CN112257303B - Temperature stabilization time testing method based on thermal simulation model - Google Patents
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Abstract
The invention relates to a method for testing temperature stabilization time of a thermal simulation model, and belongs to the fields of environmental tests and reliability tests. Firstly, a physical model of a product is established according to a design file of the product, the physical model is imported into thermal simulation software to establish the thermal simulation model of the product, after relevant parameters and boundary conditions are set, a temperature distribution cloud picture of the product is calculated, a temperature maximum hysteresis effect point of the product is determined, marking is carried out according to the position of the maximum hysteresis effect point, and finally, the time when the point reaches the expected environmental temperature is calculated through a transient calculation function, namely the temperature stabilizing time. The invention can rapidly and accurately test the temperature stabilization time of the product in high and low temperature environments.
Description
Technical Field
The invention provides a temperature stabilization time testing method based on a thermal simulation model, relates to the realization of a temperature stabilization time testing technology based on the thermal simulation model, and belongs to the fields of environmental tests and reliability tests.
Background
Temperature testing is one of the requisite test items for products in acceptance, identification, routine testing. The temperature test comprises test items such as high and low temperature storage, high and low temperature work, temperature circulation, temperature impact and the like. The severity of these test items depends to a large extent on the magnitude or range of temperature and the time or number of cycles the temperature is applied to the product under test. Temperature magnitude, temperature variation range and cycle number are all explicitly required in the test standard or in the test outline, however, the magnitude of the temperature stabilization time is often an uncertainty factor. The temperature stabilization time is taken as one of the indispensable conditions for the temperature test, and the development of the temperature stabilization test work plays a very critical role in ensuring the test reproducibility and improving the test reliability.
In recent years, with the spanned development of science and technology, the speed of updating weaponry is increasingly faster, and the delivery schedule is increasingly tense. In order to meet the delivery schedule, in the actual implementation process of a temperature test, a tester selects a temperature stabilization time to have the phenomenon of 'brainwave beating', so that on one hand, a concept of temperature stabilization is not understood, and the concepts of product temperature stabilization and temperature stabilization in test equipment are often confused, and products with different weights or sizes are tested according to a certain heat preservation time; in actual operation, on the other hand, in order to meet the progress requirement, the actual measurement or calculation is rarely performed on the time for the product to reach the temperature stabilization, but the heat preservation time is determined according to the test experience of similar products. The temperature stabilization time chosen is objectively inadequate in most cases.
In the temperature test, the product is always required to be preheated due to the structural characteristics of the product, so that the temperature inside and outside the product are stable at the same time, and the situation of half-life and half-ripeness is avoided. Wherein the "preheat" time is referred to as the temperature stabilization time, at GJB150.1A, "military equipment environmental test method section 1: the general requirements are clearly defined in chapter 3.5 of the test temperature stability. And (3) stabilizing the temperature of the test piece, wherein the time required for the maximum hysteresis effect functional component to reach the temperature stabilization is the temperature stabilization time when the temperature change rate of the functional component with the maximum temperature hysteresis effect in the test piece is not more than 2.0 ℃/h, except for the other provision.
The existing temperature stability time test method can be divided into two types, one is calculated by referring to the weight method in GJB 4-1983, namely, the environmental test of ship electronic equipment, the temperature stability time under each interval is defined according to different weight intervals, but the method is not applicable to products with complex structures, small weights and various components, and the calculated temperature stability time is inaccurate, so that the phenomena of over-test and under-test of the products are most likely to occur; another method is based on the measured direct measurement method, which is to arrange temperature sensors on key functional components of the product and perform temperature test according to actual environmental conditions, and compare and analyze to obtain the temperature stabilization time of the product after collecting the measured data of each sensor.
Disclosure of Invention
Technical problem to be solved
The existing temperature stabilization time testing method is widely applied to a weight method, but because equipment has a complicated and integrated development trend, the heat preservation time is completely determined according to the weight method, and the test time is insufficient or overlong. If the test time is insufficient, the product is not hot or cold, so that the undertest is caused, and the environmental adaptability and the reliability of the product in the identification test are reduced; if the time is too long, namely the time required for temperature stabilization is exceeded, the test time is unnecessarily prolonged, and resources are wasted. Meanwhile, if the temperature stabilization time test method based on actual measurement is adopted, the method is not easy to implement, and the test period and the test cost are seriously affected. In order to rapidly calculate the accurate heat preservation time of a product temperature test without increasing more test cost, the invention provides a temperature stabilization time test method based on a thermal simulation model, which aims to solve the problems of inaccurate temperature stabilization time calculation, long period of an actual measurement method and high cost of the existing weight method.
Technical proposal
A temperature stabilization time test method based on a thermal simulation model is characterized by comprising the following steps:
step 1: referring to a product design scheme, establishing an original 3D geometric model or CAD model of the product, and primarily simplifying an original geometric structure outside the product to obtain a primarily simplified physical model;
step 2: the model after preliminary simplification is imported into Flothem or Icepak simulation software, a compact modeling method is adopted to model components in the product, partial details are omitted or deleted on the premise that the heat dissipation area of the product and the structure related to the heat dissipation performance of the product are not changed, and a thermal simulation model after secondary simplification is established;
step 3: dividing the established model by adopting an unstructured grid dividing method, and checking and adjusting the grid unit dividing effect until the two parameters of the alignment rate and the distortion ratio of the grid model meet the model requirement;
step 4: setting initial input parameters, boundary conditions and solving control parameters of a thermal simulation model in Flotherm or Icepak simulation software, and calculating and solving to obtain a thermal simulation calculated temperature cloud image and a monitoring point record of a product;
step 5: determining a functional component corresponding to a maximum hysteresis effect point of a product in a high-temperature or low-temperature environment according to a temperature cloud image and a monitoring point record obtained by the thermal simulation model;
step 6: the functional component is marked as a test point, the ambient temperature is set, and the time required for the point to reach the maximum hysteresis function functional component to reach the preset ambient temperature, namely the temperature stabilization time, is calculated through a transient calculation function in software.
The preliminary simplification of the original geometry outside the product described in step 1 is specifically to simplify or eliminate some geometric structural features or detail parts existing on the outer surface of the product, where the geometric structural features or detail parts are: boss, rounding, chamfering, counter bore, groove, stud and chamfering.
In the step 4, if the set environmental temperature condition is high temperature, the functional component at the position of the lowest temperature point in the temperature cloud chart and the monitoring point record is the maximum hysteresis effect point in the high temperature environment; otherwise, when the set environmental temperature condition is low temperature, the functional part at the position of the highest temperature point in the temperature cloud chart and the monitoring point record is the maximum hysteresis effect point in the low temperature environment.
Advantageous effects
The invention provides a temperature stabilization time testing method based on a thermal simulation model, which is characterized in that a thermal simulation technology is utilized, a physical model after product simplification is firstly established according to a design file of a product, the physical model is imported into thermal simulation software, the thermal simulation model is produced and subjected to secondary simplification, after relevant parameters and boundary conditions are set, a product temperature distribution cloud chart is calculated, a temperature maximum hysteresis effect point of the product is determined, and finally, the temperature stabilization time of the product is rapidly and accurately calculated by utilizing transient functions in the thermal simulation software.
The method solves the problem that the temperature stabilization time of the product cannot be calculated rapidly and accurately in an actual environment test, can help a tester to determine the temperature stabilization time required by the temperature test rapidly, ensures the accuracy of a calculation result, can calculate more accurate temperature stabilization time compared with a traditional weight method, is easier to operate compared with an actual measurement method, improves the reliability of the test result, obviously reduces the test cost, shortens the test period, and has higher practical application value.
Drawings
Fig. 1 is a physical model of a product after preliminary simplification.
Fig. 2 is a secondarily simplified thermal simulation model.
Fig. 3 is a background grid setting interface.
Fig. 4 is a grid encryption parameter setting interface.
FIG. 5 is a grid-partitioned thermal simulation model.
Fig. 6 is a boundary condition and parameter setting interface.
Fig. 7 is a diagram of a simulation result convergence function.
Fig. 8 is a temperature distribution cloud of the product.
FIG. 9 is a flow chart of the present invention
Detailed Description
The invention will now be further described with reference to examples, figures:
the invention provides a construction method of a temperature stability time test technology based on a thermal simulation model. The technology constructed by the method can rapidly calculate the accurate temperature stabilization time of the product in the temperature stabilization time test. In the technology, a physical model of a product is firstly established according to a design file of the product and is subjected to necessary simplification, then the physical model is imported into thermal simulation software, the thermal simulation model is obtained after secondary simplification, after relevant parameters and boundary condition setting are completed, a temperature distribution cloud picture of the product is calculated, so that a maximum hysteresis effect point is determined, and finally the temperature stabilization time of the product is calculated by utilizing a transient function according to the maximum hysteresis effect point effect. The technology can rapidly and accurately calculate the temperature stabilizing time of the product and shorten the test period. As shown in fig. 9, the specific procedure is as follows:
step 1, consulting a product design scheme, establishing an original 3D geometric model or CAD model of the product, and primarily simplifying an original geometric structure outside the product to obtain a primarily simplified physical model;
step 2, importing the primarily simplified model into Flothem or Icepak simulation software, modeling components in the product by adopting a compact modeling method, omitting or deleting part of details on the premise of not changing the heat dissipation area of the product and the structure related to the heat dissipation performance of the product, and establishing a secondarily simplified thermal simulation model;
step 3, dividing the established model by adopting an unstructured grid dividing method, and checking and adjusting the grid unit dividing effect until the two parameters of the alignment rate and the distortion ratio of the grid model meet the model requirement;
step 4, setting initial input parameters, boundary conditions and solving control parameters of a thermal simulation model in Flotherm or Icepak simulation software, and calculating and solving to obtain a thermal simulation calculated temperature cloud image and a monitoring point record of the product;
step 5, determining a maximum hysteresis effect point (functional component) of the product in a high-temperature (low-temperature) environment according to a temperature cloud image and a monitoring point record obtained by the thermal simulation model;
and 6, marking the element (functional component) as a test point, setting the ambient temperature, and calculating the time required for the maximum hysteresis effect functional component to reach the preset ambient temperature, namely the temperature stabilizing time, through a transient calculation function in software.
In the step 1, referring to the product design scheme, an original 3D geometric model or CAD model of the product is built, and the original geometric structure outside the product is primarily simplified to obtain a primarily simplified physical model, which is as follows:
the method for consulting the product design scheme is as follows: acquiring a product design file required to be subjected to temperature stabilization time test;
the method for establishing the original 3D geometric model or CAD model of the product is as follows: the modeling software commonly used at present comprises Pro E, solid works and the like, the physical model established through the software can be directly imported into the simulation software through a reserved interface in the simulation software, and proper modeling software is selected to establish an original 3D geometric model of the product according to the geometric shape and internal structural characteristics of the product in the product design file;
the method for primarily simplifying the original geometric structure outside the product and obtaining the primarily simplified physical model is as follows: when the geometric shape and the internal structure of the product are complex, the original geometric model structure of the product is built through modeling software such as Pro E, solid works and the like, the geometric model needs to be initially simplified for the later calculation of building a thermal simulation model by adopting a finite element volume method based on Flotherm simulation software or based on Icepak simulation software, the simplified standard is that the deleted detail features are not main factors influencing the heat radiation performance of the product, and some geometric structure features or detail parts existing on the outer surface of the product are generally simplified or removed, such as details with small influence on the whole temperature field of the product, such as bosses, rounding, chamfer angles, counter bores, grooves, studs, chamfer angles and the like, which exist outside, so that the physical model of the product after the initial simplification or deletion is completed is obtained.
The method comprises the following steps of (1) introducing a primarily simplified model into Flothem or Icepak simulation software, modeling components and the like in a product by adopting a compact modeling method, omitting or deleting part of details on the premise of not changing the heat dissipation area of the product and the structure related to the heat dissipation performance of the product, and establishing a secondarily simplified thermal simulation model, wherein the specific method comprises the following steps of:
the method for importing the model after preliminary simplification into Flotherm or Icepak simulation software comprises the following steps: adding the model after preliminary simplification into Flothem or Icepak simulation software through an import interface reserved in Flothem or Icepak software;
the method for modeling the components and the like in the product by adopting the compact modeling method comprises the following steps of: after the initial simplified modeling of the outside of the product is completed, functional components such as components, chips and the like in the product need to be modeled, and common modeling methods of the PCB and the components comprise a compact modeling method and a detailed modeling method, wherein the detailed modeling method establishes an accurate model by inputting all parameters covering various detailed features, but the modeling process is complicated, and the workload of grid division is large, so that the calculation period is overlong; the compact level modeling method is different from the detailed modeling method, and although the built model is not as accurate as the detailed modeling method, the division number and the resolution period of the model mesh can be greatly reduced. In addition, as the calculation stability time has lower precision requirement on the model calculation result, a compact modeling method is adopted;
the method for omitting or deleting part of details on the premise of not changing the heat dissipation area of the product and the structure related to the heat dissipation performance of the product is as follows: the PCB board card, components (capacitance and resistance) and chips in the primarily simplified physical model are equivalent to boards or blocks with similar physical parameters and uniformly distributed heat sources, unnecessary components, pins and the like are deleted to complete secondary simplification (such as devices with smaller power consumption are not modeled), and the method does not need to have influence or smaller influence on the heat dissipation area and heat dissipation performance of the product, so that the establishment of the thermal simulation model is completed.
The step 3, namely, dividing the established model by adopting an unstructured grid dividing method, checking and adjusting the grid unit dividing effect until the two parameters of the alignment rate and the distortion ratio of the grid model meet the model requirements, is as follows:
the method for dividing the established model by adopting the unstructured grid dividing method comprises the following steps of:
the precondition of resolving the model is that the model is required to be matched, the grid division mode provided in the software comprises a Cartesian grid division method, an unstructured grid division method and a dominant grid division method, and the resolving period and the accuracy of the model are directly determined by the number of the grid divisions. On the premise of ensuring certain precision, the mesh division is more convenient to calculate, and the unstructured mesh division method has strong universality, can be compatible with more physical model interfaces, and can ensure that the discretized model is consistent with the geometric model to the greatest extent, namely the body attachment is good;
the method for checking and adjusting the grid cell division effect and checking and adjusting the grid cell division effect is as follows: after the grid division is finished, the grid division quality is required to be checked, parameters such as material physical properties and the like can be continuously set when the grid cells are undistorted, proper in size and high in alignment rate, the checking process can be realized through judging quality evaluation parameters displayed in software, and if the grid division quality does not meet the grid division quality standard of Icepak or Flotherm software, the model is required to be modified again until the quality evaluation parameters meet the requirements, wherein the quality evaluation parameters comprise the alignment rate and the distortion rate.
The method comprises the following steps of: after the grid division quality inspection is passed, initial parameters and boundary conditions of a thermal simulation model are input, wherein the initial parameters and boundary conditions comprise physical property parameters of materials, environmental temperature conditions, a heat dissipation mode, calculation iteration times and the like. Boundary conditions such as physical property parameters of materials and the like are set in software according to actual conditions of products (such as material properties of the products), environmental temperature conditions are set according to high-temperature test conditions in a test outline of the products, a heat dissipation mode is determined according to actual heat dissipation types of the products, such as natural cooling, forced air cooling, forced liquid cooling, heat pipes, micro-channel technology and the like, the number of calculation iterations is judged according to grid division conditions, the calculation is generally controlled in 200-600 steps, and a calculation result is required to reach a convergence standard, so that a thermal simulation temperature cloud picture of the products can be obtained.
The method comprises the following steps of: if the environmental temperature condition set in the step 4 is high temperature, the functional component at the position of the lowest temperature point in the temperature cloud chart and the monitoring point record is the maximum hysteresis effect point in the high temperature environment through observation, otherwise, when the set environmental temperature condition is low temperature, the functional component at the position of the highest temperature point in the temperature cloud chart and the monitoring point record is the maximum hysteresis effect point in the low temperature environment.
The "marking the component (functional component) as a test point" in step 6, setting an ambient temperature, and calculating the time required for the component to reach the maximum hysteresis effect to reach the predetermined ambient temperature, that is, the temperature stabilizing time, through the transient calculation function in the software. The specific method is as follows: after determining the maximum hysteresis effect point of the product in the high (low) temperature environment, marking the point as a test point in simulation software, setting the high (low) temperature environment temperature required by the test through the transient calculation function in the software, and operating the software to obtain the time required for the test point to reach the set environment temperature, namely the temperature stabilizing time under the environment temperature condition.
Through the steps, the construction of a temperature stability time test technology based on a thermal simulation model can be completed, the thermal simulation model of the product is built through twice simplification, a temperature distribution cloud image of the product is calculated according to the thermal simulation model, a maximum hysteresis effect point of the product is determined, a mark of a part where the maximum hysteresis effect point is located is used as a test point, and expected environmental temperature is set for transient calculation, so that the temperature stability time of the product in high-temperature and low-temperature tests is obtained.
Examples:
step one: different modeling methods are needed for different types of products, when the geometric shape and the internal structure of the product are complex, modeling software such as Pro E, solid works and the like is used for building the original 3D geometric model structure of the product, the excessively complex geometric model is unfavorable for the calculation of building a thermal simulation model based on Flotherm simulation software or Icepak simulation software by adopting a finite element volume method in the later stage, the original geometric structure appearance of the product is needed to be primarily simplified, the simplification standard is that the deleted detail features are not main factors influencing the heat dissipation performance of the product, and certain electronic equipment is taken as an example, as shown in figure 1, the detail parts with small influence on the whole temperature field of the product by structures such as bosses, rounding, chamfers, counter bores, grooves and the like existing outside the product are simplified or removed, and small features such as studs, chamfers and the like are ignored, so that the product is simplified into a plurality of block blocks to be spliced together, and the physical model after the primary simplification of the product is obtained.
Step two: the simplified model is imported into Flotherm or Icepak simulation software through a software interface reserved by Flotherm or Icepak, and the calculation accuracy of temperature stabilization time is in units of minutes, so that the difficulty of a later thermal simulation model calculation process is reduced, the calculation time is shortened, and the modeling is performed on boards, devices, chips and the like in the product on the premise that the heat dissipation area of the product and the structure related to the heat dissipation performance of the product are not changed. The modeling method of the PCB and the components commonly used comprises a detailed modeling method and a compact modeling method, wherein the detailed modeling method needs to input various specific parameters of the board card and the components, the output calculation result is accurate, the modeling and grid division process is complex, the settlement period is long, the workload is large, and the calculation stability time has lower precision requirement on the model calculation result, so that the compact modeling method is adopted in the invention, the grid division quantity can be greatly reduced, and the time is greatly shortened. And (3) adopting a compact modeling method to equivalent a board card, a device and a chip in the primarily simplified physical model to be boards or blocks with similar physical parameters and uniformly distributed heat sources, simultaneously continuously deleting unnecessary components, pins and the like to complete secondary simplification (for example, a device with smaller power consumption does not perform modeling), and establishing a simplified thermal simulation model, as shown in fig. 2.
Step three: icepak operates in a similar manner to Flotherm, and the present invention is described with respect to Icepak software. After the thermal simulation model of the product is established, the model can be further resolved by carrying out grid division on the model, and the common grid division modes include a Cartesian grid division method, an unstructured grid division method and a dominant grid division method, and the resolving period and accuracy of the model are directly determined by the number of grid divisions. The unstructured grid division method has strong universality, can be compatible with more physical model interfaces, and can ensure that the discretized model is consistent with the geometric model to the greatest extent, namely, the body fitting performance is good. In order to ensure basic calculation accuracy and shorten resolving time as much as possible, the simplified thermal simulation model is divided by adopting an unstructured grid division method, the quality of grid division determines model accuracy, grid division effects need to be checked after grid division is completed, parameters such as material physical properties can be continuously set when the grid cells are free of distortion, proper in size and high in alignment rate, and if the grid division quality does not meet the quality standard of Icepak software, the model needs to be modified again until the parameters meet requirements, wherein the quality evaluation parameters comprise the alignment rate and the distortion rate. Taking the electronic product as an example, using a grid division tool of the icepak, carrying out grid division on the model, setting a background grid size according to the size of a calculation domain of the model as shown in figure 3, wherein the main components of the heat exchange of the back plate of the product and air convection are used for fully capturing the heat exchange effect of the product and air, carrying out local encryption processing on the back plate of the product, the grid encryption parameters are shown in figure 4, and carrying out grid division on the calculation region according to the grid division strategy, wherein the division result is shown in figure 5. As can be seen from fig. 5, the number of four-side grids of the chip model is greater than 3, the number of grids in the thickness direction of the back plate is greater than 2, the number of grids in the fin gaps is greater than 4, the requirements of the ICEPAK on the grid model are met, the body-fitting property of the grids is checked, the grids capture small-size models and gaps well, and the body-fitting property of the grids meets the requirements. Further, the ICEPAK is utilized to check the quality evaluation index by a grid quality checking tool, the alignment rate of the grid model is larger than 0.42, the distortion ratio is larger than 0.01, and both parameters meet the requirements.
Step four: after the grids are divided, a thermal simulation model is established according to Flothem or Icepak simulation software to set initial input parameters and boundary conditions, and the initial input parameters and boundary conditions mainly comprise material physical parameters, environment temperature conditions, a heat dissipation mode, solution iteration times and the like. The boundary conditions such as physical property parameters of materials are set in software according to the actual conditions of products, the environment temperature conditions are set according to the high-temperature test conditions in the test outline of the products, the heat dissipation mode is determined according to the heat dissipation type of the products, the calculation iteration number is judged according to the grid division condition, and the control is generally carried out in 200-600 steps. The environmental conditions and the heat dissipation modes of the model are set for the electronic product, the heat dissipation modes are selected for natural cooling, the environmental temperature is set to 90 ℃, the setting result is shown in fig. 6, the divided grids are simpler, the iteration number is set to 200 steps, the running software carries out control parameter calculation solution, the simulation calculation result reaches the convergence standard through 200 steps of iterative calculation, the average temperature of the product is 97.2 ℃ as shown in fig. 7, the highest temperature is reduced to 107.5 ℃, the temperature distribution cloud diagram of the product is shown in fig. 8, and the calculated junction temperature of the main monitoring points is shown in table 1.
Table 1 monitoring points calculate junction thermometer
| Sequence number | Monitoring point chip name | Chip power consumption/W | The chip calculates junction temperature/DEGC | Maximum allowable junction temperature/°c |
| 1 | FT-6678 | 7.5 | 104.5 | 125 |
| 2 | JFM7K325T | 8.36 | 99.2 | 125 |
| 3 | GM8108 | 0.33 | 96.7 | 125 |
| 4 | HCE4620 | 2.05 | 103.7 | 125 |
| 5 | SM41J128M16M | 0.23 | 96.1 | 125 |
| 6 | HCE4644 | 0.375 | 99.6 | 125 |
| 7 | HCE4644 | 1.15 | 108.6 | 125 |
| 8 | HCE4632 | 0.08 | 96.4 | 125 |
| 9 | HCE4632 | 0.06 | 92.2 | 125 |
Step five: and according to the temperature cloud image and the record of the monitoring points calculated by the thermal simulation model, observing the positions of the highest and lowest points in the temperature cloud image, comparing the positions with devices (components) where the junction temperature meter of the monitoring points is positioned, and determining the respective maximum hysteresis effect points (functional components) of the product in high-temperature and low-temperature environments, namely the positions of the elements (components) where the two points with the lowest and highest temperatures in the temperature distribution cloud image respectively. The calculated junction temperature of the temperature distribution cloud chart and the monitoring point of the product is shown in fig. 8 and table 1, namely the maximum hysteresis effect point in a high-temperature environment is a No. 9 component, and the maximum hysteresis effect point in a low-temperature environment is a No. 7 component.
Step six: the method comprises the steps of respectively setting the environmental temperature conditions of a device (component) where a maximum hysteresis effect point is located in a high-low temperature environment, marking the component (component) as a test point through a transient calculation function in software, and calculating the time required for the component with the maximum hysteresis effect to reach the preset environmental temperature, namely the temperature stabilization time, by operating the software. For the electronic product, the environment temperature is set to be 90 ℃, the time for the No. 9 component to reach the environment temperature of 90 ℃ is set to be 10min21s, namely the position of the component serving as the maximum hysteresis effect point in the high-temperature environment is set to be the temperature stabilizing time of the product in the high-temperature environment of 10min21s, and the low-temperature time calculating method is the same. The temperature stabilizing time obtained by the calculation method is very close to the measured value of 8min58s, and the requirements in actual engineering can be met.
Through the steps, the temperature stability time test technology based on the thermal simulation model can be built. In the technology, firstly, a simplified physical model of a product is established according to a design file of the product, then the physical model is imported into thermal simulation software, the thermal simulation model of the product is generated and is subjected to secondary simplification, after relevant parameters and boundary conditions are set, whether settlement conditions are met or not is checked, a product temperature distribution cloud picture is calculated after error-free confirmation, a temperature maximum hysteresis effect point of the product is determined, and finally, the temperature stabilizing time of the product is calculated rapidly and accurately by utilizing transient functions in the thermal simulation software.
The temperature test technology is constructed based on a thermal simulation theory, so that a practical temperature stability time test technology based on a thermal simulation model is formed.
Claims (3)
1. A temperature stabilization time test method based on a thermal simulation model is characterized by comprising the following steps:
step 1: referring to a product design scheme, establishing an original 3D geometric model or CAD model of the product, and primarily simplifying an original geometric structure outside the product to obtain a primarily simplified physical model;
step 2: the model after preliminary simplification is imported into Flothem or Icepak simulation software, a compact modeling method is adopted to model components in the product, partial details are omitted or deleted on the premise that the heat dissipation area of the product and the structure related to the heat dissipation performance of the product are not changed, and a thermal simulation model after secondary simplification is established;
step 3: dividing the established model by adopting an unstructured grid dividing method, and checking and adjusting the grid unit dividing effect until the two parameters of the alignment rate and the distortion ratio of the grid model meet the model requirement;
step 4: setting initial input parameters, boundary conditions and solving control parameters of a thermal simulation model in Flotherm or Icepak simulation software, and calculating and solving to obtain a thermal simulation calculated temperature cloud image and a monitoring point record of a product;
step 5: determining a functional component corresponding to a maximum hysteresis effect point of a product in a high-temperature or low-temperature environment according to a temperature cloud image and a monitoring point record obtained by the thermal simulation model;
step 6: the functional component is marked as a test point, the ambient temperature is set, and the time required for the point to reach the maximum hysteresis function functional component to reach the preset ambient temperature, namely the temperature stabilization time, is calculated through a transient calculation function in software.
2. The method for testing the temperature stabilization time based on the thermal simulation model according to claim 1, wherein in the step 1, the original geometry outside the product is primarily simplified, specifically, some geometric features or detail parts existing on the outer surface of the product are simplified or eliminated, and the geometric features or detail parts are: boss, rounding, chamfering, counter bore, groove, stud and chamfering.
3. The method for testing the temperature stabilization time based on the thermal simulation model according to claim 1, wherein in the step 4, if the set environmental temperature condition is high temperature, the functional component at the position of the lowest temperature point in the temperature cloud chart and the monitoring point record is the maximum hysteresis effect point in the high temperature environment through observation; otherwise, when the set environmental temperature condition is low temperature, the functional part at the position of the highest temperature point in the temperature cloud chart and the monitoring point record is the maximum hysteresis effect point in the low temperature environment.
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