CN102558506A - Epoxy resin for encapsulating LED luminous body - Google Patents
Epoxy resin for encapsulating LED luminous body Download PDFInfo
- Publication number
- CN102558506A CN102558506A CN2010106064827A CN201010606482A CN102558506A CN 102558506 A CN102558506 A CN 102558506A CN 2010106064827 A CN2010106064827 A CN 2010106064827A CN 201010606482 A CN201010606482 A CN 201010606482A CN 102558506 A CN102558506 A CN 102558506A
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- epoxy resin
- led
- agent
- luminous body
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Abstract
The invention discloses an epoxy resin for encapsulating an LED luminous body, which comprises a material A and a material B, wherein the material A comprises a curing agent, the mass ratio of the material A to the material B is 1:1.5, the material A comprises the components in parts by weight: 90-120 parts of thermosetting resin, 300-400 parts of filler, 1-5 parts of pigment, 80-100 parts of active diluting agent, 1-5 parts of antioxygen, 0-2 parts of defoaming agent and 0-5 parts of coupling agent. The epoxy resin provided by the invention has better bonding force, dampness and heat ageing resistance, chemical corrosion resistance, a certain elasticity and mechanical strength, and is very suitable for encapsulation of the LED luminous body.
Description
Technical field
The present invention relates to a kind of epoxy resin, particularly a kind of epoxy resin of LED twinkler encapsulation usefulness of LED lamp belongs to LED lamp manufacture technology field.
Background technology
Photodiode (LED) is an electrical luminous semiconductor material, he has, and working voltage is low, energy consumption is low, stability number etc. plurality of advantages.
Common LED, its core cell are exactly an electrical luminous semiconductor material, and this unit is the square of a 3-5mm, use epoxy sealing all around then, unit and shelf are fixed up, with the protection core cell.
At present, plastic cement injection moulding epoxy encapsulation is the most common profile molding mode.But at present used adhering with epoxy resin power is less, when having certain temperature, can produce break-off and ftractures.
Summary of the invention
Problem to be solved by this invention provides a kind of have stronger cohesiveness, suitable elasticity and the LED twinkler encapsulating epoxy resin of compressive strength.
In order to solve above-mentioned technical problem, technical scheme of the present invention is: a kind of LED twinkler encapsulating epoxy resin comprises A, two types of materials of B; Said category-B material is a solidifying agent, and the mass ratio of said A material and B material is 1: 1.5, and said category-A material comprises the following component of meter by weight: 90～120 parts of thermosetting resins; 300～400 parts of fillers, 1～5 part of pigment, 80～100 parts of reactive thinners; 1～5 part in oxidation inhibitor, 0～2 part of skimmer, 0～5 part of coupling agent.
The component that said A material is counted by weight is preferably: 100～110 parts of thermosetting resins, 350～380 parts of fillers, 2～4 parts of pigment, 85～90 parts of reactive thinners, 2～4 parts in oxidation inhibitor, 1～2 part of skimmer, 2～3 parts of coupling agents
Described category-A material also comprises precipitation agent, and said precipitation agent is a silicon-dioxide.
Epoxy resin of the present invention has bonds well power, wet and heat ageing resistant, resistance to chemical attack, and has certain elasticity and physical strength, is suitable for very much the encapsulation of LED twinkler.
Through test, its shrinking percentage shrinking percentage≤1.0%, tensile strength>=8.0MPa.
Embodiment
Embodiment 1
The A material is:
Get 90 parts in resol, 370 parts of silica powders, 3 parts in fluorescent material, 90 parts of aromatic series monoglycidyl ethers, 5 parts of phosphorous acid esters, 1 part of silicone emulsion.
The B material is a modified amine curing agent; The mass ratio of A material and B material is 1: 1.5.
The epoxy resin shrinking percentage of above-mentioned substance is 0.6%, and tensile strength is 15MPa.
Above-mentioned epoxy resin carries out stretch-draw on LED twinkler encapsulation completion is after 12 hours to it, and the 3-5Mpa that exerts pressure connects resin pre compressed magnitude 0.2mm.It connects good leakless to solidify the back
Embodiment 2
The A material is:
Get 120 parts in resol, 300 parts of silica powders, 5 parts in fluorescent material, 80 parts of aromatic series monoglycidyl ethers, 3 parts of phosphorous acid esters, 5 parts of epoxy radicals silicone hydrides.
The B material is a modified amine curing agent; The mass ratio of A material and B material is 1: 1.5.
The epoxy resin shrinking percentage of above-mentioned substance is 0.8%, and tensile strength is 10MPa.
Above-mentioned epoxy resin carries out stretch-draw on LED twinkler encapsulation completion is after 12 hours to it, and the 3-5Mpa that exerts pressure connects resin pre compressed magnitude 0.2mm.It connects good leakless to solidify the back.
Embodiment 3
The A material is:
Get 100 parts in resol, 400 parts of silica powders, 1 part in fluorescent material, 100 parts of aromatic series monoglycidyl ethers, 1 part of phosphorous acid ester, 2 parts of silicone emulsions, 3 parts of epoxy radicals silicone hydrides.
The B material is a modified amine curing agent; The mass ratio of A material and B material is 1: 1.5.
The epoxy resin shrinking percentage of above-mentioned substance is 0.7%, and tensile strength is 11MPa.
Above-mentioned epoxy resin carries out stretch-draw on LED twinkler encapsulation completion is after 12 hours to it, and the 3-5Mpa that exerts pressure connects resin pre compressed magnitude 0.2mm.It connects good leakless to solidify the back.
The foregoing description does not limit the present invention in any way, and every employing is equal to the technical scheme that replacement or the mode of equivalent transformation obtain and all drops in protection scope of the present invention.
Claims (3)
1. a LED twinkler encapsulating epoxy resin comprises A, two types of materials of B, and said category-B material is a solidifying agent; It is characterized in that: the mass ratio of said A material and B material is 1: 1.5, and said category-A material comprises the following component of meter by weight: 90～120 parts of thermosetting resins, 300～400 parts of fillers; 1～5 part of pigment, 80～100 parts of reactive thinners, 1～5 part in oxidation inhibitor; 0～2 part of skimmer, 0～5 part of coupling agent.
2. LED twinkler encapsulating epoxy resin according to claim 1; It is characterized in that: the component that said A material is counted by weight is preferably: 100～110 parts of thermosetting resins, 350～380 parts of fillers, 2～4 parts of pigment; 85～90 parts of reactive thinners; 2～4 parts in oxidation inhibitor, 1～2 part of skimmer, 2～3 parts of coupling agents.
3. LED twinkler encapsulating epoxy resin according to claim 1 is characterized in that: described category-A material also comprises precipitation agent, and said precipitation agent is a silicon-dioxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106064827A CN102558506A (en) | 2010-12-27 | 2010-12-27 | Epoxy resin for encapsulating LED luminous body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106064827A CN102558506A (en) | 2010-12-27 | 2010-12-27 | Epoxy resin for encapsulating LED luminous body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102558506A true CN102558506A (en) | 2012-07-11 |
Family
ID=46405221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106064827A Pending CN102558506A (en) | 2010-12-27 | 2010-12-27 | Epoxy resin for encapsulating LED luminous body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102558506A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910427A (en) * | 2017-11-24 | 2018-04-13 | 江苏瑞博光电科技有限公司 | A kind of diode annesl film |
| CN107955357A (en) * | 2017-11-24 | 2018-04-24 | 江苏瑞博光电科技有限公司 | Light emitting diode film and its manufacture method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009155370A (en) * | 2007-12-25 | 2009-07-16 | Gun Ei Chem Ind Co Ltd | Epoxy resin molding material for sealing motor and molded article |
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
-
2010
- 2010-12-27 CN CN2010106064827A patent/CN102558506A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009155370A (en) * | 2007-12-25 | 2009-07-16 | Gun Ei Chem Ind Co Ltd | Epoxy resin molding material for sealing motor and molded article |
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910427A (en) * | 2017-11-24 | 2018-04-13 | 江苏瑞博光电科技有限公司 | A kind of diode annesl film |
| CN107955357A (en) * | 2017-11-24 | 2018-04-24 | 江苏瑞博光电科技有限公司 | Light emitting diode film and its manufacture method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |