CN102572036B - Electronic product - Google Patents
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- CN102572036B CN102572036B CN201010610147.4A CN201010610147A CN102572036B CN 102572036 B CN102572036 B CN 102572036B CN 201010610147 A CN201010610147 A CN 201010610147A CN 102572036 B CN102572036 B CN 102572036B
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- 238000009792 diffusion process Methods 0.000 claims description 22
- 238000005538 encapsulation Methods 0.000 claims description 14
- 230000005236 sound signal Effects 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
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- 230000001413 cellular effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
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- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 208000002925 dental caries Diseases 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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Abstract
The invention provides an electronic product. The electronic product comprises a shell and a sound sensor array which is arranged in the shell and is composed of at least two sound sensor units, wherein sound holes corresponding to sound sensor units are arranged on the shell; the center spacing between two of the sound sensor units is less than the spacing between two of the sound holes on the shell; and the sound sensor units are respectively communicated with the corresponding sound holes on the shell by relatively diffused and extended sound channels. According to the electronic product, a plurality of sound sensor units can be arranged adjacently without increasing internal size of product, and the outside signal receiving positions of the sound holes of a plurality of sound sensors are extended by relatively diffused and extended sound channels, so that the spacing between two of the sound holes in the sound sensors is realized.
Description
Technical field
The present invention relates to microphone applications technical field, more specifically, relate to a kind of electronic product of applying microphone products.
Background technology
Along with social progress and the development of technology, the popularity rate of the small portable electronic products such as mobile phone is more and more higher.The small portable electronic product inside such as general mobile phone are all provided with sound transducer for receiving extraneous voice signal, in recent years, along with electronic product is more and more higher to the requirement of phonetic entry performance, stricter to reducing the requirements such as noise, the microphone function that only comprises a pick-up is single, be difficult to realize some specific functions, can not meet the multiple demand of current portable type electronic product to microphone.
Therefore, portions of electronics product starts to adopt at least two sound transducers to form array structure, the patent that for example Chinese Patent Application No. is 200820043724.4, a kind of acoustic pick-up array construction of microphone is disclosed, this structure comprises two miniature pick-ups that are combined on substrate, the center distance of two pick-ups is 10.5mm, and its scale error is positive and negative is 0.1mm.But this sound transducer array disclosing for 200820043724.4 patents for this application number, realize necessary acoustical behavior, just need to realize enough phase differences, if two microphone spaces are too little, arrive two microphones from a sound source and just do not have the phase difference time difference in other words, acoustic signal cannot be processed, therefore requires the center distance of sound transducer unit larger.
But well-known, the size of cell phone type portable electronic products reduces rapidly, its inside also dwindles gradually for the space that various parts are installed, the sound transducer overall dimensions adopting is generally reduced into less than 10 cubic millimeters, multiple sound transducers is installed on different positions, except taking the inner space of electronic product, also cause complexity increasing is installed, circuit configuration complexity, production cost increases, and product reliability also has decline.
Therefore, need to a kind ofly can meet the microphone products that can either control sound transducer overall dimensions, can meet again the multiple demand of portable type electronic product to microphone.
Summary of the invention
In view of the above problems, the object of this invention is to provide one multiple sound transducers are installed, but relatively the pickup electronic product of conventional art can reduce again the electronic product of the good and low cost of manufacture of size, the acoustic efficiency of product greatly.
According to an aspect of the present invention, a kind of electronic product is provided, comprise shell and be arranged at the sound transducer array by least two sound transducer cell formations in described shell, on described shell, being provided with and sound hole one to one, described sound transducer unit, wherein:
The center distance of described sound transducer unit is less than the spacing in sound hole corresponding on described shell, and the sound channel that described sound transducer unit extends by relative diffusion is communicated with respectively sound hole corresponding on described shell.
Improve as one, the sound channel of described relative diffusion is arranged on described shell.
Improve as one, be provided with the main circuit board of described electronic product in described shell, described sound transducer cellular installation is on the main circuit board of described electronic product.
Improve as one, described sound transducer unit is MEMS sound transducer, described MEMS sound transducer is integrated in an encapsulation being made up of sound transducer shell and sound transducer wiring board, and by barrier portion, described encapsulation is divided into the cavity equating with described MEMS sound transducer quantity between described MEMS sound transducer.
Improve as one, be provided with sound transducer sound hole respectively with described cavity on corresponding described sound transducer shell, the sound channel of described relative diffusion is the sound hole of correspondence on airtight connection described sound transducer sound hole and described shell respectively.
Improve as one, between described mobile phone main circuit board and shell, be provided with a gum cover;
Described gum cover holds fixing described sound transducer array, and the sound channel that described relative diffusion is extended is arranged on the surface that described gum cover is adjacent with described shell.
Improve as one, described sound transducer unit is MEMS sound transducer, described MEMS sound transducer is integrated in an encapsulation being made up of a cavity being made up of sound transducer shell and sound transducer wiring board, and the MEMS sensor chip in described MEMS sound transducer is arranged on the surface of the sound transducer wiring board in described cavity; And
On described sound transducer wiring board, the position corresponding with described MEMS sensor chip is also provided with the sound transducer sound hole for receiving external sound signal;
Described sound transducer by described sound transducer wiring board welded and installed on described main circuit board with described shell away from a side, and on described main circuit board, be provided with the main circuit board sound hole corresponding with described sound transducer sound hole;
The sound channel of described relative diffusion is communicated with sound hole corresponding on described sound transducer sound hole and described shell by the described main circuit board sound of airtight connection hole.
Improve as one, between described mobile phone main circuit board and shell, be provided with a gum cover, be formed with parallel gum cover sound hole in described gum cover inside;
The sound channel of described relative diffusion is arranged on described shell;
Sound hole on described shell is communicated with described sound transducer sound hole by described sound channel, described gum cover sound hole, described main circuit board sound hole successively.
According to of the present invention, can make multiple sound transducers unit adjacently arrange, and don't increasing interiors of products size, the sound channel extending by relative diffusion receives multiple sound transducers the sound hole site expansion of outer signals, thereby realizes the sound pitch of holes that sound transducer needs.
In order to realize above-mentioned and relevant object, one or more aspects of the present invention comprise below by the feature that describes in detail and particularly point out in the claims.Explanation below and accompanying drawing describe some illustrative aspects of the present invention in detail.But, the instruction of these aspects be only some modes that can use in the variety of way of principle of the present invention.In addition, the present invention is intended to comprise all these aspects and their equivalent.
Brief description of the drawings
By reference to the content below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present invention, other object of the present invention and result will be understood and easy to understand more.In the accompanying drawings:
Fig. 1 is the schematic appearance of the present invention as a kind of mobile phone;
Fig. 2 a is the partial structurtes schematic diagram of the embodiment of the present invention one;
Fig. 2 b is that the partial structurtes of the embodiment of the present invention one are improved schematic diagram;
Fig. 2 c is the sound transducer array structure schematic diagram of the embodiment of the present invention one;
Fig. 2 d is the sound transducer array vertical view of the embodiment of the present invention one;
Fig. 2 e is the gum cover structural representation of the embodiment of the present invention one;
Fig. 2 f is the shell concrete structure vertical view of the embodiment of the present invention one;
Fig. 3 is the partial structurtes schematic diagram of the embodiment of the present invention two;
Fig. 4 is the partial structurtes schematic diagram of the embodiment of the present invention three.
In institute's drawings attached, identical label is indicated similar or corresponding feature or function.
Embodiment
As previously mentioned, the object of the invention is in order to solve the problems of too that takes up room because OC requirement causes between the sound transducer of formation sound transducer array structure, in order further to dwindle the shared space of sound transducer array structure on the basis ensureing microphone products superperformance, make the structure of the electronic product of applying sound transducer array structure compacter, the sound channel that the present invention extends by relative diffusion dexterously extends to larger spacing by the sound transducer being arranged on less space for the sound hole that receives external sound, thereby realize the needed acoustic efficiency of sound transducer array.
Below with reference to accompanying drawing, specific embodiments of the invention are described in detail.
In below to the statement of specific embodiment, except special instruction, " shell ", " sound hole " all refer to the shell of electronic product of the present invention and be arranged on the sound hole on electronic product casing of the present invention, and the shell, the sound hole that form the sound transducer of sound transducer array represent with the form such as " sound transducer shell ", " sound transducer sound hole " or " MEMS sound transducer sound hole ".
Embodiment mono-
This enforcement one example adopts the exemplary carrier of a kind of mobile phone as electronic product of the present invention, and Fig. 1 is the cell phone appearance schematic diagram of application embodiments of the invention one, and Fig. 2 a is the partial structurtes schematic diagram at the mobile phone sound hole place shown in Fig. 1.
As shown in Figure 1, the 1st, the shell of mobile phone, on shell 1, be provided with two for receiving the sound hole 11 and 12 of external sound signal, the spacing L in sound hole 11 and 12 is greater than 10mm, to make can there is enough phase differences by the received voice signal in these two sound holes, thereby realize the needed effect of array microphone.In Fig. 1, the internal structure of sound transducer is not described in detail, only do installation site signal.
Fig. 2 a is the structural representation that mobile phone part is provided with sound transducer position, as shown in Figure 2, sound hole 11 and 12 is run through and is arranged on shell 1, arrange and can have multiple sound transducers unit in shell 1 inside, in the present embodiment one, only do exemplary illustration with two sound transducer unit, in the plan of establishment of multiple sound transducers and the present embodiment, the plan of establishment of two sound transducers is similar, those skilled in the art can class release the adjacent plan of establishment that is arranged on the spacing that between the sound hole that makes sound transducer compared with little space, maintenance needs of multiple sound transducers from the technical description of the present embodiment one.
Two sound transducers in embodiment mono-shown in Fig. 2 a are respectively the sound transducer 22 of sound transducer 21 and adjacent setting, are respectively arranged with sound transducer sound hole 211 and sound transducer sound hole 221 for receiving external sound signal on sound transducer 21 and sound transducer 22.In the present invention, sound transducer 21 setting adjacent with sound transducer 22, its center distance is very little, even only have several millimeters, be provided with sound channel 111 and 121 in the inside of shell 1, wherein sound channel 111 connects sound hole 11 and sound transducer sound hole 211, and sound channel 121 connects sound hole 12 and sound transducer sound hole 221, and sound channel 111 and 121 relative diffusion are extended, thereby the sound hole that makes two sound transducers receive external sound is lengthened to larger spacing.
Obviously, rely on this structure shown in Fig. 2 a, multiple sound transducers unit (as 21,22) is in the situation that size is less, still can adjacently be arranged on less space, the sound channel that only need to extend by relative diffusion, extends to larger spacing by the sound hole that receives external sound, just can realize the acoustic efficiency that sound transducer array needs, and do not need complicated circuit design, do not need to increase the inside installing space of electronic product yet.
Further, the present embodiment one is also just like the improvement project of Fig. 2 b to Fig. 2 f.Fig. 2 b to Fig. 2 f is respectively the schematic diagram of partial structurtes improvement, sound transducer array structure, gum cover structure and the shell mechanism of the embodiment of the present invention one.
As shown in Fig. 2 b and Fig. 2 c, in this improvement project, sound transducer 21 and sound transducer 22 are the MEMS sound transducer that utilizes MEMS (micro electro mechanical system) technique to make, and be integrated in an encapsulation being formed by sound transducer shell 23 and sound transducer wiring board 24, and, by the barrier portion 231 being arranged in encapsulation, between two sound transducers, this encapsulation is divided into two cavitys, these two cavitys are not connected each other.
That is to say, in the improvement project shown in Fig. 2 b and Fig. 2 c, be provided with barrier portion 231 at sound transducer shell 23 middle parts, thereby make sound transducer shell 23 and sound transducer wiring board 24 in conjunction with forming two cavitys, MEMS sensor chip 212 and IC chip 213 are installed in one of them cavity, MEMS sensor chip 222 and IC chip 223 are installed in another cavity, are separately positioned on two sound transducer shells 23 that cavity is corresponding for receiving the sound transducer sound hole 211 and 221 of external sound signal.Sound transducer 21 and sound transducer 22 all by sound transducer wiring board 24 welded and installed on mobile phone main circuit board 3.
In a preferred embodiment of the present invention, between mobile phone main circuit board 3 and shell 1, be provided with a gum cover 4, the strong flexible gum cover of the preferred sealing of this gum cover 4, sound transducer 21 and sound transducer 22 are held fixing by gum cover 4, on gum cover 4 surface adjacent with shell 1, be provided with the sound channel 111 and 121 that relative diffusion is extended, the airtight connection of sound hole with phone housing by the sound transducer sound hole of sound transducer 21 and sound transducer 22 respectively, thereby the sound channel that sound transducer sound hole nearer relative position is extended by relative diffusion extends to the distance in two sound holes on phone housing, realize the acoustic efficiency that sound transducer array needs.Particularly, sound channel 111 connects respectively sound hole 11 and sound transducer sound hole 211, and sound channel 121 connects respectively sound hole 12 and sound transducer sound hole 221.
In the improvement project shown in Fig. 2 b to Fig. 2 f, equally only do exemplary illustration with two MEMS sound transducer unit, in the plan of establishment of multiple MEMS sound transducers and this improvement project, the plan of establishment of two sound transducers is similar, barrier portion wherein can all separate all MEMS sound transducers in an integration packaging separately independently in cavity, those skilled in the art can class release the adjacent plan of establishment that is arranged on the spacing that between the sound hole that makes sound transducer compared with little space, maintenance needs of multiple MEMS sound transducers from above-mentioned technical description.
This improved structure, adopt multiple MEMS sound transducers have been integrated in to a scheme in encapsulation, the sound transducer size of entirety is cumulative much smaller than the size of multiple sound transducers, and as an encapsulation unit, not only very convenient in installation, can effectively enhance productivity, be also convenient to the internal structure design of electronic product, reduce wiring board design complexity and usable floor area, there is extraordinary technique effect.Meanwhile, rely on the strong flexible gum cover of sealing property not only can realize more easily the transfer of sound hole site, the expansion of spacing, can also provide reliable guarantee for the air-tightness of sound channel, reach good acoustic efficiency.
Embodiment bis-
Fig. 3 is the partial structurtes schematic diagram of the embodiment of the present invention two.As shown in Figure 3, with respect to embodiment mono-, sound transducer structure in the present embodiment two and sound channel structure difference, in the present embodiment two, sound transducer 21 and the MEMS sound transducer of sound transducer 22 for utilizing MEMS (micro electro mechanical system) technique to make, and be integrated in an encapsulation being formed by sound transducer shell 23 and sound transducer wiring board 24, sound transducer shell 23 and sound transducer wiring board 24 are in conjunction with forming a cavity, MEMS sensor chip 212 and MEMS sensor chip 222 are arranged on the surface of the sound transducer wiring board 24 in described cavity, and on sound transducer wiring board 24, the position corresponding with MEMS sensor chip 212 and MEMS sensor chip 222 is also provided with the sound transducer sound hole 211 and 221 for receiving external sound signal.Sound transducer 21 and sound transducer 22 by sound transducer wiring board 24 welded and installed on mobile phone main circuit board 3 with phone housing 1 away from a side, and on main circuit board 3, be provided with the main circuit board sound hole 31 and 32 corresponding with sound transducer sound hole 211 and 221.Between mobile phone main circuit board 3 and shell 1, be provided with a flexible gum cover 4, the inner sound channel 111 and 121 that forms two relative diffusion extensions of gum cover 4, sound channel 111 connects respectively sound hole 11 and main circuit board sound hole 31, and sound channel 121 connects respectively sound hole 12 and main circuit board sound hole 32.Thereby extraneous voice signal can enter from sound hole 11, enter sound transducer 21 and be applied on MEMS sensor chip 212 through sound channel 111, main circuit board sound hole 31, sound transducer sound hole 211; Also can enter from sound hole 12, enter sound transducer 22 and be applied on MEMS sensor chip 222 through sound channel 121, main circuit board sound hole 32, sound transducer sound hole 221.
This improved structure of the present embodiment two, adopt multiple MEMS sound transducers have been integrated in to a scheme in encapsulation, the sound transducer size of entirety is cumulative much smaller than the size of multiple sound transducers, and do not need the separation of barrier portion as an encapsulation unit, not only very convenient in installation, also simplify production technology, improve production efficiency, be convenient to the internal structure design of electronic product, reduce wiring board design complexity and usable floor area, there is extraordinary technique effect.Meanwhile, sound transducer is installed on the side of mobile phone main circuit board away from shell, can reduce on the whole the thickness of mobile phone, more meets the needs of small-sized electronic product design.
Embodiment tri-
Fig. 4 is the partial structurtes schematic diagram of the embodiment of the present invention three.As shown in Figure 4, with respect to embodiment bis-, sound channel structure difference in the present embodiment three, in the present embodiment three, flexible gum cover 4 two the parallel gum cover sound holes 41 and 42 of inner formation that arrange between mobile phone main circuit board 3 and shell 1 are communicated with respectively main circuit board sound hole 31 and 32, phone housing 1 inside is provided with the sound channel 111 and 121 that two relative diffusion are extended, sound channel 111 connects respectively sound hole 11 and gum cover sound hole 41, and sound channel 121 connects respectively sound hole 12 and gum cover sound hole 42.Thereby extraneous voice signal can enter from sound hole 11, enter sound transducer 21 and be applied on MEMS sensor chip 212 through sound channel 111, gum cover sound hole 41, main circuit board sound hole 31, sound transducer sound hole 211; Also can enter from sound hole 12, enter sound transducer 22 and be applied on MEMS sensor chip 222 through sound channel 121, gum cover sound hole 42, main circuit board sound hole 32, sound transducer sound hole 221.
This improved structure of the present embodiment three, adopts the technology that relative diffusion prolongation sound channel is set in phone housing, does not need to design complicated gum cover, can reduce on the whole thickness, the reduction production difficulty of mobile phone, meets the needs of small-sized electronic product design.
In the mode of example, the structure according to electronic product of the present invention is described above with reference to accompanying drawing.But, it will be appreciated by those skilled in the art that the electronic product proposing for the invention described above, can also on the basis that does not depart from content of the present invention, make various improvement.In addition, during specific description of embodiments of the present invention, adopt handset structure to set forth inventive concept of the present invention as case study on implementation above-mentioned, obviously other small-sized electronic product equipments can adopt technology of the present invention equally; And adopt during specific description of embodiments of the present invention two sound transducer unit to set forth inventive concept of the present invention as case study on implementation above-mentioned, obviously also can adopt more sound transducers, only need to do small technological adjustment, both can reach same product effect.Electronic product can be made for the multiple sound hole that receives external sound signal on shell, also can guide to shell by the sound transmission device of gum cover and so on and realize multiple sound hole.Therefore, should be appreciated that this type of simple adjustment all belongs to protection scope of the present invention, protection scope of the present invention should be determined by the content of appending claims.
Claims (10)
1. an electronic product, comprises shell and is arranged at the sound transducer array by least two sound transducer cell formations in described shell, is provided with and sound hole one to one, described sound transducer unit on described shell, it is characterized in that:
Center distance between described sound transducer unit is less than the spacing in sound hole corresponding on described shell, and the sound channel that described sound transducer unit extends by relative diffusion is communicated with respectively sound hole corresponding on described shell.
2. electronic product as claimed in claim 1, is characterized in that,
The sound channel of described relative diffusion is arranged on described shell.
3. electronic product as claimed in claim 1, is characterized in that,
In described shell, be provided with the main circuit board of described electronic product, described sound transducer cellular installation is on the main circuit board of described electronic product.
4. electronic product as claimed in claim 3, is characterized in that,
Described sound transducer unit is MEMS sound transducer, described MEMS sound transducer is integrated in an encapsulation being made up of sound transducer shell and sound transducer wiring board, and by barrier portion, described encapsulation is divided into the cavity equating with described MEMS sound transducer quantity between described MEMS sound transducer.
5. electronic product as claimed in claim 4, is characterized in that,
On corresponding described sound transducer shell, be provided with sound transducer sound hole respectively with described cavity, the sound channel of described relative diffusion is corresponding sound hole on airtight connection described sound transducer sound hole and described shell respectively.
6. electronic product as claimed in claim 5, is characterized in that,
Between described mobile phone main circuit board and shell, be provided with a gum cover;
Described gum cover holds fixing described sound transducer array, and the sound channel that described relative diffusion is extended is arranged on the surface that described gum cover is adjacent with described shell.
7. electronic product as claimed in claim 3, is characterized in that,
Described sound transducer unit is MEMS sound transducer, described MEMS sound transducer is integrated in an encapsulation being made up of a cavity being made up of sound transducer shell and sound transducer wiring board, and the MEMS sensor chip in described MEMS sound transducer is arranged on the surface of the sound transducer wiring board in described cavity; And
On described sound transducer wiring board, the position corresponding with described MEMS sensor chip is also provided with the sound transducer sound hole for receiving external sound signal;
Described sound transducer by described sound transducer wiring board welded and installed on described main circuit board with described shell away from a side, and on described main circuit board, be provided with the main circuit board sound hole corresponding with described sound transducer sound hole;
The sound channel of described relative diffusion is communicated with sound hole corresponding on described sound transducer sound hole and described shell by the described main circuit board sound of airtight connection hole.
8. electronic product as claimed in claim 7, is characterized in that,
Between described mobile phone main circuit board and shell, be provided with a gum cover;
The sound channel that described relative diffusion is extended is arranged on described gum cover inside.
9. electronic product as claimed in claim 7, is characterized in that,
Between described mobile phone main circuit board and shell, be provided with a gum cover, be formed with parallel gum cover sound hole in described gum cover inside;
The sound channel of described relative diffusion is arranged on described shell;
Sound hole on described shell is communicated with described sound transducer sound hole by described sound channel, described gum cover sound hole, described main circuit board sound hole successively.
10. the electronic product as described in claim 6 or 9, is characterized in that,
Described gum cover is flexible gum cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201010610147.4A CN102572036B (en) | 2010-12-28 | 2010-12-28 | Electronic product |
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| CN201010610147.4A CN102572036B (en) | 2010-12-28 | 2010-12-28 | Electronic product |
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| CN102572036A CN102572036A (en) | 2012-07-11 |
| CN102572036B true CN102572036B (en) | 2014-07-09 |
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| CN201010610147.4A Active CN102572036B (en) | 2010-12-28 | 2010-12-28 | Electronic product |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204119279U (en) * | 2014-06-18 | 2015-01-21 | 锤子科技（北京）有限公司 | A kind of mobile terminal |
| KR20210101701A (en) * | 2020-02-10 | 2021-08-19 | 삼성전자주식회사 | Portable terminal having speaker and acoustic output path for speaker |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101141828A (en) * | 2006-09-08 | 2008-03-12 | 雅马哈株式会社 | Microphone module and mounting structure adapted to portable electronic device |
| CN201947427U (en) * | 2010-12-28 | 2011-08-24 | 歌尔声学股份有限公司 | Electronic product |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4655017B2 (en) * | 2005-11-25 | 2011-03-23 | パナソニック電工株式会社 | Acoustic sensor |
| JP2007178221A (en) * | 2005-12-27 | 2007-07-12 | Yamaha Corp | Semiconductor device, its manufacturing method, and spacer manufacturing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101141828A (en) * | 2006-09-08 | 2008-03-12 | 雅马哈株式会社 | Microphone module and mounting structure adapted to portable electronic device |
| CN201947427U (en) * | 2010-12-28 | 2011-08-24 | 歌尔声学股份有限公司 | Electronic product |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 No. 268 Dongfang Road, Weifang hi tech Industrial Development Zone, Shandong, Weifang Patentee before: Goertek Inc. |
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Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: No.268, Dongfang Road, high tech Industrial Development Zone, Weifang City, Shandong Province Patentee before: GOERTEK Inc. |