CN102573277B - Three-dimensional image acquisition apparatus and manufacture method thereof - Google Patents

Abstract

The invention discloses a kind of three-dimensional image acquisition apparatus and manufacture method thereof, this device includes that printed circuit board (PCB) and stiffener, described printed circuit board (PCB) are provided with two camera models including imageing sensor；Described stiffener is provided with two windows of exposure, and wherein, described printed circuit board (PCB) and stiffener adhere to each other, to allow the camera model of printed circuit board (PCB) to be exposed by the window of exposure of stiffener.

Description

Three-dimensional image acquisition apparatus and manufacture method thereof

This application claims the korean patent application submitted on October 8th, 2010 in the front applying date and Priority, its content is passed through to quote at this to be integrally incorporated.

Technical field

It relates to for the substrate of three-dimensional (3-D) image collecting device, more specifically, this Invention relates to the substrate being configured to by strengthening using in 3-D image collecting device and prevents The technology of bending.

Background technology

Have been carried out many attempt taking three-dimensional (3-D) viewing experience to film, video and Broadcast display.

Generally, perception 3-D image is carried out by the stereoscopic vision of two.Visual disparity, i.e. by quilt Separately two parallaxes caused of about 65mm distance play most important work in stereoeffect With.That is, watch different 2-D images when right and left eyes and this two images are sent by light nerve During to brain, brain combines the table that these two images include the original 3-D image of the degree of depth with structure Show.Such ability is commonly referred to three-dimensional imaging.

The effect using perception 3-D sensation produces 3-D image, and more specifically, uses and join It is right that the acquisition equipment of standby two-lens system allows each lens to capture in a different direction As, and, show that the image of capture enables to produce 3-D image respectively.

Recently, developing rapidly along with semiconductor technology, it is achieved that imageing sensor small-sized Change, and owing to the development of the manufacturing technology of PCB (printed circuit board (PCB)) makes to include camera model Substrate can become miniaturization and lightweight.It is additionally, since miniaturization and Lightweight Technology, The mobile device making such as digital camera can be as 3-D image capture apparatus (image collector Put).

The biography including camera model embedding in 3-D acquisition equipment and using will be sketched with reference to Fig. 1 System PCB.

Seeing Fig. 1, the PCB (20) including camera model includes camera model (10) thereon With adapter (30).PCB (20) itself including traditional camera module produces bending or works as quilt Bending is produced when being arranged on 3-D image capture apparatus (image collecting device).

In order to realize 3-D image, the relative position of each camera is important.This is because 3-D Sensation can change according to the relative position of each camera.That is, the bending of PCB (20) is permissible Change in 3-D image capture apparatus for realizing the double camera module of two cameras of 3-D image Position, thus causes the reduction of the 3-D effect being captured by double camera module and realizing relatively.

Summary of the invention

Have been set up the disclosure to solve the problems referred to above of prior art, therefore, the disclosure The purpose of specific embodiment is to provide the structure of the PCB for three-dimensional (3-D) image collecting device And manufacture method, the structure of this PCB for by being connected to PCB by predetermined stiffener Prevent the appearance of bending in the pcb.

The technical theme solved by the disclosure is not limited to described above, and, in this area From description below, technical staff can be clearly understood that any other not heretofore described technology is asked Topic.That is, during following indicative explaination, the disclosure be will be more readily understood, and And, other purposes, characteristic, details and advantage thereof will be apparent from, and wherein give with reference to accompanying drawing Go out this indicative explaination, and be not intended to provide any restriction for the disclosure.

At one of the disclosure substantially aspect, it is provided that a kind of 3-D image collecting device, including: PCB, it is provided with two camera models including imageing sensor；And stiffener, its peace Equipped with two windows of exposure, wherein, PCB and stiffener adhere to each other, to allow the phase of PCB Machine module is exposed by the window of exposure of stiffener.

Preferably, the lens housing central shaft of the camera model window of exposure by stiffener Before being arranged into.

Preferably, stiffener and PCB are by covering the thermosetting on the surface contacted with each other Epoxy resin and adhere to.

Preferably, each in two camera models is separated with another camera model.

Preferably, connector unit is arranged at the region of the PCB between two camera models.

Preferably, rib structure is formed at two between camera model and connector unit.

Preferably, stiffener is formed with openning, described openning with shape at PCB At part corresponding to connector unit become, there is opening.

Preferably, stiffener is formed corresponding in addition to window of exposure and openning The rib structure of remaining area.

Preferably, the material of stiffener is hot consolidation crystalline polymer.

Preferably, binding agent be inserted in the window of exposure of stiffener and two camera models it Between.

Preferably, PCB is formed with at least one ledge (lug), and stiffener It is formed with the hole for inserting ledge.

Preferably, described hole is formed as adjacent with the window of exposure of stiffener.

Another substantially aspect in the disclosure, it is provided that one is used for manufacturing 3-D image collector The method put, described method includes: lens housing is attached to be provided with the PCB of imageing sensor； Heat cured epoxies is covered in the predetermined contact surface of PCB；Temporarily will be formed with window of exposure Stiffener be connected to be coated with the PCB of Heat cured epoxies；Stiffener is had by temporarily coupling PCB be arranged into hot plate；And, the upper surface of extruding stiffener, with by solidification thermosetting ring Epoxy resins couples stiffener.

Preferably, the upper surface of stiffener is extruded, with by solidification Heat cured epoxies The step coupling stiffener includes: be formed recessed by using at a part of place of window of exposure The solidification fixture falling into part extrudes.

Preferably, the lens housing central shaft of the camera model window of exposure by stiffener Before being arranged into.

Preferably, be formed separately two camera models, and, two camera models it Between PCB region at install connector unit.

Preferably, rib structure is formed between camera model and connector unit at two.

Preferably, stiffener is formed as having openning, described opening window with at PCB At the part that the position of connector unit that place is formed is corresponding, there is opening.

Preferably, stiffener is formed relative in addition to window of exposure and openning The rib structure of remaining area.

Preferably, the material of stiffener is hot consolidation crystalline polymer.

The appearance for preventing bending in the pcb according to the disclosure for three-dimensional (3-D) Being advantageous in that of the structure of the PCB of image collecting device: stiffener is connected to PCB, with Prevent the PCB bending caused due to the intrinsic elasticity of PCB, or when PCB is installed to 3-D image During harvester, enabling avoid the 3-D produced by the image obtained by two camera models The buckling phenomenon that the stereoperception of image reduces.

Accompanying drawing explanation

It is included to provide being further understood from of the disclosure, and is incorporated in the application also And the accompanying drawing of a part constituting the application illustrates embodiments of the invention, and with description one Play the principle for explaining the disclosure.In the accompanying drawings:

Fig. 1 is the simulated view illustrating the PCB including camera model according to prior art；

Fig. 2 is the amplification decomposition diagram of the PCB illustrating the exemplary embodiment according to the disclosure；

Fig. 3 is the connection perspective view of the PCB illustrating the exemplary embodiment according to the disclosure；And

Fig. 4 is that the use solidification fixture illustrating the exemplary embodiment according to the disclosure will strengthen structure Part is connected to include the simulated view of the method for the PCB of camera model.

Detailed description of the invention

Hereinafter, each example embodiment will be described more fully hereinafter with reference to the accompanying drawings, in the accompanying drawings, show Go out some example embodiment.But, the thought of the present invention can be come real in many different forms Existing, and should not be considered limited to example embodiment given herein.And be to provide these and show Example embodiment makes this explanation be thorough and complete, and will be to those skilled in the art Transmit the scope of the thought of the present invention all sidedly.In the accompanying drawings, in order to clear, layer may be exaggerated Size and relative size with region.In other words, it should be noted that spy illustrated in the accompanying drawings Levy and be not necessarily to scale.

It is understood that when element or layer be referred to as another element or layer " on ", " even Receive " or " being connected to " another element or during layer, it can directly at this another element or On layer, it is connected or coupled to this another element or layer, or element or the layer of centre can be there is. On the contrary, when element be referred to as directly another element or layer " on ", " being directly connected to " or When " being directly coupled to " another element or layer, there is not any intermediary element or layer.In the drawings, The element that identical reference instruction is similar.Term "and/or" as used herein includes being correlated with The one or more any and all combination listed in project of connection.

It is apparent that, although term first, second, third, etc. can be used to describe respectively at this Individual element, parts, region, layer and/or part, but these elements, parts, region, layer And/or part should not limited by these words.These words are only used for distinguishing element, a portion Part, region, layer or part and another region, layer or part.Therefore, without departing from this In the case of the teaching of the thought of invention, the first element described below, parts, region, layer Or part can be referred to as the second element, parts, region, layer or part.

For ease of description, can use such as at this " lower section ", " under ", D score, " on " and the space relative terms of " above " etc. describe as illustrated in the drawing One element or feature and another element or the relation of feature.

It will be appreciated that space relative terms is intended in addition to the orientation being described in the drawings Use or the different azimuth of device in operation.Such as, if the device in accompanying drawing is reversed, The element being then described as be in other elements or feature D score or " lower section " becomes at other yuan Part or feature " on ".Therefore, above and below exemplary term D score can be contained Orientation.Device can have other a orientation (90-degree rotation or other orientation), and accordingly Space as used herein relative descriptors is explained on ground.

Word as used herein is only used for describing specific example embodiment, and is not intended to limit The thought of the present invention.Unless the context clearly dictates otherwise, odd number shape the most as used herein Formula " one ", " being somebody's turn to do " are intended to also include plural form.Further it will be appreciated that word " wraps Include " specify when using in this manual described feature, partly, step, operation, element And/or the existence of parts, but be not excluded for other features one or more, partly, step, behaviour Work, element, parts and/or the existence of its group or increase.

In addition to additional definitions, all words the most as used herein (including science and technology word) have The implication identical with the those of ordinary skill person of being generally understood that in the field belonging to inventive concept. Further it will be appreciated that such as should be explained at the word of those defined in conventional dictionary For having the implication consistent with their implication in the environment of association area, and will not with Utopian or the most literal meaning explains, unless be defined clearly at this.

It should be noted that, the feature illustrated in the accompanying drawings is not necessarily to scale.Omit known portion Part and the explanation for the treatment of technology, in order to unnecessarily obscure and embodiment of the disclosure.

Hereinafter, the 3-D image collecting device according to example embodiment will be described in detail with reference to the attached drawings.

Fig. 2 is the decomposition diagram of the PCB illustrating the exemplary embodiment according to the disclosure, and And, Fig. 3 is the connection perspective view of the PCB illustrating the exemplary embodiment according to the disclosure.

The 3-D image collecting device illustrated in figs 2 and 3 includes: PCB (20), it is provided with Two camera models (10,11) including imageing sensor；And stiffener (100), It is provided with two windows of exposure (130), and wherein, PCB and stiffener (100) are the most viscous Attached, to allow the camera model (10,11) of PCB (20) by stiffener (100) Window of exposure (130) exposes.

Stiffener (100) in figs 2 and 3 is provided with window of exposure (130) and openning (120), wherein, window of exposure (130) is for being connected to PCB when stiffener (100) (20) time, camera model (10, the 11) exposure at the upper surface of PCB (20) will be arranged on To device above.

Meanwhile, openning (120) is for being connected to PCB (20) when stiffener (100) Time, the connector unit (30) that is included within PCB (20) be exposed to device above.

Fig. 2 is shown in and is provided with the PCB (20) of two camera models (10,11) and is connected to add State before strong component (100).More specifically, be provided with two camera models (10,11) PCB (20) and stiffener (100) be arranged such that so that camera model (10,11) Lens housing central shaft be arranged into by the window of exposure of stiffener before.

And, each in two camera models (10,11) can be with another camera mould Block is arranged discretely, and can PCB (20) between two camera models (10,11) Region at install connector unit (30).Furthermore, it is possible to two camera models (10, 11) rib structure (110) is formed and between connector unit (30).

Fig. 3 illustrates that the PCB (20) being wherein provided with two camera models (10,11) is connected to The state of stiffener (100), wherein, uses Heat cured epoxies will to be provided with two phases The PCB (20) of machine module (10,11) is connected to stiffener (100).

With the big difference of the PCB (20) including camera model according to prior art it is: bag Include the PCB (20) of two camera models (10,11) to couple thereon and have stiffener (100).

As shown in fig. 1, at the PCB including camera model (10,11) according to prior art (20), in the case of not having connection to have stiffener (110), buckling phenomenon is produced, and at root Couple according to the PCB (20) including camera model (10,11) of the exemplary embodiment of the disclosure In the case of stiffener (110), there is following effect: by include camera model (10, 11) the firm reinforcement structure of PCB (20) farthest prevents the generation of bending.

Furthermore, it is possible to the window of exposure (130) in stiffener (100) and two camera moulds Binding agent is inserted between block (10,11).And, PCB (20) could be formed with at least one Ledge, and stiffener could be formed with the hole for inserting ledge.This hole can To be formed as adjacent with the window of exposure of stiffener.

Preferably, the stiffener (100) illustrated in figs 2 and 3 could be formed with relative to The rib structure of the remaining area in addition to window of exposure (130) and openning (120), with Reduce rest mass, and prevent the deformation of stiffener.Formed for reducing " too fat to move " Window is defined as reducing too fat to move window.

Rib structure is designed to be formed stiffener (100), and wherein, rib structure can be to be formed Groove on stiffener (100) or hole.

Preferably, stiffener uses has elastomeric material, and, there is high resiliency Material include hot consolidation crystalline polymer.

Now, the method being used for description manufacturing 3-D image collecting device.

For manufacture the method for 3-D image collecting device may include that lens housing is attached to peace PCB equipped with imageing sensor；The predetermined contact surface of PCB covers Heat cured epoxies； The stiffener (100) that temporarily will be formed with window of exposure is connected to be coated with Heat cured epoxies PCB；The PCB of stiffener is had to be arranged into hot plate (150) by temporarily coupling；Further, squeeze The upper surface of pressure stiffener, to couple stiffener by solidification Heat cured epoxies.

Fig. 4 is to illustrate that use solidification fixture (170) of the exemplary embodiment according to the disclosure will Stiffener is connected to include the simulated view of the method for the PCB (20) of camera model.

Preferably, the upper surface of stiffener is extruded, with by solidification Heat cured epoxies The step coupling stiffener includes: by using solidification fixture (170) to extrude, this solidification Fixture (170) is formed with the female at a part for window of exposure.

From above it is apparent that according to the appearance for preventing bending in the pcb of the disclosure The structure for the PCB of three-dimensional (3-D) image collecting device there is following industrial usability: Stiffener is connected to PCB to prevent the bending of PCB caused due to the intrinsic elasticity of PCB, or When PCB is installed to 3-D image collecting device, enabling avoid by by two camera moulds The buckling phenomenon that the cube sensation of the 3-D image that the image that block obtains produces reduces.

Although the multiple illustrative embodiment by reference to the disclosure describe the disclosure, but should When understanding, those skilled in the art can design at the spirit of principle of the disclosure and model Enclose interior multiple other amendment and embodiments.

More specifically, the theme group in the range of the disclosure, accompanying drawing and appended claim In closing the element portion arranged and/or arranging, various changes and modifications are possible.Except in portion Part part and/or arrange on change and amendment outside, replacement use also in this area Technical staff is obvious.

Claims (16)

1. a three-dimensional image acquisition apparatus, including:

Printed circuit board (PCB), described printed circuit board (PCB) is provided with two cameras including imageing sensor Module；

Stiffener, described stiffener is provided with two windows of exposure；And

Rib structure, described rib structure is formed on described stiffener, and it is sudden and violent to be positioned at said two Between dew window；

Wherein, described printed circuit board (PCB) and described stiffener adhere to each other, to allow described print The camera model of printed circuit board is exposed by the window of exposure of described stiffener,

Wherein, a camera model in said two camera model and another camera model phase Separate,

Wherein, at described printed circuit board (PCB), region between said two camera model Connector unit is installed at place,

Wherein, described stiffener is formed with openning, and described openning has opening, and should The forming position of opening is corresponding to being formed at described connector unit at described printed circuit board (PCB) Position, and

Wherein, described rib structure is formed in addition to described window of exposure and described openning At remaining area.

Three-dimensional image acquisition apparatus the most according to claim 1, wherein, described camera mould Before the lens housing central shaft of block is arranged to by the window of exposure of described stiffener.

Three-dimensional image acquisition apparatus the most according to claim 1, wherein, described reinforcement structure Part and described printed circuit board (PCB) are by covering the Heat cured epoxies on the surface contacted with each other Adhere to.

Three-dimensional image acquisition apparatus the most according to claim 1, wherein, described rib structure It is groove or hole.

Three-dimensional image acquisition apparatus the most according to claim 1, wherein, described reinforcement structure The material of part is hot consolidation crystalline polymer.

Three-dimensional image acquisition apparatus the most according to claim 1, wherein, in described reinforcement It is inserted with binding agent between window of exposure and the said two camera model of component.

Three-dimensional image acquisition apparatus the most according to claim 6, wherein, described printing electricity Road plate is formed with at least one ledge, and described stiffener is formed for inserting described prominent Go out the hole of part.

Three-dimensional image acquisition apparatus the most according to claim 7, wherein, described hole is formed For adjacent with the window of exposure of described stiffener.

9., for the method manufacturing three-dimensional image acquisition apparatus, described method includes:

Each lens housing of two camera models is attached to be provided with the printing of imageing sensor Circuit board；

Heat cured epoxies is covered in the predetermined contact surface of described printed circuit board (PCB)；

The stiffener that temporarily will be formed with window of exposure is connected to be coated with described thermoset epoxy tree The described printed circuit board (PCB) of fat；

The printed circuit board arrangement of described stiffener is had to hot plate by temporarily coupling；And

Extrude the upper surface of described stiffener, to be joined by the described Heat cured epoxies of solidification Connect described stiffener.

Method the most according to claim 9, wherein, extrudes the upper table of described stiffener Face, to couple the step of described stiffener and include by solidifying described Heat cured epoxies: By using the solidification being formed with female at a part of place corresponding to described window of exposure to press from both sides Tool extrudes.

11. methods according to claim 9, wherein, the lens housing of described camera model Before central shaft is arranged into by the window of exposure of described stiffener.

12. methods according to claim 9, wherein, are formed separately two camera models, And the company of installation at described printed circuit board (PCB), region between said two camera model Connect device unit.

13. methods according to claim 12, wherein, at said two camera model and Rib structure is formed between described connector unit.

14. methods according to claim 12, wherein, described stiffener is formed out Mouth window, described openning has opening, and the position of this opening is corresponding to being formed at described printing The position of the described connector unit at circuit board.

15. methods according to claim 14, wherein, it is right that described stiffener is formed The rib structure of Ying Yu remaining area in addition to described window of exposure and described openning.

16. methods according to claim 9, wherein, the material of described stiffener is Hot consolidation crystalline polymer.