CN102573315A - Process for forming circuit of epoxy resin circuit board - Google Patents
Process for forming circuit of epoxy resin circuit board Download PDFInfo
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- CN102573315A CN102573315A CN2012100220892A CN201210022089A CN102573315A CN 102573315 A CN102573315 A CN 102573315A CN 2012100220892 A CN2012100220892 A CN 2012100220892A CN 201210022089 A CN201210022089 A CN 201210022089A CN 102573315 A CN102573315 A CN 102573315A
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- circuit
- epoxy resin
- circuit board
- base plate
- epoxy
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a process for forming a circuit of an epoxy resin circuit board, wherein a mechanical treatment is carried out to the surface of an epoxy resin substrate by sand blasting, and sand blasting parameters are controlled, so that the surface of the substrate has a reasonable surface shape, thereby being beneficial to improving the surface adhesive force; simultaneously, a corona treatment for generating polar groups is carried out before a process of self-assembled monolayer, so that the surface of the substrate and the self-assembled monolayer are combined more firmly by chemical bonds. According to the invention, the technical process is simple, the production cost is low, the production efficiency is high, and strong adhesive force exists between the circuit of the product and the substrate, thereby greatly prolonging a service life of the circuit board, and saving the use cost; and meanwhile, as the shape of the self-assembled monolayer is consistent to that of the circuit, not only the material is saved, but also the printing of the self-assembled monolayer can have pertinence, and occurrence of disqualified surface is easy to avoid, thereby being favorable for guaranteeing product quality.
Description
Technical field
The present invention relates to a kind of technology that is used for circuit board making, the circuit that is specifically related to a kind of epoxy circuit board forms technology.
Background technology
Epoxy resin is a kind of base material that more generally uses during printed circuit board (PCB) is produced; Conventional method forming plain conductor on the epoxy resin base plate all is to be based upon on the basis of photoetching technique; Photoetching process needs the multiprogrammings such as etching through plated film, exposure, development and high-risk reagent, and needs the instrument of a series of precisions of configuration to satisfy harsh experiment condition; Whole technical process is comparatively complicated, inefficiency; And have many potential safety hazards, and danger is bigger, can cause problems such as environmental pollution, and production cost is high.
Along with the development of printed-board technology, the method for multiple minimizing printed circuit board (PCB) processing procedure operation has appearred; A kind of method of carrying out deposition formation plain conductor in metal location at substrate surface is all disclosed like Chinese patent 200510029511.7,200610026693.7,200810094824.4; This method comprises carries out self-assembled modified and formation self assembly layer to substrate; Utilize inkjet technology on the substrate of modifying, forming required catalyst layer, use chemical plating method depositing metal layers on substrate at last.Said method need carry out surface treatment to substrate before self assembly, generally adopt the concentrated acid oxidase substrate, needs after the oxidation fully to clean, and will store a large amount of acid solutions simultaneously, and the spent acid discharging also can pollute, and is unfavorable for large-scale production.The substrate surface of oxidation processes is smooth comparatively, and the wettability of self assembly layer and substrate is poor, and adhesive force is little when self-assembled modified, can't reach predetermined adhesive strength, reduces the quality of circuit board; Simultaneously, in the prior art, self-assembled modified is that whole base plate is all processed, and causes the not waste of spray printing catalyst place self-assembled film, is unfavorable for falling dirty the reduction of discharging.
Therefore, need a kind of circuit of epoxy circuit board to form technology, technical process is simple; Have lower production cost and higher production efficiency; Have bigger adhesive force between the circuit of product and the substrate, prolong the useful life of circuit board greatly, practice thrift use cost.
Summary of the invention
In view of this; The object of the invention provides a kind of circuit of epoxy circuit board to form technology; Technical process is simple, has lower production cost and higher production efficiency, has bigger adhesive force between the circuit of product and the substrate; Prolong the useful life of circuit board greatly, practice thrift use cost.
The circuit of epoxy circuit board of the present invention forms technology, comprises the following steps:
A. surface treatment:
I handles and cleans out the epoxy resin base plate surface sand-blasting, and blasting treatment adopts 50-300 order sand ball evenly to be sprayed onto the epoxy resin base plate surface, processing time 5s-1min, blasting pressure 0.3Mpa-2.0Mpa;
The epoxy resin base plate corona treatment that II is clean with removing surface, operating voltage 5-15kV, processing speed 2-20m/min, electrode gap 1-5mm, on substrate generation-C=O ,-NH
2Or-OH isopolarity group;
B. at the epoxy resin base plate surface by utilizing spray printing technology formation of step a and the self assembled monolayer of circuit identical patterns; The composition of self-composed monomolecular is that an end contains long-chain carbon alkanes or aromatic compound, and the other end contains-SH ,-OH or-functional group of NH; Said-SH ,-OH or-the NH active group increases the adhesive force of substrate and coating;
C. spray printing is used for the catalyst of electroless plating conducting metal on self assembled monolayer, forms the catalyst layer with the circuit identical patterns;
D. the epoxy resin base plate of step c is placed the chemical plating fluid of conducting metal, with the catalyst layer of circuit identical patterns on electroless grown conducting metal lead.
Further, among the step b, the volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 0.1%-15%;
Further, catalyst layer adopts the colloidal sol of gold, silver or palladium, and perhaps the ion salt solution of gold, silver or palladium forms through spray printing, and as adopting the ion salt solution of gold, silver or palladium, then concentration is 1-15mmol/L; In the steps d, the chemical plating fluid of conducting metal is the chemical plating fluid of copper;
Further, among the step a, on epoxy resin base plate surface generation-C=O ,-NH
2Or-OH isopolarity group;
Further, the corona treatment operating voltage is 10kV, processing speed 12m/min, electrode gap 2mm;
Further, among the step c, catalyst layer forms through spray printing like the ion salt solution that adopts gold, silver or palladium, and then concentration is 7mmol/L;
Further, the volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 10%;
Further, blasting treatment adopts 120 order sand balls evenly to be sprayed onto the epoxy resin base plate surface, processing time 30s, blasting pressure 0.8Mpa.
Beneficial effect of the present invention: the circuit of epoxy circuit board of the present invention forms technology; Mechanical treatment is carried out through sandblast in the epoxy resin base plate surface; And, make substrate surface have rational surface configuration through to the sandblast parameter control, be beneficial to the adhesive force that improves the surface; Simultaneously; Before carrying out self assembled monolayer technology, also carry out the corona treatment of polarization group, it is more firm that substrate surface and self assembled monolayer are combined through chemical bond, and technical process is simple; Have lower production cost and higher production efficiency; Have bigger adhesive force between the circuit of product and the substrate, prolong the useful life of circuit board greatly, practice thrift use cost; Simultaneously, self assembled monolayer is consistent with circuitry shapes, and not only economical with materials can also make the self assembled monolayer printing pointed, is easy to avoid occurring defective surface, is beneficial to the assurance product quality.
Embodiment
The circuit of epoxy circuit board of the present invention forms the implementation of processes example:
The circuit of epoxy circuit board forms technology and comprises the following steps:
A. surface treatment:
I handles and cleans out the epoxy resin base plate surface sand-blasting, and blasting treatment adopts 50-300 order sand ball evenly to be sprayed onto the epoxy resin base plate surface, processing time 5s-1min, blasting pressure 0.3Mpa-2.0Mpa;
The epoxy resin base plate corona treatment that II is clean with removing surface, operating voltage 5-15kV, processing speed 2-20m/min, electrode gap 1-5mm carries out under the atmospheric environment, on substrate generation-C=O ,-NH
2Or-OH isopolarity group;
B. at the epoxy resin base plate surface by utilizing spray printing technology formation of step a and the self assembled monolayer of circuit identical patterns; The composition of self-composed monomolecular is that an end contains long-chain carbon alkanes or aromatic compound, and the other end contains-SH ,-OH or-functional group of NH; Said-SH ,-OH or-the NH active group increases the adhesive force of substrate and coating;
C. spray printing is used for the catalyst of electroless plating conducting metal on self assembled monolayer, forms the catalyst layer with the circuit identical patterns;
D. the epoxy resin base plate of step c is placed the chemical plating fluid of conducting metal, with the catalyst layer of circuit identical patterns on electroless grown conducting metal lead.
The substrate surface corona discharge that the present invention utilizes high-frequency voltage being processed; The various ions that produce behind the air ionization are under the effect of highfield, and the pretreated substrate of acceleration shock is under the bombardment of high energy particle; The bond fission of substrate surface macromolecule; Material surface has produced many different free radicals and unsaturated center, and the airborne water of the free radical on these shallow surfaces and unsaturated center and surface adsorption reacts, thereby forms amido, amide groups, carbonyl and hydroxyl isopolarity group at fiber surface; Make the substrate surface activation, improve wetting of surfaces property and interface bond strength.
The generation of self assembled monolayer is a spontaneous process; The substrate immersion is contained in the weak solution of bioactive molecule; Through chemical bond spontaneous be adsorbed on the substrate form orientation regular, arrange closely monolayer in order; Self assembled monolayer can be divided into three parts on structure, the one, the reflecting point on the head base of molecule, it and substrate surface with covalent bond (like Si-O key and Au-S key etc.) or ionic bond (like Ag
+) combine; The 2nd, the alkyl chain of molecule, interchain lean on the Van der Waals force effect that bioactive molecule is arranged at the surface of solids in order and closely; The 3rd, the molecular end group, as-CH
3,-COOH ,-OH ,-NH
2,-SH ,-CH
2-CH
3And-CCH
2Deng, through terminal active group to obtain the interface of different physical and chemical performances.
Embodiment one
The circuit of the epoxy circuit board of present embodiment forms technology, comprises the following steps:
A. surface treatment:
I handles and cleans out the epoxy resin base plate surface sand-blasting, and blasting treatment adopts 120 order sand balls evenly to be sprayed onto the epoxy resin base plate surface, processing time 30s, blasting pressure 0.8Mpa;
The epoxy resin base plate that II is clean with removing surface carries out corona treatment, adopts corona discharge device (Dalian radio nine factories, down together); Operating voltage 10kV, processing speed 12m/min, electrode gap 2mm carries out under the atmospheric environment, and substrate hydrophily test result is seen table 1;
B. at the epoxy resin base plate surface by utilizing spray printing technology formation of step a and the self assembled monolayer of circuit identical patterns; Adopt ink-jet printer to realize (the Japanese MicroCraft J6151 of M Co., Ltd. type; Down together); The volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 10%, and the composition of self-composed monomolecular is a 3-sulfydryl propyl trimethoxy silicane;
C. spray printing is used for the catalyst of electroless plating conducting metal on self assembled monolayer; Catalyst layer adopts palladium chloride solution through the catalyst layer of spray printing formation with the circuit identical patterns; According to the characteristic that contains long-chain carbon alkanes or aromatic compound, the terminal active group strong bonded of catalyst layer and 3-sulfydryl propyl trimethoxy silicane; The concentration of palladium chloride solution is 7mmol/L;
D. the epoxy resin base plate of step c is placed the chemical plating fluid of conducting metal, with the catalyst layer of circuit identical patterns on electroless grown conducting metal lead; The chemical plating fluid of conducting metal is the chemical plating fluid of copper, and the chemical plating fluid prescription is pressed copper sulphate 10g/L, EDTA disodium salt 40g/L; NaOH 10g/L, potassium ferrocyanide 0.2g/L, inferior sodium phosphate 10g/L; Distilled water 30g/L; PH is about 12, and working temperature 45-60 ℃, promptly the prescription of electroplate liquid can adopt proportioning of the prior art.
Embodiment two
The circuit of the epoxy circuit board of present embodiment forms technology, comprises the following steps:
A. surface treatment:
I handles and cleans out the epoxy resin base plate surface sand-blasting, and blasting treatment adopts 50 order sand balls evenly to be sprayed onto the epoxy resin base plate surface, processing time 5s, blasting pressure 2.0Mpa;
The epoxy resin base plate corona treatment that II is clean with removing surface, operating voltage 5kV, processing speed 2m/min, electrode gap 1mm carries out under the atmospheric environment, and substrate hydrophily test result is seen table 1;
B. at the epoxy resin base plate surface by utilizing spray printing technology formation of step a and the self assembled monolayer of circuit identical patterns; The volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 15%, and the composition of self-composed monomolecular is the 3-aminopropyl trimethoxysilane;
C. spray printing is used for the catalyst of electroless plating conducting metal on self assembled monolayer, and catalyst layer adopts silver chlorate solution to form the catalyst layer with the circuit identical patterns through spray printing; According to the characteristic that contains long-chain carbon alkanes or aromatic compound, the terminal active group strong bonded of catalyst layer and 3-sulfydryl propyl trimethoxy silicane; The concentration of silver chlorate solution is 1mmol/L;
D. the epoxy resin base plate of step c is placed the chemical plating fluid of conducting metal, with the catalyst layer of circuit identical patterns on electroless grown conducting metal lead; The chemical plating fluid of conducting metal is the chemical plating fluid of copper, and the chemical plating fluid prescription is pressed copper sulphate 10g/L, EDTA disodium salt 40g/L; NaOH 10g/L, potassium ferrocyanide 0.2g/L, inferior sodium phosphate 10g/L; Distilled water 30g/L; PH is about 12, and working temperature 45-60 ℃, promptly the prescription of electroplate liquid can adopt proportioning of the prior art.
Embodiment three
The circuit of the epoxy circuit board of present embodiment forms technology, comprises the following steps:
A. surface treatment:
I handles and cleans out the epoxy resin base plate surface sand-blasting, and blasting treatment adopts 300 order sand balls evenly to be sprayed onto the epoxy resin base plate surface, processing time 60s, blasting pressure 0.3Mpa;
The epoxy resin base plate corona treatment that II is clean with removing surface, operating voltage 15kV, processing speed 20m/min, electrode gap 5mm carries out under the atmospheric environment, and substrate hydrophily test result is seen table 1;
B. at the epoxy resin base plate surface by utilizing spray printing technology formation of step a and the self assembled monolayer of circuit identical patterns; The volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 0.1%, and the composition of self-composed monomolecular is a 3-sulfydryl propyl trimethoxy silicane;
C. spray printing is used for the catalyst of electroless plating conducting metal on self assembled monolayer, and catalyst layer adopts palladium chloride solution to form the catalyst layer with the circuit identical patterns through spray printing; According to the characteristic that contains long-chain carbon alkanes or aromatic compound, the terminal active group strong bonded of catalyst layer and 3-sulfydryl propyl trimethoxy silicane; The concentration of palladium chloride solution is 15mmol/L;
D. the epoxy resin base plate of step c is placed the chemical plating fluid of conducting metal, with the catalyst layer of circuit identical patterns on electroless grown conducting metal lead; The chemical plating fluid of conducting metal is the chemical plating fluid of copper, and the chemical plating fluid prescription is pressed copper sulphate 10g/L, EDTA disodium salt 40g/L; NaOH 10g/L, potassium ferrocyanide 0.2g/L, inferior sodium phosphate 10g/L; Distilled water 30g/L; PH is about 12, and working temperature 45-60 ℃, promptly the prescription of electroplate liquid can adopt proportioning of the prior art.
In fact, those skilled in the art can know according to above-mentioned record, and catalyst layer adopts the colloidal sol of gold, silver or palladium, and the gold, silver perhaps except that the foregoing description in or the ion salt solution of palladium pass through spray printing formation, all can realize goal of the invention.
Prepared circuit board sees the following form through the adhesive force testing result in the foregoing description: table 1
| Test item | Embodiment one | Embodiment two | Embodiment three | Prior art |
| Corona treatment metacoxal plate contact angle/° (water) | 28 | 32 | 33 | 45 |
| Adhesive force/kgcm -2 | 16.7 | 15.1 | 15.6 | 13.2 |
Detecting instrument: contact angle adopts contact angle tester (German CRUSS DSA30 type); The material pulling force is real
Test machine (day island proper Tianjin SGM-50kN type).
Can find out by last table; The circuit board substrate that explained hereafter of the present invention goes out has hydrophily preferably after corona treatment; Thereby have more firm adhesion with the self assembly layer, thereby the circuit of circuit board product and substrate have the adhesive force much higher than prior art.By finding out in the table, in the technical process, each parameter control is different, and adhesive force has fluctuation, though all be better than prior art, embodiment one is apparently higher than other embodiment, for preferably.
Explanation is at last; Above embodiment is only unrestricted in order to technical scheme of the present invention to be described; Although with reference to preferred embodiment the present invention is specified, those of ordinary skill in the art should be appreciated that and can make amendment or be equal to replacement technical scheme of the present invention; And not breaking away from the aim and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (8)
1. the circuit of an epoxy circuit board forms technology, it is characterized in that: comprise the following steps:
A. surface treatment:
I handles and cleans out the epoxy resin base plate surface sand-blasting, and blasting treatment adopts 50-300 order sand ball evenly to be sprayed onto the epoxy resin base plate surface, processing time 5s-1min, shot-peening pressure 0.3Mpa-2.0Mpa;
The epoxy resin base plate that II is clean with removing surface carries out corona treatment, operating voltage 5-15kV, and processing speed 2-20m/min, electrode gap 1-5mm carries out under the atmospheric environment, on substrate, generates polar group;
B. at the epoxy resin base plate surface by utilizing spray printing technology formation of step a and the self assembled monolayer of circuit identical patterns; The composition of self-composed monomolecular is that an end contains long-chain carbon alkanes or aromatic compound, and the other end contains-SH ,-OH or-functional group of NH;
C. spray printing is used for the catalyst of electroless plating conducting metal on self assembled monolayer, forms the catalyst layer with the circuit identical patterns;
D. the epoxy resin base plate of step c is placed the chemical plating fluid of conducting metal, with the catalyst layer of circuit identical patterns on electroless grown conducting metal lead.
2. the circuit of epoxy circuit board according to claim 1 forms technology, and it is characterized in that: among the step b, the volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 0.1%-15%.
3. the circuit of epoxy circuit board according to claim 2 forms technology; It is characterized in that: catalyst layer adopts the colloidal sol of gold, silver or palladium; Perhaps the ion salt solution of gold, silver or palladium forms through spray printing, and as adopting the ion salt solution of gold, silver or palladium, then concentration is 1-15mmol/L; In the steps d, the chemical plating fluid of conducting metal is the chemical plating fluid of copper.
4. the circuit of epoxy circuit board according to claim 3 forms technology, it is characterized in that: among the step a, be generated as on the epoxy resin base plate surface-C=O ,-NH
2Or-OH isopolarity group.
5. the circuit of epoxy circuit board according to claim 4 forms technology, it is characterized in that: among the step a, and the operating voltage 10kV of corona treatment, processing speed 12m/min, electrode gap 2mm.
6. the circuit of epoxy circuit board according to claim 5 forms technology, it is characterized in that: among the step c, catalyst layer forms through spray printing like the ion salt solution that adopts gold, silver or palladium, and then concentration is 7mmol/L.
7. the circuit of epoxy circuit board according to claim 6 forms technology, and it is characterized in that: the volumetric concentration that is used for the surface active liquid of spray printing self assembled monolayer is 10%.
8. the circuit of epoxy circuit board according to claim 7 forms technology, and it is characterized in that: blasting treatment adopts 120 order sand balls evenly to be sprayed onto the epoxy resin base plate surface, processing time 30s, blasting pressure 0.8Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022089.2A CN102573315B (en) | 2012-01-31 | 2012-01-31 | Process for forming circuit of epoxy resin circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022089.2A CN102573315B (en) | 2012-01-31 | 2012-01-31 | Process for forming circuit of epoxy resin circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN102573315A true CN102573315A (en) | 2012-07-11 |
| CN102573315B CN102573315B (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210022089.2A Active CN102573315B (en) | 2012-01-31 | 2012-01-31 | Process for forming circuit of epoxy resin circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135608A (en) * | 2016-02-26 | 2017-09-05 | 住友金属矿山株式会社 | The engraving method of laminated body and the manufacture method for having used its printed wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1850687A (en) * | 2006-05-18 | 2006-10-25 | 复旦大学 | Method for conducting metal located-sedimentation on glass base material |
| CN101652244A (en) * | 2007-04-18 | 2010-02-17 | 旭化成电子材料株式会社 | metal-resin laminate |
-
2012
- 2012-01-31 CN CN201210022089.2A patent/CN102573315B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1850687A (en) * | 2006-05-18 | 2006-10-25 | 复旦大学 | Method for conducting metal located-sedimentation on glass base material |
| CN101652244A (en) * | 2007-04-18 | 2010-02-17 | 旭化成电子材料株式会社 | metal-resin laminate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135608A (en) * | 2016-02-26 | 2017-09-05 | 住友金属矿山株式会社 | The engraving method of laminated body and the manufacture method for having used its printed wiring board |
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| Publication number | Publication date |
|---|---|
| CN102573315B (en) | 2015-05-13 |
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Effective date of registration: 20161024 Address after: 401220 Changshou District of Chongqing economic and Technological Development Zone United Road No. 22 Patentee after: Chongqing Yuntianhua hanen New Material Development Co Ltd Patentee after: Yutianhua Co., Ltd., Yunnan Address before: 657800 Zhaotong City, Yunnan province Shuifu county to jingjiaba Patentee before: Yutianhua Co., Ltd., Yunnan |