CN102582960A

CN102582960A - Buffer structure

Info

Publication number: CN102582960A
Application number: CN2012100211484A
Authority: CN
Inventors: 曹玉阳
Original assignee: AU Optronics Suzhou Corp Ltd; AU Optronics Corp
Current assignee: AU Optronics Suzhou Corp Ltd; AU Optronics Corp
Priority date: 2012-01-18
Filing date: 2012-01-18
Publication date: 2012-07-18

Abstract

The invention provides a buffer structure, which comprises a buffer body provided with a plurality of rectangular notches. The width of each rectangular notch is equal to the depth of the rectangular notch, the bottom of each rectangular notch contacts with one side of the rectangular notch when the buffer body is folded along the rectangular notches, and a containing space is formed in the folded buffer body and used for containing an electronic device. The buffer structure can achieve a buffer effect, can be unfolded to facilitate transportation, and is not adhered so that consumption of adhesives can be decreased, and environmental protection is facilitated.

Description

Buffer structure

Technical field

The invention relates to the electronics package packing, and the buffer structure of particularly packing relevant for electronics package.

Background technology

Electronics package; Like liquid crystal indicator, portable terminal, panel computer etc., in transportation, may receive extraneous collision and causes electrons device generation flaw; Even damage; Therefore, receive the influence of extraneous collision, need in the packing box of electronics package, add buffer structure in order to avoid electronics package as far as possible.Foam is with its flexible design; Cost, protectiveness is good etc., and characteristics are widely used in the packing of electronics package, promptly use it to be made into required buffer structure; Particularly; It is bonding to use foam sheet to cut, and is processed into required buffer structure then, and the buffer structure that is made into through this foam material can play good buffering effect.

With reference to Fig. 1, Fig. 1 has illustrated the structural representation of the existing buffer structure of processing with foamed materials.

As shown in Figure 1; Buffer structure 1 comprises first segmentation 11, second segmentation 12, the 3rd segmentation 13; Wherein, First segmentation 11 and second segmentation 12, first segmentation 11 and the 3rd segmentation 13 are carried out bonding respectively through hot melt adhesive, bonding after, make the segmentation 11 of winning respectively with second segmentation 12, the 3rd segmentation 13 fixes and become the U font.

But existing buffer structure 1 has following defective at least:

1) buffer structure 1 manufacturing process is difficult for realizing;

2) owing to be difficult for launching through the bonding back of hot melt adhesive, it is bigger to make that 1 of buffer structure takes up space, the inconvenience transportation;

3) owing to use hot melt adhesive, be unfavorable for environmental protection.

In view of this, how to design a kind of buffer structure, make this buffer structure both can reach buffering effect; Can also launch to be convenient to transportation, and not bind, thereby can reduce the use adhesives; And then help environmental protection, be the technical matters that needs to be resolved hurrily of person skilled in the industry.

Summary of the invention

In order to solve the problems of the technologies described above, one side of the present invention has proposed a kind of buffer structure, comprises: a buffering body; Said buffering body has a plurality of rectangular notches, the width of said rectangular notch and its deep equality, wherein; When folding said buffering body so that the bottom of said rectangular notch contacts with the one of which sidepiece along each rectangular notch place; And the buffering body after folding forms between a disposal area, between said disposal area with a ccontaining electronics package.

In one embodiment of the present invention, the buffering body after folding is deployable.

In one embodiment of the present invention, between said disposal area be side's opening.

In one embodiment of the present invention, the quantity of said rectangular notch is four.

In one embodiment of the present invention, the material of said buffering body is the foam material.

In one embodiment of the present invention, said electronics package comprises read out instrument, portable terminal or computer apparatus.

Another aspect of the present invention has also proposed a kind of buffer structure; Comprise: a buffering body, said buffering body has a plurality of V-shaped groove mouths, and a side of said V-shaped groove mouth has a dovetail furrow; Opposite side have one with the corresponding convexity of said dovetail furrow; Wherein, when along each V-slot mouth place folding said buffering body so that said convexity is arranged in said dovetail furrow and the both sides of V-shaped groove mouth are fixed, and; Buffering body after folding forms between a disposal area, between said disposal area with a ccontaining electronics package.

By on can know that buffer structure proposed by the invention both can be reached buffering effect, can also launch to be convenient to transportation, and do not bind, thereby can reduce the use adhesives, and then help environmental protection.

Description of drawings

Fig. 1 has illustrated the structural representation of the existing buffer structure of processing with foamed materials;

Fig. 2 A has illustrated the folding preceding scheme drawing of the buffer structure of an embodiment of the present invention;

Fig. 2 B has illustrated the scheme drawing after the folding of buffer structure shown in Fig. 2 A;

Fig. 3 has illustrated an electronics package and buffer structure 2 stack-mounted scheme drawing mutually;

Fig. 4 A has illustrated the folding preceding scheme drawing of the buffer structure of another embodiment of the present invention; And

Fig. 4 B has illustrated the scheme drawing after the folding of buffer structure shown in Fig. 4 A.

The specific embodiment

Understand technical scheme of the present invention better in order to make this area person skilled; The accompanying drawing that will combine embodiment of the present invention below; Technical scheme in the embodiment of the present invention is carried out clear, intactly description; Obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiments.In addition, graphic only for the purpose of description, according to life size mapping.

With reference to Fig. 2 A-2B, Fig. 2 A has illustrated the folding preceding scheme drawing of the buffer structure of an embodiment of the present invention below; Fig. 2 B has illustrated the scheme drawing after the folding of buffer structure shown in Fig. 2 A.

Shown in Fig. 2 A, buffer structure 2 comprises a buffering body 21, has a plurality of rectangular notches 22 on the buffering body 21; Such as, having 4 rectangular notches 22, each rectangular notch 22 has a bottom 221 and a sidepiece 222; And the width d of each rectangular notch 22 equates with its degree of depth h substantially.In this embodiment, the material of buffering body 21 preferably, is the foam material, but not as limit, also can is other material.

Of Fig. 2 B, cushion body 21 so that the bottom 221 of rectangular notch 22 contacts with its sidepiece 222 when folding along each rectangular notch 22 place, and; Can know by Fig. 2 B; Buffering body 21 after folding forms between a disposal area 23, and in other words, the buffer structure 2 after folding has between the disposal area 23; 23 1 side's openings between this disposal area can be used for a ccontaining electronics package.

Wherein, the buffer structure 2 shown in Fig. 2 B can launch, after the expansion; Its shape is shown in Fig. 2 A, and hence one can see that, when buffer structure 2 during in running condition not; Then can it be expanded into the shape like Fig. 2 A, especially, when buffer structure 2 in transportation; Can be launched into the shape like Fig. 2 A, thereby be convenient to transportation, this has convenience property with respect to existing buffer structure 1.

Again please with reference to Fig. 2 B, Fig. 3, Fig. 3 has illustrated an electronics package and buffer structure 2 stack-mounted scheme drawing mutually.

As shown in Figure 3; Electronics package 3 is assembled with buffer structure 2 mutually; Be about to electronics package 3 and be placed between the disposal area 23 li, buffer structure 2 will produce protective effect to electronics package this moment, can prevent that electronics package 3 receives extraneous collision and the situation that produces flaw or damage occurs.

In this embodiment, electronics package 3 can be a read out instrument, such as liquid crystal indicator, also can be portable terminal; Like smart mobile phone, can be computer apparatus also, like panel computer; Certainly, electronics package 3 can also be other associated electrical product, not as limit.

With reference to Fig. 4 A-4B, Fig. 4 A has illustrated the folding preceding scheme drawing of the buffer structure of another embodiment of the present invention below; Fig. 4 B has illustrated the scheme drawing after the folding of buffer structure shown in Fig. 4 A.

Shown in Fig. 4 A, buffer structure 4 comprise one the buffering body 41, the buffering body 41 have a plurality of V-shaped groove mouths 42, like two V-shaped groove mouths 42, a side of V-shaped groove mouth 42 has a dovetail furrow 43, opposite side have one with dovetail furrow 43 corresponding protruding 44.In this embodiment, the material of buffering body 41 preferably, is the foam material, but not as limit, also can is other material.

Shown in Fig. 4 B, cushion body 41 so that convexity 44 is arranged in dovetail furrow 43 when folding, promptly along each V-slot mouth 42 place; Let convexity 44 and dovetail furrow 43 fasten, thereby make the both sides of V-shaped groove mouth 42 fix, and; Buffering body 41 after folding forms between a disposal area 45, that is, the buffer structure 4 of this moment has between the disposal area 45; 45 is side's opening between the disposal area, and 45 can be used for holding electronic device 3 between this disposal area.

In like manner, the buffer structure 4 shown in Fig. 4 B also can launch, after the expansion; Its shape is shown in Fig. 4 A, and hence one can see that, when buffer structure 4 during in running condition not; Then can it be expanded into the shape like Fig. 4 A, especially, when buffer structure 4 in transportation; Can be launched into the shape like Fig. 4 A, thereby be convenient to transportation, this has convenience property with respect to existing buffer structure 1.In addition,, behind the folding buffering body 41, make convexity 44 and dovetail furrow 43 fasten, thereby make that the both sides of V-shaped groove mouth 43 are fixing more firm because the both sides of V-shaped groove mouth 42 have dovetail furrow 43 and convexity 44.

In the preceding text, illustrate and describe the specific embodiment of the present invention.But those skilled in the art can understand, and under situation without departing from the spirit and scope of the present invention, can also specific embodiments of the invention do various changes and replacement.These changes and replacement all drop within protection scope of the present invention.

Claims

1. a buffer structure is characterized in that, comprises:

One buffering body, said buffering body has a plurality of rectangular notches, the width of said rectangular notch and its deep equality,

Wherein, when folding said buffering body is so that the bottom of said rectangular notch contacts with the one of which sidepiece along each rectangular notch place, and the buffering body after folding forms between a disposal area, between said disposal area with a ccontaining electronics package.

2. buffer structure according to claim 1 is characterized in that, the buffering body after folding is deployable.

3. buffer structure according to claim 1 is characterized in that, is side's opening between said disposal area.

4. buffer structure according to claim 1 is characterized in that, the quantity of said rectangular notch is four.

5. buffer structure according to claim 1 is characterized in that, the material of said buffering body is the foam material.

6. buffer structure according to claim 1 is characterized in that said electronics package comprises read out instrument, portable terminal or computer apparatus.

7. a buffer structure is characterized in that, comprises:

One the buffering body, said buffering body has a plurality of V-shaped groove mouths, a side of said V-shaped groove mouth has a dovetail furrow, opposite side have one with the corresponding convexity of said dovetail furrow,

Wherein, when folding said buffering body is so that said convexity is arranged in said dovetail furrow and the both sides of V-shaped groove mouth are fixed along each V-slot mouth place, and the buffering body after folding forms between a disposal area, between said disposal area with a ccontaining electronics package.

8. buffer structure according to claim 7 is characterized in that, the buffering body after folding is deployable.

9. buffer structure according to claim 7 is characterized in that, is side's opening between said disposal area.

10. buffer structure according to claim 7 is characterized in that, the material of said buffering body is the foam material.