CN102544820A - Electric conduction terminal - Google Patents
Electric conduction terminal Download PDFInfo
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- CN102544820A CN102544820A CN2011103764352A CN201110376435A CN102544820A CN 102544820 A CN102544820 A CN 102544820A CN 2011103764352 A CN2011103764352 A CN 2011103764352A CN 201110376435 A CN201110376435 A CN 201110376435A CN 102544820 A CN102544820 A CN 102544820A
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- Prior art keywords
- metal layer
- conducting terminal
- conductive metal
- contact site
- electric conduction
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Abstract
An electric conduction terminal is used for electrically connecting with a butting joint module, and is characterized by comprising at least one contact part, wherein the contact part has a contact area which is contacted with the butting joint module, a linear high electric conduction metal layer is locally arranged on the contact area, the width of the linear high electric conduction metal layer is between 0.01mm and 0.03mm; and in the electric conduction terminal, under the premise of ensuring that the contact part has good electric conduction performance when the width of the linear high electric conduction metal layer is larger than 0.01mm, the width of the linear high electric conduction metal layer can be smaller than 0.03mm, generally, the width of the contact area is greatly larger than 0.03mm, so a local metal layer is formed on the contact area through the linear high electric conduction metal layer, in conclusion, under the premise of ensuring that the contact part has good electric conduction performance, the consumption of high conduction metal (generally precious metal ) is saved, so the cost for forming the linear high electric conduction metal layer through the electric conduction terminal is reduced.
Description
[technical field]
The present invention relates to a kind of conducting terminal, relate in particular to the conducting terminal that a kind of contact site is provided with strip high-conductive metal layer.
[background technology]
A kind of conducting terminal is contained in the insulating body of an electric connector; The one of which end docks module with one and connects; The other end and a circuit board connect; So that said electric connector is electrically connected to said butt joint module on the said circuit board, said conducting terminal comprises that a contact site contacts with said butt joint module, for improving said terminal and the said performance that connects of docking between the module; Industry is plated on said contact site usually and is established the preferable metal level of electric conductivity, and the material of common said metal level is precious metal gold or palladium nickel or the like.
Current said metal level generally adopts electric plating method to form; Like the continuous plating in electroplating, the restriction of process conditions can't form local coating among a small circle to these methods because of receiving separately, therefore docks the good performance that connects between the module for the said conducting terminal of assurance with said; Said metal level is set on said contact site usually on a large scale; So, dock the good performance that connects between the module with said, waste precious metal though can guarantee said contact site; Correspondingly, can increase the electroplating cost of said terminal.
[summary of the invention]
When above-mentioned conducting terminal is LGA (Land Grid Array) type terminal; Correspondingly; The butt joint module that above-mentioned butt joint module is the LGA form; In the contact site process of the said conducting terminal of pressed, said contact site upwards is connected to the contact mat of position at said butt joint module lower surface at said butt joint module; When above-mentioned conducting terminal was PGA type terminal, correspondingly, the butt joint module that above-mentioned butt joint module is the PGA form then carried out in side direction (level to) the displacement process at said butt joint module, and the stitch of said butt joint module is connected to said conducting terminal.
With regard to the butt joint module of LGA form; Said butt joint module compresses till contact site to the final location of said conducting terminal from top to bottom gradually; Its final stroke that compresses track (track that the abutment of said butt joint module and said contact site forms) on said contact site maybe be high slightly or low slightly; The base portion part far away of actual contact point when high slightly (the final contact point of said butt joint module and said contact site) said conducting terminal of distance on said contact site, the nearer part of base portion of actual contact point said conducting terminal of distance on said contact site when low slightly.Far away or near contact point can be linked to be wire expection contact area, compresses track and extends along said.
With regard to the butt joint module of PGA form; Said butt joint module carries out side direction (level to) displacement and compresses gradually till contact site to the location of said conducting terminal; Its final stroke that compresses track also maybe be slightly far or is near slightly; Consider far away or near actual contact point, can be linked to be wire expection contact zone equally, compress track and extend along said.
As long as in above-mentioned wire expection contact zone, high-conductive metal (precious metal) is set, with regard to the said butt joint module of LGA form, no matter its stroke to pressed is higher or lower, can both guarantee to have on the actual contact point high-conductive metal to improve electric conductivity; With regard to PGA form butt joint module, no matter the stroke of its lateral displacement is far away or nearer, also can both guarantee to have on the actual contact point high-conductive metal with the raising electric conductivity.Outside said wire expection contact zone, then the high-conductive metal layer needn't be set, to avoid unnecessary cost.
Therefore; The present invention adopts following technical scheme: a kind of conducting terminal; Connect in order to dock module, it is characterized in that, comprise a contact site with one; Be provided with a wire high-conductive metal layer in said contact site and compress the formed track extension of said contact site gradually along said butt joint module, the live width of said wire high-conductive metal layer is between the 0.01mm to 0.03mm.
Further; The elastic arm that said conducting terminal has a base portion and extended by said base portion; Said contact site is located on the said elastic arm and is supplied a contact mat crimping of said butt joint module, and roughly the bearing of trend with said elastic arm is identical for the direction that said wire high-conductive metal layer extends.
Further, said conducting terminal has a base portion and upwards roughly extends an elastic arm to horizontal direction more earlier by said base portion; Said contact site is located at the part of roughly extending to horizontal direction on the said elastic arm, and supplies one of said butt joint module stitch butt, and roughly the horizontal-extending direction with said elastic arm is identical for the direction that said wire high-conductive metal layer extends.
Further, the material of said wire high-conductive metal layer is a precious metal.
Further, said precious metal is a gold.
In the present invention; The online 0.01mm that is wider than of said wire high-conductive metal layer; Can guarantee that said contact site has excellent conducting performance; Simultaneously for reducing the consumption of precious metal (material of common said wire high-conductive metal layer is a precious metal) as far as possible, the live width of said wire high-conductive metal layer is set at less than 0.03mm, with the cost of avoiding there is no need.The setting of wire high-conductive metal layer in sum; Guaranteeing that having the high-conductive metal layer on the point that said contact site is actual with the butt joint module contacts puts to guarantee excellent conducting performance before; Practiced thrift the consumption that high-conductive metal (being generally precious metal) there is no need; Thereby, reduce the cost that said conducting terminal forms said wire high-conductive metal layer.
Purpose, shape, structure, characteristic and effect thereof for ease of to conducting terminal provided by the invention all can have further understanding and understanding, combine embodiment and accompanying drawing to elaborate at present.
[description of drawings]
Fig. 1 is the stereogram of conducting terminal first embodiment of the present invention;
Fig. 2 is the cutaway view before the butt joint module compacting conducting terminal among conducting terminal first embodiment of the present invention;
Fig. 3 is the cutaway view when docking module crimping conducting terminal among conducting terminal first embodiment of the present invention;
Fig. 4 is the conducting terminal first embodiment of the present invention vertical view in the insulating body of packing into;
Fig. 5 is the stereogram of conducting terminal second embodiment of the present invention;
Fig. 6 analyses and observe partial enlarged drawing for conducting terminal second embodiment of the present invention.
The drawing reference numeral of embodiment:
Conducting terminal 1 base portion 10 elastic arms 11
Contact site 12 interfaces 120 contact point 120a
Wire expection contact zone 1200 weld parts, 13 insertion slots 14
Fixing arm 15 insulating bodies 2 accepting grooves 20
Wire high-conductive metal layer 3
Butt joint module 101 interfacing part 101a
[embodiment]
See also first embodiment of Fig. 1 to Fig. 4 for conducting terminal 1 provided by the invention, in this embodiment, said conducting terminal is for being LGA (Land Grid Array; Be called for short LGA; The surface grid array) type terminal, one of which end dock module 101 crimping with one, the other end is soldered on the circuit board 102; By this, said butt joint module 101 and said circuit board 102 are electrically connected.
See also Fig. 2 to Fig. 3, an electric connector 100 is in present embodiment; Be LGA (Land Grid Array is called for short LGA, the surface grid array) connector; Said electric connector 100 comprises a plurality of said conducting terminals 1, and an insulating body 2, wherein; Provided a plurality of accepting grooves 20 on the said insulating body 2, accommodated and fixing said conducting terminal 1 in order to correspondence.
See also Fig. 1 to Fig. 3; Each said conducting terminal 1 comprises that a base portion 10 is immobilizated in each said accepting groove 20; So that said conducting terminal 1 is carried out fixed limit, by the upper end of said base portion 10 up and an elastic arm 11 that extends before oblique, said elastic arm 11 comprises that a contact site 12 that is the bending setting is revealed in the end face of said insulating body 2; The upper surface of said contact site 12 is defined as the crimp 101a crimping that an interface 120 supplies said butt joint module 101; So that said conducting terminal 1 connects with the said module 101 that docks, and in present embodiment, said crimp 101a is a contact mat.Said elastic arm 11 provides enough elasticity for said contact site 12; So that said contact site 12 is difficult for tired with the said module 101 that docks for the elasticity crimping; Further; Extend the bottom surface that a weld part 13 is revealed in said insulating body 2 by the lower end of said base portion 10, and said weld part 13 is soldered on the weld pad 102a of said circuit board 102 through scolders (not label), so that said conducting terminal 1 is electrically conducted with said circuit board 102.
See also Fig. 2 to Fig. 4, in present embodiment, said butt joint module 101 is fixed on the said electric connector 100 finally stopping to a position through from top to bottom stroke, and electrically conducts via said electric connector 100 and said circuit board 102.In said butt joint module 101 stroke from top to bottom; Said interfacing part 101a suppresses said contact site 12, and makes said elastic arm 11 downwarpings distortion, and then; Said interfacing part 101a and said contact site 12 in front and back to slide relative takes place; Compress track so that said interfacing part 101a forms one on said contact site 12, (when said butt joint module 101 finally installs and fixes to said electric connector 100, the abutment between said interfacing part 101a and the said interface 120) is defined as a said contact point 120a who docks between module 101 and the said contact site 12 to said interfacing part 101a in final stop place on the said contact site 12; Certainly; Said contact point 120a is not limited to a bit, can be a zone, and that looks said contact mat 101a and said contact site 12 specifically contacts situation and decide.
See also Fig. 2 to Fig. 4, usually, said conducting terminal 1 exists manufacture deviation and assembling deviation with said insulating body 2; Thereby; When said conducting terminal 1 is assembled in the said insulating body 2, said conducting terminal 1 possibly have the branch of height, and promptly said contact site 12 has the branch of distance apart from said base portion 10; Thereby; When said butt joint module 101 to the said conducting terminal 1 of pressed during to final travel position, the position of the said contact point 120a between said butt joint module 101 and the said contact site 12 on corresponding said interface 120 has nothing in common with each other, the distance between promptly said contact point 120a and the corresponding said base portion 10 has the difference of distance.All said contact point 120a are connected being aligned at present; To on each said interface 120, form sagittal wire expection contact zone 1200; All has the good performance that connects in order to ensure each said conducting terminal 1 between the module 101 with said the butt joint; Even the said contact point 120a of the said conducting terminal 12 of high or low each is provided with the high-conductive metal layer, a wire high-conductive metal layer 3 is established in plating on the bearing of trend of said wire expection contact zone 1200.
See also Fig. 1 and Fig. 4; In present embodiment; The said track (front and back to) that compresses is provided with said wire high-conductive metal layer 3 in said wire expection 1200 upper edges, contact zone; Be said wire high-conductive metal layer 3 bearing of trend roughly the bearing of trend with said elastic arm 11 is identical, and the live width of said wire high-conductive metal layer 3 is between the 0.01mm to 0.03mm.Wherein, The live width of said wire high-conductive metal layer 3 is greater than 0.01mm; Be in order to guarantee that said conducting terminal 1 has a less contact resistance with the said module 101 that docks, and make said conducting terminal 1 and the said better performances that connects of docking between the module 101, and the live width of said wire high-conductive metal layer 3 is less than 0.03mm; Be for reducing the consumption of precious metal, practicing thrift the cost that said wire high-conductive metal layer 3 forms
Further; See also Fig. 4; In present embodiment, have an electric conductivity preferably for pursuing said conducting terminal 1, and do not waste the consumption of precious metal, the line length of said wire high-conductive metal layer 3 is set to equal the length of said wire expection contact zone 1200.
In present embodiment, said wire high-conductive metal layer 3 for example can be formed by chemical plating, and key step comprises following:
At first; Said conducting terminal 1 is carried out a chemical plating pre-treatment; Mainly be to carry out the chemical plating pre-treatment to said contact site 12; Said pre-treatment mainly comprises following technology: mechanical alligatoring, electrochemical deoiling, chemical roughen, sensitization, activation, dispergation, washing, wherein, washing can intert into the front and back of arbitrary technology.
Then, utilize an ink discharge device (not shown) that plating bath is injected on the said wire expection contact zone 1200, on said wire expection contact zone 1200, carry out chemical plating and form said wire high-conductive metal layer 3.Wherein, The drop that said ink discharge device (not shown) ejects is very little; Therefore; Many point-like drops coverings that said wire high-conductive metal layer 3 zone are actually by said ink discharge device (not shown) ejection form, and using and on said contact site 12 surfaces, forming live width is the said wire high-conductive metal layer 3 of 0.01mm to 0.03mm.
At last, plate reprocessing, mainly comprise: washing, dry, coating reprocessing.
See also Fig. 5 to Fig. 6, be as follows with the difference of a last embodiment:
Said electric connector 100 is PGA (Pin Grid Array; PGA, the needle-like grid array) connector, correspondingly; Said conducting terminal 1 is a BGA type terminal; Each said conducting terminal 1 has a base portion 10, by the upper end of said base portion 10 earlier upwards, the elastic arm 11 that extends forward of approximate horizontal again, extend the bottom surface that a weld part 13 is revealed in said insulating body 2 by the lower end of said base portion 10; And said weld part 13 is soldered on the weld pad 102a of said circuit board 102 through a scolder (not label), so that said conducting terminal 1 is electrically conducted with said circuit board 102.
Said elastic arm 11 is provided with a contact site 12 horizontal settings; Before and after said contact site 12 upper edges to providing an insertion slot 14; In present embodiment, said insertion slot 14 diminishes in wide cut near the direction of said base portion 10 gradually, by said elastic arm 11 to extending below a fixing arm 15; Conflicts respectively two relative interior sidewall surface of said accepting groove 20 extremely of said fixing arm 15 and said elastic arm 11; So that said conducting terminal 1 is played the fixed limit effect, said insertion slot 14 is further offered to extending below to said fixing arm 15, so that said fixing arm 15 has elasticity preferably; And be convenient to said conducting terminal 1 is assembled in the said accepting groove 20, two side wall surfaces of said insertion slot 14 and the part that is positioned on the said contact site 12 define two interfaces 120.
When the said interfacing part 101a of said butt joint module 101 (in present embodiment; Said interfacing part is a stitch) be inserted in the said insertion slot 14, and move and conflict to said two interfaces 120 to said base portion 10 directions, when electrically connecting with said conducting terminal 1; Said interfacing part 101a will form one in front and back to relative displacement takes place and compress track on said interface 120; Define said interfacing part 101a and be respectively a said contact point 120a who docks module 101 and said contact site 12 in said two interfaces, 120 final footholds (promptly be completely fixed in said electric connector 100 when said butt joint module 101, when being electrically conducted, the conflict point of said interfacing part 101a and said two interfaces 120) with said electric connector 100; Because of said conducting terminal 1 exists foozle and assembly error with said insulating body 2; So the relative position of said contact point 120a on said interface 120 has nothing in common with each other, promptly said contact point 120a also has nothing in common with each other apart from the distance of said base portion 10; So; Said contact point 120a is connected being aligned, then, will be front and back to a said wire expection contact zone 1200 that extends at present respectively at forming on said two interfaces; On said wire expection contact zone 1200, a said wire height is set and leads conductive metal layer 3; Then, roughly the horizontal-extending direction with said elastic arm 11 is identical for the direction that said wire expection contact zone 1200 extends, so that each said conducting terminal 2 all has good electric conductivity on actual contact point 120a.
In sum; The main beneficial effect of conducting terminal 1 provided by the invention is: in the present invention, the said wire high-conductive metal layer 3 online 0.01mm that is wider than can guarantee that said contact site 12 has under the prerequisite of excellent conducting performance; Simultaneously; For reducing the consumption of precious metal (material of common said wire high-conductive metal layer is a precious metal) as far as possible, the live width of said wire high-conductive metal layer 3 is set at less than 0.03mm, with the cost of avoiding there is no need.To sum up guarantee said contact site 12 actual with dock the point that module contacts on have the high-conductive metal layer to guarantee under the excellent conducting performance; Practiced thrift the consumption that high-conductive metal (being generally precious metal) there is no need; Thereby, reduce the cost that said conducting terminal 1 forms said wire high-conductive metal layer 3.
Above-mentioned explanation is the detailed description to the preferable possible embodiments of the present invention; But embodiment is not in order to limit patent claim of the present invention; Equal variation that all disclosed technical spirits are accomplished down or modification change; Also all should belong to claim that the present invention is contained, be not the mode of welding when electrically connecting like what adopt when said weld part 13 and said circuit board 102, but during the crimping mode; Also said wire high-conductive metal layer 3 can be set on said weld part, to promote the performance that connects between said conducting terminal 1 and the said circuit board 102.
Claims (5)
1. conducting terminal; Connect in order to dock module with one; It is characterized in that; Comprise: at least one contact site, be provided with a wire high-conductive metal layer in said contact site and compress the formed track extension of said contact site gradually along said butt joint module, the live width of said wire high-conductive metal layer is between the 0.01mm to 0.03mm.
2. conducting terminal as claimed in claim 1 is characterized in that: the elastic arm that said conducting terminal has a base portion and extended by said base portion; Said contact site is located on the said elastic arm and is supplied the crimping of one of said butt joint module contact mat, and roughly the horizontal-extending direction with said elastic arm is identical for the direction that said wire high-conductive metal layer extends.
3. conducting terminal as claimed in claim 1 is characterized in that: said conducting terminal has a base portion and upwards roughly extends an elastic arm to horizontal direction more earlier by said base portion; Said contact site is located at the part of roughly extending to horizontal direction on the said elastic arm, and supplies one of said butt joint module stitch butt, and roughly the horizontal-extending direction with said elastic arm is identical for the direction that said wire high-conductive metal layer extends.
4. like claim 1 or 2 or 3 described conducting terminals, it is characterized in that: the material of said wire high-conductive metal layer is a precious metal.
5. conducting terminal as claimed in claim 4 is characterized in that: said precious metal is gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103764352A CN102544820A (en) | 2011-11-23 | 2011-11-23 | Electric conduction terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103764352A CN102544820A (en) | 2011-11-23 | 2011-11-23 | Electric conduction terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102544820A true CN102544820A (en) | 2012-07-04 |
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ID=46351123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103764352A Pending CN102544820A (en) | 2011-11-23 | 2011-11-23 | Electric conduction terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102544820A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4361470A (en) * | 1974-09-03 | 1982-11-30 | Micro-Plate, Inc. | Connector contact point |
| JPH01225075A (en) * | 1988-03-01 | 1989-09-07 | Nec Corp | Plastic contact spring |
| JPH0458486A (en) * | 1990-06-26 | 1992-02-25 | Matsushita Electric Ind Co Ltd | Manufacture of contact for ic card read/write device |
| JPH0875820A (en) * | 1994-09-06 | 1996-03-22 | Advantest Corp | Graphite vapor-deposited contact pin and ic socket pin using this contact pin |
| US20050048851A1 (en) * | 2003-09-03 | 2005-03-03 | Masao Okita | Electrical terminal and method for manufacturing same |
| US20110086558A1 (en) * | 2009-10-14 | 2011-04-14 | Hon Hai Precision Industry Co., Ltd. | Electrical contact with improved material and method manufacturing the same |
| JP2011146333A (en) * | 2010-01-18 | 2011-07-28 | Cheng Uei Precision Industry Co Ltd | Terminal and electroplating method of the same |
-
2011
- 2011-11-23 CN CN2011103764352A patent/CN102544820A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4361470A (en) * | 1974-09-03 | 1982-11-30 | Micro-Plate, Inc. | Connector contact point |
| JPH01225075A (en) * | 1988-03-01 | 1989-09-07 | Nec Corp | Plastic contact spring |
| JPH0458486A (en) * | 1990-06-26 | 1992-02-25 | Matsushita Electric Ind Co Ltd | Manufacture of contact for ic card read/write device |
| JPH0875820A (en) * | 1994-09-06 | 1996-03-22 | Advantest Corp | Graphite vapor-deposited contact pin and ic socket pin using this contact pin |
| US20050048851A1 (en) * | 2003-09-03 | 2005-03-03 | Masao Okita | Electrical terminal and method for manufacturing same |
| US20110086558A1 (en) * | 2009-10-14 | 2011-04-14 | Hon Hai Precision Industry Co., Ltd. | Electrical contact with improved material and method manufacturing the same |
| JP2011146333A (en) * | 2010-01-18 | 2011-07-28 | Cheng Uei Precision Industry Co Ltd | Terminal and electroplating method of the same |
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| PB01 | Publication | ||
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Application publication date: 20120704 |