CN102560036A - Copper strip annealing anti-sticking agent - Google Patents
Copper strip annealing anti-sticking agent Download PDFInfo
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- CN102560036A CN102560036A CN2012100132228A CN201210013222A CN102560036A CN 102560036 A CN102560036 A CN 102560036A CN 2012100132228 A CN2012100132228 A CN 2012100132228A CN 201210013222 A CN201210013222 A CN 201210013222A CN 102560036 A CN102560036 A CN 102560036A
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- annealing
- copper strips
- sticking agent
- copper strip
- aluminum silicate
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Abstract
The invention discloses a copper strip annealing anti-sticking agent, belonging to the technical field of metal surface spraying treatment. The copper strip annealing anti-sticking agent has two forms as follows: (1) magnesium aluminum silicate and water; and (2) magnesium aluminum silicate, an assistant and water. Due to rational combination of the copper strip annealing anti-sticking agent, the problem of annealing cementation of a copper strip bell-type furnace is solved well. In addition, according to the copper strip annealing anti-sticking agent disclosed by the invention, distillation range of the technology is shortened; the original process including uncoiling, rolling and curling, re-uncoiling, degreasing, water-washing, anti-sticking agent spraying, curling and annealing is shortened into the process including uncoiling, rolling, anti-sticking agent spraying, curling and annealing. In comparison with the conventional technology, the copper strip anti-sticking agent disclosed by the invention has the advantages that: production link is reduced and production cost is reduced by more than 30%.
Description
Technical field
The invention belongs to metallic surface spray treatment technical field, be specifically related to copper strips annealing release agent.
Background technology
Copper and copper alloy band have a wide range of applications, and it is produced and adopts the mode of calendering to process.Because rolling processing causes flow of metal, metal inside produces bigger stress, thus the thermal treatment of will annealing in the course of processing, metal at a certain temperature (high temperature) recrystallize to eliminate stress.
Present copper processing industry, the copper strips heat treated mode of annealing mainly is divided into air cushion furnace annealing or bell jar furnace annealing.Air cushion furnace annealing is meant that copper strips is at rare gas element (N
2) or reducing gas (H
2) protection on-line continuous annealing down, uncoiling of copper strips, process annealing, a rolling.The bell jar furnace annealing is to go into the intensification under atmosphere protection of bell jar stove, constant temperature, cooling annealing to the copper strips package.
Air cushion furnace annealing is respond well, and because the annealing of copper strips single line, the high temperature bond phenomenon can not take place in copper strips, but the air cushion furnace cost is high, is that the less copper strips processing enterprise of general investment is difficult to bear; So some device fabrication merchants have developed some easy continuous annealing furnaces; The annealing device that has kept the air cushion furnace core; Equipment manufacturing cost significantly descends, but because equipment is simple, factors such as the size of body of heater, stopping property cause power consumption to rise; Although compare air cushion furnace decline has by a relatively large margin been arranged from cost, but still expensive.In some manufacturers that produces low and middle-grade relatively copper strips,, adopt the bell jar furnace annealing in order to practice thrift cost more; Because the bell jar furnace interior does not have continuous passage with the external world; Heat lost less, and every stove multireel copper strips of can annealing, production cost has had very big decline.
The mode of bell jar furnace annealing is exactly that copper strips becomes convolution code to go into intensification, constant temperature in the stove, lower the temperature, come out of the stove; Copper strips and copper strips under annealing temperature (260~600 ℃) bond; Especially the relatively low fine copper band (for example C10200) of fusing point bonds more serious; Uncoiling formed the copper strips distortion easily after such result caused annealing, and the template that has a strong impact on copper strips also is the microcosmic planeness of copper strips, causes the defective of product.In order to address this problem, traditional mode is to curl copper strips again to reduce the curling tension force of copper strips through coil opening machine before the annealing, just reduces the tightness between the copper strips.This method is more effective for the heavy copper strips of rouleau, but volume is very difficult to operation after heavily surpassing 3 tons, and the limit phenomenon produces physical deformation and influences template because last curled portion branch collapses.
In order to address this problem, some manufacturers adopt copper strips before curling, to smear the antiseized branch that is connected into, and mostly this antiseized composition is colloid silica, and concrete operation is with SiO
2Aqueous colloidal or the organic colloid surface that is sprayed onto copper strips, production technique is: uncoiling-rolling-curl; Uncoiling-degreasing again-washing-spraying release agent-curl-annealing.From technical process, in order to spray release agent, increased this procedure of degreasing, the flow process of production is elongated, decrease in efficiency, covert increase cost.If in the operation of rolling, spray release agent, the back that takes place again to anneal is cleaned clean and is caused surface quality to descend.
Summary of the invention
Problem to the prior art existence; The objective of the invention is to design the technical scheme that a kind of copper strips annealing release agent is provided, this release agent can directly apply in the operation of rolling, i.e. limit rolled edge spraying release agent; Rolling, spraying release agent is accomplished continuously; Technology becomes uncoiling-rolling-spraying release agent-curling-annealing, prevents copper strips bell jar furnace annealing adhesion problem effectively, and has shortened the technology boiling range of copper strips bell jar furnace annealing.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Magnesium aluminum silicate 1~3%
Water surplus.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Magnesium aluminum silicate 1~3%
Auxiliary agent 0.5~2%
Water surplus;
Described auxiliary agent is ceramic particle or zeyssatite.
Described copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Magnesium aluminum silicate 1.5~2.5%
Auxiliary agent 1~1.5%
Water surplus.
Described copper strips annealing release agent is characterized in that described ceramic particle is SiO
2, Al
2O
3, ZrO
2, TiO
2Mixture with one or more arbitrary proportions among the SiC.
Described copper strips annealing release agent is characterized in that described ceramic particle particle diameter is 0.1~2 μ m.
The copper strips annealing release agent that is made up of magnesium aluminum silicate and water among the present invention is suitable for adopting the rolling copper strips of emulsion lubrication, more than the thickness 0.5mm of copper strips.The content of magnesium aluminum silicate surpasses 3% back viscosity increase has certain influence to sprinkling, and in addition, water-retaining capacity also increases to some extent, causes the water cut increase of copper strip surface that annealing is caused adverse influence; If bentonitic content is lower than 1%, the anti-stick effect is not good enough.
The copper strips annealing release agent that is made up of magnesium aluminum silicate, auxiliary agent ceramic particle and water among the present invention is for adopting the rolling copper strips of emulsion lubrication to be suitable for the copper strips below the thickness 0.5mm of copper strips.For thin copper strips, the thick band of warp tension ratio that curls is bigger, and the anti-stick poor effect that magnesium aluminum silicate uses is separately added heat-stable ceramic particle and can effectively be improved the anti-stick effect.The particle diameter of ceramic particle is less than 0.1 μ m, and the addition of ceramic particle need add the great talent and produce effect, and particle diameter can produce scuffing greater than 2 μ m for thin copper strips.
The copper strips annealing release agent that is made up of magnesium aluminum silicate, auxiliary agent zeyssatite and water among the present invention is for adopting the rolling copper strips of emulsion lubrication to be suitable for.The content of magnesium aluminum silicate surpasses 3% back viscosity increase has certain influence to sprinkling, and in addition, water-retaining capacity also increases to some extent, causes the water cut increase of copper strip surface that annealing is caused adverse influence; If diatomaceous content is lower than 1%, zeyssatite can condense in sedimentation.
Above-mentioned copper strips annealing release agent, compatibility is reasonable, has well solved copper strips bell jar furnace annealing agglutinating problem, and the present invention shortened the technology boiling range, with original " technology uncoiling-rolling-curl; Uncoiling-degreasing again-washing-spraying release agent-curl-annealing " shorten to " uncoiling-rolling-spraying release agent-curl-annealing ", compare with existing processes, utilize copper strips annealing release agent of the present invention to reduce production link, reduce production costs more than 30%.
Embodiment
Further specify the present invention below in conjunction with Figure of description.The per-cent that the present invention relates to all is weight percentage.
Embodiment 1
Copper strips: C10200,0.5mm is thick; Lubricating fluid: emulsion; Volume is heavy: 4 tons
Experimental technique: blooming mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 1
Table 1 shows: the copper strips annealing release agent that adopts embodiment 1 is that the copper strips of 0.5mm, emulsion lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts magnesium aluminum silicate 2% and water 98% among the embodiment 1, magnesium aluminum silicate 1.5% and water 98.5%, and magnesium aluminum silicate 2.5% and water 97.5%, or magnesium aluminum silicate 3% and water 97% also can reach the technique effect identical with embodiment 1.
Embodiment 2
Copper strips: C10200,0.16mm is thick; Lubricating fluid: emulsion; Volume is heavy: 4 tons
Experimental technique: finishing mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 2
Table 2 shows: the copper strips annealing release agent that adopts embodiment 2 is that the copper strips of 0.16mm, emulsion lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts magnesium aluminum silicate 1%, SiO among the embodiment 2
20.5% with water 98.5%, magnesium aluminum silicate 1.2%, SiO
20.8% with water 98%, magnesium aluminum silicate 1.4%, SiO
20.9% with water 97.7%, magnesium aluminum silicate 1.8%, SiO
21.2% with water 97%, magnesium aluminum silicate 2.2%, SiO
21.5% with water 96.3%, magnesium aluminum silicate 2.6%, SiO
21.8% with water 95.6%, or magnesium aluminum silicate 3%, SiO
22% with water 95%, and SiO in the above-mentioned prescription
2Use SiO instead
2, Al
2O
3, ZrO
2, TiO
2With the mixture of one or more arbitrary proportions among the SiC, the particle diameter of ceramic particle adopts 0.1 μ m, 0.5 μ m, 0.8 μ m, 1 μ m, 1.5 μ m or 2 μ m, also can reach the technique effect identical with embodiment 2.
Embodiment 3
Copper strips: C10200,0.10mm is thick; Lubricating fluid: emulsion; Volume is heavy: 4 tons
Experimental technique: finishing mill on-line spray
Evaluation symbol: ◎-nothing bonding zero-slight bonding ▲-bonding
Table 3
Table 3 shows: the copper strips annealing release agent that adopts embodiment 3 is that the copper strips of 0.1mm, emulsion lubrication is handled to thickness, and copper strip surface does not have bonding, and the copper strip surface state is good.
Copper strips annealing release agent prescription adopts magnesium aluminum silicate 1.2%, zeyssatite 0.8% and water 98% among the embodiment 3; Magnesium aluminum silicate 1.4%, zeyssatite 0.9% and water 97.7%; Magnesium aluminum silicate 1.8%, zeyssatite 1.2% and water 97%, magnesium aluminum silicate 2.2%, zeyssatite 1.5% and water 96.3%, magnesium aluminum silicate 2.6%, zeyssatite 1.8% and water 95.6%; Or magnesium aluminum silicate 3%, zeyssatite % and water 95%, also can reach the technique effect identical with embodiment 3.
Claims (5)
1. copper strips annealing release agent is characterized in that containing the component of following weight per-cent:
Magnesium aluminum silicate 1~3%
Water surplus.
2. copper strips as claimed in claim 1 annealing release agent is characterized in that containing the component of following weight per-cent:
Magnesium aluminum silicate 1~3%
Auxiliary agent 0.5~2%
Water surplus;
Described auxiliary agent is ceramic particle or zeyssatite.
3. copper strips as claimed in claim 2 annealing release agent is characterized in that containing the component of following weight per-cent:
Magnesium aluminum silicate 1.5~2.5%
Auxiliary agent 1~1.5%
Water surplus.
4. copper strips annealing release agent as claimed in claim 2 is characterized in that described ceramic particle is SiO
2, Al
2O
3, ZrO
2, TiO
2Mixture with one or more arbitrary proportions among the SiC.
5. copper strips annealing release agent as claimed in claim 2 is characterized in that described ceramic particle particle diameter is 0.1~2 μ m.
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CN2012100132228A CN102560036A (en) | 2012-01-17 | 2012-01-17 | Copper strip annealing anti-sticking agent |
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CN2012100132228A CN102560036A (en) | 2012-01-17 | 2012-01-17 | Copper strip annealing anti-sticking agent |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560044A (en) * | 2012-02-20 | 2012-07-11 | 徐高磊 | Copper strip surface treatment method and device |
CN104388649A (en) * | 2014-12-01 | 2015-03-04 | 绍兴市力博电气有限公司 | Anti-adhesive agent for metal surface treatment |
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CN1053568A (en) * | 1990-01-24 | 1991-08-07 | 浙江大学 | The anti-stick sand coating of zirconium matter whey base cast steel |
CN1155523A (en) * | 1996-01-22 | 1997-07-30 | 中国兵器工业第五研究所 | Optical glass secondary press heating anti-sticking material and manufacturing method thereof |
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2012
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CN1053568A (en) * | 1990-01-24 | 1991-08-07 | 浙江大学 | The anti-stick sand coating of zirconium matter whey base cast steel |
CN1155523A (en) * | 1996-01-22 | 1997-07-30 | 中国兵器工业第五研究所 | Optical glass secondary press heating anti-sticking material and manufacturing method thereof |
CN1263496A (en) * | 1997-07-09 | 2000-08-16 | 美孚石油公司 | Metallized uniaxially shrinkable biaxially oriented polypropylene film |
CN1220923A (en) * | 1997-12-22 | 1999-06-30 | 中国科学院长沙大地构造研究所 | Powdery quartz coating material |
CN1411372A (en) * | 1999-10-19 | 2003-04-16 | 宝洁公司 | Antimicrobial compositions comprising pyroglutamic acid and optionally metal salts |
CN1966180A (en) * | 2006-11-24 | 2007-05-23 | 费长正 | Alcohol zircon flour coating for heavy castings and its production method |
CN101607298A (en) * | 2009-07-02 | 2009-12-23 | 沈阳铸造研究所 | A kind of attapulgite suspending agent for casting alcohol-based coating and preparation method |
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Title |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560044A (en) * | 2012-02-20 | 2012-07-11 | 徐高磊 | Copper strip surface treatment method and device |
CN104388649A (en) * | 2014-12-01 | 2015-03-04 | 绍兴市力博电气有限公司 | Anti-adhesive agent for metal surface treatment |
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Application publication date: 20120711 |