CN102569154B - Wafer clamping device - Google Patents
Wafer clamping device Download PDFInfo
- Publication number
- CN102569154B CN102569154B CN201110459560.XA CN201110459560A CN102569154B CN 102569154 B CN102569154 B CN 102569154B CN 201110459560 A CN201110459560 A CN 201110459560A CN 102569154 B CN102569154 B CN 102569154B
- Authority
- CN
- China
- Prior art keywords
- substrate
- locating piece
- clamping device
- wafer clamping
- fixed teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a wafer clamping device which is characterized by comprising a base plate, a positioning column, a positioning block and an elastic resetting device, wherein the positioning column is arranged on the surface of the base plate and protrudes out of the surface of the base plate; the positioning block is arranged at the edge of the base plate and the positioning block is provided with a separation blade which extends to the center of the base plate from the edge of the base plate; the positioning block can move away from the edge of the base plate and can move back to be buckled at the edge of the base plate; the elastic resetting device can generate an elastic deformation force when the positioning block moves away from the edge of the base plate; and the elastic deformation force can drive the positioning block back to move back to be buckled at the edge of the base plate. The wafer clamping device, disclosed by the invention, has the advantages of simple structure, convenience for use, short time for clamping and detaching the wafer, fewer work procedures and time saving.
Description
Technical field
The present invention relates to a kind of wafer clamping device.
Background technology
In wafer large-scale production process, need every single stepping can fast, save time.Wafer is thin due to thickness, therefore in most of processing procedure, needs fixture to fix.But clamp structure of the prior art is complicated, uses inconvenience, clamping and dismounting inconvenience, the operating time is long, operation is many, efficiency is low.
Summary of the invention
The object of the invention is, in order to overcome deficiency of the prior art, to provide the wafer clamping device that a kind of structure is simple, easy to operate.
For realizing above object, the present invention is achieved through the following technical solutions:
Wafer clamping device, is characterized in that, comprising:
Substrate;
Reference column, described reference column is arranged at substrate surface and protrudes from substrate surface;
Locating piece, described locating piece is arranged on substrate edges, and locating piece is provided with the catch extended to substrate center from substrate edges, and described locating piece also can return back to away from substrate edges motion and arrange with being fastened on substrate edges;
Elasticity reset device, described elasticity reset device produces elastic deformation force when locating piece moves away from substrate edges, and this elastic deformation force has trend locating piece being returned back to be fastened on the position of substrate edges.
Preferably, described locating piece is provided with groove; Substrate edges through-thickness embeds in groove, and described catch is the cell wall of groove.
Preferably, described substrate comprises substrate body and is arranged on the fixed teeth in substrate body, and the number of described fixed teeth is two or more, and plural fixed teeth along the circumferential direction arranges; Locating piece is at least arranged in one of them fixed teeth.
Preferably, described locating piece is sleeved on fixed teeth end.
Preferably, the groove of described locating piece shape along its length and fixed teeth matching form along the circumferential direction close.
Preferably, the length of the groove of described locating piece is greater than the thickness of fixed teeth.
Preferably, described elasticity reset device is spring.
Preferably, described elasticity reset device is Compress Spring, and described substrate is provided with screw rod, and described locating piece is provided with the first through hole, is provided with step in the first through hole; Screw rod is through the first through hole and substrate threaded engagement; Described Compress Spring to be sleeved on screw rod and to be restricted between screw rod end and step.
Preferably, described locating piece can screw rod be that axle is arranged rotationally.
Preferably, described substrate through-thickness is provided with the second through hole.
Preferably, described reference column is provided with termination, and termination and substrate surface have the gap adapted with wafer thickness.
Preferably, be draw-in groove between termination and substrate surface.
Wafer clamping device in the present invention, structure is simple, easy to use, clamping and the dismounting wafer time short, operation is few, saves time.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is end view of the present invention.
Fig. 3 is the A-A cutaway view in Fig. 2.
Fig. 4 is the positioning block structure cutaway view in the present invention.
Fig. 5 is the present invention first use principle schematic diagram.
Fig. 6 is the present invention second use principle schematic diagram.
Fig. 7 is the present invention the 3rd use principle schematic diagram.
Fig. 8 is the present invention the 4th use principle schematic diagram.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
As shown in Figure 1, Figure 2 and Figure 3, wafer clamping device, comprises substrate 1.The fixed teeth 12 that substrate 1 comprises basic body 11 and is arranged in substrate body 11.Fixed teeth 12 number is six.Six fixed teeth 12 along the circumferential direction arrange.Wherein four fixed teeth 12 are provided with reference column 2.Reference column 2 protrudes from fixed teeth 12 surface 121.Reference column 2 has termination 21.There is between termination 21 and substrate body 11 gap adapted with wafer thickness, between termination 21 and substrate body 11, form draw-in groove 22.Substrate body 11 is provided with the second through hole 13 along thickness T direction.
Wherein two fixed teeth 12 are respectively arranged with a locating piece 3.As shown in Figure 4, locating piece 3 is provided with groove 31 to locating piece 3 structure.Groove 31 closes along length L direction shape and fixed teeth 12 circumferencial direction matching form.Groove 31 length L is greater than the thickness T of fixed teeth 12.First cell wall 32 of groove 31 and the second cell wall 33 are along the edge of fixed teeth 12 to the length that the center O extension of substrate body 1 is selected.Locating piece 3 is provided with the first through hole 34.Step 35 is provided with in first through hole 34.
The fixed teeth 12 being provided with locating piece 3 is provided with screw 4.Screw 4 is through the first through hole 34 and fixed teeth 12 threaded engagement.Compress Spring 5 to be sleeved on screw 4 and between screw 4 end 41 and step 35, and is restricted between end 41 and step 35.Locating piece 3 in Fig. 2 and Fig. 3, relative to the state in Fig. 1 with screw 4 for axle have rotated 90 degree.
Be illustrated in figure 1 the clamping device before not placing wafer.Now, the groove 31 length L direction of locating piece 3 and the matching form of fixed teeth 12 circumferencial direction close, and locating piece 3 is fastened in fixed teeth 12.Locating piece 12 protrudes from substrate body 11 surface unlike reference column 2.As shown in Figure 5, when needing clamping wafer, wafer 6 can be placed on substrate body 11, four reference columns 2 hold wafer 6.As shown in Figure 6, on the basis of Fig. 5, locating piece 3 is pulled to make itself and fixed teeth 12 edge pull open certain distance.Now Compress Spring 5 is produced elastic deformation force by compression, and this elastic deformation force can make locating piece 3 return back to the position contacted with fixed teeth 12.As shown in Figure 7, on the basis of Fig. 6, rotate locating piece 3 and make its 90-degree rotation, the length L direction of groove 31 is consistent with the thickness T direction of substrate body 11.As shown in Figure 8, on the basis of Fig. 7, after unclamping locating piece 3, locating piece 3, under the effect of the elastic deformation force of Compress Spring 5, is also finally fastened in fixed teeth 12 near fixed teeth 12.Because locating piece 3 have rotated 90 degree relative to the state in Fig. 1, therefore, first cell wall 32 of groove 3 and the edge of the second cell wall 33 self-retaining tooth 12 extend certain length to the center O of substrate body 11, and push down wafer 6, can prevent wafer 6 from departing from from substrate 1 surface.The length that the edge of the first cell wall 32 and the second cell wall 33 self-retaining tooth 12 extends to the center of substrate body 11 can be determined according to the distance at the edge of wafer 6 edge and fixed teeth 12.In the present invention, four reference columns 2 and two locating pieces 3 are utilized to fix wafer 6.
When needing to take off wafer 6, according to mode of operation reverse operating during clamping wafer.
Embodiment in the present invention, only for the present invention will be described, does not form the restriction to right, other equivalent in fact substituting, all in scope that those skilled in that art can expect.
Claims (10)
1. wafer clamping device, is characterized in that, comprising:
Substrate;
Reference column, described reference column is arranged at substrate surface and protrudes from substrate surface;
Locating piece, described locating piece is arranged on substrate edges, and locating piece is provided with the catch extended to substrate center from substrate edges, and described locating piece also can return back to away from substrate edges motion and arrange with being fastened on substrate edges;
Elasticity reset device, described elasticity reset device produces elastic deformation force when locating piece moves away from substrate edges, and this elastic deformation force has trend locating piece being returned back to be fastened on the position of substrate edges;
Described substrate comprises substrate body and is arranged on the fixed teeth in substrate body, and the number of described fixed teeth is two or more, and plural fixed teeth along the circumferential direction arranges; Locating piece is at least arranged in one of them fixed teeth;
Described reference column is provided with termination, and termination and substrate surface have the gap adapted with wafer thickness.
2. wafer clamping device according to claim 1, is characterized in that, described locating piece is provided with groove; Substrate edges through-thickness embeds in groove, and described catch is the cell wall of groove.
3. wafer clamping device according to claim 1, is characterized in that, described locating piece is sleeved on fixed teeth end.
4. wafer clamping device according to claim 1, is characterized in that, the groove of described locating piece shape along its length and fixed teeth matching form along the circumferential direction close.
5. wafer clamping device according to claim 4, is characterized in that, the length of the groove of described locating piece is greater than the thickness of fixed teeth.
6. wafer clamping device according to claim 1, is characterized in that, described elasticity reset device is spring.
7. wafer clamping device according to claim 6, is characterized in that, described elasticity reset device is Compress Spring, and described substrate is provided with screw rod, and described locating piece is provided with the first through hole, is provided with step in the first through hole; Screw rod is through the first through hole and substrate threaded engagement; Described Compress Spring to be sleeved on screw rod and to be restricted between screw rod end and step.
8. wafer clamping device according to claim 7, is characterized in that, described locating piece can screw rod be that axle is arranged rotationally.
9. wafer clamping device according to claim 1, is characterized in that, described substrate through-thickness is provided with the second through hole.
10. wafer clamping device according to claim 1, is characterized in that, is draw-in groove between termination and substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459560.XA CN102569154B (en) | 2011-12-31 | 2011-12-31 | Wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459560.XA CN102569154B (en) | 2011-12-31 | 2011-12-31 | Wafer clamping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102569154A CN102569154A (en) | 2012-07-11 |
| CN102569154B true CN102569154B (en) | 2015-05-13 |
Family
ID=46414235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110459560.XA Active CN102569154B (en) | 2011-12-31 | 2011-12-31 | Wafer clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102569154B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0250064A2 (en) * | 1986-06-20 | 1987-12-23 | Varian Associates, Inc. | Wafer processing chuck using multiple thin clamps |
| EP1868238B1 (en) * | 2006-06-14 | 2013-02-13 | ASM Assembly Systems GmbH & Co. KG | Clamping device for a wafer |
| CN201845753U (en) * | 2010-11-03 | 2011-05-25 | 颀中科技（苏州）有限公司 | Wafer clamp |
| CN201859863U (en) * | 2010-11-05 | 2011-06-08 | 中美矽晶制品股份有限公司 | Wafer loading device |
| CN202495435U (en) * | 2011-12-31 | 2012-10-17 | 上海新阳半导体材料股份有限公司 | Wafer clamping device |
-
2011
- 2011-12-31 CN CN201110459560.XA patent/CN102569154B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102569154A (en) | 2012-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202292517U (en) | Indexible elastic pressure plate | |
| CN203887557U (en) | Special fixture for machining fan hub | |
| CN202495435U (en) | Wafer clamping device | |
| CN102569154B (en) | Wafer clamping device | |
| CN109249069B (en) | Step cylinder milling fixture | |
| CN104043979A (en) | Pressure measurable pawl-type locking clamp | |
| CN201711890U (en) | Supporting mechanism with magnet positioning column | |
| CN202607276U (en) | Bell housing clamp | |
| CN201399584Y (en) | Double-surface turning device | |
| CN204413666U (en) | Accurate centralizer | |
| CN209632534U (en) | Clamp for machining is clamped for workpiece centrifugal force | |
| CN101862968B (en) | Tool for processing sector | |
| CN203726161U (en) | Pressure measurable pawl type loosening-preventing clamp | |
| CN203592323U (en) | Double-fixing fixture with measurable pressure | |
| CN203171263U (en) | Corner locking device for knife rest of gear machine tool | |
| CN202053089U (en) | Fixture for processing conducting rod | |
| CN203779138U (en) | Pressure controllable type detent anti-loose fixture | |
| CN204565716U (en) | A kind of clamp for machining of piston rod | |
| CN203993182U (en) | Insulating part workpiece machining clamp | |
| CN204673689U (en) | Cutting means and cutter changing assembly thereof | |
| CN202019282U (en) | Rapidly installed speed reduction stepping motor | |
| CN203566350U (en) | Efficient column slot milling and positioning device | |
| CN203527037U (en) | Simple clamp for CNC machine tool | |
| CN203062352U (en) | Multi-station clamping device | |
| CN203679846U (en) | Pressure-controllable and pawl anti-loosening type rapid mounting clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |