that aircraft is executed the task, receive temperature loading and the effect of oscillating load in-flight; It respectively forms some state may take place for components and parts, web member variation even inefficacy; This variation or inefficacy meeting exert an influence to components and parts or the parts around it, finally jeopardize the reliability and the security of whole module even equipment.
Hardware FMEA (failure mode and the impact analysis of using on the engineering at present; Failure Modes and Effect Analysis) method is analysis elements device, parts, the equipment all possible fault mode in design, manufacturing and use through system; And the reason of each fault mode and influence; Find potential weak link, propose innovative approach and design prediction scheme, thereby improve a kind of analytical approach of product reliability.The enforcement of this method depends on engineering staff's experience; Has bigger subjectivity; The engineering staff that experience is not abundant possibly can't find crucial failure mode; Of the influence of these failure modes can't be estimated accurately, thereby design Improvement Measure targetedly can not be proposed its same level, a high level and final level.
FMIS (failure mode inject emulation, Failure Modes and Injection Simulation) is the failure mode utilizing stress and failure mode to inject method that emulation combines to obtain can to take place under product actual environment and the condition of work, quantitatively confirms the method that circuit is exported under these fault modes.FMIS mainly comprises the technology or the method for stress emulation and two keys of failure mode injection.The stress emulation mode is meant utilizes commercial numerical simulation software; For example ANSYS, Flotherm, Nastran utilize method of computer simulation to obtain the response of equipment to these load with on temperature that equipment bore, the digital model that oscillating load is applied to product.The failure mode implantttion technique is to utilize EDA (electric design automation; Electronic Design Automation) software; The failure mode circuit model is injected in the normal circuit simulation model, obtains circuit each several part and final output electric property ability situation under this failure mode.Eda software commonly used comprises Pspice, Cadence, Cyber etc.The FMIS method is the quantitative householder method of carrying out FMEA.Through the new and retrieval to looking into of prior art, the report that does not also utilize the FMIS method to carry out the FMEA aspect research of aviation parameter treatment facility power module and use both at home and abroad.
Summary of the invention
1, purpose: the objective of the invention is to deficiency to prior art; A kind of FMIS method of aviation parameter treatment facility power module is provided; It is based on the stress emulation mode and the failure mode implantttion technique is confirmed the power module failure mode; And quantitatively obtain under this failure mode circuit output, for the designer assess failure mode influence, confirm that its harmfulness provides foundation, also foundation is provided simultaneously for the design improvement of power module.
2, technical scheme: the present invention realizes through following technical scheme; Confirm the critical component of power module; Confirm the potential failure mode of critical component, the circuit output under the emulation power module normal condition, the circuit output of emulation power module under failure state.
The FMIS method of a kind of aviation parameter of the present invention treatment facility power module, its concrete steps are following:
Step 1: confirm the critical component on the aviation parameter treatment facility power module (hereinafter to be referred as " power module ").Mainly comprise:
A. at first to obtain the stress distribution of power module under temperature, oscillating load.Detailed process is following:
1) confirms worst temperature and vibration environment in the power module task process.Mainly comprise:
1. if provided the operating temperature range and the vibration acceleration power spectrum density section of power module in the designing requirement of power module; Then select high temperature in the temperature range as worst temperature environment; Select in the given vibration acceleration power spectrum density section; Maximum one of vibration acceleration power spectrum metric if only provide a vibration acceleration power spectrum density section, then confirms as the most abominable vibration environment with this section as the most abominable vibration environment.
2. if do not provide the operating temperature range and the vibration acceleration power spectrum density section of power module in the power module designing requirement, confirm worst temperature and vibration environment according to national standard " GBT2423.43-2008 electric and electronic product environmental test ".
2) power module is carried out the emulation of Flotherm Temperature Distribution.Flotherm is a kind of commercial finite integral software of maturation, and major function is to carry out temperature simulation.Mainly comprise:
A) three-dimensional CAD (computer-aided design (CAD), the Computer Aided Design) model of importing power module.At first will set up good power module three-dimensional CAD model and pass through intermediate form; Import in the Flotherm software like forms such as IGES, SAT, STEP; This three-dimensional CAD model has been described the structure of power module and has been formed, assembled annexation; Comprise that power module and power consumption surpass the geometry of the components and parts of 0.1W, need not set up the geometry of components and parts pad.
B) the definition power module is formed the Temperature Distribution artificial material parameter of each several part.Mainly comprise: the specific heat capacity of each composition material, coefficient of heat conductivity.
C) the power module model is carried out grid dividing.Utilize Flotherm software to carry out automatic mesh and divide, the grid length breadth ratio should be controlled in 20.
D) apply temperature loading and boundary condition.Temperature loading mainly comprises the reality of work power consumption of rugged surrounding temperature and components and parts, utilizes the temperature of Flotherm to apply order, with 1) in the severe temperature environment condition confirmed be applied in the power module model.With the actual power loss of components and parts surface area divided by components and parts, obtain the face heat flow density, utilize the heat flow density of Flotherm to apply order, be input in the Flotherm software.Utilize the Flotherm temperature boundary that order is set, the NATURAL CONVECTION COEFFICIENT OF HEAT of components and parts and air phase-contact surface is set.
E) implement Temperature Distribution emulation.Utilize the order of finding the solution of Flotherm to carry out the Temperature Distribution emulation of this power module under severe temperatures condition, finally can obtain the power module each several part, the Temperature Distribution of each location point.
3) power module is carried out ANSYS vibration stress distributed simulation.ANSYS is a kind of commercial finite element emulation software of maturation, can carry out power spectrum density emulation.Mainly comprise:
A) three-dimensional CAD model of importing power module.At first will set up good power module three-dimensional CAD model and pass through intermediate form; Import in the ANSYS software like forms such as IGS, STEP; This three-dimensional CAD model has been described the structure of power module and has been formed, assembled annexation; Comprised power module and weight geometry, need not set up the geometry of components and parts pad greater than the components and parts of 0.1 gram.
B) the definition power module is formed the vibration stress artificial material parameter of each several part.Mainly comprise: the density of each composition material, elastic modulus, Poisson ratio.
C) the power module model is carried out grid dividing.Utilize ANSYS software to carry out automatic mesh and divide, the grid length breadth ratio should be controlled in 5.
D) apply vibration acceleration power spectrum density and boundary condition.Mainly comprise; Utilize the acceleration power spectral density of ANSYS to apply order; With 1) in the most abominable vibration acceleration power spectrum metric and the frequency value corresponding thereof confirmed be input in the ANSYS software; And be applied to the position, fixed position of power module, apply the installation direction of direction perpendicular to power module.Utilize the displacement boundary of ANSYS to apply order, position, power module fixed position is applied the null displacement constraint of X, Y, three directions of Z.
E) implement vibration stress emulation.The vibration damping value of power module is set, according to the general quantity of selecting between 0.03 to 0.05 of engineering experience.Utilize the order of finding the solution of ANSYS to carry out the stress emulation of this power module under the most abominable vibration condition, find the solution the response that can obtain each position of power module after the end, comprise displacement, speed and acceleration-root-mean square.
B. components and parts, the parts of high temperature, high vibratory response are confirmed as critical component.
For discrete devices such as IC chip, diode, transistors, if the quality grade of chip is a technical grade, then when emulation obtained its surface temperature above 85 ℃, this integrated circuit was a critical component; If the chip quality grade is army's grade, then when emulation obtained its surface temperature above 100 ℃, this integrated circuit was a critical component; For components and parts such as resistor, capacitors, if it is a surface mount with the connected mode of circuit board, then when emulation obtained its surface temperature above 90 ℃, these components and parts were decided to be critical component.
Components and parts, parts that the peaked position of displacement, acceleration-root-mean square that equipment is obtained in vibration emulation belongs to are decided to be critical component.
Step 2: the failure mode of confirming critical component.According under tabulate 1, the corresponding relation of the load of electronic product and failure mode and failure cause utilizes on the power module that obtains in the step 1 key components and the suffered load type of parts to confirm the failure mode that it is possible.
Load that table 1 electronic product receives and failure mode and failure cause corresponding relation
Step 3: carry out the transient circuit emulation of power module under normal condition.Mainly comprise:
A. set up the Pspice circuit model of power module under the normal condition.At first set up the model of each components and parts of forming power module.Circuit model for components and parts such as resistor, capacitor, inductor, part diode, part transistors can be selected universal model in the model bank of Pspice, revise relevant parameter in the universal model according to the actual parameter of components and parts.For devices such as IC chip and part diode, transistors,, can arrive the corresponding model of page download of components and parts manufacturer if can't find the model of corresponding model in the Pspice model bank.After the components and parts model is built up,, each components and parts input/output terminal is coupled together, form the Pspice circuit model of power module according to the circuit function relation.
B. circuit under the normal condition is carried out transient state emulation.The voltage that input is extraneous to offer power circuit is curve over time; Start the emulation of Pspice circuit transient state; Obtain the input and output electrical quantity and the final output of circuit of each components and parts in the circuit under the normal condition, for example voltage, electric current curve over time.
Step 4: carry out the transient circuit emulation of power module under failure state, mainly comprise:
A. failure mode is injected.The failure mode of the key components that step 1 is definite is injected in the power module Pspice circuit model of setting up in the step 3 (a), forms the circuit model under the failure state.Shown in the following tabulation 2 of failure of elements pattern method for implanting.
The method for implanting of table 2 component invalidation mode
B. the circuit under the failure state is carried out transient state emulation.The voltage that input is extraneous to offer power circuit is curve over time; Start the emulation of Pspice circuit transient state; Obtain the input and output electrical quantity and the final output of circuit of each components and parts in the circuit under the failure state, for example voltage, electric current curve over time.
In sum; Technical thought of the present invention is: the critical component of at first confirming power module according to the result of stress emulation; Utilize the corresponding relation of load and failure mode to confirm the failure mode of critical component, set up the Pspice circuit model of power module; Obtain the circuit output under the power module normal condition through carrying out the emulation of circuit transient state; Set up the Pspice circuit model under the power module failure state, obtain the circuit output under the power module failure state through carrying out the emulation of circuit transient state.Can find out; FMIS method based on the aviation parameter treatment facility power module of stress emulation and failure mode implantttion technique; Can obtain the contingent failure mode of power module at the commitment of design and be somebody's turn to do circuit output state under the inefficacy; Thereby help the influence that the designer assesses this failure mode, take design Improvement Measure targetedly, avoid the generation of losing efficacy.
3, advantage and effect: the present invention has the following advantages:
1. utilize the stress emulation mode to confirm the critical component of power module.The power module critical component can rely on experience or confirm through development test in kind.Usually adopt empirical method in the design phase, adopt test method at the principle prototype Qualify Phase.When the designer lacked experience, the Primary Component of confirming in the design phase was often inaccurate.And adopt test method to need long test period and change in design time at Qualify Phase.Utilize the stress emulation mode to provide equipment quantitative stress distribution situation for the slip-stick artist in the design phase, the locator key parts are comparatively accurate, and can practice thrift experimentation cost, shorten the equipment R&D cycle.
2. utilize the failure mode implantttion technique to obtain the output under the power module failure state.The failure of elements pattern has short circuit, open circuit, three kinds of situation of parameter drift usually.For short circuit, these two kinds of patterns of opening a way, the designer can be relatively easy to confirm its influence to peripheral devices and power module.But for parameter drift, different drift values can cause the Different Effects to power module, only rely on to analyze qualitatively to be difficult to provide accurately its influence.The method that the failure mode implantttion technique provides a kind of quantitative emulation power module under failure state, to export, the designer can contrast the output under normal and the failure state, describes the influence of this failure mode accurately.
Description of drawings
Fig. 1 is the inventive method FB(flow block).
Fig. 2 is that embodiment of the invention power module structure is formed synoptic diagram.
Fig. 3 is the Pspice model synoptic diagram of embodiment of the invention power module.
Fig. 4 is the two-way voltage output synoptic diagram under the embodiment of the invention power module normal condition.
Fig. 5 is the Pspice model synoptic diagram of embodiment of the invention power module after injecting resistance R 12 short circuits.
Fig. 6 is the Pspice model synoptic diagram of embodiment of the invention power module after injecting resistance R 12 parameter drifts.
Fig. 7 is the two-way voltage output synoptic diagram of embodiment of the invention power module under resistance R 12 short-circuit conditions.
Fig. 8 is the two-way voltage output synoptic diagram of embodiment of the invention power module under resistance R 12 parameter drift states.
Symbol description is following among the figure:
Pspice among Fig. 1 is a kind of commercial electronic design automation software commonly used.
LM193 among Fig. 3,5,6 is the model of operational amplifier, belongs to IC-components.
Out1 among Fig. 4,7,8 is the 1 tunnel output, or is called output 1; Out2 is the 2 tunnel output, or is called output 2.
Embodiment
To combine accompanying drawing and embodiment that the present invention is done further detailed description below.
Following examples are to implement according to flow process as shown in Figure 1, mainly comprise the transient circuit emulation under the critical component of confirming power module, the potential failure mode of confirming critical component, the power module normal condition, the transient circuit emulation under the power module failure state.The structure of power module is formed as shown in Figure 2.Mainly comprise circuit board, plastic packaged integrated circuit chip, ceramic integrated circuit chip, patch resistor, plug-in mounting resistor, capacitor.
See Fig. 1, the FMIS method of a kind of aviation parameter of the present invention treatment facility power module, these method concrete steps are following:
Step 1: confirm the critical component on the aviation parameter treatment facility power module (hereinafter to be referred as " power module ").Mainly comprise:
B. components and parts, the parts of high temperature, high vibratory response are confirmed as critical component.
According to the high-temperature device of confirming among " a kind of aviation parameter treatment facility reliability weak link is confirmed method " embodiment, wherein U4 and R12 are positioned at power module.U4 is the IC chip of army's grade, and the shell temperature has surpassed 100 ℃; R12 is army's grade surface-mount resistor, and the shell temperature has surpassed 90 ℃.Therefore confirm that U4, R12 are the key components under the hot conditions.
Under vibration condition, aviation parameter treatment facility reliability weak link is on CPU module and AD modular converter, and there is not the weak link of vibration reliability in power module, does not have the critical component under the vibration condition yet.
Step 2: the failure mode of confirming critical component.According to table 1, the corresponding relation of the load of electronic product and failure mode and failure cause utilizes on the power module that obtains in the step 1 key components and the suffered load type of parts to confirm the failure mode that it is possible.Critical component in the present embodiment power module and failure mode thereof, failure cause are tabulated shown in 3 as follows.
The failure mode of the critical component on table 3 power module
Step 3: carry out the transient circuit emulation of power module under normal condition, mainly comprise:
A. set up the Pspice circuit model of power module.Each components and parts on the power module, comprise resistor, capacitor, circuit model be in the model bank of Pspice, to call universal model, revise the resistance of resistor in the universal model and the appearance value of capacitor then.The model of IC chip also directly provides in the Pspice model bank.After the components and parts model is built up,, each components and parts input/output terminal is coupled together, form the Pspice circuit model of power module according to the circuit function relation.As shown in Figure 3.
B. circuit under the normal condition is carried out transient state emulation.The extraneous voltage that offers power circuit of input, direct current 27V starts the emulation of Pspice circuit transient state, obtains the input and output electrical quantity and the final output of circuit of each components and parts in the circuit under the normal condition.Like Fig. 4 is the two-way voltage output under the power module normal condition.
Step 4: carry out the transient circuit emulation of power module under failure state, mainly comprise:
A. failure mode is injected.The failure mode of the key components that step 1 is definite is injected in the power module Pspice circuit model of setting up in the step 3 (a), forms the circuit model under the failure state.Shown in the following tabulation 4 of the failure mode Pspice model of U4 and R12 and method for implanting thereof.
The method for implanting of table 4U4 and R12 failure mode
Be illustrated in figure 5 as the Pspice model of power module after injecting resistance R 12 short circuits, wherein circular position is the model of R12 short trouble.Fig. 6 is the Pspice model of power module after injecting resistance R 12 parameter drifts, and oval position is the model of R12 parameter drift fault.
B. the circuit under the failure state is carried out transient state emulation.The extraneous voltage that offers power circuit of input, direct current 27V starts the emulation of Pspice circuit transient state, obtains the input and output electrical quantity and the final output of circuit of each components and parts in the circuit under U4, the R12 failure mode existence.Like Fig. 7 is the two-way voltage output of power module under resistance R 12 short-circuit conditions.It is thus clear that after R12 resistive short in the power module, Out1 output perseverance is a high level, output error when Out2 is 17～32V at input voltage.Like Fig. 8 is the two-way voltage output of power module under resistance R 12 parameter drift states.Thus it is clear that,, output is not had influence when the resistance of R12 in the power module during by 6.2 kilo-ohms of parameter drifts to 6.25 kilo-ohm.
Through aviation parameter treatment facility power module is carried out FMIS; Can help the engineering staff to confirm crucial failure of elements pattern and failure effect thereof on the power module in the initial stage of design; Take means to avoid behind the component failure thereby help the designer to power module, so the harm that causes of entire equipment.
The present invention has set up based on the aviation parameter treatment facility power module fault of stress emulation and failure mode implantttion technique and has influenced emulation mode.Utilize this method, can carry out stress emulation and failure mode to the power module of aviation parameter treatment facility and inject, in the critical failure and the influence thereof of quick positioning equipment of design phase, avoiding losing efficacy works the mischief to equipment.
Claims (2)
1. the FMIS method of an aviation parameter treatment facility power module, it is characterized in that: these method concrete steps are following:
Step 1: confirm the critical component on the aviation parameter treatment facility power module: comprising:
A. at first to obtain the stress distribution of power module under temperature, oscillating load; Detailed process is following:
1) confirms worst temperature and vibration environment in the power module task process; Comprise:
1. if provided the operating temperature range and the vibration acceleration power spectrum density section of power module in the designing requirement of power module; Then select high temperature in the temperature range as worst temperature environment; Select in the given vibration acceleration power spectrum density section; Maximum one of vibration acceleration power spectrum metric if only provide a vibration acceleration power spectrum density section, then confirms as the most abominable vibration environment with this section as the most abominable vibration environment;
2. if do not provide the operating temperature range and the vibration acceleration power spectrum density section of power module in the power module designing requirement, confirm worst temperature and vibration environment according to national standard " GBT2423.43-2008 electric and electronic product environmental test ";
2) power module is carried out the emulation of Flotherm Temperature Distribution; Flotherm is a kind of finite integral software, and its function is to carry out temperature simulation; Comprise:
A) three-dimensional CAD model of importing power module; At first will set up good power module three-dimensional CAD model and pass through intermediate form; Import in the Flotherm software like IGES, SAT, STEP form; This three-dimensional CAD model has been described the structure of power module and has been formed, assembled annexation; Comprise that power module and power consumption surpass the geometry of the components and parts of 0.1W, need not set up the geometry of components and parts pad;
B) the definition power module is formed the Temperature Distribution artificial material parameter of each several part; Comprise: the specific heat capacity of each composition material, coefficient of heat conductivity;
C) the power module model is carried out grid dividing; Utilize Flotherm software to carry out automatic mesh and divide, the grid length breadth ratio is controlled in 20;
D) apply temperature loading and boundary condition; Temperature loading mainly comprises the reality of work power consumption of rugged surrounding temperature and components and parts, utilizes the temperature of Flotherm to apply order, with 1) in the severe temperature environment condition confirmed be applied in the power module model; With the actual power loss of components and parts surface area divided by components and parts, obtain the face heat flow density, utilize the heat flow density of Flotherm to apply order, be input in the Flotherm software; Utilize the Flotherm temperature boundary that order is set, the NATURAL CONVECTION COEFFICIENT OF HEAT of components and parts and air phase-contact surface is set;
E) implement Temperature Distribution emulation; Utilize the order of finding the solution of Flotherm to carry out the Temperature Distribution emulation of this power module under severe temperatures condition, finally obtain the power module each several part, the Temperature Distribution of each location point;
3) power module is carried out ANSYS vibration stress distributed simulation; ANSYS is a kind of finite element emulation software, can carry out power spectrum density emulation; Comprise:
A) three-dimensional CAD model of importing power module; At first will set up good power module three-dimensional CAD model and pass through intermediate form; Import in the ANSYS software like IGS, STEP form; This three-dimensional CAD model has been described the structure of power module and has been formed, assembled annexation; Comprised power module and weight geometry, need not set up the geometry of components and parts pad greater than the components and parts of 0.1 gram;
B) the definition power module is formed the vibration stress artificial material parameter of each several part; Comprise: the density of each composition material, elastic modulus, Poisson ratio;
C) the power module model is carried out grid dividing; Utilize ANSYS software to carry out automatic mesh and divide, the grid length breadth ratio is controlled in 5;
D) apply vibration acceleration power spectrum density and boundary condition; Comprise; Utilize the acceleration power spectral density of ANSYS to apply order; With 1) in the most abominable vibration acceleration power spectrum metric and the frequency value corresponding thereof confirmed be input in the ANSYS software; And be applied to the position, fixed position of power module, apply the installation direction of direction perpendicular to power module; Utilize the displacement boundary of ANSYS to apply order, position, power module fixed position is applied the null displacement constraint of X, Y, three directions of Z;
E) implement vibration stress emulation; The vibration damping value of power module is set, selects the quantity between 0.03 to 0.05 according to engineering experience; Utilize the order of finding the solution of ANSYS to carry out the stress emulation of this power module under the most abominable vibration condition, find the solution and finish the response that the back obtains each position of power module, comprise displacement, speed and acceleration-root-mean square;
B. components and parts, the parts of high temperature, high vibratory response are confirmed as critical component;
For IC chip, diode, transistor discrete device, if the quality grade of chip is a technical grade, then when emulation obtained its surface temperature above 85 ℃, this integrated circuit was a critical component; If the chip quality grade is army's grade, then when emulation obtained its surface temperature above 100 ℃, this integrated circuit was a critical component; For resistor, capacitor components and parts, if it is a surface mount with the connected mode of circuit board, then when emulation obtained its surface temperature above 90 ℃, these components and parts were decided to be critical component;
Components and parts, parts that the peaked position of displacement, acceleration-root-mean square that equipment is obtained in vibration emulation belongs to are decided to be critical component;
Step 2: the failure mode of confirming critical component; According under tabulate 1, the corresponding relation of the load of electronic product and failure mode and failure cause utilizes on the power module that obtains in the step 1 key components and the suffered load type of parts to confirm the failure mode that it is possible;
Load that table 1 electronic product receives and failure mode and failure cause corresponding relation
Step 3: carry out the transient circuit emulation of power module under normal condition; Comprise:
A. set up the Pspice circuit model of power module under the normal condition; At first set up the model of each components and parts of forming power module; Circuit model for resistor, capacitor, inductor, diode, transistor components and parts is selected universal model in the model bank of Pspice, revise relevant parameter in the universal model according to the actual parameter of components and parts; For IC chip and diode, transistor device, if can't find the model of corresponding model in the Pspice model bank, to the corresponding model of page download of components and parts manufacturer; After the components and parts model is built up,, each components and parts input/output terminal is coupled together, form the Pspice circuit model of power module according to the circuit function relation;
B. circuit under the normal condition is carried out transient state emulation; The voltage that input is extraneous to offer power circuit is curve over time; Start the emulation of Pspice circuit transient state; Obtain the input and output electrical quantity and the final output of circuit of each components and parts in the circuit under the normal condition, for example voltage, electric current curve over time;
Step 4: carry out the transient circuit emulation of power module under failure state; Comprise:
A. failure mode is injected; The failure mode of the key components that step 1 is definite is injected in the power module Pspice circuit model of setting up in the step 3 (a), forms the circuit model under the failure state; Shown in the following tabulation 2 of failure of elements pattern method for implanting;
The method for implanting of table 2 component invalidation mode
B. the circuit under the failure state is carried out transient state emulation; The voltage that input is extraneous to offer power circuit is curve over time; Start the emulation of Pspice circuit transient state; Obtain the input and output electrical quantity and the final output of circuit of each components and parts in the circuit under the failure state, for example voltage, electric current curve over time.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100036146A CN102592021B (en) | 2012-01-06 | 2012-01-06 | Failure modes and injection simulation (FMIS) method for power module of aerial parameter processing device |
| PCT/CN2012/000063 WO2013102282A1 (en) | 2012-01-06 | 2012-01-13 | Fmis method for power supply module of aviation parameter processing device |
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| CN2012100036146A CN102592021B (en) | 2012-01-06 | 2012-01-06 | Failure modes and injection simulation (FMIS) method for power module of aerial parameter processing device |
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| WO (1) | WO2013102282A1 (en) |
Cited By (12)
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| CN103488842A (en) * | 2013-09-29 | 2014-01-01 | 北京航空航天大学 | Method for automatically predicting reliability of typical discrete devices based on Saber |
| CN103514330A (en) * | 2013-10-08 | 2014-01-15 | 工业和信息化部电子第五研究所 | Method and system for constructing failure analysis process in component failure analysis expert system |
| CN104020404A (en) * | 2013-08-26 | 2014-09-03 | 北京航空航天大学 | Construction method for optical coupler low-frequency noise equivalent circuit comprising internal defect |
| CN105528943A (en) * | 2015-07-06 | 2016-04-27 | 中国电子科技集团公司第二十八研究所 | Design and implementation method of education and training system based on circuit simulation technology |
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| CN104020404A (en) * | 2013-08-26 | 2014-09-03 | 北京航空航天大学 | Construction method for optical coupler low-frequency noise equivalent circuit comprising internal defect |
| CN104020404B (en) * | 2013-08-26 | 2017-05-10 | 北京航空航天大学 | Construction method for optical coupler low-frequency noise equivalent circuit comprising internal defect |
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| CN103488842A (en) * | 2013-09-29 | 2014-01-01 | 北京航空航天大学 | Method for automatically predicting reliability of typical discrete devices based on Saber |
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| CN105528943A (en) * | 2015-07-06 | 2016-04-27 | 中国电子科技集团公司第二十八研究所 | Design and implementation method of education and training system based on circuit simulation technology |
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| CN109492282A (en) * | 2018-10-29 | 2019-03-19 | 北京遥感设备研究所 | A kind of DC/DC power module life assessment Primary Component determines method |
| CN110823561A (en) * | 2019-11-13 | 2020-02-21 | 南京工业大学 | Method for monitoring fatigue life of key part of rolling mill transmission shaft system under unsteady state load in real time based on material model library |
| CN110823561B (en) * | 2019-11-13 | 2021-03-26 | 南京工业大学 | Method for monitoring fatigue life of key part of rolling mill transmission shaft system under unsteady state load in real time based on material model library |
| CN113901685A (en) * | 2021-09-27 | 2022-01-07 | 北京航空航天大学 | Method for determining weak link of DC-DC power supply module based on FSR method |
| CN113901685B (en) * | 2021-09-27 | 2024-10-01 | 北京航空航天大学 | Method for determining weak link of DC-DC power supply module based on FSR method |
| CN115308978A (en) * | 2022-08-05 | 2022-11-08 | 郑州森鹏电子技术股份有限公司 | Design method for heating and defrosting function of vehicle-mounted camera |
| CN115308978B (en) * | 2022-08-05 | 2024-05-28 | 郑州森鹏电子技术股份有限公司 | Design method for heating and defrosting functions of vehicle-mounted camera |
| CN116930725A (en) * | 2023-09-15 | 2023-10-24 | 中国船舶集团有限公司第七一九研究所 | Marine circuit board card service life test and evaluation method and system |
| CN116930725B (en) * | 2023-09-15 | 2023-12-26 | 中国船舶集团有限公司第七一九研究所 | Marine circuit board card service life test and evaluation method and system |
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| CN102592021B (en) | 2013-08-14 |
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