CN102573271A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN102573271A CN102573271A CN2010105978489A CN201010597848A CN102573271A CN 102573271 A CN102573271 A CN 102573271A CN 2010105978489 A CN2010105978489 A CN 2010105978489A CN 201010597848 A CN201010597848 A CN 201010597848A CN 102573271 A CN102573271 A CN 102573271A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- top layer
- depression
- layer circuit
- line construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises an inner base plate, a first circuit structure, a plurality of through-holes and a second circuit structure, wherein the inner base plate is provided with a first surface and a second surface opposite to the first surface; the first circuit structure is equipped on the first surface; the through-holes are formed in the inner base plate and the first circuit structure; the second circuit structure is equipped on the second surface; the second circuit structure is provided with a cavity exposing out of the second surface and the through-holes, and at least one through-hole exposed by the cavity projects from the second surface.
Description
Technical field
The present invention relates to a kind of wiring board and preparation method thereof, and particularly relate to a kind of wiring board and preparation method thereof with depression (cavity) in order to ccontaining fin.
Background technology
In recent years, along with making rapid progress of electronic technology, coming out one after another of high-tech electronic industry makes electronic product more humane, with better function constantly weed out the old and bring forth the new, and towards light, thin, short, little trend design.In these electronic products, can dispose usually and be used for installing electronic component wiring board on it.
Along with the lifting of technology, the usefulness that is installed on the electronic component on the wiring board is more and more stronger, and is therefore also increasingly high for the demand of heat radiation.In order to reach the purpose of heat radiation, generally can fin directly be installed on the electronic component, or fin is installed on the opposite side with respect to the wiring board of electronic component.
Yet after being filled to electronic component and groups of fins on the wiring board, the volume of product also increases thereupon, thereby can't meet at present the demand for shorten product sizes.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of wiring board, it is in order to produce the wiring board with depression.
Another purpose of the present invention is to provide a kind of wiring board, and it has the depression in order to ccontaining fin.
For reaching above-mentioned purpose, the present invention proposes a kind of wiring board, and it comprises internal substrate, first line construction, a plurality of via and second line construction.Internal substrate have first surface and with the first surface opposing second surface.First line construction is disposed on the first surface.Via is disposed in the internal substrate and first line construction.Second line construction is disposed on the second surface.Second line construction has depression, and this depression exposes second surface and via, and at least one in these vias that its pocket exposed is outstanding from second surface.
According to the described wiring board of the embodiment of the invention, above-mentioned internal substrate comprises core layer, the first top layer circuit, second top layer circuit and the internal connection-wire structure.The first top layer circuit and the second top layer circuit are disposed at the relative both sides of core layer respectively.Internal connection-wire structure is disposed in the core layer, to be electrically connected the first top layer circuit and the second top layer circuit.
According to the described wiring board of the embodiment of the invention, the above-mentioned second surface that depression exposed for example is the surface of core layer.
According to the described wiring board of the embodiment of the invention, the above-mentioned second surface that depression exposed for example is the surface of the second top layer circuit.
According to the described wiring board of the embodiment of the invention, the second surface that above-mentioned depression exposed for example is the surface of the core layer and the second top layer circuit.
According to the described wiring board of the embodiment of the invention, at least one in the above-mentioned via that depression exposed is for example outstanding from the surface of the second top layer circuit.
According to the described wiring board of the embodiment of the invention, the above-mentioned second top layer circuit that depression exposed for example has a plurality of patterning openings, and each via is arranged in wherein one of these patterning openings.
According to the described wiring board of the embodiment of the invention; The part of the above-mentioned second top layer circuit that depression exposed for example is positioned at the edge of depression; And another part of the second top layer circuit that depression exposed for example has a plurality of patterning openings, and each via is arranged in wherein one of these patterning openings.
According to the described wiring board of the embodiment of the invention, the above-mentioned second top layer circuit that depression exposed for example is positioned at the edge of depression.
The present invention proposes a kind of manufacture method of wiring board in addition, and it is that internal substrate is provided earlier.Internal substrate have first surface and with the first surface opposing second surface, and have district to be removed on the second surface.On the second surface of waiting to remove in the district, form release layer (release film).Then, on first surface and second surface, form first line construction and second line construction respectively.Then, in first line construction, internal substrate, release layer and second line construction, form a plurality of first vias.Afterwards, remove release layer with and second line construction and first via of top, in second line construction, forming depression, and below depression, form a plurality of second vias.
According to the manufacture method of the described wiring board of the embodiment of the invention, above-mentioned internal substrate comprises core layer, the first top layer circuit, second top layer circuit and the internal connection-wire structure.The first top layer circuit and the second top layer circuit are disposed at relative two sides of core layer respectively.Internal connection-wire structure is disposed in the core layer, to be electrically connected the first top layer circuit and the second top layer circuit.
According to the manufacture method of the described wiring board of the embodiment of the invention, the second above-mentioned top layer circuit for example is positioned to be waited to remove outside the district, and release layer is formed on the surface of core layer.
According to the manufacture method of the described wiring board of the embodiment of the invention, the second above-mentioned top layer circuit for example is arranged in district to be removed, and release layer is formed on the surface of the second top layer circuit.
Manufacture method according to the described wiring board of the embodiment of the invention; The formation method of the first above-mentioned via for example is earlier through machine drilling manufacture craft or direct laser drill (direct laser drilling; DLD) manufacture craft forms a plurality of through holes in first line construction, internal substrate, release layer and second line construction.Then, on the inwall of these through holes, form conductor layer.
According to the manufacture method of the described wiring board of the embodiment of the invention, above-mentioned remove release layer with and the method for second line construction of top and first via for example be to carry out the laser cutting manufacture craft on every side along what wait to remove the district earlier.Then, divest the release layer waiting to remove in the district with and second line construction and first via of top.
According to the manufacture method of the described wiring board of the embodiment of the invention, at least one in the second above-mentioned via is for example outstanding from second surface.
Based on above-mentioned; In the present invention; Fin arrangement is in the depression of circuit board structure; And dispose in the circuit board structure and be connected with depression and, therefore when electronic component is disposed on this circuit board structure with respect to depression, can heat conduction to the fin of electronic component generation be discharged through via in order to the via of heat conduction.In addition, compare,, therefore can reduce the volume after the assembling effectively because fin arrangement is in the depression of circuit board structure with background technology.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended accompanying drawing to elaborate as follows.
Description of drawings
Figure 1A to Fig. 1 E is the making flow process generalized section of the wiring board that one embodiment of the invention illustrated;
Fig. 2 wait to remove for one embodiment of the invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map;
Fig. 3 wait to remove for another embodiment of the present invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map;
Fig. 4 A to Fig. 4 E is the making flow process generalized section of the wiring board that another embodiment of the present invention illustrated;
Fig. 5 wait to remove for another embodiment of the present invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map;
Fig. 6 wait to remove for another embodiment of the present invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map;
Fig. 7 wait to remove for another embodiment of the present invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map.
The main element symbol description
100: internal substrate
100a: first surface
100b: second surface
100c: district to be removed
102: core layer
104: the first top layer circuits
106: the second top layer circuits
108: internal connection-wire structure
110: release layer
112: the first line constructions
112a, 112e, 114a, 114e: increase a layer dielectric layer
112b, 112g, 114b, 114g: blind hole
112c, 112h, 114c, 114h: conduction duct
112d, 114d: build-up circuit layer
112f, 114f: line material layer
114: the second line constructions
116a, 116b: through hole
118: conductor layer
118a, 118b, 122: via
120: depression
600: the patterning opening
Embodiment
Figure 1A to Fig. 1 E is the making flow process generalized section according to the wiring board that one embodiment of the invention illustrated.At first, please with reference to Figure 1A, internal substrate 100 is provided.Internal substrate 100 has first surface 100a and second surface 100b.First surface 100a is relative with second surface 100b, and have on the second surface 100b wait to remove the district 100c.Internal substrate 100 comprises core layer 102, the first top layer circuit 104, the second top layer circuit 106 and internal connection-wire structure 108.Core layer 102 for example is a dielectric layer.The first top layer circuit 104 and the second top layer circuit 106 are disposed at relative two sides of core layer 102 respectively.The first top layer circuit 104 for example is electrically connected through the internal connection-wire structure 108 that is arranged in core layer 102 with the second top layer circuit 106.The first top layer circuit 104, the second top layer circuit 106 for example are metal with the material of intraconnections 108.In the present embodiment, internal connection-wire structure 108 for example is the via that the first top layer circuit 104 is electrically connected with the second top layer circuit 106.In other embodiments, internal connection-wire structure 108 also can comprise one or more layers internal wiring and with these internal wirings, the first top layer circuit be connected with the second top layer line electricity via.In addition, in the present embodiment, wait to remove on the second surface 100b among the district 100c and do not have the second top layer circuit 106.
Then, please with reference to Figure 1B, waiting to remove formation release layer 110 on the second surface 100b among the district 100c.The formation method of release layer 110 for example is directly separated type material to be attached on the second surface 100b, promptly directly is attached on the core layer 102.The material of release layer 110 for example is fluorine resin (fluoro-resin) or fluoropolymer (fluoro-polymer) or metal for being easy to and the dielectric material material separate.Then, on first surface 100a and second surface 100b, form first line construction 112 and second line construction 114 respectively.The formation method of first line construction 112 and second line construction 114 for example is the mode that increases layer (build-up) of utilizing earlier; On first surface 100a, form and increase layer dielectric layer 112a and the first line material layer (not illustrating), and formation increases layer dielectric layer 114a and the second line material layer (not illustrating) on second surface 100b.The material of the first line material layer and the second line material layer is metal, for example copper.Then, in increasing layer dielectric layer 112a and the first line material layer, form blind hole 112b, and in increasing layer dielectric layer 114a and the second line material layer, form blind hole 114b.Blind hole 112b exposes first line layer 104 of part, and blind hole 114b exposes second line layer 106 of part.The formation method of blind hole 112b and 114b for example is a laser drill.Then; Electroplate manufacture craft, in blind hole 112b, form conduction duct 112c, to be electrically connected the first line material layer and first line layer 104; And in blind hole 114b, form conduction duct 114c, to be electrically connected the second line material layer and second line layer 106.Then, the first line material layer and the second line material layer are carried out the patterning manufacture craft, to form build-up circuit layer 112d and build-up circuit layer 114d.Afterwards, utilize the mode increase layer once more, increase layer dielectric layer 112e and line material layer 112f increasing to form on layer dielectric layer 112a, and formation increases layer dielectric layer 114e and line material layer 114f on layer dielectric layer 114a increasing.
In the present embodiment, first line construction 112 and second line construction 114 have comprised two layers of dielectric layer and two-layer line layer respectively, but the present invention is not limited to this.In other embodiments, look actual demand, first line construction 112 and second line construction 114 also can comprise the dielectric layer of multilayer more and the line layer of multilayer more respectively.
Then, please with reference to Fig. 1 C, in first line construction 112, internal substrate 100, release layer 110 and second line construction 114, form a plurality of through hole 116a, for example two or more through hole 116a.The formation method of through hole 116a for example is machine drilling manufacture craft or direct laser drill manufacture craft.Fig. 2 for form internal substrate behind the through hole on look sketch map.As shown in Figure 2, owing in waiting to remove district 100c, do not have the second top layer circuit 106, so through hole 116a is formed in the core layer 102 of internal substrate 100.In addition, in the present embodiment,, can also look actual demand and form through hole 116b in waiting to remove outside the district 100c except in waiting to remove district 100c, forming the through hole 116a.In addition; In the described step of Fig. 1 C; Can also utilize the machine drilling manufacture craft and in increasing layer dielectric layer 112e and line material layer 112f, form blind hole 112g; And in increasing layer dielectric layer 114e and line material layer 114f, form blind hole 114g, wherein blind hole 112g exposes the build-up circuit layer 112 of part, and blind hole 114g exposes the build-up circuit layer 114 of part.
Then, please, electroplate manufacture craft, to form conductor layer 118 on the inwall of through hole 116a and 116b and among blind hole 112g and the 114g with reference to Fig. 1 D.The conductor layer 118 that is arranged in through hole 116a constitutes via 118a.The conductor layer 118 that is arranged in through hole 116b constitutes via 118b.The conductor layer 118 that is arranged in blind hole 112g and 114g constitutes conduction duct 112h and 114h respectively.
Afterwards, please with reference to Fig. 1 E, conductor layer 118 is carried out the patterning manufacture craft, to form required line layer.Then; Remove release layer 110 with and second line construction 114 and via 118a (promptly being positioned at the conductor layer 118 of release layer 110 tops) of top; In second line construction 114, forming depression 120, and form via 122 (remaining conductor layer 118 constitutes in by through hole 116a) in depression 120 belows.Remove release layer 110 with and the method for second line construction 114 of top and via 118a for example be earlier along wait to remove district 100c around carry out the laser cutting manufacture craft.Then, divest the release layer 110 waiting to remove among the district 100c with and second line construction 114 and via 118a of top.Special one carry be; Since after the laser cutting manufacture craft be with the mode that directly divests remove release layer 110 with and above rete; Therefore after divesting, still have segment conductor layer 118 and residue in around the through hole 116a, that is via 122 can wait certainly that the second surface 110b (surface of core layer 102) that removes among the district 100c is outstanding.In the present embodiment, the via 122 around each through hole 116a is all from waiting that the second surface 110b that removes among the district 100c is outstanding.In other embodiments, also possibly be that via 122 around one or the partial through holes 116a is from waiting that the second surface 110b that removes among the district 100c is outstanding.In addition, in the present embodiment, the outstanding via of waiting certainly to remove among the district 100c 122 of second surface 110b is upright, but in other embodiments, the via 122 of these outstanding second surface 110b also possibly partly or entirely toppled over.
In the wiring board shown in Fig. 1 E, via 118b is in order to be electrically connected first line construction 112 with second line construction 114.In addition, depression 120 is in order to ccontaining fin.Therefore, when electronic component arrangements is on first line construction, can with fin arrangement in depression 120, heat conduction to the fin that electronic component produces be discharged through via 122.Because fin arrangement is in depression 120, therefore compare with background technology, can reduce the volume after the assembling effectively.
Special one carry be; For fear of along wait to remove district 100c around when carrying out the laser cutting manufacture craft; Waiting to remove core layer 102 around the district 100c receives laser cutting and damages; Therefore can the second top layer circuit 106 be designed to around waiting to remove district 100c the barrier layer with as laser cutting the time.Fig. 3 for waited to remove according to another embodiment of the present invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map.As shown in Figure 3, wait to remove district 100c around have the second top layer circuit 106, therefore when laser cutting, it is impaired with the core layer of avoiding waiting removing around the district 100c 102 that the second top layer circuit 106 can be used as the barrier layer.Therefore, remove release layer 110 and on rete and after forming depression 120, can be positioned at the edge of depression 120 as the second top layer circuit 106 on barrier layer.
Fig. 4 A to Fig. 4 E is the making flow process generalized section according to the wiring board that another embodiment of the present invention illustrated.In the present embodiment, will represent with identical label with Figure 1A to Fig. 1 E components identical.At first, please with reference to Fig. 4 A, internal substrate 100 is provided.Internal substrate 100 comprises core layer 102, the first top layer circuit 104, the second top layer circuit 106 and the internal connection-wire structure 108 that the first top layer circuit 104 is electrically connected with the second top layer circuit 106.In the present embodiment, wait that the core layer 102 that removes among the district 100c is covered by the second top layer circuit 106 fully.
Then, please with reference to Fig. 4 B to Fig. 4 C.The described step of Fig. 4 B to Fig. 4 C is identical with Figure 1B to Fig. 1 C, at this NES.Special one carry be; In the present embodiment; Because the core layer of waiting to remove among the district 100c 102 is covered by second line layer 106 fully, therefore, release layer 110 waits to remove the second surface 100b that distinguishes among the 100c upward the time when being formed at, and release layer 110 is to be attached on the second top layer circuit 106.In addition, because the core layer of waiting to remove among the district 100c 102 covered by the second top layer circuit 106 fully, so through hole 116a can pass and wait to remove the second top layer circuit of distinguishing among the 100c 106, and is as shown in Figure 5.
In addition, in another embodiment, wait that the second top layer circuit 106 that removes among the district 100c can have patterning opening 600, and through hole 116a can be formed in the patterning opening 600, as shown in Figure 6.In Fig. 6, patterning opening 600 is the cross opening, but the present invention is not limited to this.In other embodiments, patterning opening 600 also can be other shaped aperture.
Afterwards, please with reference to Fig. 4 D to Fig. 4 E.The described step of Fig. 4 D to Fig. 4 E is identical with Fig. 1 D to Fig. 1 E, at this NES.Special one carry be, in the present embodiment because release layer 110 is attached on the second top layer circuit 106, therefore remove release layer 110 with and above rete after, depression 120 can expose the second top layer circuit 106.Likewise; Since after the laser cutting manufacture craft be with the mode that directly divests remove release layer 110 with and above rete; Therefore after divesting, still have segment conductor layer 118 and residue in around the through hole 116a, that is via 122 can wait certainly that the second surface 110b (surface of second line layer 106) that removes among the district 100c is outstanding.Likewise, in the present embodiment, the via 122 around each through hole 116a is all from treating that second surface 110b is outstanding, and in other embodiments, also can be that the via 122 around or the partial through holes 116a is outstanding from second surface 110b.In addition, in the present embodiment, the via 122 outstanding from second surface 110b is upright, but in other embodiments, the via 122 of these outstanding second surface 110b also possibly partly or entirely toppled over.
Fig. 7 for waited to remove according to another embodiment of the present invention illustrated the internal substrate that forms in the district behind the through hole on look sketch map.Please with reference to Fig. 7; The difference of present embodiment and the described embodiment of Fig. 5 is: in the present embodiment; The core layer of waiting to remove among the district 100c 102 is only covered by the second top layer circuit, 106 parts, and through hole 116a passes and waits to remove the second top layer circuit 106 among the district 100c.In addition, similar with the described embodiment of Fig. 3, in the present embodiment, the second top layer circuit 106 of part is optionally around waiting to remove district 100c.
In above-mentioned Fig. 2, Fig. 3, Fig. 5, Fig. 6 and Fig. 7, all illustrated 12 through hole 116a, but the present invention in other embodiments, also can have the through hole of other quantity not as limit.
Special one carry be, in above-mentioned each embodiment, after forming depression 120, can also be further with via 122 from waiting that the outstanding part of second surface 110b (surface of the core layer 102 or the second top layer circuit 106) that removes among the district 100c removes.
In sum; The present invention forms in circuit board structure and is connected in order to the depression of ccontaining fin and with depression and in order to the via of heat conduction; Therefore when electronic component is installed on this circuit board structure with respect to depression, can heat conduction to the fin that is installed in the depression that electronic component produces be discharged through the via in the circuit board structure.
In addition, in the present invention,, therefore fin is installed in the volume that can reduce effectively in the depression after the assembling, to reach the purpose of shorten product sizes because circuit board structure has depression.
Though disclosed the present invention in conjunction with above embodiment; Yet it is not in order to limit the present invention; Be familiar with this operator in the technical field under any; Do not breaking away from the spirit and scope of the present invention, can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (17)
1. wiring board comprises:
Internal substrate, have first surface and with this first surface opposing second surface;
First line construction is disposed on the first surface;
A plurality of vias are disposed in this internal substrate and this first line construction; And
Second line construction is disposed on the second surface, and this second line construction has depression, and this depression exposes this second surface and those vias, and at least one in those vias that wherein this depression exposed is outstanding from this second surface.
2. wiring board as claimed in claim 1, wherein this internal substrate comprises:
Core layer;
The first top layer circuit and the second top layer circuit are disposed at the relative both sides of this core layer respectively; And
Internal connection-wire structure is disposed in this core layer, to be electrically connected this first top layer circuit and this second top layer circuit.
3. wiring board as claimed in claim 2, this second surface that wherein this depression exposed is the surface of this core layer.
4. wiring board as claimed in claim 2, this second surface that wherein this depression exposed is the surface of this second top layer circuit.
5. wiring board as claimed in claim 4, this second top layer circuit that wherein this depression exposed has a plurality of patterning openings, and each via is arranged in wherein one of those patterning openings.
6. wiring board as claimed in claim 2, this second surface that wherein this depression exposed comprises the surface of this core layer and this second top layer circuit.
7. wiring board as claimed in claim 6, at least one in those vias that wherein this depression exposed is outstanding from the surface of this second top layer circuit.
8. wiring board as claimed in claim 7, this second top layer circuit that wherein this depression exposed has a plurality of patterning openings, and each via is arranged in wherein one of those patterning openings.
9. wiring board as claimed in claim 7; The part of this second top layer circuit that wherein this depression exposed is positioned at the edge of this depression; And another part of this second top layer circuit that this depression exposed has a plurality of patterning openings, and each via is arranged in wherein one of those patterning openings.
10. wiring board as claimed in claim 7, this second top layer circuit that wherein this depression exposed is positioned at the edge of this depression.
11. the manufacture method of a wiring board comprises:
One internal substrate is provided, this internal substrate have first surface and with this first surface opposing second surface, and have district to be removed on this second surface;
Wait to remove formation one release layer on this second surface in the district at this;
On this first surface and this second surface, form first line construction and second line construction respectively;
In this first line construction, this internal substrate, this release layer and this second line construction, form a plurality of first vias; And
Remove this release layer with and this second line construction and those first vias of top, in this second line construction, forming depression, and below this depression, form a plurality of second vias.
12. the manufacture method of wiring board as claimed in claim 11, wherein this internal substrate comprises:
Core layer;
The first top layer circuit and the second top layer circuit are disposed at the relative both sides of this core layer respectively; And
Internal connection-wire structure is disposed in this core layer, to be electrically connected this first top layer circuit and this second top layer circuit.
13. the manufacture method of wiring board as claimed in claim 12, wherein this second top layer circuit is positioned at this and waits to remove outside the district, and this release layer is formed on the surface of this core layer.
14. the manufacture method of wiring board as claimed in claim 12, wherein this second top layer circuit is arranged in this district to be removed, and this release layer is formed on the surface of this second top layer circuit.
15. the manufacture method of wiring board as claimed in claim 11, wherein the formation method of those first vias comprises:
Through machine drilling manufacture craft or direct laser drill manufacture craft, in this first line construction, this internal substrate, this release layer and this second line construction, form a plurality of through holes; And
On the inwall of those through holes, form a conductor layer.
16. the manufacture method of wiring board as claimed in claim 11, wherein remove this release layer with and this second line construction of top and the method for those first vias comprise:
Along this wait to remove the district around carry out the laser cutting manufacture craft; And
Divest this wait to remove in the district this release layer with and this second line construction and those first vias of top.
17. the manufacture method of wiring board as claimed in claim 11, wherein at least one in those second vias is outstanding from this this second surface of waiting to remove in the district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010597848.9A CN102573271B (en) | 2010-12-21 | 2010-12-21 | Wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010597848.9A CN102573271B (en) | 2010-12-21 | 2010-12-21 | Wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102573271A true CN102573271A (en) | 2012-07-11 |
| CN102573271B CN102573271B (en) | 2015-09-09 |
Family
ID=46417384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010597848.9A Active CN102573271B (en) | 2010-12-21 | 2010-12-21 | Wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102573271B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080141A (en) * | 2006-05-24 | 2007-11-28 | 富士通株式会社 | Printed circuit board unit |
| CN101170878A (en) * | 2006-10-27 | 2008-04-30 | 三星电机株式会社 | Method for manufacturing print circuit board |
-
2010
- 2010-12-21 CN CN201010597848.9A patent/CN102573271B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080141A (en) * | 2006-05-24 | 2007-11-28 | 富士通株式会社 | Printed circuit board unit |
| CN101170878A (en) * | 2006-10-27 | 2008-04-30 | 三星电机株式会社 | Method for manufacturing print circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102573271B (en) | 2015-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5727521B2 (en) | Printed circuit board and manufacturing method thereof | |
| TWI517770B (en) | Printed circuit board and method for manufacturing the same | |
| US7404251B2 (en) | Manufacture of printed circuit boards with stubless plated through-holes | |
| US9603263B2 (en) | Manufacturing method of circuit substrate | |
| US20060284640A1 (en) | Structure of circuit board and method for fabricating the same | |
| US10083901B2 (en) | Method for manufacturing circuit redistribution structure | |
| US7908744B2 (en) | Method for fabricating printed circuit board having capacitance components | |
| CN104576596B (en) | Semiconductor substrate and its manufacturing method | |
| CN101409238A (en) | Method for preparing seedless layer package substrate | |
| US8008682B2 (en) | Alumina substrate and method of making an alumina substrate | |
| KR101164957B1 (en) | PCB within cavity and Fabricaring method of the same | |
| US10182494B1 (en) | Landless via concept | |
| JPWO2009101904A1 (en) | Semiconductor device and manufacturing method thereof | |
| KR20140048564A (en) | Structure of heat dissipation substrate having thermal channel and manufacturing method thereof | |
| US20130020699A1 (en) | Package structure and method for fabricating the same | |
| KR101136396B1 (en) | PCB within cavity and Fabricaring method of the same | |
| CN101657071B (en) | Manufacturing method of blind via structure of substrate | |
| CN102573271A (en) | Circuit board and manufacturing method thereof | |
| JP2011040720A (en) | Printed circuit board and manufacturing method thereof | |
| US20090090548A1 (en) | Circuit board and fabrication method thereof | |
| CN113675158B (en) | Circulation cooling embedded packaging substrate and manufacturing method thereof | |
| CN101765912A (en) | Method for producing an electronic component and electronic component | |
| TWI646872B (en) | Circuit board structures and methods for fabricating the same | |
| KR101009080B1 (en) | A heat radiating printed circuit board and a method of manufacturing the same | |
| TWI392407B (en) | Circuit board and manufacturacting mthod thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |