CN102573422A - Method for enhancing heat exchange of free surface array jet system - Google Patents
Method for enhancing heat exchange of free surface array jet system Download PDFInfo
- Publication number
- CN102573422A CN102573422A CN2012100123375A CN201210012337A CN102573422A CN 102573422 A CN102573422 A CN 102573422A CN 2012100123375 A CN2012100123375 A CN 2012100123375A CN 201210012337 A CN201210012337 A CN 201210012337A CN 102573422 A CN102573422 A CN 102573422A
- Authority
- CN
- China
- Prior art keywords
- nanofluid
- heat transfer
- jet
- heat
- heat exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000002708 enhancing effect Effects 0.000 title claims description 4
- 239000002105 nanoparticle Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 4
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 4
- 239000002270 dispersing agent Substances 0.000 claims description 7
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 7
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 7
- 238000005728 strengthening Methods 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 239000012530 fluid Substances 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000004907 flux Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000002474 experimental method Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000008367 deionised water Substances 0.000 description 9
- 229910021641 deionized water Inorganic materials 0.000 description 9
- 238000001816 cooling Methods 0.000 description 5
- 238000010907 mechanical stirring Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- UXIJQZSBOOKEKZ-UHFFFAOYSA-N oxocopper hydrate Chemical compound O.[Cu]=O UXIJQZSBOOKEKZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- AEDZKIACDBYJLQ-UHFFFAOYSA-N ethane-1,2-diol;hydrate Chemical compound O.OCCO AEDZKIACDBYJLQ-UHFFFAOYSA-N 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- KTZTWIUHOOVDLH-UHFFFAOYSA-N copper;ethane-1,2-diol Chemical compound [Cu].OCCO KTZTWIUHOOVDLH-UHFFFAOYSA-N 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明针对现有阵列射流技术中存在换热性能较低等问题,提供一种能够应用于高热流密度条件下电子器件散热的方法,提高了电子器件的散热能力,保证电子器件的安全运行。本发明将高导热性能的纳米流体引入自由表面阵列射流中,选择高导热性能的金属/金属氧化物纳米流体,利用纳米流体的高导热性能和强化换热作用,有效提高阵列射流系统的换热能力,从而获得更高的换热效果。本发明与现有技术相比,其显著优点是:1、实验工质为纳米流体,比普通工质具有更高的导热能力;2、纳米流体中纳米粒子的无规则运动有助于热量在流体中传递,将有助于提高发热体表面温度的均匀性;3、纳米流体中纳米粒子冲击换热表面,提高自由表面阵列射流的换热能力。
The invention aims at the problems of low heat transfer performance in the existing array jet technology, and provides a method for heat dissipation of electronic devices under the condition of high heat flux, which improves the heat dissipation capacity of the electronic devices and ensures the safe operation of the electronic devices. The invention introduces the nanofluid with high thermal conductivity into the free surface array jet, selects the metal/metal oxide nanofluid with high thermal conductivity, utilizes the high thermal conductivity and enhanced heat transfer effect of the nanofluid, and effectively improves the heat transfer of the array jet system ability, so as to obtain a higher heat transfer effect. Compared with the prior art, the present invention has the remarkable advantages as follows: 1. The experimental working fluid is a nanofluid, which has higher thermal conductivity than the common working fluid; 2. The random movement of nanoparticles in the nanofluid helps heat flow The transfer in the fluid will help to improve the uniformity of the surface temperature of the heating element; 3. The nano-particles in the nano-fluid impact the heat-exchanging surface and improve the heat-exchanging capacity of the free-surface array jet.
Description
技术领域 technical field
本发明属于电子器件热控制方法,将高导热性能纳米流体引入自由表面阵列射流中,从而有效增强阵列射流换热效果。 The invention belongs to a heat control method for an electronic device, which introduces a nanofluid with high thermal conductivity into a free surface array jet, thereby effectively enhancing the heat exchange effect of the array jet.
背景技术 Background technique
射流冲击冷却的原理是:流体通过一定形状的喷嘴(圆形或狭缝形)直接喷射到被冷却表面,由于流程短,流速高,在换热表面上形成很大的压力,射流冲击驻点区附近的边界层变得很薄,因而具有极高的换热效率,相比于常规的对流换热技术,射流冷却技术的冲击换热系数要高几倍甚至是一个数量级。对比文献1(Fabbri Metteo, Dhir Vijay K., Optimized heat transfer for high power electronic cooling using arrays of microjets, 127(2005): 760-769.)利用微型孔阵列实验研究了阵列射流的散热能力,证明阵列射流是一种极为有效的电子器件散热方法。但是目前实验研究大量使用的是低导热性能的工质,如对比文献1中实验工质为水,而高导热性能的工质必能带来更高的换热性能。 The principle of jet impingement cooling is: the fluid is directly sprayed to the surface to be cooled through a nozzle of a certain shape (circular or slit shape). Due to the short flow and high flow rate, a large pressure is formed on the heat exchange surface, and the jet impacts the stagnation point. The boundary layer near the cooling zone becomes very thin, so it has extremely high heat transfer efficiency. Compared with conventional convective heat transfer technology, the impact heat transfer coefficient of jet cooling technology is several times or even an order of magnitude higher. Comparative literature 1 (Fabbri Metteo, Dhir Vijay K., Optimized heat transfer for high power electronic cooling using arrays of microjets, 127(2005): 760-769.) used micro-hole array experiments to study the heat dissipation capability of array jets, proving that array Jets are an extremely effective method of cooling electronics. However, at present, a large amount of working fluids with low thermal conductivity are used in experimental studies. For example, the experimental working medium in Reference 1 is water, and high thermal conductivity working fluids will definitely bring higher heat transfer performance.
自从纳米流体(对比文献2 Choi S U S, Enhancing thermal conductivity of fluids with nano-particles . American Society of Mechanical Engineering, 231(1995) : 992103.)被提出后,各国学者对其导热能力、粘度等进行了研究,研究证明了纳米流体对强化换热贡献,但未有人将阵列射流和纳米流体相结合,从而增强阵列射流的换热性能,为未来大功率电器的散热提高有效的技术支持。 Since nanofluids (comparative literature 2 Choi S U S, Enhancing thermal conductivity of fluids with nano-particles . American Society of Mechanical Engineering, 231(1995): 992103.) were proposed, scholars from various countries have conducted research on their thermal conductivity, viscosity, etc. The research has proved that nanofluids contribute to enhanced heat transfer, but no one has combined array jets and nanofluids to enhance the heat transfer performance of array jets and provide effective technical support for the heat dissipation of high-power electrical appliances in the future.
本方法将纳米流体引入自由表面阵列射流中,将纳米流体的高导热能力和对换热的强化作用和自由表面阵列射流极高的对流换热性能相结合,有效提高了阵列射流的冲击换热能力,从而更加有效的满足更高热流密度电子器件的散热需求,有效控制电子器件的表面温度,满足未来大功率电子器件的工作温度需求。 This method introduces the nanofluid into the free surface array jet, combines the high thermal conductivity of the nanofluid and the strengthening effect on heat transfer with the extremely high convective heat transfer performance of the free surface array jet, and effectively improves the impact heat transfer of the array jet ability, so as to more effectively meet the heat dissipation requirements of higher heat flux electronic devices, effectively control the surface temperature of electronic devices, and meet the operating temperature requirements of future high-power electronic devices.
发明内容 Contents of the invention
本发明的目的在于针对现有阵列射流技术中存在换热性能较低等问题,提供一种能够应用于高热流密度条件下电子器件散热的方法,提高了电子器件的散热能力,保证电子器件的安全运行。 The purpose of the present invention is to solve the problems of low heat transfer performance in the existing array jet technology, and provide a method that can be applied to heat dissipation of electronic devices under the condition of high heat flux, which improves the heat dissipation capacity of electronic devices and ensures the stability of electronic devices. safe operation.
将高导热性能的纳米流体引入自由表面阵列射流中,选择高导热性能的金属/金属氧化物纳米流体,利用纳米流体的高导热性能和强化换热作用,有效提高阵列射流系统的换热能力,从而获得更高的换热效果。 Introduce the nanofluid with high thermal conductivity into the free surface array jet, select the metal/metal oxide nanofluid with high thermal conductivity, and use the high thermal conductivity and enhanced heat transfer effect of the nanofluid to effectively improve the heat exchange capacity of the array jet system. Thereby obtaining a higher heat transfer effect.
实现本发明的技术解决方案为: Realize the technical solution of the present invention is:
一种强化自由表面阵列射流换热的方法,包括以下具体步骤: A method for strengthening free surface array jet heat transfer, comprising the following specific steps:
(1)选择具有高导热性能和高分散性能的纳米粒子; (1) Select nanoparticles with high thermal conductivity and high dispersion;
(2)制备纳米流体; (2) Preparation of nanofluids;
(3)优化自由表面阵列射流系统; (3) Optimize the free surface array jet system;
(4)将制备好的纳米流体加入自由表面阵列射流系统,调节工作环境,进行自由表面阵列射流换热。 (4) Add the prepared nanofluid into the free surface array jet system, adjust the working environment, and perform free surface array jet heat exchange.
第(1)步所述的高导热性能和高分散性能的纳米粒子为金属/金属氧化物纳米粒子,优选铜、铝或者其氧化物。 The nanoparticles with high thermal conductivity and high dispersion performance described in step (1) are metal/metal oxide nanoparticles, preferably copper, aluminum or their oxides.
第(2)步所述的纳米流体采用经典的两步法制备,所述的纳米流体的浓度为0.17-1.34Vol.%。 The nanofluid in step (2) is prepared by a classic two-step method, and the concentration of the nanofluid is 0.17-1.34Vol.%.
第(3)步所述的优化阵列射流系统即为优化换热设备本体,换热本体的优化要求相邻射流孔间距S和射流孔直径D比值范围为3-10,冲击间距H和射流孔直径比值为3.5-15,射流孔直径范围为0.5mm-3.0mm;同时换热表面刻槽强化换热能力,槽深h选值为0.5mm-1.5mm,槽宽d选值为0.5mm-2.0mm,槽间距p选值为0.5mm-2.0mm。 The optimized array jet system described in step (3) is to optimize the body of the heat exchange equipment. The optimization of the heat exchange body requires that the ratio of the distance S between adjacent jet holes to the diameter D of the jet hole be in the range of 3-10, and the impact distance H and the jet hole The diameter ratio is 3.5-15, and the diameter range of the jet hole is 0.5mm-3.0mm; at the same time, the heat exchange surface is grooved to enhance the heat exchange capacity. The groove depth h is selected to be 0.5mm-1.5mm, and the groove width d is selected to be 0.5mm- 2.0mm, the selected value of groove spacing p is 0.5mm-2.0mm.
在第(2)步中,为了达到更好的分散效果,采用十二烷基苯磺酸钠作为分散剂,所述的十二烷基苯磺酸钠的添加量为0-0.1%。 In step (2), in order to achieve a better dispersion effect, sodium dodecylbenzenesulfonate is used as a dispersant, and the amount of sodium dodecylbenzenesulfonate added is 0-0.1%.
本发明与现有技术相比,其显著优点是: Compared with the prior art, the present invention has the remarkable advantages of:
1、实验工质为纳米流体,比普通工质具有更高的导热能力; 1. The experimental working medium is nanofluid, which has higher thermal conductivity than ordinary working medium;
2、纳米流体中纳米粒子的无规则运动有助于热量在流体中传递,将有助于提高发热体表面温度的均匀性; 2. The irregular movement of nanoparticles in the nanofluid helps to transfer heat in the fluid, which will help to improve the uniformity of the surface temperature of the heating element;
3、纳米流体中纳米粒子冲击换热表面,提高自由表面阵列射流的换热能力。 3. The nanoparticles in the nanofluid impact the heat exchange surface, improving the heat exchange capacity of the free surface array jet.
附图说明 Description of drawings
图1是本发明实施例1纳米流体作为散热工质对热流密度为50W/cm2的换热表面进行散热实验的换热效果图。 Fig. 1 is a heat transfer effect diagram of a heat transfer experiment performed on a heat transfer surface with a heat flux density of 50 W/cm 2 using nanofluid as a heat dissipation working medium in Example 1 of the present invention.
图2是本发明实施例2纳米流体作为散热工质对热流密度为50W/cm2的换热表面进行散热实验的换热效果图。 Fig. 2 is a heat transfer effect diagram of a heat transfer experiment performed on a heat transfer surface with a heat flux density of 50 W/cm 2 using the nanofluid of Example 2 of the present invention as a cooling medium.
具体实施方式 Detailed ways
下面结合附图和具体实施方式对本发明作进一步描述。 The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
本方法将纳米流体引入自由表面阵列射流中,包括纳米流体的选择,自由表面阵列射流环境以及工作条件。 The method introduces the nanofluid into the free surface array jet, including the choice of the nanofluid, the free surface array jet environment and working conditions.
实现本方法主要表现在纳米流体的选择以及工作条件的控制。(1)选择具有高导热性能和高分散性能的铜、铝或者其氧化物纳米粒子;(2)利用经典的两步法制备浓度为0.17-1.34Vol.%的纳米流体,考察纳米流体的稳定性和分散性,确保所制备的纳米流体可以长时间安全使用;(3)优化自由表面阵列射流系统,强化系统换热能力,换热本体的优化要求相邻射流孔间距S和射流孔直径D比值范围为1.5-10,冲击间距H和射流孔直径比值为3.5-15,射流孔直径范围为0.5mm-3.0mm;同时换热表面刻槽强化换热能力,槽深h选值为0.5mm-1.5mm,槽宽d选值为0.5mm-2.0mm,槽间距p选值为0.5mm-2.0mm;(4)将制备好的纳米流体加入自由表面阵列射流系统,调节工作环境,进行自由表面阵列射流换热。 The realization of this method is mainly manifested in the selection of nanofluids and the control of working conditions. (1) Select copper, aluminum or their oxide nanoparticles with high thermal conductivity and high dispersion properties; (2) Prepare nanofluids with a concentration of 0.17-1.34Vol.% using a classic two-step method, and investigate the stability of nanofluids (3) Optimize the free surface array jet system to enhance the heat transfer capacity of the system, and the optimization of the heat transfer body requires the spacing S of adjacent jet holes and the diameter of the jet hole D The ratio range is 1.5-10, the ratio of the impact distance H to the jet hole diameter is 3.5-15, and the jet hole diameter range is 0.5mm-3.0mm; at the same time, the heat exchange surface is grooved to enhance the heat transfer capacity, and the groove depth h is selected as 0.5mm -1.5mm, the selected value of groove width d is 0.5mm-2.0mm, and the selected value of groove spacing p is 0.5mm-2.0mm; (4) Add the prepared nanofluid to the free surface array jet system to adjust the working environment and carry out free Surface array jet heat transfer.
实施例1 Example 1
1、量取乙二醇和去离子水各1.5L,充分混合均匀,制成1:1的乙二醇-水溶液; 1. Measure 1.5L each of ethylene glycol and deionized water, and mix them well to make a 1:1 ethylene glycol-water solution;
2、称取120g平均直径50nm的金属铜纳米粒子,将其加入乙二醇-水溶液中,将其放入超声设备中超声4h,同时进行机械搅拌,制备出体积分数为0.56%的铜-乙二醇-水纳米流体,此即两步法制备纳米流体; 2. Weigh 120g of metal copper nanoparticles with an average diameter of 50nm, add it to ethylene glycol-water solution, put it into an ultrasonic device for ultrasonication for 4h, and perform mechanical stirring at the same time to prepare copper-ethylene glycol with a volume fraction of 0.56%. Glycol-water nanofluid, which is a two-step method for preparing nanofluid;
3、优化系统,对系统管内进行保温处理,调节换热设备,选择射流孔直径为1.5mm,S/D为3,H/D为7;表面刻槽,槽深0.5mm,槽宽0.5mm,槽间距0.5mm,调节射流孔位置,保证阵列射流孔正对换热表面中心; 3. Optimize the system, heat-preserve the inside of the system tube, adjust the heat exchange equipment, select the diameter of the jet hole to be 1.5mm, the S/D to be 3, and the H/D to be 7; the surface is grooved, the groove depth is 0.5mm, and the groove width is 0.5mm , the groove spacing is 0.5mm, adjust the position of the jet hole to ensure that the array jet hole is facing the center of the heat exchange surface;
4、将制备的纳米流体加入实验系统,调节实验温度至15℃,换热工质流量0.144m3/h,模拟热源加热至50W/cm2,,开始换热实验。 4. Add the prepared nanofluid into the experimental system, adjust the experimental temperature to 15°C, the flow rate of the heat exchange working medium is 0.144m3/h, and the simulated heat source is heated to 50W/cm2 to start the heat exchange experiment.
其换热效果如图1所示,将纳米流体引入自由表面阵列射流中,与未使用纳米流体相比,系统换热性能有很大的提高,最高提升幅度达到了18.5%,显示了使用纳米流体作为工质的优越性。同时,图1也说明了过高的纳米粒子份额可能会引起换热性能的下降,因此选择合适的纳米粒子种类和份额是非常关键的因素。 The heat transfer effect is shown in Figure 1. When nanofluids are introduced into the free surface array jet, compared with those without using nanofluids, the heat transfer performance of the system is greatly improved, with the highest improvement rate reaching 18.5%. The superiority of fluid as a working medium. At the same time, Figure 1 also shows that an excessively high proportion of nanoparticles may cause a decrease in heat transfer performance, so selecting the appropriate type and proportion of nanoparticles is a very critical factor.
实施例2 Example 2
1、量取去离子水3L,称取38g平均直径25nm的金属铜纳米粒子,将其加入去离子水中,同时添加质量分数0.05%的十二烷基苯磺酸钠作为分散剂,将其放入超声设备中超声4h,同时进行机械搅拌,制备出体积分数为0.17%的铜-水纳米流体; 1. Measure 3L of deionized water, weigh 38g of metal copper nanoparticles with an average diameter of 25nm, add it to deionized water, and add sodium dodecylbenzenesulfonate with a mass fraction of 0.05% as a dispersant at the same time, put it in Ultrasonic 4h in ultrasonic equipment, carry out mechanical stirring simultaneously, prepare the copper-water nanofluid that volume fraction is 0.17%;
2、优化系统,对系统管内进行保温处理,调节换热设备,选择射流孔直径为3.0mm,S/D为1.5,H/D为5;表面刻槽,槽深1.0mm,槽宽0.5mm,槽间距0.5mm,调节射流孔位置,保证阵列射流孔正对换热表面中心; 2. Optimize the system, heat-preserve the inside of the system tube, adjust the heat exchange equipment, select the jet hole diameter as 3.0mm, S/D as 1.5, and H/D as 5; the surface is grooved, the groove depth is 1.0mm, and the groove width is 0.5mm , the groove spacing is 0.5mm, adjust the position of the jet hole to ensure that the array jet hole is facing the center of the heat exchange surface;
3、将制备的纳米流体加入实验系统,调节实验温度至21℃,换热工质流量0.22m3/h,模拟热源加热至49W/cm2,,开始换热实验。 3. Add the prepared nanofluid into the experimental system, adjust the experimental temperature to 21°C, the flow rate of the heat exchange working medium to 0.22m 3 /h, and heat the simulated heat source to 49W/cm 2 , and start the heat exchange experiment.
其换热效果如图2所示例如,从图2可以得出,将纳米流体引入自由表面阵列射流中,与未使用纳米流体相比,系统换热性能有很大的提高,最高提升幅度达到了6.5%,但是体积份额较低时可能无法获得有效的强化作用。图2也说明分散剂会影响纳米流体的换热能力。 The heat transfer effect is shown in Fig. 2. For example, it can be concluded from Fig. 2 that the heat transfer performance of the system is greatly improved when the nanofluid is introduced into the free-surface array jet, and the highest improvement reaches 6.5%, but the effective strengthening effect may not be obtained when the volume fraction is low. Figure 2 also illustrates that dispersants can affect the heat transfer capability of nanofluids.
实施例3 Example 3
1、量取去离子水3L,称取79g平均直径50nm的氧化铜纳米粒子,将其加入去离子水中,同时添加质量分数0.1%的十二烷基苯磺酸钠作为分散剂,将其放入超声设备中超声4h,同时进行机械搅拌,制备出体积分数为0.33%的氧化铜-水纳米流体; 1. Measure 3L of deionized water, weigh 79g of copper oxide nanoparticles with an average diameter of 50nm, add it to deionized water, and add 0.1% sodium dodecylbenzenesulfonate as a dispersant at the same time, put it in Ultrasonic 4h in ultrasonic equipment, carry out mechanical stirring simultaneously, prepare the copper oxide-water nanofluid that volume fraction is 0.33%;
2、优化系统,对系统管内进行保温处理,调节换热设备,选择射流孔直径为0.5mm,S/D为10,H/D为15;表面刻槽,槽深1.5mm,槽宽2.0mm,槽间距2.0mm,调节射流孔位置,保证阵列射流孔正对换热表面中心; 2. Optimize the system, heat-preserve the inside of the system tube, adjust the heat exchange equipment, select the jet hole diameter as 0.5mm, S/D as 10, and H/D as 15; the surface is grooved, the groove depth is 1.5mm, and the groove width is 2.0mm , the groove spacing is 2.0mm, adjust the position of the jet hole to ensure that the array jet hole is facing the center of the heat exchange surface;
3、将制备的纳米流体加入实验系统,调节实验温度至20℃,换热工质流量0.197m3/h,模拟热源加热至50W/cm2,开始换热实验。 3. Add the prepared nanofluid into the experimental system, adjust the experimental temperature to 20°C, the flow rate of the heat exchange working medium is 0.197m3/h, and the simulated heat source is heated to 50W/cm2, and the heat exchange experiment is started.
利用上述方法进行换热实验,与未使用纳米流体相比,系统换热性能最高提升幅度达到了4.3%。 Using the above method to conduct heat transfer experiments, compared with that without using nanofluids, the maximum increase in heat transfer performance of the system reached 4.3%.
实施例4 Example 4
1、量取去离子水3L,称取240g平均直径50nm的金属铝纳米粒子,将其加入去离子水中,同时添加质量分数0.05%的十二烷基苯磺酸钠作为分散剂,将其放入超声设备中超声4h,同时进行机械搅拌,制备出体积分数为1.343 %的氧化铜-水纳米流体; 1. Measure 3L of deionized water, weigh 240g of metal aluminum nanoparticles with an average diameter of 50nm, add it to deionized water, and add 0.05% sodium dodecylbenzenesulfonate as a dispersant at the same time, put it in Ultrasonic 4h in ultrasonic equipment, carry out mechanical stirring simultaneously, prepare the copper oxide-water nanofluid that volume fraction is 1.343%;
2、优化系统,对系统管内进行保温处理,调节换热设备,选择射流孔直径为1.5mm,S/D为3,H/D为7;表面刻槽,槽深1.0mm,槽宽1.5mm,槽间距1.5mm,调节射流孔位置,保证阵列射流孔正对换热表面中心; 2. Optimize the system, heat-preserve the inside of the system tube, adjust the heat exchange equipment, select the diameter of the jet hole to be 1.5mm, the S/D to be 3, and the H/D to be 7; the surface is grooved, the groove depth is 1.0mm, and the groove width is 1.5mm , the groove spacing is 1.5mm, adjust the position of the jet hole to ensure that the array jet hole is facing the center of the heat exchange surface;
3、将制备的纳米流体加入实验系统,调节实验温度至20℃,换热工质流量0.197m3/h,模拟热源加热至50W/cm2,开始换热实验。 3. Add the prepared nanofluid into the experimental system, adjust the experimental temperature to 20°C, the flow rate of the heat exchange working medium is 0.197m 3 /h, and the simulated heat source is heated to 50W/cm 2 to start the heat exchange experiment.
利用上述方法进行换热实验,与未使用纳米流体相比,系统换热性能最高提升幅度达到了8.4%。 Using the above method to conduct heat transfer experiments, compared with that without using nanofluids, the heat transfer performance of the system can be improved by up to 8.4%.
实施例5 Example 5
1、量取去离子水3L,称取139g平均直径50nm的氧化铝纳米粒子,将其加入去离子水中,同时添加质量分数0.05%的十二烷基苯磺酸钠作为分散剂,将其放入超声设备中超声4h,同时进行机械搅拌,制备出体积分数为0.746%的氧化铜-水纳米流体; 1. Measure 3L of deionized water, weigh 139g of alumina nanoparticles with an average diameter of 50nm, add it to deionized water, and add 0.05% sodium dodecylbenzenesulfonate as a dispersant at the same time, put it in Ultrasonic 4h in ultrasonic equipment, carry out mechanical stirring simultaneously, prepare the copper oxide-water nanofluid that volume fraction is 0.746%;
2、优化系统,对系统管内进行保温处理,调节换热设备,选择射流孔直径为1.0mm,S/D为5,H/D为10,表面刻槽,槽深1.5mm,槽宽1.5mm,槽间距1.5mm,调节射流孔位置,保证阵列射流孔正对换热表面中心; 2. Optimize the system, heat-preserve the inside of the system tube, adjust the heat exchange equipment, select the jet hole diameter as 1.0mm, S/D as 5, H/D as 10, groove on the surface, groove depth 1.5mm, groove width 1.5mm , the groove spacing is 1.5mm, adjust the position of the jet hole to ensure that the array jet hole is facing the center of the heat exchange surface;
3、将制备的纳米流体加入实验系统,调节实验温度至21℃,换热工质流量0.172m3/h,模拟热源加热至50W/cm2,开始换热实验。 3. Add the prepared nanofluid into the experimental system, adjust the experimental temperature to 21°C, the flow rate of the heat exchange working medium is 0.172m3/h, the simulated heat source is heated to 50W/cm2, and the heat exchange experiment is started.
利用上述方法进行换热实验,与未使用纳米流体相比,系统换热性能最高提升幅度达到了5.1%。 Using the above method to conduct heat transfer experiments, compared with that without using nanofluids, the maximum increase in heat transfer performance of the system reached 5.1%.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210012337.5A CN102573422B (en) | 2012-01-16 | 2012-01-16 | Method for enhancing heat exchange of free surface array jet system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210012337.5A CN102573422B (en) | 2012-01-16 | 2012-01-16 | Method for enhancing heat exchange of free surface array jet system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102573422A true CN102573422A (en) | 2012-07-11 |
CN102573422B CN102573422B (en) | 2014-09-17 |
Family
ID=46417462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210012337.5A Active CN102573422B (en) | 2012-01-16 | 2012-01-16 | Method for enhancing heat exchange of free surface array jet system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102573422B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102757769A (en) * | 2012-08-03 | 2012-10-31 | 何秋生 | Water-based nano-oxide coolant for cooling high-power central processing unit (CPU) chip and operation system |
CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
CN116314084A (en) * | 2023-05-24 | 2023-06-23 | 中国人民解放军国防科技大学 | A microparticle flow heat exchange device based on a jet actuator |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2586694Y (en) * | 2002-11-22 | 2003-11-19 | 罗行 | Nnometer working fluid enclosed type natural circulation heat transmission apparatus |
CN101231148A (en) * | 2008-02-21 | 2008-07-30 | 上海交通大学 | Circular tube microchannel heat pipe using carbon nanotube suspension as working medium |
-
2012
- 2012-01-16 CN CN201210012337.5A patent/CN102573422B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2586694Y (en) * | 2002-11-22 | 2003-11-19 | 罗行 | Nnometer working fluid enclosed type natural circulation heat transmission apparatus |
CN101231148A (en) * | 2008-02-21 | 2008-07-30 | 上海交通大学 | Circular tube microchannel heat pipe using carbon nanotube suspension as working medium |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102757769A (en) * | 2012-08-03 | 2012-10-31 | 何秋生 | Water-based nano-oxide coolant for cooling high-power central processing unit (CPU) chip and operation system |
CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
CN107567247B (en) * | 2017-09-07 | 2019-07-02 | 太原理工大学 | A kind of electronic device heat dissipation method of array jet, solid-liquid phase change coupling |
CN116314084A (en) * | 2023-05-24 | 2023-06-23 | 中国人民解放军国防科技大学 | A microparticle flow heat exchange device based on a jet actuator |
CN116314084B (en) * | 2023-05-24 | 2023-08-04 | 中国人民解放军国防科技大学 | A microparticle flow heat exchange device based on a jet actuator |
Also Published As
Publication number | Publication date |
---|---|
CN102573422B (en) | 2014-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102271485B (en) | Array jetting, boiling cooling exchange method based on combination under high heat flux condition | |
CN103594430B (en) | Micro-channel radiator for dissipating heat of power electronic device | |
CN104112736B (en) | 3D IC with the complicated microchannel fluid cooling of interlayer | |
CN101533810A (en) | Pulsating heat pipe radiator having foam | |
CN104658992A (en) | Novel micro heat sink provided with pin-fin array | |
CN204948606U (en) | Two phase flow microchannel cold plates | |
CN104244680A (en) | Composite water cooling plate | |
Zhou et al. | Research progress of the liquid cold plate cooling technology for server electronic chips: A review | |
CN107660102A (en) | Conduit nano flower composite wick structure and preparation method thereof | |
CN103188912A (en) | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium | |
CN105004204A (en) | Flat-plate type loop heat pipe evaporator experiment system | |
CN102573422B (en) | Method for enhancing heat exchange of free surface array jet system | |
JP2022519266A (en) | Boiling enhancement device | |
CN110146956A (en) | An internal heat transport microstructure of an optical module | |
CN108167790A (en) | For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density | |
CN108050497A (en) | For the side-emitting LED lamp radiator under superelevation heat flow density | |
CN113446883B (en) | A dual-fluid loop staggered wave-type microchannel radiator based on elastic turbulence | |
CN103824825B (en) | Micro-channel phase change heat exchange device | |
CN206061407U (en) | Liquid-cooled heat-pipe radiator | |
CN104729338B (en) | Gradient metal foam heat sink | |
CN103822519B (en) | Porous surface boiling heat transfer intensifying device and preparation method thereof | |
CN206847442U (en) | Variable-diameter serial and parallel channel plate type pulsating heat pipe | |
CN111093347B (en) | Self-circulation efficient radiator | |
CN207893719U (en) | For photo-thermal integrated device, radiator and the LED light under superelevation heat flow density | |
CN107734934A (en) | It is a kind of directly to contact communicate-type heat-pipe radiator and application method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |