CN102573315B - Process for forming circuit of epoxy resin circuit board - Google Patents
Process for forming circuit of epoxy resin circuit board Download PDFInfo
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- CN102573315B CN102573315B CN201210022089.2A CN201210022089A CN102573315B CN 102573315 B CN102573315 B CN 102573315B CN 201210022089 A CN201210022089 A CN 201210022089A CN 102573315 B CN102573315 B CN 102573315B
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- epoxy resin
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- assembled monolayer
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Abstract
The invention discloses a process for forming a circuit of an epoxy resin circuit board, wherein a mechanical treatment is carried out to the surface of an epoxy resin substrate by sand blasting, and sand blasting parameters are controlled, so that the surface of the substrate has a reasonable surface shape, thereby being beneficial to improving the surface adhesive force; simultaneously, a corona treatment for generating polar groups is carried out before a process of self-assembled monolayer, so that the surface of the substrate and the self-assembled monolayer are combined more firmly by chemical bonds. According to the invention, the technical process is simple, the production cost is low, the production efficiency is high, and strong adhesive force exists between the circuit of the product and the substrate, thereby greatly prolonging a service life of the circuit board, and saving the use cost; and meanwhile, as the shape of the self-assembled monolayer is consistent to that of the circuit, not only the material is saved, but also the printing of the self-assembled monolayer can have pertinence, and occurrence of disqualified surface is easy to avoid, thereby being favorable for guaranteeing product quality.
Description
Technical field
The present invention relates to a kind of technique for circuit board making, be specifically related to a kind of process for forming circuit of epoxy circuit board.
Background technology
Epoxy resin is a kind of base material more generally used during printed circuit board (PCB) is produced, the conventional method that epoxy resin base plate is formed plain conductor is all be based upon on the basis of photoetching technique, photoetching process need through multiprogrammings such as the etchings of plated film, exposure, development and high-risk reagent, and need the instrument configuring a series of precision to meet harsh experiment condition; Whole technical process is comparatively complicated, inefficiency; And there is many potential safety hazards, danger is comparatively large, and can cause the problems such as environmental pollution, production cost is high.
Along with the development of printed-board technology, there is the method for multiple minimizing printed circuit board (PCB) processing procedure operation; As Chinese patent 200510029511.7,200610026693.7,200810094824.4 all discloses a kind of method of carrying out metal pin deposition formation plain conductor at substrate surface, the method comprises carries out self-assembled modified to substrate and forms Iy self-assembled layer, utilize inkjet technology to form required catalyst layer on modified substrate, finally use chemical plating method depositing metal layers on substrate.Said method needs to carry out surface treatment to substrate before self assembly, generally adopts concentrated acid oxidase substrate, needs fully to clean after oxidation, will store a large amount of acid solution simultaneously, and spent acid discharge also can pollute, and is unfavorable for large-scale production.The substrate surface of oxidation processes is comparatively smooth, and the wettability of Iy self-assembled layer and substrate is poor, and time self-assembled modified, adhesive force is little, cannot reach predetermined adhesive strength, reduces the quality of circuit board; Meanwhile, in prior art, self-assembled modified is all process whole substrate, causes the waste of non-spray printing catalyst place self-assembled film, is unfavorable for falling dirty reduction of discharging.
Therefore, need a kind of process for forming circuit of epoxy circuit board, technical process is simple, there is lower production cost and higher production efficiency, between the circuit of product and substrate, there is larger adhesive force, greatly extend the useful life of circuit board, save use cost.
Summary of the invention
In view of this, object of the present invention provides a kind of process for forming circuit of epoxy circuit board, technical process is simple, there is lower production cost and higher production efficiency, between the circuit of product and substrate, there is larger adhesive force, greatly extend the useful life of circuit board, save use cost.
The process for forming circuit of epoxy circuit board of the present invention, comprises the following steps:
A. surface treatment:
I is to the process of epoxy resin base plate surface sand-blasting and clean out, and blasting treatment adopts 50-300 order sand ball to be evenly sprayed onto epoxy resin base plate surface, processing time 5s-1min, blasting pressure 0.3Mpa-2.0Mpa;
II is by epoxy resin base plate corona treatment clean for removing surface, and operating voltage 5-15kV, processing speed 2-20m/min, electrode gap 1-5mm, substrate produces-C=O ,-NH
2or-OH isopolarity group;
B. Printing techniques is utilized to form the self assembled monolayer with circuit identical patterns in the epoxy resin base plate surface of step a, the composition of self-composed monomolecular is that long-chain carbon alkanes or aromatic compound are contained in one end, and the other end is containing the functional group of-SH ,-OH or-NH; Described-SH ,-OH or-NH active group increase the adhesive force of substrate and coating;
C. on self assembled monolayer, spray printing is used for the catalyst of electroless plating conducting metal, forms the catalyst layer with circuit identical patterns;
D. the epoxy resin base plate of step c is placed in the chemical plating fluid of conducting metal, with electroless grown conducting metal wire on the catalyst layer of circuit identical patterns.
Further, in step b, the volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 0.1%-15%;
Further, catalyst layer adopts the colloidal sol of gold, silver or palladium, or the ion salt solution of gold, silver or palladium is formed by spray printing, and as adopted the ion salt solution of gold, silver or palladium, then concentration is 1-15mmol/L; In steps d, the chemical plating fluid of conducting metal is the chemical plating fluid of copper;
Further, in step a, at epoxy resin base plate Surface Creation-C=O ,-NH
2or-OH isopolarity group;
Further, corona treatment operating voltage is 10kV, processing speed 12m/min, electrode gap 2mm;
Further, in step c, catalyst layer is formed by spray printing as adopted the ion salt solution of gold, silver or palladium, then concentration is 7mmol/L;
Further, the volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 10%;
Further, blasting treatment adopts 120 order sand balls to be evenly sprayed onto epoxy resin base plate surface, processing time 30s, blasting pressure 0.8Mpa.
Beneficial effect of the present invention: the process for forming circuit of epoxy circuit board of the present invention, by sandblasting, mechanical treatment is carried out to epoxy resin base plate surface, and by the control to sandblasting parameter, make substrate surface have rational surface configuration, be beneficial to the adhesive force improving surface; Simultaneously, the corona treatment of polarization group is also carried out before carrying out self assembled monolayer technique, make substrate surface and self assembled monolayer more firm by chemical bonds, technical process is simple, there is lower production cost and higher production efficiency, between the circuit of product and substrate, there is larger adhesive force, greatly extend the useful life of circuit board, save use cost; Meanwhile, self assembled monolayer is consistent with circuitry shapes, not only saves material, self assembled monolayer can also be made to print pointed, be easy to avoid occurring defective surface, be beneficial to guarantee product quality.
Embodiment
The embodiment of the process for forming circuit of epoxy circuit board of the present invention:
The process for forming circuit of epoxy circuit board comprises the following steps:
A. surface treatment:
I is to the process of epoxy resin base plate surface sand-blasting and clean out, and blasting treatment adopts 50-300 order sand ball to be evenly sprayed onto epoxy resin base plate surface, processing time 5s-1min, blasting pressure 0.3Mpa-2.0Mpa;
II is by epoxy resin base plate corona treatment clean for removing surface, and operating voltage 5-15kV, processing speed 2-20m/min, electrode gap 1-5mm, carries out under atmospheric environment, and substrate produces-C=O ,-NH
2or-OH isopolarity group;
B. Printing techniques is utilized to form the self assembled monolayer with circuit identical patterns in the epoxy resin base plate surface of step a, the composition of self-composed monomolecular is that long-chain carbon alkanes or aromatic compound are contained in one end, and the other end is containing the functional group of-SH ,-OH or-NH; Described-SH ,-OH or-NH active group increase the adhesive force of substrate and coating;
C. on self assembled monolayer, spray printing is used for the catalyst of electroless plating conducting metal, forms the catalyst layer with circuit identical patterns;
D. the epoxy resin base plate of step c is placed in the chemical plating fluid of conducting metal, with electroless grown conducting metal wire on the catalyst layer of circuit identical patterns.
The present invention utilizes high-frequency voltage at processed substrate surface corona discharge, the various ions produced after air ionization are under the effect of highfield, the pretreated substrate of acceleration shock, under the bombardment of high energy particle, the bond fission of substrate surface macromolecule, material surface creates many different free radicals and unsaturated center, water in the free radical on these shallow surfaces and the air of unsaturated center and adsorption reacts, thus form amido at fiber surface, amide groups, carbonyl and hydroxyl isopolarity group, substrate surface is activated, improve wettability of the surface and water ratio limit intensity.
The generation of self assembled monolayer is a spontaneous process, substrate is immersed in the weak solution containing bioactive molecule, on substrate, form that orientation is regular by chemical bond Spontaneous adsorption, arrangement orderly monolayer closely, self assembled monolayer can be divided into three parts structure, one is the head base of molecule, the reflecting point on it and substrate surface with covalent bond (as Si-O key and Au-S key etc.) or ionic bond (as Ag
+) combine; Two is alkyl chains of molecule, makes bioactive molecule at the surface of solids in order and close-packed arrays between chain and chain by van der Waals interaction; Three is molecular end groups, as-CH
3,-COOH ,-OH ,-NH
2,-SH ,-CH
2-CH
3and-CCH
2deng, by terminal reactive group to obtain the interface of different physical and chemical performance.
Embodiment one
The process for forming circuit of the epoxy circuit board of the present embodiment, comprises the following steps:
A. surface treatment:
I is to the process of epoxy resin base plate surface sand-blasting and clean out, and blasting treatment adopts 120 order sand balls to be evenly sprayed onto epoxy resin base plate surface, processing time 30s, blasting pressure 0.8Mpa;
Epoxy resin base plate clean for removing surface is carried out corona treatment by II, adopts corona discharge device (Dalian radio nine factory, lower same); Operating voltage 10kV, processing speed 12m/min, electrode gap 2mm, carries out under atmospheric environment, and substrate hydrophily test result is in table 1;
B. Printing techniques is utilized to form the self assembled monolayer with circuit identical patterns in the epoxy resin base plate surface of step a, ink-jet printer is adopted to realize (Japanese MicroCraft M Co., Ltd. J6151 type, lower same), volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 10%, and the composition of self-composed monomolecular is 3-mercaptopropyi trimethoxy silane;
C. on self assembled monolayer, spray printing is used for the catalyst of electroless plating conducting metal, catalyst layer adopts palladium chloride solution to form the catalyst layer with circuit identical patterns by spray printing, according to the characteristic containing long-chain carbon alkanes or aromatic compound, catalyst layer and 3-mercaptopropyi trimethoxy silane terminal reactive group strong bonded; The concentration of palladium chloride solution is 7mmol/L;
D. the epoxy resin base plate of step c is placed in the chemical plating fluid of conducting metal, with electroless grown conducting metal wire on the catalyst layer of circuit identical patterns; The chemical plating fluid of conducting metal is the chemical plating fluid of copper, chemical plating fluid formula presses copper sulphate 10g/L, EDETATE DISODIUM 40g/L, NaOH 10g/L, potassium ferrocyanide 0.2g/L, inferior sodium phosphate 10g/L, distilled water 30g/L, PH is about 12, and working temperature 45-60 DEG C, namely the formula of electroplate liquid can adopt proportioning of the prior art.
Embodiment two
The process for forming circuit of the epoxy circuit board of the present embodiment, comprises the following steps:
A. surface treatment:
I is to the process of epoxy resin base plate surface sand-blasting and clean out, and blasting treatment adopts 50 order sand balls to be evenly sprayed onto epoxy resin base plate surface, processing time 5s, blasting pressure 2.0Mpa;
II by epoxy resin base plate corona treatment clean for removing surface, operating voltage 5kV, processing speed 2m/min, electrode gap 1mm, carries out under atmospheric environment, and substrate hydrophily test result is in table 1;
B. Printing techniques is utilized to form the self assembled monolayer with circuit identical patterns in the epoxy resin base plate surface of step a, volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 15%, and the composition of self-composed monomolecular is 3-aminopropyl trimethoxysilane;
C. on self assembled monolayer, spray printing is used for the catalyst of electroless plating conducting metal, and catalyst layer adopts silver chloride solution to form the catalyst layer with circuit identical patterns by spray printing; According to the characteristic containing long-chain carbon alkanes or aromatic compound, catalyst layer and 3-mercaptopropyi trimethoxy silane terminal reactive group strong bonded; The concentration of silver chloride solution is 1mmol/L;
D. the epoxy resin base plate of step c is placed in the chemical plating fluid of conducting metal, with electroless grown conducting metal wire on the catalyst layer of circuit identical patterns; The chemical plating fluid of conducting metal is the chemical plating fluid of copper, chemical plating fluid formula presses copper sulphate 10g/L, EDETATE DISODIUM 40g/L, NaOH 10g/L, potassium ferrocyanide 0.2g/L, inferior sodium phosphate 10g/L, distilled water 30g/L, PH is about 12, and working temperature 45-60 DEG C, namely the formula of electroplate liquid can adopt proportioning of the prior art.
Embodiment three
The process for forming circuit of the epoxy circuit board of the present embodiment, comprises the following steps:
A. surface treatment:
I is to the process of epoxy resin base plate surface sand-blasting and clean out, and blasting treatment adopts 300 order sand balls to be evenly sprayed onto epoxy resin base plate surface, processing time 60s, blasting pressure 0.3Mpa;
II by epoxy resin base plate corona treatment clean for removing surface, operating voltage 15kV, processing speed 20m/min, electrode gap 5mm, carries out under atmospheric environment, and substrate hydrophily test result is in table 1;
B. Printing techniques is utilized to form the self assembled monolayer with circuit identical patterns in the epoxy resin base plate surface of step a, volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 0.1%, and the composition of self-composed monomolecular is 3-mercaptopropyi trimethoxy silane;
C. on self assembled monolayer, spray printing is used for the catalyst of electroless plating conducting metal, and catalyst layer adopts palladium chloride solution to form the catalyst layer with circuit identical patterns by spray printing; According to the characteristic containing long-chain carbon alkanes or aromatic compound, catalyst layer and 3-mercaptopropyi trimethoxy silane terminal reactive group strong bonded; The concentration of palladium chloride solution is 15mmol/L;
D. the epoxy resin base plate of step c is placed in the chemical plating fluid of conducting metal, with electroless grown conducting metal wire on the catalyst layer of circuit identical patterns; The chemical plating fluid of conducting metal is the chemical plating fluid of copper, chemical plating fluid formula presses copper sulphate 10g/L, EDETATE DISODIUM 40g/L, NaOH 10g/L, potassium ferrocyanide 0.2g/L, inferior sodium phosphate 10g/L, distilled water 30g/L, PH is about 12, and working temperature 45-60 DEG C, namely the formula of electroplate liquid can adopt proportioning of the prior art.
In fact, those skilled in the art can know according to above-mentioned record, and catalyst layer adopts the colloidal sol of gold, silver or palladium, or the ion salt solution of gold, silver except in above-described embodiment or palladium is formed by spray printing, all can realize goal of the invention.
Circuit board obtained in above-described embodiment is seen the following form by adhesive force testing result: table 1
| Test item | Embodiment one | Embodiment two | Embodiment three | Prior art |
| Corona treatment metacoxal plate contact angle/° (water) | 28 | 32 | 33 | 45 |
| Adhesive force/kgcm -2 | 16.7 | 15.1 | 15.6 | 13.2 |
Detecting instrument: contact angle adopts contact angle tester (German CRUSS DSA30 type); Material pulling force is real
Test machine (Japanese Shimadzu SGM-50kN type).
As can be seen from the above table, the circuit board substrate that explained hereafter of the present invention goes out has good hydrophily after corona treatment, thus have more firmly adhesion with Iy self-assembled layer, thus the circuit of circuit board product and substrate have the adhesive force much higher compared with prior art.As can be seen from table, in technical process, the control of parameters is different, and adhesive force has fluctuation, although be all better than prior art, embodiment one apparently higher than other embodiment, for preferably.
What finally illustrate is, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from aim and the scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (2)
1. a process for forming circuit for epoxy circuit board, is characterized in that: comprise the following steps:
A. surface treatment:
The process of I pair of epoxy resin base plate surface sand-blasting is also cleaned out, and blasting treatment adopts 50-300 order sand ball to be evenly sprayed onto epoxy resin base plate surface, processing time 5s-1min, pressure 0.3Mpa-2.0Mpa;
Epoxy resin base plate clean for removing surface is carried out corona treatment, operating voltage 10kV, processing speed 12m/min by II, and electrode gap 2mm carries out under atmospheric environment, is-C=O ,-NH2 or-OH polar group at epoxy resin base plate Surface Creation;
B. the epoxy resin base plate surface obtained in step a utilizes Printing techniques to form the self assembled monolayer with circuit identical patterns, the composition of self-composed monomolecular is that long-chain carbon alkanes or aromatic compound are contained in one end, and the other end is containing the functional group of-SH ,-OH or-NH; Volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 0.1%-15%;
C. on self assembled monolayer, spray printing is used for the catalyst of electroless plating conducting metal, forms the catalyst layer with circuit identical patterns; Catalyst layer adopts the colloidal sol of gold, silver or palladium, or the ion salt solution of gold, silver or palladium is formed by spray printing, and the concentration of the ion salt solution of described gold, silver or palladium is 7mmol/L;
D. the epoxy resin base plate of step c is placed in the chemical plating fluid of conducting metal, with electroless grown conducting metal wire on the catalyst layer of circuit identical patterns, the chemical plating fluid of described conducting metal is the chemical plating fluid of copper.
2. the process for forming circuit of epoxy circuit board according to claim 1, is characterized in that: the volumetric concentration for the surface active liquid of spray printing self assembled monolayer is 10%.
3. the process for forming circuit of epoxy circuit board according to claim 2, is characterized in that: blasting treatment adopts 120 order sand balls to be evenly sprayed onto epoxy resin base plate surface, processing time 30s, blasting pressure 0.8Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022089.2A CN102573315B (en) | 2012-01-31 | 2012-01-31 | Process for forming circuit of epoxy resin circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022089.2A CN102573315B (en) | 2012-01-31 | 2012-01-31 | Process for forming circuit of epoxy resin circuit board |
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| Publication Number | Publication Date |
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| CN102573315A CN102573315A (en) | 2012-07-11 |
| CN102573315B true CN102573315B (en) | 2015-05-13 |
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| JP6646258B2 (en) * | 2016-02-26 | 2020-02-14 | 住友金属鉱山株式会社 | Laminated body etching method and printed wiring board manufacturing method using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1850687A (en) * | 2006-05-18 | 2006-10-25 | 复旦大学 | Method for conducting metal located-sedimentation on glass base material |
| CN101652244A (en) * | 2007-04-18 | 2010-02-17 | 旭化成电子材料株式会社 | metal-resin laminate |
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2012
- 2012-01-31 CN CN201210022089.2A patent/CN102573315B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1850687A (en) * | 2006-05-18 | 2006-10-25 | 复旦大学 | Method for conducting metal located-sedimentation on glass base material |
| CN101652244A (en) * | 2007-04-18 | 2010-02-17 | 旭化成电子材料株式会社 | metal-resin laminate |
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Effective date of registration: 20161024 Address after: 401220 Changshou District of Chongqing economic and Technological Development Zone United Road No. 22 Patentee after: Chongqing Yuntianhua hanen New Material Development Co Ltd Patentee after: Yutianhua Co., Ltd., Yunnan Address before: 657800 Zhaotong City, Yunnan province Shuifu county to jingjiaba Patentee before: Yutianhua Co., Ltd., Yunnan |