CN102585502B - A preparation method of high-temperature polymer-based PTC material with delayed NTC effect - Google Patents

A preparation method of high-temperature polymer-based PTC material with delayed NTC effect Download PDF

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CN102585502B
CN102585502B CN 201210042280 CN201210042280A CN102585502B CN 102585502 B CN102585502 B CN 102585502B CN 201210042280 CN201210042280 CN 201210042280 CN 201210042280 A CN201210042280 A CN 201210042280A CN 102585502 B CN102585502 B CN 102585502B
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王法军
欧军飞
薛名山
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Nanchang Hangkong University
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Abstract

本发明涉及一种具有延迟NTC效应的高温聚合物PTC材料的制备方法。材料包括:导电炭黑(CB)、聚合物基体聚苯硫醚(PPS)和聚四氟乙烯(PTFE),其配方按照质量百分比为:CB含量3%~15%,PPS含量42.5%~67.9%,PTFE含量25.5%~48.5%,其中PPS与PTFE质量比为5/5~7/3;制备方法是将CB偶联剂改性处理,然后与PPS粉末和PTFE粉末在无水乙醇中分散,球磨混合均匀后将溶剂挥发,然后在一定温度下热压烧结得到CB/PPS/PTFE复合材料。本发明的有延迟NTC效应的高温聚合物PTC材料的特点是:不需要使用交联设备辐射交联消除材料的NTC效应,降低了制造成本,简化了生产工艺;复合材料的室温电阻率可以通过调节CB含量和PPS与PTFE重量比进行调节。

Figure 201210042280

The invention relates to a preparation method of a high-temperature polymer PTC material with delayed NTC effect. Materials include: conductive carbon black (CB), polymer matrix polyphenylene sulfide (PPS) and polytetrafluoroethylene (PTFE), and its formula is: CB content 3%~15%, PPS content 42.5%~67.9% by mass percentage %, PTFE content 25.5%~48.5%, of which the mass ratio of PPS to PTFE is 5/5~7/3; the preparation method is to modify the CB coupling agent, and then disperse it with PPS powder and PTFE powder in absolute ethanol , after mixing uniformly by ball milling, the solvent is volatilized, and then hot-pressed and sintered at a certain temperature to obtain a CB/PPS/PTFE composite material. The high-temperature polymer PTC material with delayed NTC effect of the present invention is characterized in that it does not need to use cross-linking equipment to radiate and cross-link to eliminate the NTC effect of the material, which reduces the manufacturing cost and simplifies the production process; the room temperature resistivity of the composite material can be passed Adjust the CB content and the weight ratio of PPS and PTFE to adjust.

Figure 201210042280

Description

一种具有延迟NTC效应的高温聚合物基PTC材料的制备方法A preparation method of high-temperature polymer-based PTC material with delayed NTC effect

技术领域 technical field

本发明涉及一种现代电子和电气工程领域的聚合物基PTC复合材料,涉及一种具有延迟NTC效应的高温聚合物基PTC材料的制备方法。 The invention relates to a polymer-based PTC composite material in the field of modern electronics and electrical engineering, and relates to a preparation method of a high-temperature polymer-based PTC material with delayed NTC effect.

技术背景 technical background

目前聚合物PTC材料的制造主要以聚乙烯(PE)、乙烯-醋酸乙烯酯共聚物(EVA)、聚偏氟乙烯(PVDF)等单组分结晶或半结晶聚合物为基体材料,这些聚合物基体材料的熔点一般都小于150 ℃,致使最终的聚合物基PTC材料的使用温度不高。同时,这类PTC材料在加工过程中往往需要辐射交联消除NTC效应后才能使用,否则材料在使用中因通电导致温度升高接近聚合物基体的熔点时,聚合物会发生变形甚至烧毁。但PTC材料的辐射交联处理过程需要使用昂贵的交联设备,这会提高了材料的生产成本。随着现代科技的日新月异,聚合物PTC材料应用领域不断拓展,需要开发加工方便、制造成本低廉、使用温度更高(PTC转变温度高于200 ℃)、并且综合性能优异的聚合物基PTC材料。目前的PE、EVA、PP和PVDF单组份聚合物基PTC材料都无法满足200 ℃高温使用的要求。通过使用高熔点的半结晶性聚合物材料作为基体是提高聚合物基PTC材料使用温度的基本方法,采用两种或多种聚合物共混组成多元复合体系,可以使复合材料具有不同于单一聚合物基体的新颖独特性能,实现各组分的优势互补,甚至展现出新的功能。因此,多元聚合物基体共混复合材料在聚合物基PTC材料的研究和开发中越来越受到人们的关注。 At present, the manufacture of polymer PTC materials mainly uses single-component crystalline or semi-crystalline polymers such as polyethylene (PE), ethylene-vinyl acetate copolymer (EVA), and polyvinylidene fluoride (PVDF) as matrix materials. The melting point of the matrix material is generally less than 150 °C, so that the final polymer-based PTC material does not have a high service temperature. At the same time, such PTC materials often need radiation crosslinking to eliminate the NTC effect during processing, otherwise, when the temperature of the material rises close to the melting point of the polymer matrix due to energization during use, the polymer will be deformed or even burned. However, the radiation crosslinking treatment process of PTC materials requires the use of expensive crosslinking equipment, which will increase the production cost of the material. With the rapid development of modern science and technology, the application fields of polymer PTC materials continue to expand, and it is necessary to develop polymer-based PTC materials with convenient processing, low manufacturing cost, higher service temperature (PTC transition temperature higher than 200 ℃), and excellent comprehensive performance. The current PE, EVA, PP and PVDF one-component polymer-based PTC materials cannot meet the requirements of high temperature use at 200 °C. Using a semi-crystalline polymer material with a high melting point as a matrix is the basic method to increase the service temperature of a polymer-based PTC material. Two or more polymers are blended to form a multi-component composite system, which can make the composite material different from a single polymer. The novel and unique performance of the material matrix realizes the complementary advantages of each component, and even exhibits new functions. Therefore, multi-polymer matrix blend composites have attracted more and more attention in the research and development of polymer-based PTC materials.

发明内容 Contents of the invention

本发明的目的是提供一种具有显著延迟NTC效应的高温聚合物基PTC材料的制备方法。 The purpose of the present invention is to provide a method for preparing a high-temperature polymer-based PTC material with significantly delayed NTC effect.

本发明的一种具有延迟NTC效应的高温聚合物基PTC材料的制备方法,其特征在于: A kind of preparation method of the high-temperature polymer-based PTC material with delayed NTC effect of the present invention is characterized in that:

1)原料:所述的具有延迟NTC效应的高温聚合物基PTC材料有着以下的物质组成:导电填料CB、聚合物基体材料PPS和PTFE;所述的CB导电填料占复合材料总质量的3.0%~15.0%;所述聚合物基体PPS含量42.5%~67.9%,PTFE含量25.5%~48.5%,其中PPS与PTFE质量比为5/5~7/3;所述的CB导电填料平均粒径为50nm,经硅烷偶联剂处理后使用,其中硅烷偶联剂与CB的质量比为100:1;所述的聚合物基体PPS熔点为285 ℃,平均粒径为20 μm;所述的聚合物基体PTFE熔点为327 ℃,熔融粘度为1010 Pa·s,平均粒径为25 μm; 1) Raw material: The high-temperature polymer-based PTC material with delayed NTC effect has the following material composition: conductive filler CB, polymer matrix material PPS and PTFE; the CB conductive filler accounts for 3.0% of the total mass of the composite material ~15.0%; the polymer matrix PPS content is 42.5%~67.9%, and the PTFE content is 25.5%~48.5%, wherein the mass ratio of PPS to PTFE is 5/5~7/3; the average particle size of the CB conductive filler is 50nm, used after being treated with a silane coupling agent, wherein the mass ratio of the silane coupling agent to CB is 100:1; the melting point of the polymer matrix PPS is 285°C, and the average particle size is 20 μm; the polymer matrix The melting point of the matrix PTFE is 327 °C, the melt viscosity is 10 10 Pa·s, and the average particle size is 25 μm;

 2) CB导电填料的表面处理:室温下将CB粉末通过超声分散和搅拌使其在无水乙醇中形成悬浮液,然后加入偶联剂后持续搅拌10~30分钟;随后加入去离子水,在40~60℃下超声分散并搅拌15~60分钟;离心分离粉体,然后使用无水乙醇洗涤1~3次后,在60~120℃下真空干燥2~5小时,自然冷却到室温后使用;其中偶联剂为γ-氨丙基三乙氧基硅烷; 2) Surface treatment of CB conductive filler: Ultrasonic disperse and stir the CB powder at room temperature to form a suspension in absolute ethanol, then add the coupling agent and continue stirring for 10-30 minutes; then add deionized water, in Ultrasonic dispersion and stirring at 40-60°C for 15-60 minutes; centrifuge the powder, wash with absolute ethanol for 1-3 times, vacuum-dry at 60-120°C for 2-5 hours, cool to room temperature naturally before use ; Wherein the coupling agent is γ-aminopropyltriethoxysilane;

3)复合:称取PPS和PTFE粉末以及步骤(2)中硅烷偶联剂改性得到的CB粉末,使CB导电填料的质量百分含量为3.0~15.0%;聚合物基体PPS质量百分含量为42.5%~67.9%;PTFE质量百分含量为25.5%~48.5%;其中PTFE与PPS质量比为5/5~7/3;然后将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; 3) Composite: Weigh the PPS and PTFE powder and the CB powder modified by the silane coupling agent in step (2), so that the mass percentage of the CB conductive filler is 3.0~15.0%; the mass percentage of the polymer matrix PPS 42.5%~67.9%; the mass percentage of PTFE is 25.5%~48.5%; the mass ratio of PTFE to PPS is 5/5~7/3; then the CB powder, PPS powder and PTFE powder are dispersed in ethanol and ball milled After mixing evenly, the solvent was evaporated in an oven, and then dried in a vacuum oven at 120 °C for 1 h to obtain a mixed powder;

 4) 成型:将混合粉料至于硬质合金模具中,在330~380 ℃下于100 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品。 4) Molding: put the mixed powder in a cemented carbide mold, hot press at 330~380°C under a pressure of 100 MPa for 15 minutes, and cool to room temperature to obtain a disc with a diameter of 20 mm and a thickness of 1~3 mm sample.

本发明具有以下有益效果:这种聚合物PTC复合材料具有高达250 ℃的转变温度,能够作为高温PTC材料使用;复合材料的NTC效应从295 ℃延迟到335 ℃左右,延迟了约40℃,避免了昂贵的辐射交联工艺,简化了PTC材料的制造工艺,降低了生产成本;复合材料采用了耐高温的聚合物基体PPS和PTFE,本身不燃,保证了材料使用的安全性,不需额外添加有毒含卤阻燃剂;复合材料可以通过调节CB的含量和PPS与PTFE重量比改变复合材料的导电性,因此可以较为精确的控制复合材料的室温电导率。 The invention has the following beneficial effects: the polymer PTC composite material has a transition temperature as high as 250°C and can be used as a high-temperature PTC material; the NTC effect of the composite material is delayed from 295°C to about 335°C, which is delayed by about 40°C, avoiding The expensive radiation cross-linking process is simplified, the manufacturing process of PTC materials is simplified, and the production cost is reduced; the composite material uses high-temperature-resistant polymer matrix PPS and PTFE, which are non-combustible, which ensures the safety of the material and does not require additional additions Toxic halogen-containing flame retardant; the composite material can change the conductivity of the composite material by adjusting the content of CB and the weight ratio of PPS and PTFE, so the room temperature conductivity of the composite material can be controlled more accurately.

附图说明 Description of drawings

图1为本发明制备聚合物PTC复合材料的工艺流程图; Fig. 1 is the process flow sheet that the present invention prepares polymer PTC composite material;

图2为CB导电填料含量为8 wt%,聚合物基体PPS与PTFE质量比分别为7/3, 6/4, 5/5时的CB/PPS/PTFE复合材料的DSC曲线; Fig. 2 is the DSC curve of the CB/PPS/PTFE composite material when the CB conductive filler content is 8 wt%, and the polymer matrix PPS and PTFE mass ratio are respectively 7/3, 6/4, 5/5;

图3为CB导电填料含量为8wt%,PPS/PTFE=5/5 (w/w),CB/PPS/PTFE复合材料 Figure 3 shows that the CB conductive filler content is 8wt%, PPS/PTFE=5/5 (w/w), CB/PPS/PTFE composite material

的电阻-温度曲线; resistance-temperature curve;

图4为CB导电填料含量为8wt%,PPS/PTFE=7/3 (w/w),CB/PPS/PTFE复合材料 Figure 4 shows that the CB conductive filler content is 8wt%, PPS/PTFE=7/3 (w/w), CB/PPS/PTFE composite material

的电阻-温度曲线; resistance-temperature curve;

图5为CB导电填料含量为12wt%,PPS/PTFE=5/5 (w/w),CB/PPS/PTFE复合材的电阻-温度曲线; Fig. 5 is that CB conductive filler content is 12wt%, PPS/PTFE=5/5 (w/w), the resistance-temperature curve of CB/PPS/PTFE composite material;

图6为CB导电填料含量为9wt%,PPS/PTFE=5/5 (w/w),CB/PPS/PTFE复合材料 Figure 6 shows that the CB conductive filler content is 9wt%, PPS/PTFE=5/5 (w/w), CB/PPS/PTFE composite material

的电阻-温度曲线; resistance-temperature curve;

图7为CB导电填料含量为9wt%,PPS/PTFE=6/4 (w/w),CB/PPS/PTFE复合材料 Figure 7 shows that the CB conductive filler content is 9wt%, PPS/PTFE=6/4 (w/w), CB/PPS/PTFE composite material

的电阻-温度曲线; resistance-temperature curve;

图8为CB导电填料含量为9wt%,PPS/PTFE=7/3 (w/w),CB/PPS/PTFE复合材料 Figure 8 shows that the CB conductive filler content is 9wt%, PPS/PTFE=7/3 (w/w), CB/PPS/PTFE composite material

的电阻-温度曲线。 resistance-temperature curve.

具体实施方式 Detailed ways

下面通过结合具体实施例对本发明做进一步的详细说明。实施例仅是对本发明的一种说明,而不构成对本发明的限制。实施例是实际应用例子,对于本领域的专业技术人员很容易掌握并验证。如果在本发明的基础上做出某种改变,那么其实质并不超出本发明的范围。 The present invention will be further described in detail below in conjunction with specific embodiments. The embodiment is only an illustration of the present invention, and does not constitute a limitation to the present invention. The embodiments are examples of practical applications, which are easy to grasp and verify for those skilled in the art. If some changes are made on the basis of the present invention, then the essence does not go beyond the scope of the present invention.

实施例1 Example 1

(1) 室温下将100 g CB导电填料粉末通过超声分散和搅拌使其在无水乙醇中形成悬浮液,然后加入1 g 偶联剂(γ-氨丙基三乙氧基硅烷)后持续搅拌10~30分钟;随后加入去离子水,在40~60℃下超声分散并搅拌15~60分钟;离心分离粉体,然后使用无水乙醇洗涤1~3次后,在60~120℃下真空干燥2~5小时,自然冷却到室温后使用; (1) At room temperature, 100 g of CB conductive filler powder is ultrasonically dispersed and stirred to form a suspension in absolute ethanol, and then 1 g of coupling agent (γ-aminopropyltriethoxysilane) is added and stirred continuously 10~30 minutes; then add deionized water, ultrasonically disperse at 40~60°C and stir for 15~60 minutes; centrifuge the powder, and then use absolute ethanol to wash 1~3 times, then vacuum at 60~120°C Dry for 2-5 hours, then use after cooling to room temperature naturally;

(2) 称取3.1269 g PPS和3.1269 g PTFE粉末以及步骤(1)中硅烷偶联剂改性得到的CB粉末0.5438 g;使CB导电填料的质量百分含量为8%,聚合物基体PPS质量百分含量为46%,PTFE质量百分含量为46%,其中PPS与PTFE质量比为5/5;将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; (2) Weigh 3.1269 g PPS and 3.1269 g PTFE powder and 0.5438 g of CB powder modified by silane coupling agent in step (1); make the mass percentage of CB conductive filler be 8%, polymer matrix PPS mass The percentage content is 46%, and the mass percentage content of PTFE is 46%, wherein the mass ratio of PPS and PTFE is 5/5; disperse CB powder, PPS powder and PTFE powder in ethanol, mix them evenly by ball milling, and evaporate the solvent in an oven , and then dried in a vacuum oven at 120°C for 1 h to obtain a mixed powder;

(3) 成型:将混合粉料至于硬质合金模具中,在360 ℃下于100 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品; (3) Molding: Put the mixed powder in a cemented carbide mold, hot press at 360 °C for 15 minutes under a pressure of 100 MPa, and cool to room temperature to obtain a disc shape with a diameter of 20 mm and a thickness of 1~3 mm sample;

(4) 实施例1-6中复合材料的制备流程图见附图1;用刀片切割步骤(3)得到的试样5-10 mg样品,在氮气中,升温速率为20 ℃/min条件下测量样品的DSC曲线,其结果见附图2中曲线c;在步骤(3)得到的试样两端涂覆导电银浆于100℃处理1h,自然降温后稳定24h,使银浆与芯片材料达到欧姆接触,然后测试样品电阻-温度特性,其结果见附图3:室温电阻率为151 Ω·cm;PTC转变从250 ℃开始,到295 ℃结束,PTC强度为2.5;NTC效应从295 ℃延迟到335 ℃后发生,延迟了40 ℃。 (4) The preparation flow diagram of the composite material in Examples 1-6 is shown in accompanying drawing 1; the sample 5-10 mg sample obtained in step (3) is cut with a blade, in nitrogen, the heating rate is under the condition of 20 ℃/min Measure the DSC curve of the sample, the results are shown in the curve c in the accompanying drawing 2; the two ends of the sample obtained in step (3) are coated with conductive silver paste and treated at 100°C for 1h, and stabilized for 24h after natural cooling, so that the silver paste and the chip material Reach the ohmic contact, and then test the resistance-temperature characteristics of the sample. The results are shown in Figure 3: the room temperature resistivity is 151 Ω cm; Occurs after a delay to 335 °C, a delay of 40 °C.

实施例2 Example 2

(1) CB导电填料粉末的表面处理工艺同实例1; (1) The surface treatment process of CB conductive filler powder is the same as example 1;

(2) 称取4.4291 g PPS和1.8982 g PTFE粉末以及步骤(1)中硅烷偶联剂改性得到的CB粉末0.5502 g;使CB导电填料的质量百分含量为8%,聚合物基体PPS质量百分含量为64.4%,PTFE质量百分含量为27.6%,其中PPS与PTFE质量比为7/3;将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; (2) Weigh 4.4291 g PPS and 1.8982 g PTFE powder and 0.5502 g of CB powder modified by silane coupling agent in step (1); make the mass percentage of CB conductive filler be 8%, polymer matrix PPS mass The percentage content is 64.4%, and the mass percentage content of PTFE is 27.6%, wherein the mass ratio of PPS and PTFE is 7/3; disperse CB powder, PPS powder and PTFE powder in ethanol, mix them evenly by ball milling, and evaporate the solvent in an oven , and then dried in a vacuum oven at 120°C for 1 h to obtain a mixed powder;

(3) 成型:将混合粉料至于硬质合金模具中,在380 ℃下于50 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品; (3) Molding: Put the mixed powder in a cemented carbide mold, hot-press at 380 °C for 15 minutes under a pressure of 50 MPa, and cool to room temperature to obtain a disc shape with a diameter of 20 mm and a thickness of 1-3 mm sample;

(4) 样品的DSC曲线测试条件同实施例1,结果见附图2中曲线a;样品电阻-温度特性测试方法同实施例1,其结果见附图4:室温电阻率为319 Ω·cm;PTC转变从250 ℃左右开始,到290 ℃结束,PTC强度为4.7;NTC效应从290 ℃延迟到335 ℃后发生,延迟了45 ℃。 (4) The DSC curve test condition of the sample is the same as that of Example 1, and the results are shown in curve a in the accompanying drawing 2; ; The PTC transition starts from around 250 ℃ and ends at 290 ℃, with a PTC intensity of 4.7; the NTC effect occurs after a delay of 45 ℃ from 290 ℃ to 335 ℃.

实施例3 Example 3

(1) CB导电填料粉末的表面处理工艺同实例1; (1) The surface treatment process of CB conductive filler powder is the same as example 1;

(2) 称取2.4684 g PPS和2.4684 g PTFE粉末以及步骤(1)中硅烷偶联剂改性得到的CB粉末0.6732 g;使CB导电填料的质量百分含量为12%,聚合物基体PPS质量百分含量为44%,PTFE质量百分含量为44%,其中PPS与PTFE质量比为5/5;将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; (2) Weigh 2.4684 g PPS and 2.4684 g PTFE powder and 0.6732 g of CB powder modified by silane coupling agent in step (1); make the mass percentage of CB conductive filler be 12%, polymer matrix PPS mass The percentage content is 44%, and the mass percentage content of PTFE is 44%, wherein the mass ratio of PPS and PTFE is 5/5; disperse CB powder, PPS powder and PTFE powder in ethanol, mix them evenly by ball milling, and evaporate the solvent in an oven , and then dried in a vacuum oven at 120°C for 1 h to obtain a mixed powder;

(3) 成型:将混合粉料至于硬质合金模具中,在340 ℃下于100 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品; (3) Molding: Put the mixed powder in a cemented carbide mold, hot press at 340 °C under 100 MPa pressure for 15 minutes, and cool to room temperature to obtain a disc shape with a diameter of 20 mm and a thickness of 1~3 mm sample;

(4) 样品电阻-温度特性测试方法同实施例1,其结果见附图5:室温电阻率为30 Ω·cm;PTC转变从250 ℃左右开始,到295 ℃结束,PTC强度为0.8;NTC效应从295 ℃延迟到335 ℃后发生,延迟了40 ℃。 (4) The test method of sample resistance-temperature characteristics is the same as in Example 1, and the results are shown in Figure 5: the room temperature resistivity is 30 Ω cm; the PTC transition starts from about 250 °C and ends at 295 °C, and the PTC intensity is 0.8; The effect occurs after a delay from 295 °C to 335 °C, a delay of 40 °C.

实施例4 Example 4

(1) CB导电填料粉末的表面处理工艺同实例1; (1) The surface treatment process of CB conductive filler powder is the same as example 1;

(2) 称取2.9514 g PPS和2.9514 g PTFE粉末以及步骤(1)中硅烷偶联剂改性得到的CB粉末0.5838 g;使CB导电填料的质量百分含量为9%,聚合物基体PPS质量百分含量为45.5%,PTFE质量百分含量为45.5%,其中PPS与PTFE质量比为5/5;将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; (2) Weigh 2.9514 g PPS and 2.9514 g PTFE powder and 0.5838 g of CB powder modified by silane coupling agent in step (1); make the mass percentage of CB conductive filler be 9%, polymer matrix PPS mass The percentage content is 45.5%, and the mass percentage content of PTFE is 45.5%, wherein the mass ratio of PPS and PTFE is 5/5; disperse CB powder, PPS powder and PTFE powder in ethanol, mix them evenly by ball milling, and evaporate the solvent in an oven , and then dried in a vacuum oven at 120°C for 1 h to obtain a mixed powder;

(3) 成型:将混合粉料至于硬质合金模具中,在360 ℃下于80 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品; (3) Molding: put the mixed powder in a cemented carbide mold, hot press at 360 °C for 15 minutes under a pressure of 80 MPa, and cool to room temperature to obtain a disc shape with a diameter of 20 mm and a thickness of 1~3 mm sample;

(4) 样品电阻-温度特性测试方法同实施例1,其结果见附图6:室温电阻率为102 Ω·cm;PTC转变从250 ℃左右开始,到295 ℃结束,PTC强度为2.4;NTC效应从295 ℃延迟到335 ℃后发生,延迟了40 ℃。 (4) The test method of sample resistance-temperature characteristics is the same as in Example 1, and the results are shown in Figure 6: the room temperature resistivity is 102 Ω cm; the PTC transition starts from about 250 ℃ and ends at 295 ℃, and the PTC intensity is 2.4; the NTC The effect occurs after a delay from 295 °C to 335 °C, a delay of 40 °C.

实施例5 Example 5

(1) CB导电填料粉末的表面处理工艺同实例1; (1) The surface treatment process of CB conductive filler powder is the same as example 1;

(2) 称取3.7152 g PPS和2.4768 g PTFE粉末以及步骤(1)中硅烷偶联剂改性得到的CB粉末0.6124 g;使CB导电填料的质量百分含量为9%,聚合物基体PPS质量百分含量为54.6%,PTFE质量百分含量为36.4%,其中PPS与PTFE质量比为6/4;将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; (2) Weigh 3.7152 g PPS and 2.4768 g PTFE powder and 0.6124 g of CB powder modified by silane coupling agent in step (1); make the mass percentage of CB conductive filler be 9%, polymer matrix PPS mass The percentage content is 54.6%, and the mass percentage content of PTFE is 36.4%, wherein the mass ratio of PPS and PTFE is 6/4; disperse CB powder, PPS powder and PTFE powder in ethanol, mix them evenly by ball milling, and evaporate the solvent in an oven , and then dried in a vacuum oven at 120°C for 1 h to obtain a mixed powder;

(3) 成型:将混合粉料至于硬质合金模具中,在340 ℃下于50 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品; (3) Molding: Put the mixed powder in a cemented carbide mold, hot press at 340 °C and 50 MPa for 15 minutes, and cool to room temperature to obtain a disc shape with a diameter of 20 mm and a thickness of 1~3 mm sample;

(4) 样品的DSC曲线测试条件同实施例1,结果见附图2中曲线b;样品电阻-温度特性测试方法同实施例1,其结果见附图6:室温电阻率为402 Ω·cm;PTC转变从250 ℃左右开始,到285 ℃结束,PTC强度为3.7;NTC效应从285 ℃延迟到330 ℃后发生,延迟了40 ℃。 (4) The DSC curve test condition of sample is the same as embodiment 1, and the results are shown in the curve b in accompanying drawing 2; ; The PTC transition starts from around 250 ℃ and ends at 285 ℃, with a PTC intensity of 3.7; the NTC effect occurs after a delay of 40 ℃ from 285 ℃ to 330 ℃.

实施例6 Example 6

(1) CB导电填料粉末的表面处理工艺同实例1; (1) The surface treatment process of CB conductive filler powder is the same as example 1;

(2) 称取3.8418 g PPS和1.6465 g PTFE粉末以及步骤(1)中硅烷偶联剂改性得到的CB粉末0.5428 g;使CB导电填料的质量百分含量为9%,聚合物基体PPS质量百分含量为63.7%,PTFE质量百分含量为27.3%,其中PPS与PTFE质量比为7/3;将CB粉末、PPS粉末和PTFE粉末在乙醇中分散,球磨混合均匀后在烘箱中蒸发溶剂,然后置于真空干燥箱中120 ℃条件下干燥1 h,得到混合粉料; (2) Weigh 3.8418 g PPS and 1.6465 g PTFE powder and 0.5428 g of CB powder modified by silane coupling agent in step (1); make the mass percentage of CB conductive filler be 9%, polymer matrix PPS mass The percentage content is 63.7%, the mass percentage content of PTFE is 27.3%, and the mass ratio of PPS and PTFE is 7/3; the CB powder, PPS powder and PTFE powder are dispersed in ethanol, and the solvent is evaporated in an oven after mixing evenly by ball milling , and then dried in a vacuum oven at 120°C for 1 h to obtain a mixed powder;

(3) 成型:将混合粉料至于硬质合金模具中,在340 ℃下于50 MPa压力下热压15分钟,冷却到室温后得到直径为20 mm,厚度为1~3 mm的圆片状样品; (3) Molding: Put the mixed powder in a cemented carbide mold, hot press at 340 °C and 50 MPa for 15 minutes, and cool to room temperature to obtain a disc shape with a diameter of 20 mm and a thickness of 1~3 mm sample;

(4) 样品电阻-温度特性测试方法同实施例1,其结果见附图6:室温电阻率为896 Ω·cm;PTC转变从250 ℃左右开始,到300 ℃结束,PTC强度为4.8;NTC效应从300 ℃延迟到335 ℃后发生,延迟了35 ℃。 (4) The test method of sample resistance-temperature characteristics is the same as in Example 1, and the results are shown in Figure 6: the room temperature resistivity is 896 Ω cm; the PTC transition starts from about 250 ℃ and ends at 300 ℃, and the PTC intensity is 4.8; the NTC The effect occurs after a delay from 300 °C to 335 °C, a delay of 35 °C.

Claims (1)

1. preparation method with the high temperature polymer matrix PTC material that postpones the NTC effect is characterized in that method is:
1) raw material: described high temperature polymer matrix PTC material with delay NTC effect has following material to form: conductive filler material CB, polymer matrix material PPS and PTFE; Described CB conductive filler material accounts for 3.0% ~ 15.0% of matrix material total mass; Described polymeric matrix PPS content 42.5% ~ 67.9%, PTFE content 25.5% ~ 48.5%, wherein PPS and PTFE mass ratio are 5/5 ~ 7/3; Described CB conductive filler material median size is 50nm, uses after silane coupling agent is processed, and wherein the mass ratio of silane coupling agent and CB is 1:100; Described polymeric matrix PPS fusing point is 285 ℃, and median size is 20 μ m; Described polymeric matrix PTFE fusing point is 327 ℃, and melt viscosity is 10 10Pas, median size is 25 μ m;
2) surface treatment of CB conductive filler material: make it in dehydrated alcohol, form suspension by ultra-sonic dispersion and stirring in the CB powder under the room temperature, then add and continue behind the coupling agent to stir 10 ~ 30 minutes; Add subsequently deionized water, at 40 ~ 60 ℃ of lower ultra-sonic dispersion and stirred 15 ~ 60 minutes; The centrifugation powder, then use absolute ethanol washing 1 ~ 3 time after, 60 ~ 120 ℃ of lower vacuum-dryings 2 ~ 5 hours, use after naturally cooling to room temperature; Wherein coupling agent is γ-aminopropyl triethoxysilane;
3) compound: take by weighing the silane coupler modified CB powder that obtains in PPS and PTFE powder and the step (2), the quality percentage composition that makes the CB conductive filler material is 3.0 ~ 15.0%; Polymeric matrix PPS quality percentage composition is 42.5% ~ 67.9%; PTFE quality percentage composition is 25.5% ~ 48.5%; Wherein PTFE and PPS mass ratio are 5/5 ~ 7/3; Then CB powder, PPS powder and PTFE powder are disperseed in ethanol, ball milling mixes afterwards evaporating solvent in baking oven, then places dry 1 h under 120 ℃ of conditions of vacuum drying oven, obtains mixed powder;
4) moulding: as in the sintered-carbide die, in hot pressing 15 minutes under 100 MPa pressure under 330 ~ 380 ℃, obtaining diameter behind the cool to room temperature is 20 mm with mixed powder, and thickness is the disc-shaped sample of 1 ~ 3 mm.
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