CN102558682A - Preparation method for electronic product plastic shell material - Google Patents

Preparation method for electronic product plastic shell material Download PDF

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Publication number
CN102558682A
CN102558682A CN201110456633XA CN201110456633A CN102558682A CN 102558682 A CN102558682 A CN 102558682A CN 201110456633X A CN201110456633X A CN 201110456633XA CN 201110456633 A CN201110456633 A CN 201110456633A CN 102558682 A CN102558682 A CN 102558682A
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China
Prior art keywords
parts
electronic product
preparation
particles
particle
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Pending
Application number
CN201110456633XA
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Chinese (zh)
Inventor
潘雪峰
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Individual
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Individual
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Priority to CN201110456633XA priority Critical patent/CN102558682A/en
Publication of CN102558682A publication Critical patent/CN102558682A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a preparation method for an electronic product plastic shell material. The preparation method comprises the following steps: after 128 parts of PP (propene polymer), 20 parts of oil-filled TPE (thermoplastic elastomer), 12 parts of white oil, 36 parts of polystyrene and 40 parts of triethanolamine are added into a reaction kettle according to parts by weight, heating to 230-235DEG C under the protection of nitrogen, and stirring for 3h; adding 17 parts of dicumyl peroxide and 24 parts of methyl isopropyl ketone, and stirring for 4h under the condition of constant temperature; then, adding reaction resultant into a parallel double-screw granulator; at the temperature of 140-220 DEG C, plasticizing, extruding and smashing to obtain particles; extruding and shaping the particles; putting the particles into a water tank to be cooled; and drying at the temperature of 80 DEG C. The material disclosed by the invention has excellent thermoplastic body mechanical property and machining performance, and the production cost is lowered; the material is nontoxic and pollution-free, and is suitable for mass production; and the material can be recovered after being used, and can be used as a production raw material for injection molding after being cleaned and smashed.

Description

A kind of electronic product plastic casing preparation methods
Technical field
The present invention relates to a kind of electronic product plastic casing preparation methods.
Technical background
The technology of electronic product is maked rapid progress on the market now, and manufacturer constantly releases new product, has so just caused old constantly superseded with bad electronic product; Add that China is a consumption big country; So all can have large quantities of industrial wastes every day, and can cause certain environmental pollution, this does not meet the social theory of present environmental protection; But these industrial wastes or be difficult to recycle, or the cost that utilizes again is too high.
Summary of the invention
The present invention seeks in order to overcome the deficiency of prior art, a kind of electronic product plastic casing preparation methods that can recycle once more is provided.
The objective of the invention is to realize through following technical scheme:
A kind of electronic product plastic casing preparation methods, this method comprise the steps: by weight with 128 parts of PP; After 20 parts of oil-filled TPE, 12 parts of white oils, 36 parts of PS and 40 parts of trolamines add reaction kettle; Under protection of nitrogen gas, be heated to 230-235 ℃ and stir 3h, add 17 parts of Di Cumyl Peroxide 99s then and 24 parts of Methyl isobutyl ketones stir 4h under temperature-resistant condition; Then resultant of reaction is joined the parallel double-screw tablets press, 140~220 ℃ of plasticizings extrude pulverize particle, the particle extrusion moulding is put into tank cooling with particle, and is dry down at 80 ℃ then.
Beneficial effect of the present invention:
Material of the present invention is good in hot plastomer's mechanical property and processing characteristics, reduces production costs; Nontoxic pollution-free is applicable to scale operation, and this material can need only through cleaning, pulverize and just can carry out injection moulding as raw materials for production again in use recovery more later.
Embodiment
Embodiment 1
A kind of electronic product plastic casing preparation methods, this method comprise the steps: by weight with 128 parts of PP; After 20 parts of oil-filled TPE, 12 parts of white oils, 36 parts of PS and 40 parts of trolamines add reaction kettle; Under protection of nitrogen gas, be heated to 230-235 ℃ and stir 3h, add 17 parts of Di Cumyl Peroxide 99s then and 24 parts of Methyl isobutyl ketones stir 4h under temperature-resistant condition; Then resultant of reaction is joined the parallel double-screw tablets press, 140~220 ℃ of plasticizings extrude pulverize particle, the particle extrusion moulding is put into tank cooling with particle, and is dry down at 80 ℃ then.

Claims (1)

1. an electronic product plastic casing preparation methods is characterized in that this method comprises the steps: by weight with 128 parts of PP; After 20 parts of oil-filled TPE, 12 parts of white oils, 36 parts of PS and 40 parts of trolamines add reaction kettle; Under protection of nitrogen gas, be heated to 230-235 ℃ and stir 3h, add 17 parts of Di Cumyl Peroxide 99s then and 24 parts of Methyl isobutyl ketones stir 4h under temperature-resistant condition; Then resultant of reaction is joined the parallel double-screw tablets press, 140~220 ℃ of plasticizings extrude pulverize particle, the particle extrusion moulding is put into tank cooling with particle, and is dry down at 80 ℃ then.
CN201110456633XA 2011-12-31 2011-12-31 Preparation method for electronic product plastic shell material Pending CN102558682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110456633XA CN102558682A (en) 2011-12-31 2011-12-31 Preparation method for electronic product plastic shell material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110456633XA CN102558682A (en) 2011-12-31 2011-12-31 Preparation method for electronic product plastic shell material

Publications (1)

Publication Number Publication Date
CN102558682A true CN102558682A (en) 2012-07-11

Family

ID=46405384

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110456633XA Pending CN102558682A (en) 2011-12-31 2011-12-31 Preparation method for electronic product plastic shell material

Country Status (1)

Country Link
CN (1) CN102558682A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103612325A (en) * 2013-12-06 2014-03-05 新化县鑫天电子陶瓷有限公司 Method for cooling hot-pressed electronic ceramic blank
CN108059788A (en) * 2018-02-06 2018-05-22 合肥东恒锐电子科技有限公司 A kind of heat dissipation panel computer shell material

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1556138A (en) * 2004-01-07 2004-12-22 南京聚隆化学实业有限责任公司 Dynamic polypropylene sulfide composite material and its preparation method
US20060247331A1 (en) * 2002-08-12 2006-11-02 Coffey James N Method to make an article comprising polymer concentrate
CN101307219A (en) * 2007-05-16 2008-11-19 南通江洲工程材料科技有限公司 Multicomponent high molecular composite construction sealing materials and production process thereof
JP2009249559A (en) * 2008-04-09 2009-10-29 Techno Plus:Kk Resin composition for cleaning plastic molding machine
CN101851369A (en) * 2009-03-31 2010-10-06 上海金发科技发展有限公司 High-fluidity polypropylene/polystyrene alloy and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060247331A1 (en) * 2002-08-12 2006-11-02 Coffey James N Method to make an article comprising polymer concentrate
CN1556138A (en) * 2004-01-07 2004-12-22 南京聚隆化学实业有限责任公司 Dynamic polypropylene sulfide composite material and its preparation method
CN101307219A (en) * 2007-05-16 2008-11-19 南通江洲工程材料科技有限公司 Multicomponent high molecular composite construction sealing materials and production process thereof
JP2009249559A (en) * 2008-04-09 2009-10-29 Techno Plus:Kk Resin composition for cleaning plastic molding machine
CN101851369A (en) * 2009-03-31 2010-10-06 上海金发科技发展有限公司 High-fluidity polypropylene/polystyrene alloy and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103612325A (en) * 2013-12-06 2014-03-05 新化县鑫天电子陶瓷有限公司 Method for cooling hot-pressed electronic ceramic blank
CN103612325B (en) * 2013-12-06 2015-11-04 新化县鑫天电子陶瓷有限公司 A kind of cooling means of hot pressing note electronic ceramics blank
CN108059788A (en) * 2018-02-06 2018-05-22 合肥东恒锐电子科技有限公司 A kind of heat dissipation panel computer shell material

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Effective date of abandoning: 20120711

C20 Patent right or utility model deemed to be abandoned or is abandoned